Display panel, preparation method of display panel and electronic device

Abstract

Embodiments of the present application provide a display panel, a preparation method of the display panel and an electronic device, and relate to the technical field of display. In the display panel, the touch wire and the isolation structure are formed by the isolation structure layer, and a shielding layer is arranged between the touch wire and the signal wire in the substrate. In this way, when the distance between the touch wire and the signal wire in the substrate is relatively small, the signal interference between the two can be reduced by the shielding layer, so that the display panel has good display effect and touch precision, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are considered the next generation of display technology after liquid crystal displays. Due to their excellent color and image quality, they are widely used in various consumer electronics products such as smartphones, televisions, laptops, desktop computers, automotive displays, and wearable devices, and have become the mainstream technology in display panels.

[0003] However, the current manufacturing process of OLED display products still needs further improvement. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above background, this application provides a display panel, a method for manufacturing the display panel, and an electronic device.

[0005] A first aspect of this application provides a display panel, the display panel including a first display area, the display panel further including:

[0006] substrate;

[0007] An isolation structure layer is located on one side of the substrate. The isolation structure layer includes an isolation structure and touch traces. The isolation structure forms a plurality of isolation openings on the substrate. The touch traces at least partially surround the isolation openings. The isolation structure is insulated from the touch traces.

[0008] A shielding layer is located between the signal traces on the substrate and the touch traces.

[0009] In one possible implementation of this application, there is a gap between the isolation structures that enclose the corresponding sides of the adjacent isolation openings, and at least a portion of the touch traces are located in the gap.

[0010] In one possible implementation of this application, the orthographic projection of the touch trace on the substrate completely overlaps with the orthographic projection of the shielding layer on the substrate; or,

[0011] The orthographic projection of the touch trace on the substrate lies within the orthographic projection of the shielding layer on the substrate.

[0012] In one possible implementation of this application, the orthographic projection of the touch trace on the substrate surrounds the orthographic projection of the isolation opening on the substrate.

[0013] Preferably, the touch traces are continuously distributed around the isolation opening;

[0014] Preferably, the orthographic projections of the isolation structures that enclose adjacent isolation openings on the substrate do not overlap;

[0015] Preferably, the display panel further includes a first conductive connection portion, and the isolation structure forming adjacent isolation openings is connected through the first conductive connection portion, wherein the first conductive connection portion is located on the side of the isolation structure layer away from the substrate or the first conductive connection portion is formed by a conductive layer in the substrate near the shielding layer.

[0016] In one possible implementation of this application, the touch traces are discontinuously distributed around the isolation opening;

[0017] Preferably, the isolation structure layer further includes an isolation structure connecting portion, through which the isolation structures that enclose adjacent isolation openings are connected;

[0018] Preferably, the connecting portion of the isolation structure is located at the gap between the isolation structures on opposite sides of the adjacent isolation openings;

[0019] Preferably, the touch trace is insulated from the connection portion of the isolation structure.

[0020] In one possible embodiment of this application, at the gap position between the isolation structures that enclose and form adjacent isolation openings on opposite sides, the touch traces are located on opposite sides of the connection portion of the isolation structures;

[0021] Preferably, the display panel further includes a second conductive connection portion, which connects touch traces located on opposite sides of the isolation structure connection portion. The second conductive connection portion is located on the side of the isolation structure layer away from the substrate, or the second conductive connection portion is formed by a conductive layer close to the substrate.

[0022] In one possible implementation of this application, the display panel further includes:

[0023] A pixel defining layer is located on one side of the substrate, and the isolation structure layer is located on the side of the pixel defining layer away from the substrate;

[0024] The pixel defining layer defines a plurality of pixel openings on the substrate, and the pixel openings are connected to the corresponding isolation openings;

[0025] Preferably, the pixel defining layer is an inorganic pixel defining layer;

[0026] Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride;

[0027] Preferably, the display panel further includes a light-emitting device, which, in a direction away from the substrate, includes a first electrode, a light-emitting material layer, and a second electrode stacked together, wherein the second electrode overlaps with the isolation structure;

[0028] Preferably, the first electrode is disposed on the side of the pixel defining layer near the substrate, and at least a portion of the first electrode is exposed through the pixel opening. The first electrode is connected to the pixel circuit in the substrate, wherein the pixel circuit includes the signal trace.

