LED ultrathin display module integrated with driving IC

Abstract

The invention provides a light-emitting diode (LED) ultrathin display module integrated with a driving integrated circuit (IC), which belongs to the technical field of LED display and comprises an LED lamp panel, a driving IC board and a connecting structure. The LED lamp panel comprises LED lamp beads, a PCB (Printed Circuit Board) substrate, a bus transceiver, a scanning control IC (Integrated Circuit), a constant current output driving IC, an electrolytic capacitor, a magnetic attraction sheet and a positioning sheet; the LED lamp beads are attached to the TOP face of the PCB substrate and are arranged in an array mode. The bus transceiver, the scanning control IC, the constant current driving IC, the electrolytic capacitor, the magnetic attraction sheet and the positioning sheet are mounted on the BOTTOM surface of the PCB substrate; the driving IC board comprises a PCB substrate, a main control driving IC, a floating connector, a DC / DC-1 and a DC / DC-2; and the driving IC board is mounted on the BOTTOM surface of the PCB substrate through an SMT production process and is electrically connected with the BOTTOM surface of the PCB substrate. The safety is improved, and the efficient and energy-saving effects are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display, and in particular to an LED ultra-thin display module with integrated driver IC. Background Art

[0002] With the continuous advancement of LED display technology, in response to the needs of special scenarios such as shopping malls, exhibition halls, airports, subways, conference rooms, home theaters and customization, LED ultra-thin modules have attracted much attention due to their advantages such as ultra-thinness, ultra-lightness, beauty, high brightness and high definition.

[0003] However, there is no precedent for integrated driver ICs in current ultra-thin LED modules, and they all need to be used with LED cabinets. The current mainstream LED cabinets are all made of die-cast aluminum, and the thinnest thickness is about 28mm. They cannot be used normally in scenes such as conference rooms or home theaters due to space constraints. In addition, due to the large size of the LED cabinet, it is necessary to equip it with an independent AC-DC power module, and the entire LED display screen uses AC power in series, which has a large power loss and low safety. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides an ultra-thin LED display module with an integrated driver IC, which can be flexibly expanded and optimized in thickness, reduce power loss in the power supply process between modules, and reduce power consumption loss on a single LED module.

[0005] The technical solution of the present invention is:

[0006] An LED ultra-thin display module with integrated driver IC includes an LED light board, a driver IC board and a connection structure; the LED light board includes LED lamp beads, a PCB substrate, a bus transceiver, a scanning control IC, a constant current output driver IC, an electrolytic capacitor, a magnetic sheet and a positioning sheet; the LED lamp beads are mounted on the TOP surface of the PCB substrate and arranged in an array; the bus transceiver, the scanning control IC, the constant current driver IC, the electrolytic capacitor, the magnetic sheet and the positioning sheet are mounted on the BOTTOM surface of the PCB substrate; the driver IC board includes the PCB substrate, the main control driver IC, a floating connector, DC / DC-1, DC / DC-2 and other necessary electronic components such as resistors, capacitors, inductors, etc.; the connection structure is a stamp hole pad between the LED light board and the driver IC board, and the driver IC board is mounted on the BOTTOM surface of the PCB substrate through the SMT production process, and the two are electrically connected. The main control driver IC adopts the ICND6603 model, the DC / DC-1 adopts the JWH6344A model, and the DC / DC-2 adopts the TMI3411 model.

[0007] Furthermore,

[0008] An AC-DC power supply module is used outside the module to provide a 48V DC power supply, which is connected to the LED module through a floating connector. After passing through the DC / DC-1 DC voltage regulator IC, the first-level level conversion from 48V to 5V is realized. Part of this power supply is directly provided to the LED lamp board through the stamp hole pad to power the LED lamp beads and row and column driver ICs (bus transceiver, scan control IC, constant current output driver IC), and part of it flows into the DC / DC-2 DC voltage regulator IC to realize the second-level level conversion from 5V to 3.3V. This part of the power supply mainly powers the main control driver IC; the LED module adopts step-by-step level conversion, and the conversion efficiency of the two ICs is as high as over 95%, which greatly reduces the power loss on a single LED module and achieves a high efficiency energy saving effect. In the signal part, the video data stream to be played outside the module is input to the main control driver IC through an external decoding and sending device. The main control driver IC implements the analysis of the private encryption protocol internally, converts it into RGB data groups and control signals, and directly gives it to the LED light board through the stamp hole pad. After passing through the row and column driver IC, the data content is displayed on the LED lamp beads; in addition, the main control driver IC will encrypt and output the data except the display content of the module to the next-level LED module.

