Miniature three-dimensional printing device

Abstract

A micro three-dimensional printing apparatus is provided. The micro three-dimensional printing apparatus includes: a micro LED display projector configured to emit image light; a material platform facing the micro LED display projector and configured to receive the image light; a movable printing plate configured to hold a three-dimensional printing object; and a moving mechanism connected with the movable printing plate and configured to move the movable printing plate.

Description

Technical Field

[0001] The present disclosure generally relates to three-dimensional printing technology, and more particularly, to a micro three-dimensional printing device. Background Art

[0002] The self-emitting micro LED display panel as a micro display module includes a micro LED (light emitting diode) array and an IC (integrated circuit) backplane, and the IC backplane is connected to each micro LED as a pixel in the micro LED array for image display. The semiconductor technology of the present invention can make the diameter of the micro LED less than 5 microns, thereby improving the integrity and image quality of the display panel compared with traditional display panels such as LCD (liquid crystal display).

[0003] Various technologies are used to manufacture three-dimensional structures. For example, a DLP (digital light processing) projector or a laser scanner is used in a three-dimensional printing device to cover a large area, and the resin reservoir is moved in the x-direction or y-direction accordingly. However, an alignment process is required to correct the tilt, position, and size of the projected image of the DLP projector or scanner. In addition, due to the volume of the DLP projector, the volume of the three-dimensional printing device cannot be reduced, which is not conducive to the miniaturization of the three-dimensional printing device and is difficult to be applied to portable devices.

[0004] The above contents are only used to help understand the technical solutions of the present disclosure and do not constitute an admission that the above contents are prior art. Summary of the invention

[0005] In order to overcome the above disadvantages, the present disclosure provides a micro 3D printing device and a manufacturing method thereof to reduce the size of the micro 3D printing device.

[0006] The embodiment of the present disclosure provides a micro three-dimensional printing device, which includes: a micro LED display projector configured to emit image light; a material platform facing the micro LED display projector and configured to receive the image light; a movable printing plate configured to hold a three-dimensional printing object; and a moving mechanism connected to the movable printing plate and configured to move the movable printing plate.

[0007] Numerous other advantages and features of the present disclosure will be further appreciated from the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Embodiments and various aspects of the present disclosure are presented in the following detailed description and accompanying drawings.The various features shown in the drawings are not drawn to scale.

[0009] Figure 1is a structural view of an exemplary micro 3D printing device according to some embodiments of the present disclosure.

[0010] Figure 2 is a cross-sectional structure of an exemplary micro display module according to some embodiments of the present disclosure.

[0011] Figure 3 is a cross-sectional structure illustrating an exemplary micro LED display projector according to some embodiments of the present disclosure.

[0012] Figure 4 is a schematic diagram of an exemplary image light rotation element according to some embodiments of the present disclosure.

[0013] Figure 5 An exemplary transmissive lens rotated about the X-axis according to some embodiments of the present disclosure is shown.

[0014] Figure 6 An exemplary transmissive lens rotated about the Y-axis according to some embodiments of the present disclosure is shown.

[0015] Figure 7 Schematic diagrams of exemplary microdisplay systems according to some embodiments of the present disclosure are shown.

[0016] Figure 8 A pixel region of a micro LED array according to some embodiments of the present disclosure is shown.

[0017] Fig. 9 The position of a pixel sub-image shifted from a target pixel point in a pixel area according to some embodiments of the present disclosure is shown.

[0018] Fig.10 A target image formed from target image data according to some embodiments of the present disclosure is shown.

[0019] Fig.11 The position of each sub-image displaced from the target image is shown according to some embodiments of the present disclosure.

[0020] Fig.12 The positions of sub-images displaced from a target image are shown according to some embodiments of the present disclosure.

[0021] Fig.13 is a formula relationship between the distance by which a sub-image is shifted from a target image and the rotation angle of a transmission lens based on a specific axis according to some embodiments of the present disclosure.

[0022] Fig.14A and Fig. 14BA flow chart of a micro-LED image display method according to some embodiments of the present disclosure is shown.

[0023] Fig.15 A block diagram showing a side cross-sectional view of an exemplary micro LED display panel according to some embodiments of the present disclosure is presented.

[0024] Fig.16 Some embodiments of the present disclosure are shown. Fig.15 A structural diagram of a top view of a micro LED display panel is shown in FIG.

[0025] Fig.17 Some embodiments of the present disclosure are shown. Fig.15 Structural diagram of a side cross-sectional view of a micro LED display chip shown in .

[0026] Fig.18 A block diagram showing a side cross-sectional view of another exemplary micro LED display panel according to some embodiments of the present disclosure is presented.

[0027] Fig.19 Some embodiments of the present disclosure are shown. Fig.18 A structural diagram of a top view of a micro LED display panel is shown in FIG.

[0028] Fig. 20 Some embodiments of the present disclosure are shown. Fig.18 A structural diagram of a side cross-sectional view of a variation of the exemplary micro LED display panel shown in FIG.

[0029] Fig.21 Some embodiments of the present disclosure are shown. Fig.18 A structural diagram of a side cross-sectional view of another variation of the exemplary micro LED display panel shown in FIG.

[0030] Fig. 22 Some embodiments of the present disclosure are shown. Fig.18 A structural diagram of a side cross-sectional view of another variation of the exemplary micro LED display panel shown in FIG.

[0031] Fig.23 A block diagram showing a side cross-sectional view of another exemplary micro LED display panel according to some embodiments of the present disclosure is presented.

[0032] Fig.24 Some embodiments of the present disclosure are shown. Fig.23 A structural diagram of a top view of a micro LED display panel is shown in FIG.

[0033] Fig.25 Some embodiments of the present disclosure are shown. Fig.23 A structural diagram of a side cross-sectional view of a variation of the exemplary micro LED display panel shown in FIG.

[0034] Fig.26 is a cross-sectional structural view of another micro LED display module according to some embodiments of the present disclosure.

[0035] Fig. 27 is a cross-sectional structural view of another micro LED display projector according to some embodiments of the present disclosure.

[0036] Fig.28 is a cross-sectional structural view of another micro LED display projector according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0037] Reference will now be made in detail to exemplary embodiments, examples of which are shown in the accompanying drawings. The following description refers to the accompanying drawings, in which the same numbers in different drawings represent the same or similar elements, unless otherwise indicated. The implementations set forth in the following description of the exemplary embodiments do not represent all implementations consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with the aspects listed in the appended claims and related to the present invention. Specific aspects of the present disclosure are described in more detail below. If there is a conflict with the terms and / or definitions incorporated by reference, the terms and definitions provided herein shall prevail.

[0038] Figure 1 is a structural view of an exemplary micro 3D printing device 100 according to some embodiments of the present disclosure. Figure 1As shown in , the three-dimensional printing device 100 includes a micro LED display projector 110, a material platform 120, a movable printing plate 130, and a moving mechanism 140. The micro three-dimensional printing device 100 further includes a moving controller (not shown), which is electrically connected to the moving mechanism 140 and controls the movement of the moving mechanism 140. The micro LED display projector 110 emits image light to the material platform 120. The material platform 120 faces the micro LED display projector 110 and includes a printing material. The movable printing plate 130 is used to hold a three-dimensional printing object A. The moving mechanism 140 is connected to the movable printing plate 130, and is used to move the movable printing plate 130 so that it faces the material platform 120, and when the printing process is performed, the three-dimensional printing object A can be printed on the movable printing plate 130. That is, the printing material can be cured with the image light emitted from the micro LED display projector 110, and formed layer by layer on the surface of the movable printing plate 130. In some embodiments, the three-dimensional printing device 100 can be a three-dimensional printing device with a top-down or bottom-up construction orientation. For ease of description, in the following description, a bottom-up directional three-dimensional printing device will be taken as an example for description.