[0029] Preferably, in a plane perpendicular to the substrate, the shielding layer is located between the touch trace and the pixel circuit in the substrate;

[0030] Preferably, the first electrode and the shielding layer are made of the same material, or the shielding layer is formed from a conductive layer in the substrate near the isolation structure layer.

[0031] In one possible implementation of this application, the first electrode and the shielding layer are insulated;

[0032] On a cross section perpendicular to the plane of the substrate and passing through the center of two adjacent isolation openings, the orthographic projection of the side of the first electrode away from the corresponding isolation opening on the substrate lies within the orthographic projection of the corresponding isolation structure on the substrate.

[0033] In one possible implementation of this application, the display panel further includes shielded signal traces, the shielding layer is connected to the shielded signal traces, and the shielded signal traces provide a shielding signal to the shielding layer; or,

[0034] The display panel also includes a touch chip, the shielding layer is connected to the touch chip, and the touch chip provides the shielding layer with a signal opposite to the touch driving signal;

[0035] Preferably, the shielding signal includes a grounding signal or a negative voltage signal.

[0036] In one possible implementation of this application, on a cross section perpendicular to the plane where the substrate is located and passing through the center of two adjacent isolation openings, the distance between the touch trace and the adjacent isolation structure is 4μm-6μm;

[0037] Preferably, the size of the touch trace is 3μm-7μm in a cross section perpendicular to the plane of the substrate and passing through the center of two adjacent isolation openings.

[0038] In one possible implementation of this application, the isolation structure layer includes a first isolation layer and a second isolation layer stacked together, the second isolation layer being disposed on the side of the first isolation layer facing away from the substrate, and the orthographic projection of the first isolation layer on the substrate being located within the orthographic projection of the second isolation layer on the substrate.

[0039] Preferably, the isolation structure layer further includes a third isolation layer, wherein the third isolation layer, the first isolation layer and the second isolation layer are stacked sequentially in the direction away from the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate;

[0040] Preferably, the orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate;

[0041] Preferably, the first isolation layer is made of aluminum, silver or copper, the second isolation layer is made of titanium or molybdenum, and the third isolation layer is made of molybdenum or titanium.

[0042] In one possible implementation of this application, the display panel further includes a first encapsulation layer, which includes a plurality of encapsulation units, and different encapsulation units are used to encapsulate light-emitting devices within different isolation openings;

[0043] Preferably, the orthographic projection of the packaging unit on the substrate is outside the orthographic projection of the touch trace on the substrate;

[0044] Preferably, the packaging unit is located outside the gap between the touch trace and the corresponding isolation structure;

[0045] Preferably, the display panel further includes a second encapsulation layer, the second encapsulation layer being located on the side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covering the encapsulation unit;

[0046] Preferably, the second encapsulation layer fills the gap between the isolation structure and the touch trace, and the second encapsulation layer also covers the touch trace;

[0047] Preferably, the second encapsulation layer has a flat surface on the side away from the substrate;

[0048] Preferably, the display panel further includes a third encapsulation layer, the third encapsulation layer being located on the side of the second encapsulation layer away from the substrate;

[0049] Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

[0050] A second aspect of this application also provides a method for manufacturing a display panel, the method comprising:

[0051] A substrate is provided, wherein the substrate includes signal traces;

[0052] A conductive material layer is fabricated on one side of the signal trace, and the conductive material layer is patterned to obtain a shielding layer;

[0053] An isolation structure material layer is fabricated on the side of the shielding layer away from the substrate. The isolation structure material layer is patterned to obtain an isolation structure layer including touch traces and isolation structures. The shielding layer is positioned between the touch traces and the signal traces in the substrate. The isolation structure forms multiple isolation openings on the substrate. The touch traces at least partially surround the isolation openings. The isolation structure is insulated from the touch traces.

