Assembly detection device and detection method for MEMS probe card
By designing an assembly detection device for MEMS probe cards, the problems of low detection efficiency and vulnerability in the prior art are solved by using support, lifting and detection mechanisms, and fast and accurate probe status detection is achieved.
Patent Information
- Application Number
- CN202510088339.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-04-25
AI Technical Summary
The prior art is inefficient and easily leads to accidental injury of the probe when detecting the assembly quality of the MEMS probe card, especially when the PH module is repeatedly disassembled and assembled.
An assembly detection device is designed, including a support mechanism, a lift mechanism and a detection mechanism. The MEMS probe card is fixed by a support mechanism, the lifting mechanism adjusts the contact between the conductive plate and the probe, and the detection mechanism uses a pressure sensor and a dial gauge to detect the state of the probe.
It realizes rapid and convenient detection of the on-off state and stuck state of the probe, avoids the risk of repeated disassembly and assembly, improves detection efficiency, and reduces the damage to the probe.
Smart Images
Figure CN119881774A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of probe card detection, and in particular to an assembly detection device and a detection method for a MEMS probe card. Background Art
[0002] Normally, the number of implanted pins in the PH module of a single MEMS probe card ranges from several thousand pins to tens of thousands of pins. Due to the processing and assembly errors between the probes and the PH, it is difficult to avoid individual probes being stuck, short-circuited or open-circuited due to poor processing or assembly when such a large number of probes are assembled on the PH module of the probe card. Therefore, effective and accurate identification of bad probes is an important part of the manufacturing process of the probe card. The traditional detection method is to assemble the PH module onto the entire card PCB after processing, and then use a professional testing machine to detect the continuity of each probe. After identifying the abnormal probe, the PH module is removed and the probe is replaced, and then the detection process is repeated until there are no abnormal probes. This method requires repeated disassembly and assembly of the PH module, which increases the risk of accidental damage to the probe, and is completely dependent on dedicated testing machines, with very low detection efficiency. Summary of the invention
[0003] In order to solve the above-mentioned technical problems, the purpose of the present application is to provide an assembly detection device for a MEMS probe card, and at the same time to provide a detection method for a MEMS probe card, so as to conveniently and quickly detect a plurality of probes assembled on a PH module.
[0004] To achieve the above-mentioned purpose, the present application adopts the following technical solution: an assembly detection device for a MEMS probe card, the MEMS probe card comprising a PH module and a plurality of probes assembled on the PH module, the assembly detection device comprising: A support mechanism, used to support and fix the MEMS probe card, the support mechanism comprising a horizontally extending support plate, a notch is provided in the middle of the support plate, the PH module is fixed above the support plate, and the plurality of probes are concentrated at the notch; A vertical lifting platform, located below the support plate, capable of being lifted up and down; and The detection mechanism includes a pressure sensor installed on the vertical lifting platform, a conductive plate installed on the top of the pressure sensor, and a micrometer in contact with the vertical lifting platform. The conductive plate can contact the plurality of probes at the notch by lifting and lowering the vertical lifting platform; the pressure sensor is used to detect and display the pressure between the conductive plate and the plurality of probes; and the micrometer is used to detect and display the lifting and lowering distance of the conductive plate.
[0005] In a possible implementation, the conductive plate can be externally connected to a multimeter or a resistance measuring instrument.
[0006] In a possible implementation, the conductive plate is parallel to the support plate and is configured to pass through the gap.
[0007] In a possible implementation, the support mechanism also includes a base, four support columns and a fixing assembly, wherein the base is located below the support plate; the four support columns are connected to the four corners of the support plate in parallel with each other and are fixed to the base; and the fixing assembly is installed on the top of the support plate.
[0008] In one possible implementation, the fixing assembly includes a pressing plate and a pair of supports, wherein the pair of supports are relatively arranged on both sides of the notch to support the PH module, and the pressing plate is configured to press the PH module onto the pair of supports from above the PH module, and the pressing plate is cooperatively connected with the pair of supports.