[0039] The printing material in the material platform 120 can be selected from one or more photopolymer materials. For example, the photopolymer material includes one or more of a free radical photopolymer material, a cationic photopolymer material, or a styrene compound, a vinyl ether, etc. The free radical photopolymer material can be acrylic acid, methacrylic acid, N-vinyl pyrrolidone, acrylamide, styrene, olefins, halogenated olefins, cycloolefins, maleic anhydride, olefins, alkynes, etc. In some embodiments, the cationic photopolymer material can be an epoxide group and a vinyl ether group. Using the printing material, a three-dimensional object can be formed (e.g., printed) on the surface of the movable printing plate 130.

[0040] During the printing process, the 3D printing device 100 can print the 3D object layer by layer. Each printed layer can have the same or different thicknesses. Figure 1, in this example, the three-dimensional printed object A is printed on the bottom surface of the movable printing plate 130. The moving mechanism 140 can be connected to the movable printing plate 130 by one or more mechanical structures (such as screws) to move the movable printing plate 130, which is not limited herein. After printing one layer, the movable printing plate 130 can move upward by a distance of one layer. Then, the next layer of the three-dimensional object can be printed with a printed pattern generated by the image light emitted from the micro LED display projector 110. The micro LED display projector 110 can project the image / pattern layer by layer until the three-dimensional object is completely printed. It can now be understood that the image / pattern projected by the micro LED display projector 110 corresponds to the layer to be printed and is consistent with the movement of the movable printing plate 130. In some embodiments, the image light and movement of the movable printing plate can be controlled by a computer program, consistent with the design of the three-dimensional object to be printed.

[0041] In some embodiments, the material platform 120 is transparent. In some embodiments, the emitted light from the micro LED display projector 110 can be transmitted through the material platform 120 into the printed material. Figure 1 , the material platform 120 is formed above the micro LED display projector 110. Therefore, the emitted light from the micro LED display projector 110 can provide light to the printing material for curing the printing material during the three-dimensional printing process.

[0042] The moving controller is electrically connected to the moving mechanism 140 for controlling the movement of the moving mechanism 140. During the three-dimensional printing process, the movable printing plate 130 can be moved by the moving mechanism 140 to face the material platform 120 and the micro LED display projector 110. The focal plane of the micro LED display projector 110 is located on the surface of the material platform 120, for example, on the bottom surface for a bottom-up printing process, or on the top surface for a top-down printing process. In this example, the focal plane of the micro LED display projector 110 is located on the bottom surface of the material platform 120.

[0043] The micro LED display projector 110 may further include a micro LED display module for emitting light having a pattern. The micro LED display module may further include a micro LED display panel. The micro LED display panel may be an AM (active matrix) micro LED display panel or a PM (passive matrix) micro LED display panel. In order to cure the printed material, the wavelength of the light emitted from the micro LED display panel does not exceed 4430nm. In some embodiments, the emitted light is ultraviolet light.

[0044] Still reference Figure 1, a pocket bracket 150 is further provided to support the micro LED display projector 110 and the material platform 120. The micro LED display projector 110 is disposed in the pocket bracket 150, and the material platform 120 is disposed on the top of the pocket bracket 150. Through the pocket bracket 150, the micro LED display projector 110 and the material platform 120 can be integrated together. Therefore, the three-dimensional printing device 100 can be portable. In addition, a top opening opposite to the micro LED display projector 110 is formed on the top surface of the pocket bracket 150 to receive the material platform 120. The material platform 120 is disposed in the top opening.

[0045] Further details of a micro LED display projector including a micro LED display module will be further described below.

[0046] Figure 2 is a cross-sectional structure of an exemplary micro LED display module 200 according to some embodiments of the present disclosure. Figure 2, the micro LED display module 200 includes a micro LED display panel 210. The micro LED display module 200 also includes an image light rotation element 220. A reinforcing plate 250 is formed on the back of the micro LED display panel 210 for supporting the micro LED display panel 210. The mounting frame 240 connects the reinforcing plate 250 with the image light rotation element 220. In addition, the mounting frame 240 includes a first cavity 241 and a second cavity 242. The image light rotation element 220 is arranged in the first cavity 241, and the micro LED display panel 210 is arranged in the first cavity 241 facing the image light rotation element 220. In some embodiments, the micro LED display panel 210 is arranged at an edge of the first cavity 241, and the edge of the reinforcing plate 250 is adhered to one edge of the mounting frame 240 by a conventional bonding means (e.g., glue or any other adhesive). In addition, the first cavity 241 and the second cavity 242 are separated by an inner protrusion 243 protruding from the inner side wall of the mounting frame 240. In some embodiments, the internal protrusion 243 is formed on the inner wall of the mounting frame 240 as an annular protrusion. In some embodiments, the internal protrusion 243 may include a plurality of discrete segments. The first chamber 241 and the second chamber 242 are connected to form a light channel L through which the image light can be emitted, so the protrusion 243 cannot shield the image light emitted from the transmission lens (not shown). The edge of the image light rotation element 220 is adhered to one side wall of the internal protrusion 243 by conventional bonding means (e.g., glue or any other adhesive). The micro LED display panel 210 may further include an IC (integrated circuit) backplane and a micro LED array area having one or more micro LEDs. The micro LED array area is formed on the surface of the IC backplane, and each micro LED is electrically connected to the IC backplane. In some embodiments, the micro LED array area is bonded to the surface of the IC backplane in a metal bonding manner.

[0047] Figure 3 is a cross-sectional structure showing an exemplary micro LED display projector 300 according to some embodiments of the present disclosure. Figure 3, the above-mentioned micro LED display module 200 can be embedded in the micro display projector 300. In some embodiments, the micro LED display projector 300 includes the aforementioned micro LED display module 200 and a lens group 330. The lens group 330 is arranged facing the micro LED display module 200 for receiving the image light emitted from the micro LED display module 200. The lens group 330 is arranged and supported in the column structure. The edge 331 of the column structure is fixed on the mounting frame 240. In addition, the edge 331 of the column structure is inserted and adhered to the other side wall of the protrusion 243 in the second chamber 242. In addition, the body of the column structure extends to the outside of the second chamber 242. In some embodiments, the diameter of at least one lens of the lens group 330 is not less than the diagonal length of the micro LED array area, and is not less than the diameter length of the transmission lens (not shown). In some embodiments, the micro LED display module 200 further includes a control unit 260. The control unit 260 is electrically connected to the micro LED display panel 210 and the image light rotation element 220.

[0048] Figure 4 is a schematic diagram of an exemplary image light rotation element 220 according to some embodiments of the present disclosure. Figure 4 The image light rotating element 220 includes a transmissive lens 221 and a lens position rotating actuator 222. The transmissive lens 221 is arranged to face the micro LED array area. Figure 2 The lens position rotation actuator 222 is connected to the transmission lens 221 via at least one preset axis. In some embodiments, the preset axis is parallel to the micro LED array area. In some embodiments, as Figure 4 As shown, the preset axes include an X-axis and a Y-axis.

[0049] Figure 5 A transmissive lens 221 is shown configured to rotate about an X-axis according to some embodiments of the present disclosure. Figure 5 , the transmissive lens 221 can be rotated by a lens position actuator (e.g., Figure 4 The lens position rotation actuator 222 in the embodiment of the present invention rotates the transmissive lens 221 around the X-axis. For example, the lens position rotation actuator generates a magnetic field to rotate the transmissive lens 221 around the X-axis, which can be understood by those skilled in the art and will not be described here. In some embodiments, the X-axis is parallel to the micro LED array area in the first direction.

[0050] Figure 6 A transmissive lens 221 is shown configured to rotate about the Y axis according to some embodiments of the present disclosure. Figure 6 , the transmissive lens 221 can be further rotated by a lens position actuator (e.g., Figure 2The lens position rotation actuator 222 in the embodiment of the present invention rotates about the Y axis. For example, the lens position rotation actuator generates a magnetic field to rotate the transmission lens 221 about the Y axis, which can be understood by those skilled in the art and will not be described here. As disclosed herein, the Y axis is parallel to the micro LED array area in the second direction. The first direction is not parallel to the second direction. In some embodiments, the first direction is perpendicular to the second direction, so the X axis is perpendicular to the Y axis. For example, the X axis is along the horizontal direction, and the Y axis is along the vertical direction.