[0054] In one possible implementation of this application, the step of fabricating a conductive material layer on one side of the signal trace and patterning the conductive material layer to obtain a shielding layer includes:

[0055] A conductive material layer is fabricated on one side of the signal trace, and the conductive material layer is patterned to obtain a first electrode and a shielding layer that are mutually insulated.

[0056] Preferably, after the step of fabricating a conductive material layer on one side of the signal trace and patterning the conductive material layer to obtain a shielding layer, the method further includes:

[0057] A pixel defining material layer is formed on the side of the first electrode and the shielding layer away from the substrate;

[0058] Preferably, after the steps of fabricating an isolation structure material layer on the side of the shielding layer away from the substrate, and patterning the isolation structure material layer to obtain an isolation structure layer including touch traces and isolation structures, the method further includes:

[0059] The pixel defining material layer exposed at the isolation opening is patterned to obtain a pixel defining layer including the pixel opening, wherein the pixel opening partially exposes the first electrode.

[0060] A third aspect of this application also provides an electronic device, the electronic device comprising a display panel as described in any possible implementation of the first aspect, or a display panel prepared in any possible implementation of the second aspect.

[0061] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. In the display panel, touch traces and isolation structures are formed by an isolation structure layer. At the same time, a shielding layer is provided between the touch traces and the signal traces of the substrate. This design can reduce signal interference between the touch traces and the traces in the substrate when they are close to each other, thereby ensuring that the display panel has good display effect and touch accuracy and improving the user experience. Attached Figure Description

[0062] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 One of the schematic diagrams illustrating the distribution of the isolation structure layer provided in this embodiment is shown;

[0064] Figure 2 Example Figure 1 One of the cross-sectional schematic diagrams at position AA in the middle;

[0065] Figure 3 Example Figure 1 Schematic diagram of the cross section at position AA (second one);

[0066] Figure 4 Example Figure 1 Schematic diagram of the cross-section at position AA (part 3);

[0067] Figure 5 The diagram illustrates the distribution of the isolation structure, the first conductive connection, and the shielding layer.

[0068] Figure 6 This embodiment provides a second schematic diagram of the distribution of the isolation structure layer;

[0069] Figure 7 Example Figure 6 One of the cross-sectional schematic diagrams at position BB in the middle;

[0070] Figure 8 Example Figure 6 Second cross-sectional diagram of the BB position;

[0071] Figure 9 One of the schematic diagrams of the film layer structure of the display panel provided in this embodiment is illustrated;

[0072] Figure 10 A schematic diagram of an isolation structure layer provided in this embodiment is illustrated.

[0073] Figure 11 This example illustrates another structural diagram of the isolation structure layer provided in this embodiment;

[0074] Figure 12 This embodiment illustrates the second schematic diagram of the film layer structure of the display panel.

[0075] Figure 13 This embodiment illustrates the third schematic diagram of the film layer structure of the display panel.

[0076] Figure 14 A flowchart illustrating the method for manufacturing the display panel provided in this embodiment is shown.

[0077] Figure 15 for Figure 14 Corresponding process flow diagram;

[0078] Figure 16a and Figure 16b Another process diagram provided in this embodiment is illustrated.

[0079] Icons: 1-Display panel; 11-Substrate; 111-Signal trace; 12-Isolation structure layer; 1201-Isolation opening; 1202-Gap; 121-Isolation structure; 122-Touch trace; 123-Isolation structure connection; 1211-First isolation structure layer; 1212-Second isolation structure layer; 1213-Third isolation structure layer; 13-Shielding layer; 14-Pixel defining layer; 1401-Pixel opening; 15-Light-emitting device; 151-First electrode; 152-Light-emitting material layer; 153-Second electrode; 171-First encapsulation layer; 1711-Encapsulation unit; 172-Second encapsulation layer; 173-Third encapsulation layer; 21-First conductive connection; 22-Second conductive connection; 30-Conductive material layer; 40-Isolation structure material layer; 50-Pixel defining material layer. Detailed Implementation

[0080] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0081] In the description of this application, it should be noted that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0082] Increasing the density of light-emitting devices (i.e., pixel density) in display panels is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in the density of light-emitting devices. Through long-term research, the inventors discovered that to address the technical challenge of limiting the density of light-emitting devices, an isolation structure can be incorporated into some display panels. During the full-layer deposition of the light-emitting material layer and cathode, the light-emitting material layer and cathode can be separated at the isolation structure location. Through multiple deposition and etching processes, light-emitting devices of different colors can be formed in different isolation openings. This process is known as light-emitting device patterning.