[0009] To facilitate the welding process, a stamp hole pad is used on the driver IC board, and a corresponding square pad is designed on the LED light board for electrical connection between the two; each LED module uses two RGB data groups, and the control signals and the control signals and the power supply are isolated by GND pads. In addition, to facilitate the routing of the LED light board, the RGB data groups, control signals and power supply are placed on the left side of the driver IC board, and a corresponding GND pad is designed on the right side. On the one hand, it increases the firmness of the driver IC board and the LED light board, and on the other hand, it can enhance the ESD protection effect between the two boards.

[0010] The LED display device mainly includes an ultra-thin LED module with an integrated driver IC and a corresponding die-cast aluminum back shell. The two are precisely locked in position with positioning plates and positioning columns, and are connected with magnetic plates and magnetic columns. Except for the LED lamp beads and the PCB substrate, the rest of the LED module is embedded in the cavity of the module back shell, which is calculated based on the height of the LED lamp beads, the thickness of the PCB substrate of the LED light board, the combined height of the floating connector, the thickness of the PCB substrate of the driver IC board, and the thickness of the die-cast aluminum of the module back shell.

[0011] The beneficial effects of the present invention are

[0012] The LED ultra-thin display module with integrated driver IC provided by the present invention includes an LED light board, a driver IC board and a connection structure. Among them, the size of the LED light board is 320mm*180mm, and it is more flexible to use this module as a splicing unit of the LED display screen; the LED light board includes LED lamp beads arranged in an array, a PCB substrate, a bus transceiver, a scanning control IC, a constant current driver IC, an electrolytic capacitor, a magnetic suction sheet and a positioning sheet; the LED lamp beads adopt 1112 packaging specifications, the height is less than 1mm, and the thickness of the PCB substrate is 1.6mm, meeting the 320mm*180mm The strength requirements of the LED module specifications, the bus transceiver, scanning control IC, constant current drive IC, electrolytic capacitor, magnetic suction sheet and positioning sheet mounted on the PCB substrate, the maximum height is the electrolytic capacitor, the height is 5mm; the driver IC board includes a PCB substrate, a main control driver IC, a floating connector, DC / DC-1, DC / DC-2 and other necessary electronic components such as resistors, capacitors, inductors, etc.; the thickness of the PCB substrate is 1.2mm, the main control driver IC, floating connector, DC / DC-1, DC / DC-2 and other necessary electronic components such as resistors, capacitors, inductors, etc. mounted on the PCB substrate, the maximum height is the floating connector-female seat, the height is 4.9mm, and the combined height of the male and female seats of the floating connector is 6mm; the display device is made of 1.6mm thick die-cast aluminum. From the above, it can be seen that an integrated The maximum thickness of the ultra-thin LED display module of the driver IC is 8.8mm (1mm+1.6mm+5mm+1.2mm), and the maximum thickness of the ultra-thin LED display device is 11.4mm (1mm+1.6mm+6mm+1.2mm+1.6mm); compared with the 28mm thickness of the traditional die-cast aluminum box, the thickness is optimized by about 2.5 times; the power supply connections between the LED modules all use a 48V DC power supply, which greatly reduces the power loss and safety of the power supply process between modules; in addition, a single LED module uses a DC / DC-1 48V to 5V DC voltage regulator IC and a DC / DC-2 5V to 3.3V DC voltage regulator IC, using step-by-step level conversion, and the conversion efficiency of the two ICs is as high as over 95%, which greatly reduces the power consumption loss on a single LED module and achieves a high efficiency energy-saving effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is the planar structure diagram of the LED module;

[0014] Figure 2 This is the main control chip framework flow chart of the LED module;

[0015] Figure 3 This is the Pinmap diagram of the driver IC board;

[0016] Figure 4It is a structural diagram of an LED display device;

[0017] Figure 5 It is a cross-sectional view of the LED display device along AB. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] The present invention provides an LED ultra-thin display module with an integrated driver IC, as shown in the attached Figure 1 As shown, it includes an LED light board, a driver IC board and a connection structure; the LED light board includes LED lamp beads, a PCB substrate, a bus transceiver, a scanning control IC, a constant current output driver IC, an electrolytic capacitor, a magnetic sheet and a positioning sheet; the LED lamp beads are mounted on the TOP surface of the PCB substrate and arranged in an array; the bus transceiver, the scanning control IC, the constant current driver IC, the electrolytic capacitor, the magnetic sheet and the positioning sheet are mounted on the BOTTOM surface of the PCB substrate;