[0051] refer to Figure 5 and Figure 6 , the rotation angle of the transmission lens 221 can be designed to be +X° (around the X axis), -X° (around the X axis), +Y° (around the Y axis), and -Y° (around the Y axis). In some embodiments, X° is not greater than 15°, and Y° is not greater than 15°. In three-dimensional space, the rotation angle of the transmission lens 221 can be (-X°, +Y°), (+X°, +Y°), (+X°, -Y°), and (-X°, -Y°).

[0052] In some embodiments, the micro LED display module further includes an actuator controller electrically connected to the lens position rotation actuator 222, which is used to control the rotation direction and rotation frequency of the lens position rotation actuator 222, so that the transmission lens 221 can be rotated at different angles around the X-axis and / or Y-axis, and the emitted light of each pixel of the micro LED display panel 210 can be shifted at different positions to increase the resolution of the pixel.

[0053] Figure 7 A schematic diagram of an exemplary microdisplay system 700 according to some embodiments of the present disclosure is shown. Figure 7, the above-mentioned micro LED display module can be applied to a micro display system 700. The micro display system 700 includes a micro LED display module 710 and a control unit 720. The control unit 720 is connected to a micro LED display panel 711 and an image light rotation element 712. The micro LED display panel 711 includes a micro LED array area 711a and an IC (integrated circuit) backplane 711b, which is formed (such as by metal bonding) at the bottom of the micro LED array area 711a and is electrically connected to each micro LED. The image light rotation element 712 includes a transmissive lens 712a and an actuator controller 712b. The control unit 720 is connected to the IC backplane 711b and the actuator controller 712b for sending signals to the IC backplane 711b and the actuator controller 712b. The control unit 720 is configured to process the target image data to form N sub-image data and calculate the rotation direction and rotation frequency of the transmission lens 712a for each sub-image data according to the refresh frequency of the target image data, send the rotation direction and the rotation frequency to the actuator controller 712b, and send the sub-image data and the rotation frequency to the IC backplane 711b. The actuator controller 712b is configured to receive the rotation direction and rotation frequency of the transmission lens 712a for each sub-image data. The actuator controller 712b is further configured to control the lens position rotation actuator (not shown) and the transmission lens 712a to perform rotation processing based on the rotation direction and rotation frequency for each sub-image data. The IC backplane 711b is configured to synchronously control the micro LED display panel 711 to display the sub-image according to the sub-image data and the rotation frequency.

[0054] The sub-images, the shifted positions of the sub-images, and the relationship between the rotation of the transmissive lens and the shifted positions of the sub-images are described in further detail below.

[0055] Each pixel point in the micro LED array area is formed in a corresponding pixel area, and each pixel area includes N pixel sub-images. The pixel sub-images of the pixel points are shifted in a shift order in the pixel area of ​​the pixel points. The N sub-images are shifted in the same shift order as the pixel sub-images, where N is an integer and not less than 2. The rotation frequency of the sub-image data is M times the refresh frequency of the target image data; wherein M is an integer and not less than 2. In some embodiments, M is equal to N. In some embodiments, M is an even integer. In some embodiments, the shift direction is clockwise. The refresh frequency of the target image data is 50 Hz to 70 Hz. In some embodiments, M may be less than 1, for example, 0.5.

[0056] Figure 8 An exemplary pixel region 800 of a micro-LED array according to some embodiments of the present disclosure is shown. Figure 8, shows an initial pixel image without transmission lens rotation. Figure 8 As shown, the large block shows the pixel area 800, and the small block shows that the pixel points 810 of the pixel area 800 are small dot-shaped blocks. Fig. 9 illustrative positions of pixel sub-images shifted from a target pixel point in a pixel region according to some embodiments of the present disclosure are shown. Fig. 9 , shows the pixel sub-image with the transmission lens rotated. Fig. 9 As shown, the dashed small block represents the initial pixel point that has not moved in the target image. The pixel area includes a first pixel sub-image 901 of the pixel point, a second pixel sub-image 902 of the pixel point, a third pixel sub-image 903 of the pixel point, and a fourth pixel sub-image 904 of the pixel point. The first pixel sub-image 901 is shifted to the upper left relative to the pixel point 910 (dashed block) in the target image 920 in the pixel area. The second pixel sub-image 902 is shifted to the upper right relative to the pixel point 910 in the target image in the pixel area. The third pixel sub-image 903 is shifted to the lower right relative to the pixel point 910 in the target image in the pixel area. The fourth pixel sub-image 904 is shifted to the lower left relative to the pixel point 910 in the target image in the pixel area.

[0057] As disclosed herein, in some embodiments, the rotation frequency of the transmissive lens is four times the refresh frequency of the target image data. The rotation angles of the transmissive lens are (-X°, +Y°), (+X°, +Y°), (+X°, -Y°), (-X°, -Y°), so the sub-image corresponding to each rotation angle is displayed from left to right and from top to bottom in a clockwise direction.

[0058] Fig.10 A target image formed from target image data according to some embodiments of the present disclosure is shown. Fig.10 , the target image is formed by different grayscale values ​​of the micro LED array. The micro LED array of the micro LED display panel is an M×N matrix, where M is a positive integer greater than 2, and N is a positive integer greater than 2. In some embodiments, the micro LED array is a 1280×680 matrix. Fig.10 As shown, four pixel points (e.g., 1001 to 1004) correspond to four micro LEDs, which are only exemplified for describing the micro LED array of the target image and the sub-image, and are not used to limit the scope of the present disclosure. In some embodiments, the width or length of the micro LED display panel is not greater than 5 μm, and the diagonal of the micro LED array area is not greater than 5 cm. Therefore, the micro LED display panel can be designed to be small in size.

[0059] Fig.11An exemplary position of each sub-image shifted relative to a pixel point in a target image according to some embodiments of the present disclosure is shown. Fig.11 , the target image data is processed to form four sub-image data: a first sub-image 1101, a second sub-image 1102, a third sub-image 1103 and a fourth sub-image 1104. Fig.11 As shown in FIG. 1 , the dotted blocks represent the pixels of each sub-image in the target image. The sub-image formed by the sub-image data is Fig.11 are shown separately in .

[0060] refer to Fig. 9 and Fig.11 , each pixel region includes a first pixel image 901, a second pixel image 902, a third pixel image 903, and a fourth pixel image 904. The first pixel image 901 is shifted to the upper left relative to the pixel points in the target image in the pixel region; the second pixel image 902 is shifted to the upper right relative to the pixel points in the target image in the pixel region; the third pixel image 903 is shifted to the lower right relative to the pixel points in the target image in the pixel region; and the fourth pixel image 904 is shifted to the lower left relative to the pixel points in the target image in the pixel region. Therefore, the first sub-image 1101 is shifted to the upper left in the target image region relative to the target image; the second sub-image 1102 is shifted to the upper right in the target image region relative to the target image; the third sub-image 1103 is shifted to the lower right in the target image region relative to the target image; and the fourth sub-image 1104 is shifted to the lower left in the target image region. The target image region is the same as the micro LED array region and does not change during the display process.

[0061] like Fig.11 As described, as the transmission lens rotates in sequence at rotation angles of (-X°, +Y°), (+X°, +Y°), (+X°, -Y°), (-X°, -Y°), the position of the sub-image shifts in a clockwise direction from left to right and from top to bottom. That is, the position of the sub-image is moved by rotating the transmission lens; and the position of the sub-image is determined by the rotation angle of the transmission lens. In some embodiments, the sub-image formed by the sub-image data is the same as the target image formed by the target image data, thereby ensuring the quality of the displayed target image. In addition, the grayscale values ​​of all pixel sub-images of the same pixel are the same as the grayscale values ​​of the target pixel image of the same pixel in the target image data, such as Fig.11 In another example, the grayscale value of at least one pixel sub-image of the same pixel is different from the grayscale of the target pixel image of the same pixel in the target image data. In some embodiments, one pixel corresponds to one micro LED.