[0083] Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419 and PCT / CN2024 / 099072 describe relevant technical solutions for isolation structures (or partition structures or isolation pillars) and encapsulation layers, the contents of which are incorporated herein by reference.

[0084] In the aforementioned display panels, touch functionality can generally be integrated. However, interference may exist between the touch signals and the display signals, leading to a decrease in display quality and touch accuracy. Ensuring the display quality and touch accuracy of the display panel is a technical problem that urgently needs to be solved by those skilled in the art.

[0085] To address the aforementioned problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0086] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram illustrating the distribution of the isolation structure layers provided in this embodiment is shown. Figure 2 Example Figure 1 A cross-sectional schematic diagram of position AA. In this embodiment, the display panel 1 includes a substrate 11, an isolation structure layer 12, and a shielding layer 13. The substrate 11 has a multi-layer structure and includes at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers. Pixel circuits that provide driving signals for the light-emitting device 13 are formed in the substrate 11. The conductive layers can be metal conductive layers.

[0087] An isolation structure layer 12 is located on a substrate 11. The isolation structure layer 12 includes an isolation structure 121 and a touch trace 122. That is, the isolation structure 121 and the touch trace 122 have the same film structure. The isolation structure 121 forms a plurality of isolation openings 1201 on the substrate 11. The touch trace 122 at least partially surrounds the isolation openings 1201. The touch trace 122 is insulated from the isolation structure 121.

[0088] In this embodiment, in a plane perpendicular to the substrate 11, a shielding layer 13 is located between the signal traces 111 and the touch traces 122 in the substrate 11. The shielding layer 13 is used to shield signal interference between the signal traces 111 and the touch traces 122 in the substrate 11. The signal traces 111 are used to electrically connect and transmit various signals, including but not limited to traces for transmitting data signals, traces for transmitting control signals, or active layers in thin-film transistors. Exemplarily, the shielding layer 13 is used to shield signal interference between the signal traces controlling the display and the touch traces 122 in the substrate 11. The signal traces controlling the display can be traces in pixel circuits.

[0089] In the above structure, when the touch trace 122 and the signal trace 111 in the substrate 11 are close to each other, the shielding layer 13 can reduce the signal interference between them, ensuring that the display panel 1 has good display effect and touch accuracy, and improving the user experience.

[0090] Please refer to this again. Figure 1 There is a gap 1202 between the isolation structures 121 that form adjacent isolation openings 1201 on the corresponding sides, and at least part of the touch wiring 122 can be located in the gap 1202.

[0091] Furthermore, in this embodiment, the orthographic projection of the touch trace 122 on the substrate 11 overlaps with the orthographic projection of the shielding layer 13 on the substrate 11. The orthographic projections of the two on the substrate 11 may completely overlap or partially overlap.

[0092] Optionally, the orthographic projection of the touch trace 122 on the substrate 11 completely overlaps with the orthographic projection of the shielding layer 13 on the substrate 11; or, the orthographic projection of the touch trace 122 on the substrate 11 is located within the orthographic projection of the shielding layer 13 on the substrate 11.

[0093] Optionally, the orthographic projection pattern of the touch trace 122 on the substrate 11 is the same as the orthographic projection pattern of the shielding layer 13 on the substrate 11.

[0094] With this design, the touch trace 122 can be blocked by the shielding layer 13, so that the shielding layer 13 can block the signal propagation path between the touch trace 122 and the trace in the substrate 11, thereby eliminating the signal interference between the two.

[0095] In one possible implementation of this embodiment, please refer to Figure 1 The orthographic projection of the touch trace 122 on the substrate 11 surrounds the orthographic projection of the isolation opening 1201 on the substrate 11. Optionally, the touch trace 122 is continuously distributed around the isolation opening 1201, that is, the touch trace 122 can form a touch pattern on the isolation structure layer 12 independently, without the need for other film layers to connect the touch trace 122 located in the isolation structure layer 12. The orthographic projections of the isolation structures 121 that surround adjacent isolation openings 1201 on the substrate 11 do not overlap with each other.