[0009] In one possible implementation, a lifting assembly is connected to the bottom of the vertical lifting platform, and the lifting assembly includes a lower bottom plate fixedly mounted on the base, a pair of rotating arms cross-connected in the middle, and an adjusting knob, the top of the pair of rotating arms is hinged to the vertical lifting platform, the bottom of the pair of rotating arms is hinged to the lower bottom plate, and the adjusting knob is transmission-connected to the pair of rotating arms to adjust the angle between the pair of rotating arms.
[0010] In a possible implementation, the micrometer is mounted on the base via a support frame, the probe of the micrometer is located above the vertical lifting platform and in contact with the upper surface of the vertical lifting platform, and the probe of the micrometer can move in the up and down directions relative to the support frame.
[0011] To achieve the above object, the present application also provides a detection method for a MEMS probe card, wherein the PH module is provided with a plurality of through holes vertically extending from top to bottom, the plurality of probes are respectively inserted into the plurality of through holes, and the plurality of probes are frictionally connected to the PH module. The detection method is implemented by the above assembly detection device, and includes: S1, fix the MEMS probe card on the support plate, and align the tips of several probes with the notches on the support plate; S2, driving the vertical lifting platform to rise to approach the MEMS probe card until the pressure sensor displays a pressure value change, and recording the reading of the micrometer at this time as 0; continuing to lift the vertical lifting platform so that the conductive platform lifts several probes to a fixed height; S3, placing the entire assembly inspection device under a microscopic observation device, measuring the height change of the needle tail of each probe one by one, and comparing the height change of the needle tail with the fixed height of several probes; S4, connecting the conductive plate to a multimeter or a resistance measuring instrument, and using the measuring probe of the multimeter or the resistance measuring instrument to contact the needle tails of a plurality of probes one by one to detect the resistance of each probe; S5, drive the vertical lifting platform to descend, remove the MEMS probe card from the supporting mechanism for needle replacement and maintenance; repeat the above steps until all probes are qualified.
[0012] Compared with the prior art, the present invention has the following beneficial effects: The present application detects whether the probe is stuck by measuring the consistency of the height of the needle tail after the needle tip is lifted, and then checks the on-off state of the probe by measuring the resistance value of each probe. The assembly detection device has a simple structure and convenient operation. The detection method has simple steps and efficient detection. There is no need to repeatedly disassemble and assemble the PH module to avoid accidental damage to the probe. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 A schematic diagram of the three-dimensional structure of an assembly detection device provided in an embodiment of the present application; Figure 2 for Figure 1 A side view of the assembly detection device in FIG. Figure 3 for Figure 1 A schematic diagram of a structure in which a MEMS probe card is assembled on a fixed component; Figure 4 for Figure 1 Schematic diagram of the three-dimensional structure of the support plate; Figure 5 A schematic diagram of a three-dimensional structure of a conductive plate, a pressure sensor and a mounting plate provided in an embodiment of the present application; Figure 6 for Figure 1 Schematic diagram of the three-dimensional structure in which the micrometer is installed on the support frame.
[0014] Among them: 1. MEMS probe card; 11. PH module; 12. probe; 10. assembly detection device; 2. support mechanism; 21. base; 22. support column; 23. support plate; 230. notch; 24. fixing component; 241. pressure plate; 242. support; 3. lifting mechanism; 31. vertical lifting platform; 32. lifting component; 321. adjustment knob; 322. inner rotating arm; 323. outer rotating arm; 324. lower bottom plate; 4. detection mechanism; 41. pressure sensor; 42. conductive plate; 420. connecting hole; 43. micrometer; 431. probe; 44. mounting plate; 45. support frame; 451. circular chassis; 452. vertical column; 453. micrometer clamp. DETAILED DESCRIPTION
[0015] To describe the technical content, structural features, achieved purpose and effect of the application in detail, the technical solutions in the embodiments of the application will be described below in conjunction with the drawings in the embodiments of the application. Obviously, the described embodiments are only a part of the embodiments of the application, rather than all of the embodiments. In the following description, for the purpose of explanation, many specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments may also be implemented without these specific details or in the case of one or more equivalent arrangements. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.