[0062] Fig.12The position of the sub-image shifted relative to the target image according to some embodiments of the present disclosure is shown. A control unit (e.g., Figure 7 The control unit 720 in the embodiment is configured to send the four sub-image data and the rotation frequency to the IC backplane, and send the rotation angle and the rotation frequency to the actuator controller. Fig.12 , the dotted blocks (e.g., 1210) represent pixels of the target image. The actuator controller (e.g., Figure 7 The actuator controller 712b in FIG. 7 controls the transmissive lens to rotate at a rotation angle of (-X°, +Y°) based on a rotation frequency (eg, 240 Hz), and the IC backplane (eg, Figure 7 The IC backplane 711b in FIG. 1 controls the micro LED display panel displaying the first sub-image based on the rotation frequency, as shown in the first target image 1201. The actuator controller controls the transmissive lens to rotate at a rotation angle (+X°, +Y°) based on the rotation frequency, and the IC backplane controls the micro LED display panel displaying the second sub-image based on the rotation frequency, as shown in the second target image 1202. Similarly, the display of the third sub-image is shown in the third target image 1203, and similarly, the display of the fourth sub-image is shown in the fourth target image 1204. Because the rotation frequency is very fast, the human eye cannot see the transformation of the four sub-images, and can only see the following. Fig.12 The final target image shown in the fourth target image 1204 in FIG. 1 is similar to Fig.10 The four sub-images are combined together in a clockwise direction to form a final target image shown in the fourth target image 1204 .

[0063] Fig.13 The formula relationship between the distance that a sub-image is displaced from a target image and the rotation angle of a transmissive lens based on a specific axis according to some embodiments of the present disclosure is shown. Fig.13 , the relationship between the displacement distance and the rotation angle is as follows:

[0064]

[0065] Wherein, Δy is the shift distance, θ is the rotation angle, t is the center thickness of the transmission lens, and n is the refractive ratio of the transmission lens. In some embodiments, the shift distance between adjacent sub-images is, for example, 50% to 100% of the pixel pitch. Therefore, the rotation angle can be calculated by the above formula.

[0066] Fig.14A 14 is a flow chart showing a micro-LED image display method 1400A according to some embodiments of the present disclosure. Fig.14A, a micro LED image display method 1400A using the above-mentioned micro LED display module includes the following steps 1401A to 1404A.

[0067] In step 1401A, a target image data is obtained. The target image data can be obtained by a control unit (e.g., control unit 720) for further operation. In some embodiments, the target image data can be stored in a memory and can be obtained by the control unit via a network. In some embodiments, the memory is an external memory.

[0068] In step 1402A, the target image data is processed to generate N sub-image data, where N is not less than 2. For example, four sub-image data are generated. The four sub-image data are the same, and the four sub-images formed according to the sub-image data are the same, such as Fig.10 shown.

[0069] In step 1403A, N sub-images are sequentially displayed according to the N sub-image data, according to the rotation frequency and preset rotation direction of the transmission lens of each sub-image data, where N is an integer and not less than 2. In addition, the pixel sub-image of the pixel point is shifted in the pixel area of ​​the pixel point in a shift order; the N sub-images are shifted in the same shift order as the pixel sub-image. The rotation frequency of the sub-image data is M times the refresh frequency of the target image data. In some embodiments, N is an integer and not less than 2, and M is an integer not less than 2. In some embodiments, M is equal to N. In some embodiments, M is an even integer. For example, the rotation frequency of the transmission lens is four times the refresh frequency of the target image data. The refresh frequency of the target image data is, for example, 50 Hz to 70 Hz. In this example, the shift direction is clockwise. The sub-image formed by the sub-image data is the same as the target image formed by the target image data.

[0070] In some embodiments, the actuator controller is configured to rotate the transmissive lens at a rotation angle of (-X°, +Y°) based on a rotation frequency (e.g., 240 Hz), and the IC backplane is configured to control the micro LED display panel displaying the first sub-image 1101 based on the rotation frequency, such as Fig.11 The actuator controller is configured to rotate the transmissive lens at a rotation angle (+X°, +Y°) based on the rotation frequency, and the IC backplane is configured to control the micro LED display panel displaying the second sub-image 1102 based on the rotation frequency, as shown in FIG. Fig.11 A similar display of the third sub-image 1103 and a similar display of the fourth sub-image 1104 are also shown in FIG. Fig.11 Shown in.

[0071] In some embodiments, the IC backplane includes an IC driving circuit for driving each of the micro-LEDs. In some embodiments, the IC driving circuit is driven and controlled by a PWM (pulse width modulation) signal and a current source. In some embodiments, the grayscale value of each of the micro-LEDs is controlled by the PWM signal.

[0072] Reference Fig.14A , in step 1404A, steps 1401A and 1403A are repeated until all target image data are displayed.

[0073] For example, by repeating steps 1401A to 1403A, a plurality of target images may be displayed.

[0074] Fig. 14B Another micro LED image display method 1400B using the aforementioned micro LED display module according to some embodiments of the present disclosure is shown. The method 1400B includes the following steps 1401B to 1404B.

[0075] At step 1401B, at least one target image data is obtained.

[0076] At step 1402B, each target image data is processed to generate N sub-image data for each target image data.

[0077] In step 1403B, based on the rotation frequency of the transmission lens and the preset rotation direction for each sub-image data, N sub-images of the target image data are displayed in sequence according to the sub-image data of the target image data, where N is an integer not less than 2.

[0078] In step 1404B, by looping step 1403B, the sub-images of the next target image data are displayed in sequence until all target images are displayed.

[0079] The details of steps 1402B to 1403B can be referred to steps 1402A to 1403A, which will not be repeated here.

[0080] Figures 15 to 25 A micro LED display panel is shown, which can be implanted as a display panel 210 in Figure 2 and Figure 3 middle. Fig.15 FIG. 1 shows a block diagram of a side cross-sectional view of an exemplary micro LED display panel 1500 showing a micro LED display chip according to some embodiments of the present disclosure. Fig.15As shown, the micro LED display panel 1500 includes a micro LED display chip 1530, a top cover plate 1540 and a sealing structure 1550. The micro LED display chip 1530 includes a micro LED array area 1532 and an IC (integrated circuit) substrate 1531. The micro LED array area 1532 is located on the IC substrate 1531 to form an image display area of ​​the micro LED display chip 1530. The remaining area on the IC substrate 1531 not covered by the micro LED array area 1532 is formed as a non-functional area. The top cover plate 1540 is arranged above the micro LED display chip and supported by the sealing structure 1550. The top cover plate 1540 covers at least a portion of the image display area (e.g., the micro LED array area 1532) and the non-functional area. Therefore, the light emitted from the image display area is transmitted upward to the top cover plate 1540. The sealing structure 1550 is formed between the edge of the micro LED display chip 1530 and the edge of the top cover plate 1540. It can be understood that the sealing structure 1550 forms a closed area on the micro LED display chip 1530 (more specifically, on the IC substrate 1531) and surrounds the image display area (e.g., the micro LED array area 1532). In some embodiments, the outer sidewall of the sealing structure 1550 is vertically aligned with the sidewall of the top cover plate 1540. In some embodiments, the micro LED display chip 1530 is a self-emitting micro LED display chip.

[0081] For the micro LED display panel 1500 , the sealing structure 1550 may prevent light from being emitted from the image display area to the outside through a gap between the top cover plate 1540 and the micro LED display chip 1530 .