[0096] In this embodiment, please refer to Figure 3 and Figure 4 The display panel 1 may also include a first conductive connection portion 21, and the isolation structure 121 that encloses and forms adjacent isolation openings 1201 is connected through the first conductive connection portion 21. For example... Figure 3 As shown, the first conductive connection portion 21 can be located on the side of the isolation structure layer 12 away from the substrate 11. For example, the first conductive connection portion 21 can be formed on the conductive layer of the thin-film encapsulation layer away from the substrate 11, and connected to the isolation structure 121 through a through-hole in the thin-film encapsulation layer. Alternatively, the first conductive connection portion 21 can also be formed from a conductive layer in the substrate 11 near the shielding layer 13, such as... Figure 4 As shown, when the substrate 11 includes four conductive metal layers, the first conductive connection portion 21 can be formed by the fourth conductive metal layer M4.

[0097] In this embodiment, such as Figure 5 As shown, the first conductive connection portion 21 connects the isolation structure 121. The first conductive connection portion 21 is insulated from the shielding layer 13. The orthographic projection of the first conductive connection portion 21 on the substrate 11 and the orthographic projection of the shielding layer 13 on the substrate 11 partially overlap. The extension direction of the first conductive connection portion 21 and the extension direction of the shielding layer 13 intersect. For example, the extension direction of the first conductive connection portion 21 and the extension direction of the shielding layer 13 are perpendicular to each other.

[0098] In another possible implementation of this embodiment, please refer to Figure 6 The touch traces 122 are discontinuously distributed around the isolation opening 1201. Optionally, the isolation structure layer 12 also includes an isolation structure connection portion 123, and the isolation structures 121 that enclose adjacent isolation openings 1201 are connected through the isolation structure connection portion 123.

[0099] In this embodiment, the isolation structure connection portion 123 is located at the gap 1202 between the isolation structures 121 on opposite sides of the adjacent isolation opening 1201, and the touch line 122 is insulated from the isolation structure connection portion 123.

[0100] Furthermore, at the gap 1202 position between the isolation structures 121 on opposite sides of the adjacent isolation openings 1201, the touch wiring 122 is located on opposite sides of the isolation structure connection portion 123.

[0101] In this embodiment, the touch pattern is formed by the isolation structure layer 12 and the conductive layer located on different layers. Please refer to [reference needed]. Figure 7 and Figure 8 The display panel 1 also includes a second conductive connection portion 22, which connects the touch traces 122 located on opposite sides of the isolation structure connection portion 123. For example, as... Figure 7 As shown, the second conductive connection portion 22 can be located on the side of the isolation structure layer 12 away from the substrate 11. The second conductive connection portion 22 can be formed on the conductive layer of the thin film encapsulation layer away from the substrate 11, and the touch traces 122 can be connected together through the through-holes in the thin film encapsulation layer. Alternatively, the second conductive connection portion 22 can also be formed from a conductive layer close to the substrate 11. The second conductive connection portion 22 can be located between the touch traces 122 and the shielding layer 13, for example... Figure 8 As shown; of course, Figure 8 The illustration only shows that the orthographic projection of the touch trace 122 on the substrate 11 is located within the orthographic projection of the shielding layer 13 on the substrate 11; in other embodiments, the orthographic projection of the second conductive connection portion 22 on the substrate 11 is also located within the orthographic projection of the shielding layer 13 on the substrate 11.

[0102] Please refer to Figure 9 The display panel 1 also includes a pixel defining layer 14, which is located on one side of the substrate 11. An isolation structure layer 12 is located on the side of the pixel defining layer 14 away from the substrate. The pixel defining layer 14 defines a plurality of pixel openings 1401 on the substrate 11. The pixel openings 1401 are connected to the corresponding isolation openings 1201. For example, the orthographic projection of the pixel openings 1401 on the substrate 11 is located within the orthographic projection of the isolation openings 1201 on the substrate 11.