[0020] The selection of LED lamp beads can be based on the size and resolution of the LED display screen, and lamp beads with different dot pitches or different package sizes can be flexibly selected. In this embodiment, the dot pitch of P1.538 is introduced, and the height of the lamp beads is less than 1mm; the PCB substrate is selected as a FR4 substrate with a high TG value and a thickness of 1.6mm; the size adopts the standard 16:9 golden horizontal and vertical ratio of 320mm*180mm; the bus transceiver provides driving force for the RGB data group and control signal, and the model is ICND74HC245TS; the scanning control IC is the row driver tube of the LED lamp bead, which integrates the serial decoding circuit and the power PMOS tube internally, and the model is ICND2018; the constant current output driver IC is the column driver IC of the LED lamp bead, with a built-in 16-channel PWM constant current output, and the model is ICND1065S; the electrolytic capacitor adopts a 220uF10V specification, and the magnetic suction sheet and the positioning sheet are both welded to the PCB substrate through the SMT production process for connection with the module back shell.

[0021] The driver IC board includes a PCB substrate, a main control driver IC, a floating connector, DC / DC-1, DC / DC-2 and other necessary electronic components such as resistors, capacitors, inductors, etc. The PCB substrate selects a ceramic substrate with high stability and high thermal conductivity, with a thickness of 1.2mm and a size of 160mm*40mm. The main control driver IC is the core IC of the receiving module, which is used to receive the data and control signals output by the decoding sending box, and parse the received private protocol into an RGB data group, and synchronously transmit the data and control signals to the next-level LED module. The model is ICND6603. The floating connector is an interface component interconnected between the LED modules, which is used to provide the required power supply and signal to the LED module. DC / DC-1 is a 48V to 5V DC voltage regulator IC, which can support a maximum current output of 20A and a conversion efficiency of 95%, and is used to power the LED light board. DC / DC-2 is a 5V to 3.3V DC voltage regulator IC with a conversion efficiency of 96%, which is used to power the ICND6603 main control driver IC.

[0022] like Figure 2 The detailed working process of the driving IC board on the LED module shown in the figure; for the power supply part, an AC-DC power supply module is used outside the module to provide a 48V DC power supply, which is connected to the LED module through a floating connector, and passes through a DC / DC-1 DC voltage regulator IC to achieve the first-level level conversion from 48V to 5V. Part of this power supply is directly provided to the LED lamp board through the stamp hole pad to power the LED lamp beads and row and column driver ICs (bus transceiver, scan control IC, constant current output driver IC), and part of it flows into the DC / DC-2 DC voltage regulator IC to achieve the second-level level conversion from 5V to 3.3V. This part of the power supply mainly powers the main control driver IC; the LED module adopts step-by-step level conversion, and the conversion efficiency of the two ICs is as high as more than 95%, which greatly reduces the power loss on a single LED module and achieves a high-efficiency energy-saving effect. In the signal part, the video data stream to be played outside the module is input to the main control driver IC through an external decoding and sending device. The main control driver IC implements the analysis of the private encryption protocol internally, converts it into RGB data groups and control signals, and directly gives it to the LED light board through the stamp hole pad. After passing through the row and column driver IC, the data content is displayed on the LED lamp beads; in addition, the main control driver IC will encrypt and output the data except the display content of the module to the next-level LED module.

[0023] As attached Figure 3As shown in the figure, it is the connection structure between the LED light board and the driver IC board. To facilitate the welding process, the driver IC board adopts the stamp hole pad method. The driver IC board is mounted on the BOTTOM surface of the PCB substrate through the SMT production process, and the two are electrically connected. The main control driver IC adopts the ICND6603 model, the DC / DC-1 adopts the JWH6344A model, and the DC / DC-2 adopts the TMI3411 model. The LED light board is designed with corresponding square pads for the electrical connection between the two; each LED module uses two groups of RGB data groups, and the control signals and the control signals and the power supply are isolated by GND pads. In addition, to facilitate the wiring of the LED light board, the RGB data group, control signal and power supply are placed on the left side of the driver IC board, and the GND pad is designed on the right side. On the one hand, it increases the firmness of the driver IC board and the LED light board, and on the other hand, it can enhance the ESD protection effect between the two boards.