[0082] In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 (for example, the distance between the bottom surface of the top cover plate 1540 and the top surface of the micro LED array area 1532) is not greater than the thickness of the micro LED display chip 1530. For example, the thickness of the micro LED display chip 1530 is 500 μm to 5 mm. In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 (for example, the distance between the bottom surface of the top cover plate 1540 and the top surface of the micro LED array area 1532) is not greater than the thickness of the top cover plate 1540. For example, the thickness of the top cover plate 1540 is not greater than 1500 μm. More specifically, the thickness of the top cover plate 1540 is in the range of 200 μm to 1500 μm. In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 is the same as the thickness of the top cover plate 1540. For example, the distance between the top cover plate 1540 and the micro LED display chip 1530 is in the range of 200 μm to 1500 μm. In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 is in the range of 3 μm to 5 μm. In some embodiments, the top cover plate 1540 is transparent. For example, the material of the top cover plate 1540 can be organic glass or inorganic glass. In some embodiments, the top cover plate 1540 is a glass cover.

[0083] In some embodiments, the sealing structure 1550 is formed on the non-functional area of ​​the micro LED display chip 1530. That is, the sealing structure 1550 connects the IC substrate 1531 and the top cover plate 1540. The height of the sealing structure 1550 can be equal to the distance between the top cover plate 1540 and the non-functional area (e.g., the top of the IC substrate 1531). In some embodiments, the sealing structure 1550 can include a light absorbing material, such as a combination of a film former composed of a resin and a polymer and a photosensitizer. The light absorbing material may include a film former. The film former may include one or more of a resin, a polymer, a photosensitizer, or a combination thereof. Using the light absorbing material, the sealing structure 1550 can further absorb the light emitted from the image display area to improve the image quality.

[0084] In some embodiments, the sealing structure 1550 may include a sealant 1551 and a plurality of spacers 1552. The sealing structure 1550 may be a combination of a sealant 1551 and the plurality of spacers 1552. The material of the sealant 1551 may include one or more of a resin and a polymer. For example, the resin may be an epoxy resin, and the polymer may be silicone. The spacers 1552 may be small balls having the same diameter. Since the sealant 1551 is flowable, the top cover plate 1540 may be pressed down as close to the micro LED display chip 1530 as possible. Therefore, the diameter of the ball may define the height of the sealing structure 1550, in other words, the distance between the top cover plate 1540 and the non-functional area (e.g., the top of the IC substrate 1531). Using such a sealing structure 1550, the distance between the top cover plate 1540 and the micro LED display chip 1530 may be effectively guaranteed or adjusted according to the thickness of the spacer 1552 (e.g., the diameter of the ball).

[0085] In some embodiments, the micro LED display panel 1500 may further include a support substrate formed below the bottom of the micro LED display chip 1530. The support substrate is rigid, thereby providing a stable base for the micro LED display chip 1530.

[0086] Fig.16 Some embodiments of the present disclosure are shown. Fig.15 15. A structural diagram of a top view of a micro LED display panel 1500 is shown in FIG. Fig.17 Some embodiments of the present disclosure are shown. Fig.15 FIG. 1 is a structural diagram of a side cross-sectional view of a micro LED display panel 1500 shown in FIG. Fig.16 and Fig.17 , the micro LED display chip 1530 includes a micro LED array area 1532 and an IC substrate 1531, wherein the IC substrate is formed at the bottom of the micro LED array area 1532 and has a portion extending to the outside of the micro LED array area 1532. The micro LED array area 1532 forms an image display area, and the extended portion of the IC substrate 1531 forms a non-functional area. The micro LED array area 1532 further includes a plurality of micro LEDs 1533 arranged in an array form. A plurality of signal metal pads and dummy metals may be further formed on the surface of the non-functional area. The signal metal pads may include a plurality of IO (input / output) metal pads 1591 and a plurality of dummy metal pads 1592.

[0087] The IO metal pad 1591 can be conductively connected to the IC substrate 1531. The micro LEDs 1533 in the micro LED array region 1532 are connected to the IC substrate 1531 through a plurality of first metal connection holes 1593, respectively. That is, each micro LED 1533 is connected to the IC substrate 1531 through one first metal connection hole 1593. The corresponding top of the first metal connection hole 1593 is connected to the micro LED 1533 one-to-one. Therefore, the plurality of first metal connection holes 1593 correspond to the plurality of micro LEDs 1533. Fig.16 As shown, the first metal connection holes 1593 are formed into an array identical to the micro LED array, and the first metal connection holes 1593 are formed as a first connection area on the IC substrate 1531 corresponding to the micro LED array area (e.g., the image display area). The bottom of the signal metal pads, namely the IO metal pads 1591 and the dummy metal pads 1592, are connected to the IC substrate 1531 through a plurality of second metal connection holes 1594. The bottom of the second metal connection hole 1594 of the IO metal pad 1591 is conductively connected to the bottom of the first metal connection hole 1593 (through a connection not shown). Therefore, the IO metal pad 1591 can be conductively connected to the micro LED 1533 through the second metal connection hole 1594, the IC substrate 1531, and the first metal connection hole 1593. The bottom of the second metal connection hole 1594 of the dummy metal pad 1592 is conductively connected to the top electrode of the micro LED 1533. The second metal connection hole 1594 is formed as a second connection area on a non-functional area. The second connection region is spaced apart from the first connection region and is close to the edge of the IC substrate 1531. In some embodiments, the first connection region is referred to as an internal connection region and the second connection region is referred to as an external connection region. A first metal connection hole 1593 and a second metal connection hole 1594 are formed in the top layer 1534 of the IC substrate 1531. It is noted that the IC substrate 1531 may further include conventional metal interconnect multilayers to connect the IO metal pads 1591 of each micro LED 1533. The metal interconnect multilayers can be understood by those skilled in the art and will not be described here.

[0088] refer to Fig.15 and Fig.16 Since the sealing structure 1550 is formed on the non-functional area, the first connection area and the second connection area are further separated by the sealing structure 1550. For example, the second connection area is formed between the sealing structure 1550 and the edge of the IC substrate 1531. The second connection area is not covered by the sealing structure 1550. Fig.16As shown, IO metal pads 1591 are formed in a one-dimensional array (e.g., in a straight line) on the second connection region. At least some of the dummy metal pads 1592 are formed on the second connection region, and the dummy metal pads are arranged in a one-dimensional array. In some embodiments, all of the dummy metal pads 1592 and IO metal pads 1591 are formed on the second connection region.

[0089] refer to Fig.15 and Fig.16 , the micro LED display panel 1500 further includes a bonding wire 1570. The bonding wire 1570 connects the signal metal pads such as the IO metal pad 1591 and the dummy metal pad 1592 on the second connection area with an external circuit. Therefore, the IC substrate 1531 and the micro LEDs 1533 in the micro LED array area 1532 can be conductively connected to the external circuit through the bonding wire 1570. Since only the signal metal pads on the second connection area are used to connect to the external circuit, the interference of the IO metal pad 1591 can be reduced and the external design can be facilitated.

[0090] Return to reference Fig.15 In some embodiments, the micro LED display panel 1500 further includes a protective layer 1580. The protective layer 1580 is formed on the surface of the second connection area and covers the surface of the welding wire 1570 to protect the connection between the second connection area and the external circuit. The welding wire 1570 can also be protected by the protective layer 1580. In some embodiments, the top of the protective layer 1580 is lower than the top of the top cover plate 1540. Therefore, the protective layer 1580 cannot contact the top cover plate 1540. In some embodiments, the top of the protective layer 1580 can be lower than the top of the micro LED array area 1532. The material of the protective layer 1580 may include a resin and a polymer. For example, the resin is an epoxy resin and the polymer is a silicone. In some embodiments, the sidewall of the protective layer 1580 is connected to the sidewall of the sealing structure 1550. Therefore, the protective layer 1580 and the sealing structure 1550 are connected, and there is no exposed non-functional area between the protective layer 1580 and the sealing structure 1550.