[0016] The present application provides an assembly inspection device for a MEMS probe card, through which an operator inspects the assembled MEMS probe card and can promptly perform repairs after an abnormal probe is detected.
[0017] like Figure 3 As shown, the MEMS probe card 1 generally includes a PH module 11 and a plurality of probes 12 assembled on the PH module 11. The PH module 11 is provided with a plurality of through holes vertically penetrating from top to bottom. The plurality of probes 12 are respectively inserted into the plurality of through holes and are retained on the PH module 11 by friction.
[0018] like Figure 1 As shown, the assembly detection device 10 includes: a supporting mechanism 2 , a lifting mechanism 3 and a detection mechanism 4 .
[0019] like Figure 1-4As shown, the support mechanism 2 is used to support and fix the MEMS probe card 1, and the support mechanism 2 includes a base 21, four support columns 22, a support plate 23 and a fixing assembly 24. The base 21 extends horizontally, and a plurality of mounting holes are provided on the base 21; the support plate 23 is parallel to the base 21 and is located above the base 21, and a square notch 230 is provided in the middle of the support plate 23; the four support columns 22 are connected to the four corners of the support plate 23 in parallel with each other, and are all fixed to the base 21 through mounting holes; the fixing assembly 24 is installed on the top of the support plate 23. The fixing assembly 24 includes a pressing plate 241 and a pair of supports 242. The pair of supports 242 are relatively arranged on both sides of the notch 230 for supporting the PH module 11 above the support plate 23. The pressing plate 241 presses the PH module 11 onto the pair of supports 242 from above the PH module 11. The pressing plate 241 is cooperatively connected with the pair of supports 242, so as to lock the PH module 11 equipped with a plurality of probes 12 onto the support plate 23. The plurality of probes 12 are concentrated at the notch 230, and the needle tips of the plurality of probes 12 are all facing the notch 230.
[0020] The lifting mechanism 3 is installed on the base 21, and the lifting mechanism 3 includes a vertical lifting platform 31 and a lifting assembly 32. The vertical lifting platform 31 is installed below the support plate 23 so as to be movable in the up and down directions. The lifting assembly 32 is used to drive the vertical lifting platform 31 to lift and lower in the up and down directions.
[0021] The lifting assembly 32 includes an adjusting knob 321, an inner rotating arm 322 and an outer rotating arm 323 cross-connected in the middle, and a lower base plate 324 fixedly mounted on the base 21. The tops of the inner rotating arm 322 and the outer rotating arm 323 are hinged to the vertical lifting platform 31, and the bottoms of the inner rotating arm 322 and the outer rotating arm 323 are hinged to the lower base plate 324.
[0022] The top of the outer rotating arm 323 can move back and forth along the first straight line X1 relative to the vertical lifting platform 31, so as to approach and move away from the top of the inner rotating arm 322. The bottom of the inner rotating arm 322 can move back and forth along the second straight line X2 relative to the lower bottom plate 324, so as to approach and move away from the bottom of the outer rotating arm 323. The first straight line X1 and the second straight line X2 are parallel to each other, and the inner rotating arm 322 and the outer rotating arm 323 have a rotation axis X3 at the intersection in the middle, and the inner rotating arm 322 and the outer rotating arm 323 rotate around the rotation axis X3 at the same time, and the rotation axis X3 is perpendicular to the first straight line X1 and the second straight line X2 at the same time.
[0023] The adjusting knob 321 is transmission connected to the top of the outer rotating arm 323. When the adjusting knob 321 is rotated, the top of the outer rotating arm 323 slides along the first straight line X1, and the outer rotating arm 323 and the inner rotating arm 322 rotate around the rotation axis X3 at the same time. The angle between the outer rotating arm 323 and the inner rotating arm 322 is adjusted, and the vertical lifting platform 31 moves in the up and down directions under the action of the outer rotating arm 323 and the inner rotating arm 322.