[0024] The structure of the LED display device is shown in the attached Figure 4 As shown, it mainly includes an LED ultra-thin module with integrated driver IC and a corresponding die-cast aluminum back shell. The two are precisely locked in position by positioning sheets and positioning columns, and connected by magnetic sheets and magnetic columns. The specific connection method is that point A of the LED module corresponds to point A' of the module back shell, point B corresponds to point B', point C corresponds to point C', and point D corresponds to point D'. It can be seen from this connection that, except for the LED lamp beads and the PCB substrate, the rest of the LED module is embedded in the cavity of the module back shell. According to the height of the LED lamp beads (1mm), the thickness of the PCB substrate of the LED lamp board (1.6mm), the combined height of the floating connector (6mm), the thickness of the PCB substrate of the driver IC board (1.2mm) and the die-cast aluminum thickness of the module back shell (1.6mm), the total thickness of an LED ultra-thin display device with integrated driver IC is 11.4mm; compared with the 28mm of the traditional die-cast aluminum box, the thickness is optimized by about 2.5 times.

[0025] In order to understand the internal structure of the LED ultra-thin display device more clearly, Figure 3 The cross-sectional view of the AB axis (A'-B' axis) is shown in the attached figure. Figure 5 As shown; it can be seen that the thickness of the LED display device is indeed composed of the height of the LED lamp beads, the thickness of the PCB substrate of the LED lamp board, the height of the floating connector, the thickness of the PCB substrate of the driver IC board, and the thickness of the die-cast aluminum of the module back shell.

[0026] The above description is only a preferred embodiment of the present invention, which is only used to illustrate the technical solution of the present invention, and is not used to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. An LED ultra-thin display module with integrated driver IC, characterized in that: Including LED light board, driver IC board and connection structure; The LED light board includes LED lamp beads, PCB substrate, bus transceiver, scanning control IC, constant current output driver IC, electrolytic capacitor, magnetic sheet and positioning sheet; LED lamp beads are mounted on the TOP surface of the PCB substrate and arranged in an array; bus transceiver, scanning control IC, constant current driver IC, electrolytic capacitor, magnetic sheet and positioning sheet are mounted on the BOTTOM surface of the PCB substrate; The driver IC board includes PCB substrate, main control driver IC, floating connector, DC / DC-1, DC / DC-2; The connection structure is a stamp hole pad between the LED light board and the driver IC board. The driver IC board is mounted on the BOTTOM surface of the PCB substrate through the SMT production process, and the two are electrically connected.

2. The display module according to claim 1, characterized in that: The main control driver IC uses the ICND6603 model, the DC / DC-1 uses the JWH6344A model, and the DC / DC-2 uses the TMI3411 model.

3. The display module according to claim 1, characterized in that: An AC-DC power module is used outside the module to provide a 48V DC power supply, which is connected to the LED module through a floating connector. After passing through the DC / DC-1 DC voltage regulator IC, the first-level level conversion from 48V to 5V is achieved. Part of this power is directly provided to the LED lamp board through the stamp hole pad to power the LED lamp beads and row and column driver ICs; the other part flows into the DC / DC-2 DC voltage regulator IC to achieve the second-level level conversion from 5V to 3.3V. This part of the power is used to power the main control driver IC.

4. The display module according to claim 3, characterized in that: The row and column driver IC includes a bus transceiver, a scan control IC, and a constant current output driver IC.

5. The display module according to claim 3, characterized in that: The video data stream to be played outside the module is input to the main control driver IC through an external decoding and sending device. The main control driver IC implements the analysis of the private encryption protocol internally, converts it into RGB data group and control signal, and directly sends it to the LED light board through the stamp hole pad. After the row and column driver IC, the data content is displayed on the LED lamp beads; In addition, the main control driver IC will encrypt and output the data except the display content of the module to the next-level LED module.

6. The display module according to claim 1, characterized in that: The connection structure uses a stamp hole pad on the driver IC board, and a corresponding square pad is designed on the LED light board for electrical connection between the two; each LED module uses two groups of RGB data, and GND pads are used to isolate the control signals and between the control signals and the power supply.

7. The display module according to claim 6, characterized in that: The RGB data group, control signal and power supply are all placed on the left side of the driver IC board, and the right side is designed with the corresponding GND pad.

8. The display module according to claim 1, characterized in that: It also includes an LED display device structure, including an LED ultra-thin module with an integrated driver IC and a corresponding die-cast aluminum rear shell. The two are locked in position with positioning plates and positioning columns, and are connected with magnetic plates and magnetic columns.

9. The display module according to claim 8, characterized in that: Except for the LED lamp beads and PCB substrate, the rest of the LED module is embedded in the cavity of the module back shell, which is calculated based on the LED lamp bead height, the PCB substrate thickness of the LED light board, the floating connector height, the PCB substrate thickness of the driver IC board, and the die-cast aluminum thickness of the module back shell.

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