[0103] In this embodiment, the pixel defining layer 14 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 14 is an inorganic pixel defining layer. When the pixel defining layer 14 is an inorganic pixel defining layer, the pixel defining layer 14 can be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed by alternating silicon oxide and silicon nitride.

[0104] When entering a new location, please refer to the following instructions again. Figure 9 The display panel 1 also includes light-emitting devices 15, at least a portion of which is located within a pixel opening 1401. In the direction away from the substrate 11, the light-emitting device 15 includes a first electrode 151, a light-emitting material layer 152, and a second electrode 153 stacked together. The first electrodes 151 are spaced apart on one side of the substrate 11. Exemplarily, the first electrodes 151 are distributed on the substrate 11, and the pixel opening 1401 exposes at least a portion of the first electrodes 151. The first electrodes 151 are connected to pixel circuitry (not shown) in the substrate 11. The light-emitting material layer 152 extends from the pixel opening 1401 to the side of the pixel defining layer 14 away from the substrate 11. The second electrode 153 extends from within the pixel opening 1401 to the side of the pixel defining layer 14 away from the substrate 11 and connects to an isolation structure 121. Exemplarily, the second electrode 153 extends from within the pixel opening 1401 to the side of the pixel defining layer 14 away from the substrate 11 and overlaps with the isolation structure 121, wherein the isolation structure 121 is a conductive isolation structure. For example, the first electrode 151 can be the anode of the light-emitting device 15, and the second electrode 153 can be the cathode of the light-emitting device 15.

[0105] For example, in a plane perpendicular to the substrate 11, the shielding layer 13 is located between the touch trace 122 and the pixel circuit in the substrate 11.

[0106] In this embodiment, the first electrode 151 and the shielding layer 13 are made of the same material and can be fabricated in the same layer. The shielding layer 13 can be a three-layer structure of ITO / Ag / ITO. Fabricating the first electrode 151 and the shielding layer 13 in the same layer does not require additional processes and will not affect the existing manufacturing process. Alternatively, the shielding layer 13 can also be formed from a conductive layer on the side of the substrate 11 closest to the isolation structure layer 12. For example, when the substrate 11 includes four conductive metal layers, the shielding layer 13 can be formed from the fourth conductive metal layer M4.

[0107] In this embodiment, the first electrode 151 and the shielding layer 13 are insulated. Please refer to [reference needed]. Figure 9On a cross section perpendicular to the plane of substrate 11 and passing through the center of two adjacent isolation openings 1201, the orthographic projection of the side of the first electrode 151 away from the corresponding isolation opening 1201 on substrate 11 is located within the orthographic projection of the corresponding isolation structure 121 on substrate 11.

[0108] Furthermore, in this embodiment, the display panel 1 also includes a shielding signal line. Exemplarily, the shielding signal line is disposed in the non-display area of ​​the display panel. The shielding signal line is connected to the shielding layer 13. The shielding signal line provides a shielding signal to the shielding layer 13. Exemplarily, the shielding signal includes a ground signal or a negative voltage signal (e.g., a -5V signal) so that the shielding layer 13 has the ability to shield the signal interference between the traces in the substrate 11 and the touch traces 122.

[0109] In other embodiments of this example, the display panel 1 may further include a touch chip connected to the touch traces 122 and the shielding layer 13. The touch chip provides the shielding layer 13 with a signal opposite to the touch driving signal, so that the shielding layer 13 has the ability to shield the signal interference between the traces in the substrate 11 and the touch traces 122. For example, when the touch driving signal is a high-level signal in a square wave signal, the touch chip provides the shielding layer 13 with a low-level signal in a square wave signal; when the touch driving signal is a sine wave signal, the touch chip provides the shielding layer 13 with a cosine wave signal.

[0110] Furthermore, please refer to again Figure 9 On a cross-section perpendicular to the plane of substrate 11 and passing through the center of two adjacent isolation openings 1201, the distance d1 between the touch trace 122 and the adjacent isolation structure 121 is 4μm-6μm. Exemplarily, the distance d1 between the touch trace 122 and the adjacent isolation structure 121 includes 4μm, 4.05μm, 4.23μm, 4.35μm, 4.85μm, 5.1μm, 5.45μm, 5.86μm, or 6μm.