[0024] like Figure 1 , 5 As shown in FIGS. 6 and 7 , the detection mechanism 4 includes a pressure sensor 41 installed on the vertical lifting platform 31 , a conductive plate 42 installed on the top of the pressure sensor 41 , and a micrometer 43 in contact with the vertical lifting platform 31 .
[0025] The conductive plate 42 can contact with the plurality of probes 12 at the notch 230 by the vertical lifting platform 31. The conductive plate 42 is parallel to the support plate 23 and is configured to pass through the notch 230 so as to contact with the plurality of probes 12. A connection hole 420 is provided on the side of the conductive plate 42. A wire is connected to the connection hole 420. The conductive plate 42 is connected to a multimeter or a resistance measuring instrument through the wire to detect whether the resistance of each probe 12 is abnormal when the conductive plate 42 contacts with the plurality of probes 12.
[0026] The pressure sensor 41 is fixedly mounted on the top of the vertical lifting platform 31 through a mounting plate 44. The pressure sensor 41 is used to detect and display the pressure between the conductive plate 42 and a plurality of probes 12, so that the operator can promptly find out whether the conductive plate 42 contacts the probes 12.
[0027] The micrometer 43 is used to detect and display the lifting distance of the conductive plate 42. The micrometer 43 is installed on the base 21 through a support frame 45. The micrometer 43 is located above the vertical lifting platform 31. The probe 431 of the micrometer 43 contacts the upper surface of the mounting plate 44 on the vertical lifting platform 31. When the vertical lifting platform 31 moves up and down, the probe 431 of the micrometer 43 can move along the vertical direction relative to the support frame 45 with the vertical lifting platform 31. The support frame 45 includes a circular base 451, a vertical column 452 and a micrometer clamp 453. The circular chassis 451 is fixedly mounted on the base 21 by a plurality of mechanical fasteners. The vertical column 452 is vertically plugged into the circular chassis 451. One end of the micrometer clamp 453 is clamped and connected to the vertical column 452 by a plurality of mechanical fasteners, and the other end is connected to the micrometer 43. The probe 431 of the micrometer can be inserted into the micrometer clamp 453 so as to move up and down. The micrometer clamp 453 is vertically arranged to the vertical column 452.
[0028] The present application also provides a detection method for a MEMS probe card, which is implemented by the above-mentioned assembly detection device 10, and the assembly detection device 10 includes: S1, fix the MEMS probe card on the support plate, and align the tips of several probes with the notches on the support plate; S2, driving the vertical lifting platform to rise to approach the MEMS probe card until the pressure sensor displays a pressure value change, and recording the reading of the micrometer at this time as 0; continuing to lift the vertical lifting platform so that the conductive platform lifts several probes to a fixed height; S3, placing the entire assembly inspection device under a microscopic observation device, measuring the height change of the needle tail of each probe one by one, and comparing the height change of the needle tail with the fixed height of several probes; S4, connecting the conductive plate to a multimeter or a resistance measuring instrument, and using the measuring probe of the multimeter or the resistance measuring instrument to contact the needle tails of a plurality of probes one by one to detect the resistance of each probe; S5, drive the vertical lifting platform to descend, remove the MEMS probe card from the supporting mechanism for needle replacement and maintenance; repeat the above steps until all probes are qualified.
[0029] In step S3, when it is found that the height change of the needle tail is less than the fixed height, it means that the friction of the probe in the through hole of the PH module is too large, and a jam occurs. The jammed probe needs to be removed in step S5 and replaced.
[0030] In step S4, when the multimeter or resistance measuring instrument detects that the resistance value of a certain probe is too large, it can be determined that the probe is abnormal and needs to be removed and replaced in step S5.
[0031] The present application detects whether the probe is stuck by measuring the consistency of the height of the needle tail after the needle tip is lifted, and then checks the on-off state of the probe by measuring the resistance value of each probe. The assembly detection device has a simple structure and convenient operation. The detection method has simple steps and efficient detection. There is no need to repeatedly disassemble and assemble the PH module to avoid accidental damage to the probe.