[0091] In some embodiments, the micro LED display panel 1500 further includes an external circuit board 1520. The external circuit is formed on the external circuit board 1520. The external circuit board 1520 is formed at the bottom of the micro LED display chip 1530, and has a portion extending to the outside of the micro LED display chip 1530. A protective layer 1580 is further formed on the surface of the extended portion of the external circuit board 1520. In some embodiments, a support substrate 1510 is further formed under the bottom of the external circuit board 1520. The support substrate 1510 is rigid, thereby providing a stable base for the micro LED display chip 1530 and the external circuit board 1520.

[0092] In some embodiments, the external circuit board 1520 is formed outside the bottom of the micro LED display chip 1530, surrounding the micro LED display chip 1530. That is, the circuit board 1520 and the micro LED display chip 1530 are integrated in the same plane. Therefore, the micro LED display panel 1500 can be more compact. The protective layer 1580 is further formed on a portion of the external circuit board 1520. In this example, the support substrate 1510 can be formed under the external circuit board 1520 and the micro LED display chip 1530. In some embodiments, the external circuit board 1520 is made of a flexible material. For example, the external circuit board 1520 is made of a flexible printed circuit.

[0093] Figures 18 to 22 FIG. 1 shows a structural diagram illustrating a variation of another exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Figures 18 to 22 , the micro LED display panel 1800 includes a micro LED display chip 1830, a top cover plate 1840 and a light shielding layer 1860. The micro LED display chip 1830 includes a micro LED array area 1832 and an IC substrate 1831. The micro LED array area 1832 is located on the IC substrate 1831 to form an image display area of ​​the micro LED display chip 1830. The remaining area on the IC substrate 1831 not covered by the micro LED array area 1832 is formed as a non-functional area. The top cover plate 1840 is formed above the micro LED display chip 1830. The light emitted from the image display area is transmitted upward to the top cover plate 1840. The light shielding layer 1860 is formed on the edge surface of the top cover plate 1840. It can be understood that the light shielding layer 1860 extends along the periphery of the top cover plate 1840. The light shielding layer 1860 can be formed on the top edge surface of the top cover plate 1840 (such as Fig.18 ) or on the bottom edge surface of the top cover plate 1840 (as shown Fig.21 The projection of the light shielding layer 1860 on the micro LED display chip 1830 in the vertical direction covers at least a portion of the non-functional area. Fig.19 Some embodiments of the present disclosure are shown. Fig.18 or Fig. 20 FIG. 1 is a top view of a micro LED display panel 1800 of a micro LED display panel. Fig.19 As shown, from the top, the light shielding layer 1860 is formed around the top cover plate 1840 and covers at least a portion of the non-functional area, exposing the image display area. The shape of the light shielding layer 1860 is a closed geometric structure that exposes at least the image display area, such as a rectangular frame, a circular frame, an elliptical frame or any other geometric shape. Fig.19 The shape of the light shielding layer 1860 shown in the figure is a rectangle with an opening that exposes at least the image display area. In some embodiments, since the image display area (e.g., the micro LED array area 1832) may not be located at the center of the micro LED display chip 1830, the center of the opening (e.g., the center of the display area or the center of the micro LED array area 1832) is not aligned with the center of the top cover plate 1840.

[0094] Therefore, light emitted from the image display area and transmitted to the top cover plate 1840 formed with the light shielding layer 1860 cannot be reflected back to the micro LED display chip 1830 to improve image quality.

[0095] In some embodiments, the projection area of ​​the light shielding layer 1860 on the non-functional area covers the IO metal pad and the dummy metal pad. Therefore, no light is reflected back on the IO metal pad and the dummy metal pad, or is further reflected outward from the micro LED display chip 1830 by the IO metal pad and the dummy metal pad. In some embodiments, the projection area of ​​the light shielding layer 1860 on the non-functional area further covers the dummy metal formed on the non-functional area to prevent reflection by the dummy metal.

[0096] In some embodiments, the outer edge of the light shielding layer 1860 is aligned with the side wall of the top cover plate 1840 in the vertical direction. This means that the light shielding layer 1860 extends to the farthest edge of the top cover plate 1840. In some embodiments, the inner edge of the light shielding layer 1860 is aligned with the side wall of the image display area in the vertical direction. Therefore, the projection area of ​​the light shielding layer 1860 on the micro LED display chip 1830 covers the non-functional area as much as possible. In addition, the projection area of ​​the light shielding layer 1860 on the micro LED display chip 1830 covers the entire non-functional area.

[0097] In some embodiments, the light shielding layer 1860 is an anti-reflective coating. For example, the material of the light shielding layer is black photoresist. The thickness of the light shielding layer 1860 is no greater than half the thickness of the top cover plate 1840. For example, the thickness of the light shielding layer 1860 is in the range of 0.3 μm to 5 μm. The light shielding layer 1860 can be a spin-coated coating on the top cover plate 1840. That is, the light shielding layer 1860 is spin-coated on the top cover plate 1840.

[0098] In some embodiments, such as Fig.18 As shown, a light shielding layer 1860 is formed on the top edge surface of the top cover plate 1840. Since the top cover plate 1840 is transparent, the light shielding layer 1860 on the top edge surface can also prevent reflection of the transmitted light. Fig. 20 FIG. 1 shows a block diagram of a side cross-sectional view of another variation of an exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Fig. 20 As shown, a light shielding layer 1860 is further formed on the side wall of the top cover plate 1840 to further prevent the light emitted from the image display area from being reflected by the side wall of the top cover plate 1840. Thus, the image quality is further improved.

[0099] like Fig.18 and Fig. 20 As shown in , the micro LED display panel 1800 may further include a sealing structure 1850. The sealing structure 1850 is formed between the top surface of the non-functional area and the bottom surface of the top cover plate 1840, thereby forming a closed space between the micro LED display chip 1830 and the top cover plate 1840 around the image display area. In some embodiments, the distance between the micro LED display chip 1830 and the top cover plate 1840 is not greater than the thickness of the micro LED display chip 1830 or the thickness of the top cover plate 1840. Due to the thickness of the light shielding layer 1860, the height of the sealing structure 1850 is equal to the distance between the non-functional area (e.g., the top of the IC substrate 1831) and the top cover plate 1840.

[0100] Fig.21 FIG. 1 shows a block diagram of a side cross-sectional view of another variation of an exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Fig.21 As shown, a light shielding layer 1860 is formed on the bottom edge surface of the top cover plate 1840. The projection of the light shielding layer 1860 in the vertical direction covers at least a portion of the non-functional area. Fig. 22 FIG. 1 shows a block diagram of a side cross-sectional view of another variation of an exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Fig. 22 As shown, the light shielding layer 1860 is formed on the bottom edge surface of the top cover plate 440 and is further formed on the side wall of the top cover plate 1840 .

[0101] like Fig.21 and Fig. 22 As shown in , the micro LED display panel 1800 further includes a sealing structure 1850. The sealing structure 1850 is formed between the top surface of the non-functional area and the bottom surface of the light shielding layer 1860 to form a closed space between the micro LED display chip 1830 and the top cover plate 1840 around the image display area. In some embodiments, the distance between the micro LED display chip 1830 and the top cover plate 1840 is not greater than the thickness of the micro LED display chip 1830 or the thickness of the top cover plate 1840. Due to the thickness of the light shielding layer 1860, the height of the sealing structure 1850 is less than the distance between the non-functional area (e.g., the top of the IC substrate 1831) and the top cover plate 1840.

[0102] In some embodiments, anti-reflective material can be integrated at the edge of the top cover plate to form a light shielding layer integrated with the top cover plate.

[0103] like Figures 18 to 22 As shown, the micro LED display panel 1800 may further include a support substrate 1810, an external circuit board 1820, one or more bonding wires 1870, and a protective layer 1880. Further details about the support substrate 1810, the external circuit board 1820, the sealing structure 1850, the bonding wires 1870, the protective layer 1880, and the signal metal pads can be referred to. Fig.15 The description of the illustrated embodiment can be found in the accompanying drawings and will not be described further here.

