A copolyimide film with low dielectric constant and low thermal expansion coefficient and a method for preparing the same

By introducing ortho-hydroxyl groups into the main chain and converting them into oxazole rings, combined with cage-type polysilsesquioxane end-capping agents, a copolymerized polyimide film with low dielectric constant and low thermal expansion coefficient was prepared, which solved the problem of difficulty in simultaneously achieving low dielectric constant and low thermal expansion coefficient in the existing technology, improved the structure and thermal stability of the film, and reduced the dielectric constant.

CN119931110BActive Publication Date: 2025-10-10HEFEI UNIV OF TECH
2 Cites 0 Cited by

Patent Information

Application Number
CN202510160246.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-13
Publication Date
2025-10-10
Estimated Expiration
2045-02-13

AI Technical Summary

Technical Problem

It is difficult for existing polyimide films to achieve both low dielectric constant and low thermal expansion coefficient simultaneously, and existing methods can lead to a decrease in mechanical properties or an increase in thermal expansion coefficient.

Method used

By introducing ortho-hydroxyl groups into the main chain and converting them into oxazole rings through thermal rearrangement reaction, combined with the use of cage-shaped polysilsesquioxane as a capping agent, a copolymerized polyimide film with low dielectric constant and low thermal expansion coefficient was prepared.

Benefits of technology

A copolymerized polyimide film with a dielectric constant of 2.7-3.0 and a thermal expansion coefficient of 19.5-26.5 ppm/K was achieved, which enhanced the structural stability and thermal stability while reducing the dielectric constant.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The application discloses a kind of copolymer polyimide film of low dielectric constant and low thermal expansion coefficient and preparation method thereof, comprising the following steps: 0.019-0.021 mol aromatic dianhydride, 0.017-0.023 mol diamine unit is reacted in 0.45-0.48 mol solvent, then 0.0004 mol end-capping agent dissolved in 0.13-0.15 mol solvent is added to react, to prepare main chain containing ortho-hydroxyl polyamic acid;Diamine unit includes 10% to 40% molar mass of main chain containing ortho-hydroxyl monomer and the balance of aromatic diamine;Polyamic acid is prepared into polyimide film by coating film, thermal imidization;Ortho-hydroxyl is heated to carry out thermal rearrangement reaction, to obtain main chain containing oxazole ring copolymer polyimide film.The dielectric constant of copolymer polyimide film prepared by the application is 2.7-3.0, and the thermal expansion coefficient is 19.5-26.5ppm / K.
Need to check novelty before this filing date? Find Prior Art