[0032] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present application. Without departing from the spirit and scope of the present application, the present application may have various changes and improvements, and the scope of protection required by the present application is defined by the attached claims, description and their equivalents.
Claims
1. An assembly detection device for a MEMS probe card, the MEMS probe card comprising a PH module and a plurality of probes assembled on the PH module, characterized in that: The assembly detection device comprises: A support mechanism, used to support and fix the MEMS probe card, the support mechanism comprising a horizontally extending support plate, a notch is provided in the middle of the support plate, the PH module is fixed above the support plate, and the plurality of probes are concentrated at the notch; A vertical lifting platform, located below the support plate, capable of being lifted up and down; and The detection mechanism includes a pressure sensor installed on the vertical lifting platform, a conductive plate installed on the top of the pressure sensor, and a micrometer in contact with the vertical lifting platform. The conductive plate can contact the plurality of probes at the notch by lifting and lowering the vertical lifting platform; the pressure sensor is used to detect and display the pressure between the conductive plate and the plurality of probes; and the micrometer is used to detect and display the lifting and lowering distance of the conductive plate.
2. The assembly detection device according to claim 1, characterized in that: The conductive plate can be externally connected to a multimeter or a resistance measuring instrument.
3. The assembly detection device according to claim 1, characterized in that: The conductive plate is parallel to the supporting plate and is configured to pass through the gap.
4. The assembly detection device according to claim 1, characterized in that: The support mechanism also includes a base, four support columns and a fixing assembly, wherein the base is located below the support plate; the four support columns are connected to the four corners of the support plate in parallel with each other and are fixed on the base; the fixing assembly is installed on the top of the support plate.
5. The assembly detection device according to claim 4, characterized in that: The fixing assembly includes a pressing plate and a pair of supports, wherein the pair of supports are arranged relatively on both sides of the notch to support the PH module, and the pressing plate is configured to press the PH module onto the pair of supports from above the PH module, and the pressing plate is cooperatively connected with the pair of supports.
6. The assembly detection device according to claim 4, characterized in that: A lifting assembly is connected to the bottom of the vertical lifting platform, and the lifting assembly includes a lower base plate fixedly mounted on the base, a pair of rotating arms cross-connected in the middle, and an adjusting knob. The top of the pair of rotating arms is hinged to the vertical lifting platform, and the bottom of the pair of rotating arms is hinged to the lower base plate. The adjusting knob is transmission-connected to the pair of rotating arms to adjust the angle between the pair of rotating arms.
7. The assembly detection device according to claim 4, characterized in that: The micrometer is installed on the base through a support frame. The probe of the micrometer is located above the vertical lifting platform and contacts the upper surface of the vertical lifting platform. The probe of the micrometer can move in the up and down directions relative to the support frame.
8. A detection method for a MEMS probe card, wherein the PH module is provided with a plurality of through holes extending vertically upward and downward, the plurality of probes are respectively inserted into the plurality of through holes, and the plurality of probes are frictionally connected to the PH module, characterized in that: The detection method is implemented by the assembly detection device according to claim 1, comprising: S1, fix the MEMS probe card on the support plate, and align the tips of several probes with the notches on the support plate; S2, driving the vertical lifting platform to rise to approach the MEMS probe card until the pressure sensor displays a pressure value change, and recording the reading of the micrometer at this time as 0; continuing to lift the vertical lifting platform so that the conductive platform lifts several probes to a fixed height; S3, placing the entire assembly inspection device under a microscopic observation device, measuring the height change of the needle tail of each probe one by one, and comparing the height change of the needle tail with the fixed height of several probes; S4, connecting the conductive plate to a multimeter or a resistance measuring instrument, and using the measuring probe of the multimeter or the resistance measuring instrument to contact the needle tails of a plurality of probes one by one to detect the resistance of each probe; S5, drive the vertical lifting platform to descend, remove the MEMS probe card from the supporting mechanism for needle replacement and maintenance; repeat the above steps until all probes are qualified.