[0104] Figure 23 to Figure 25 A structural diagram showing a variation of another exemplary micro LED display panel according to some embodiments of the present disclosure is shown. Figure 23 to Figure 25 , the micro LED display panel 2300 includes a micro LED display chip 2330, a top cover plate 2340 and a light shielding layer 2360. The micro LED display chip 2330 includes a micro LED array area 2332 and an IC substrate 2331. The micro LED array area 2332 is located on the IC substrate 2331 to form an image display area of ​​the micro LED display chip 2330. The remaining area on the IC substrate 2331 not covered by the micro LED array area 2332 is formed as a non-functional area. The light shielding layer 2360 is formed on at least a portion of the surface of the non-functional area. Therefore, light emitted from the image display area and reflected by the top cover plate 2340 to the non-functional area cannot be reflected again. In some embodiments, the top of the light shielding layer 2360 is lower than the top of the micro LED display chip 2330 (for example, the top of the micro LED array area 2332).

[0105] In some embodiments, an IO metal pad is further formed on the surface of the non-functional area, and the IO metal pad is covered by a light shielding layer 2360. Therefore, the light reflected to the non-functional area cannot be reflected by the IO metal pad again, so as to improve the quality of the micro LED display panel.

[0106] In some embodiments, a dummy metal is further formed on the surface of the non-functional area, and the dummy metal is further covered by the light shielding layer 2360. In some embodiments, the light shielding layer 2360 covers the entire non-functional area.

[0107] In some embodiments, the outer edge of the light shielding layer 2360 is aligned with a portion of the side wall of the micro LED display chip 2330 in the vertical direction. In addition, the outer edge of the light shielding layer 2360 is aligned with a portion of the non-functional area in the vertical direction. In some embodiments, the light shielding layer 2360 covers the non-functional area except for an edge surface exposed for connecting the welding wire 2370. In some embodiments, the inner edge of the light shielding layer 2360 is aligned with the side wall of the image display area in the vertical direction. That is, the light shielding layer 2360 contacts the micro LED array area 2332. Therefore, the light shielding layer 2360 covers the non-functional area as much as possible.

[0108] Fig.24 Some embodiments of the present disclosure are shown. Fig.23 The top view of the micro LED display panel is shown in FIG. Fig.24 As shown, from the top, the light shielding layer 2360 is formed on the non-functional area of ​​the IC substrate 2331, exposing the image display area. The shape of the light shielding layer 2360 is a closed geometric structure that exposes at least the image display area, such as a rectangular frame, a circular frame, an elliptical frame or any other geometric shape. Fig.24 The shape of the light shielding layer 2360 shown in FIG. 2 is a rectangle having an opening that exposes at least the image display area.

[0109] In some embodiments, the light shielding layer 2360 is an anti-reflective coating. For example, the material of the light shielding layer is black photoresist. The thickness of the light shielding layer 2360 is no greater than half the thickness of the top cover plate 2340. For example, the thickness of the light shielding layer 2360 is in the range of 0.3 μm to 5 μm.

[0110] In some embodiments, the micro LED display panel 2300 may further include a sealing structure 2350. The sealing structure 2350 is formed between the top surface of the light shielding layer 2360 and the bottom surface of the edge of the top cover plate 2340 around the image display area to form a closed space between the micro LED display chip 2330 and the top cover plate 2340 around the image display area. In some embodiments, the distance between the micro LED display chip 2330 and the top cover plate 2340 is not greater than the thickness of the micro LED display chip 2330 or the thickness of the top cover plate 2340. Due to the thickness of the light shielding layer 2360, the height of the sealing structure 2350 is less than the distance between the non-functional area (e.g., the top of the IC substrate 2331) and the top cover plate 2340.

[0111] Fig.25 FIG. 2 shows a block diagram of a side cross-sectional view of another variation of an exemplary micro LED display panel 2300 according to some embodiments of the present disclosure. Fig.25 As shown, the light shielding layer 2360 can be further formed on the side wall of the top cover plate 2340.

[0112] like Figure 23 to Figure 25 As shown, the micro LED display panel 2300 may further include a support substrate 2310, an external circuit board 2320, one or more bonding wires 2370, and a protective layer 2380. Further details about the support substrate 2310, the external circuit board 2320, the sealing structure 2350, the bonding wires 2370, the protective layer 2380, and the signal metal pads can be referred to. Fig.15 The description of the illustrated embodiment can be found in the accompanying drawings and will not be described further here.

[0113] Fig.26 is a cross-sectional structural view of another micro display module according to some embodiments of the present disclosure. Fig.26, the micro LED display module includes three monochrome micro LED display panels (for example, a red micro LED display panel, a blue micro LED display panel, and a green micro LED display panel) 2611, 2612, 2613, and an optical combination unit 2660 for combining three-color images into a target image. The three monochrome micro LED display panels 2611, 2612, 2613 are arranged around the optical combination unit 2660. The support frame 2650' includes a central cavity and four openings surrounding the central cavity. The optical combination unit 2660 is arranged in the central cavity. The red micro LED display panel 2611, the blue micro LED display panel 2612, and the green micro LED display panel 2613 are respectively fixed at the edges of the three openings, and another opening is used to transmit image light outward. The other opening is arranged to face one of the three openings and to face one of the three micro LED display panels (for example, 2611). The other opening faces the transmission lens, so that the image light emitted from the optical combination unit can be transmitted into the transmission lens (the arrow indicates the transmission direction of the image light). For example, as Fig.26 As shown, image light E1 emitted from micro LED display panel 2611, image light E2 emitted from micro LED display panel 2612, and image light E3 emitted from micro LED display panel 2613 are combined by optical combination unit 2660 and emitted in emission guide E4. As disclosed herein, optical combination unit 2660 is an optical combination prism, such as a color combination prism. The back surface of the reinforcing plate (not shown) is not outside the edge of the supporting frame 2650'. As shown in FIG. Fig.26 As shown, dotted line L1 represents the plane of the back surface of the micro LED display panel 2612, and dotted line L2 represents the plane of the edge of the support frame 2650'. The micro LED display module may further include an image light rotating element 2620 and a mounting frame 2640. Further details about the image light rotating element 2620 and the mounting frame 2640 can be referred to. Figure 2 and Figure 3 The description of the embodiment shown in FIG. 1 can be found in the accompanying drawings and will not be described further here.

[0114] Fig. 27 is a cross-sectional structural view of another micro display projector according to some embodiments of the present disclosure. Fig. 27 , the micro LED display projector includes a lens group 2630 and Fig.26The aforementioned micro LED display module shown in . The lens group 2630 is arranged to face the color combining prism (optical combination unit 2660) for receiving the combined image light emitted from the micro LED display panels 2611, 2612 and 2613. The diameter length of at least one lens of the lens group 2630 is not less than the diagonal length of the micro LED array area. The length of the diameter of at least one lens in the lens group 2630 may be less than the width of the color combining prism. Further details of the micro LED display panel, the image light rotation element and the lens group can be found in the aforementioned description and will not be repeated here.

[0115] Fig.28 is a cross-sectional structural view of another micro display projector according to some embodiments of the present disclosure. Fig.28 A micro LED display projector includes a reinforcing plate 2650, a micro LED display panel 2610 and a lens group 2630. The lens group 2630 is positioned facing the micro LED display panel 2610. The micro LED display panel 2610 can be seen in the above Figures 15 to 25 The description of the micro LED display panel will not be repeated here.

[0116] It should be understood by those skilled in the art that the micro LED display module or micro LED display panel is not limited to the above structure and may include more or less components than shown, or some components may be combined, or different components may be used.

[0117] The size of the micro 3D printing device with a micro LED display projector disclosed in this article can be reduced. The micro LED display module improves the accuracy of the image, thereby improving the performance of micro 3D printing.

[0118] It should be noted that relational terms, such as "first" and "second", herein are used only to distinguish an entity or operation from another entity or operation, without requiring or implying any actual relationship or order between these entities or operations. In addition, the words "comprising", "having", "containing", and "including" and other similar forms are intended to be equivalent in meaning and are open-ended, and one or more items following any of these words are not meant to be an exhaustive list of such one or more items, or to be limited to the listed one or more items.

[0119] As used herein, unless expressly stated otherwise, the term "or" encompasses all possible combinations unless not feasible. For example, if it is stated that a database may include A or B, then unless expressly stated otherwise or not feasible, the database may include A, or B, or A and B. As a second example, if it is stated that a database may include A, B, or C, then unless expressly stated otherwise or not feasible, the database may include A, or B, or C, or A and B, or A and C, or B and C, or A, B, and C.

[0120] In the foregoing description, embodiments have been described with reference to many specific details, which may vary depending on the implementation. Certain changes and modifications may be made to the described embodiments. In view of the description and practice of the invention disclosed herein, other embodiments will be clear to those skilled in the art. The description and examples are intended to be considered as merely exemplary, and the true scope and spirit of the invention are indicated by the following claims. The order of steps shown in the drawings is also intended to be used for illustrative purposes only and is not intended to be limited to any particular order of steps. Therefore, it will be appreciated by those skilled in the art that these steps may be performed in different orders while implementing the same method.

[0121] In the drawings and the specification, exemplary embodiments have been disclosed. However, many variations and modifications may be made to these embodiments. Therefore, although specific terms are employed, they are used only in a general and descriptive sense and not for the purpose of limitation.

Claims

1. A micro three-dimensional printing device, comprising: a micro LED display projector configured to emit image light; a material platform, the material platform facing the micro LED display projector and configured to receive the image light; a removable printing plate configured to hold a three-dimensional printed object; and A moving mechanism is connected to the movable printing plate and is configured to move the movable printing plate.

2. The micro 3D printing device according to claim 1 further comprises a pocket bracket, which is configured to support the micro LED display projector and the material platform, the micro LED display projector is arranged in the pocket bracket, and the material platform is arranged on the top of the pocket bracket.

3. The micro three-dimensional printing device according to claim 2, wherein: An opening is formed on a top surface of the pocket support, and the material platform is received in the opening.

4. The micro three-dimensional printing device according to any one of claims 1 to 3, further comprising a movement controller, the movement controller being electrically connected to the movement mechanism and configured to control the movement mechanism.

5. The micro three-dimensional printing device according to any one of claims 1 to 4, wherein: The focal plane of the micro LED display projector is located on the surface of the material platform facing the micro LED display projector.

6. The micro three-dimensional printing device according to any one of claims 1 to 5, wherein: The wavelength of the image light is no greater than 4430 nm.

7. The micro three-dimensional printing device according to claim 6, wherein: The image light is ultraviolet light.

8. The micro three-dimensional printing device according to any one of claims 1 to 7, wherein: The micro LED display projector further includes a micro LED display module and a lens group, and the micro LED display module is used to emit the image light.

9. The micro three-dimensional printing device according to claim 8, wherein: The micro LED display module further includes at least one micro LED display panel, wherein the at least one micro LED display panel includes an IC (integrated circuit) backplane and a micro LED array area having one or more micro LEDs, the micro LED array area is formed on the surface of the IC backplane, and each of the one or more micro LEDs is electrically connected to the IC backplane.

10. The micro three-dimensional printing device according to claim 9, wherein: The lens group is arranged to face the micro LED display module for transmitting image light emitted from the micro display module.

11. The micro three-dimensional printing device according to claim 10, wherein: A diameter of at least one lens in the lens group is not less than a diagonal of the micro LED array area.

12. The micro three-dimensional printing device according to any one of claims 9 to 11, wherein: The micro LED display module comprises: Three monochrome micro-LED display panels; an optical combination unit that combines the three color images from the three monochrome micro LED display panels into one target image, wherein the three monochrome micro LED display panels are arranged around the optical combination unit; and a support frame comprising a central chamber and four openings surrounding the central chamber; Wherein, the optical combination unit is arranged in the central cavity, each of the three micro LED display panels is respectively fixed on the edge of three of the openings, the fourth opening of the openings is positioned to transmit the image light outward, and the fourth opening is arranged facing one of the three openings.

13. The micro three-dimensional printing device according to any one of claims 9 to 12, wherein: The micro LED display panel further comprises: An external circuit board is formed at the bottom of the IC back plate and is electrically connected to the IC back plate via bonding wires.

14. The micro three-dimensional printing device according to claim 13, wherein: The external circuit board is made of a flexible printed circuit.

15. The micro three-dimensional printing device according to claim 13 or 14, wherein: The IC backplane includes a non-functional area and an internal connection area; the non-functional area is connected to the external circuit board via the bonding wire; and the internal connection area is connected to the micro LED.

16. The micro three-dimensional printing device according to claim 15, wherein: The non-functional region is formed adjacent to the internal connection region.

17. The micro three-dimensional printing device according to claim 15, wherein: The non-functional area is formed around the inner connection area.

18. The micro three-dimensional printing device according to any one of claims 15 to 17, wherein: The internal connection area includes an array of metal connection holes formed in the top layer of the internal connection area; each of the metal connection holes is connected one-to-one with a different one of the micro-LEDs; and the shape of the metal connection hole array is the same as the shape of the micro-LED array.

19. The micro three-dimensional printing device according to any one of claims 9 to 18, wherein: The IC backplane includes an IC driving circuit configured to drive each of the micro LEDs; wherein the IC driving circuit is driven and controlled by a PWM (pulse width modulation) signal and a current source.

20. The micro three-dimensional printing device according to claim 19, wherein: The grayscale value of each of the micro LEDs is controlled by the PWM signal.

21. The micro three-dimensional printing device according to any one of claims 9 to 20, wherein: The micro LED display panel is an AM (active matrix) micro LED display panel or a PM (passive matrix) micro LED display panel.

22. The micro three-dimensional printing device according to any one of claims 9 to 21, wherein: The micro LED display projector further includes a top cover plate covering the micro LED display panel.

23. The micro three-dimensional printing device according to claim 22, wherein: The top cover plate is a glass cover; and a gap is formed between the micro LED array area and the glass cover.

24. The micro three-dimensional printing device according to any one of claims 9 to 23, wherein: The width or length of the micro LED display panel is no greater than 5 μm; and the diagonal of the micro LED array area is no greater than 5 cm.

25. The micro three-dimensional printing device according to any one of claims 9 to 24, wherein: The micro LED display module further includes an image light rotation element, which includes a transmissive lens arranged to face the micro LED array area and a lens position rotation actuator configured to rotate the transmissive lens around at least one preset axis, wherein the preset axis is parallel to the micro LED array area.

26. The micro three-dimensional printing device according to claim 25, wherein: The transmission lens is an optical lens; and the image light emitted from the micro LED array area passes through the transmission lens and is transmitted outward in a variable direction corresponding to a rotation direction of the transmission lens.

27. The micro three-dimensional printing device according to claim 26, wherein: The diameter of the transmission lens is not less than the length of the micro LED array area.

28. The micro three-dimensional printing device according to any one of claims 25 to 27, wherein: The micro LED display module further includes an actuator controller, which is electrically connected to the lens position rotation actuator and is configured to control a rotation direction and a rotation frequency of the lens position rotation actuator.

29. The micro three-dimensional printing device according to any one of claims 25 to 28, wherein: The lens position rotation actuator is further configured to rotate the transmissive lens around an X-axis, and the X-axis is parallel to the micro LED array area in a first direction.

30. The micro three-dimensional printing device according to claim 29, wherein: The lens position rotation actuator is configured to rotate the transmissive lens around a Y-axis, and the Y-axis is parallel to the micro LED array area in a second direction; And the first direction is not parallel to the second direction.

31. The micro three-dimensional printing device according to claim 30, wherein: The X-axis is perpendicular to the Y-axis.

Images