[0111] Optionally, in a cross-section perpendicular to the plane of the substrate 11 and passing through the center of two adjacent isolation openings 1201, the dimension d2 of the touch trace 122 is 3μm-7μm. Exemplarily, the dimension d2 of the touch trace 122 includes 3μm, 3.05μm, 3.23μm, 3.5μm, 3.75μm, 3.96μm, 4.35μm, 4.85μm, 5.1μm, 5.45μm, 5.86μm, 6μm, 6.35μm, 6.75μm, or 7μm.

[0112] In this embodiment, please refer to Figure 10In the direction away from the substrate 11, the isolation structure layer 12 includes a first isolation layer 1211 and a second isolation layer 1212 stacked together, wherein the orthographic projection of the first isolation layer 1211 onto the substrate 11 lies within the orthographic projection of the second isolation layer 1212 onto the substrate 11. That is, in the direction toward the isolation opening 1201, the second isolation layer 1212 extends relative to the first isolation layer 1211. In the direction perpendicular to the plane of the substrate 11 and along the line connecting the geometric centers of two adjacent isolation openings 1201, the cross-section of the isolation structure layer 12 may be T-shaped. In this embodiment, the second electrode 153 may be connected to the first isolation layer 1211 in the isolation structure 121, wherein the first isolation layer 1211 is a conductive isolation layer.

[0113] Further, please refer to Figure 11 The isolation structure layer 12 further includes a third isolation layer 1213. In the direction away from the substrate 11, the third isolation layer 1213, the first isolation layer 1211, and the second isolation layer 1212 are sequentially stacked. The orthographic projection of the first isolation layer 1211 onto the substrate 11 lies within the orthographic projection of the third isolation layer 1213 onto the substrate 11. The orthographic projection of the third isolation layer 1213 onto the substrate 11 lies within the orthographic projection of the second isolation layer 1212 onto the substrate 11. The cross-section of the isolation structure layer 12 can be I-shaped along the line connecting the geometric centers of two adjacent isolation openings 1201, perpendicular to the plane of the substrate 11. In this embodiment, the second electrode 153 can also be connected to the third isolation layer 1213, which can also be a conductive isolation layer.

[0114] In this embodiment, the material of the first isolation layer 1211 includes aluminum, silver or copper, the material of the second isolation layer 1212 includes titanium or molybdenum, and the material of the third isolation layer 1213 includes molybdenum or titanium.

[0115] Further, please refer to Figure 12 The display panel 1 also includes a first encapsulation layer 171, which includes multiple encapsulation units 1711. Different encapsulation units 1711 are used to encapsulate light-emitting devices 15 within different isolation openings 1201. The orthographic projection of the encapsulation unit 1711 on the substrate 11 is outside the orthographic projection of the touch trace 122 on the substrate 11; that is, the encapsulation unit 1711 does not cover the touch trace 122. Furthermore, the encapsulation unit 1711 is not located in the gap 1202 between the touch trace 122 and the isolation structure 121, to prevent the conductive layer deposited below the encapsulation unit 1711 from connecting the touch trace 122 and the isolation structure 121. In other words, during the patterning process of the light-emitting device, the film layer formed in the gap 1202 between the touch trace 122 and the isolation structure 121 is etched away.

[0116] Further, please refer to Figure 13The display panel 1 also includes a second encapsulation layer 172, which is located on the side of the encapsulation unit 1711 away from the substrate 11, and the second encapsulation layer 172 at least covers the encapsulation unit 1711.

[0117] Optionally, the second encapsulation layer 172 fills the gap 1202 between the isolation structure 121 and the touch trace 122, and the second encapsulation layer 172 also covers the touch trace 122. The second encapsulation layer 172 has a flat surface on the side away from the substrate 11.

[0118] Furthermore, please refer to again Figure 13 The display panel 1 also includes a third encapsulation layer 173, which is located on the side of the second encapsulation layer 172 away from the substrate 11.

[0119] Optionally, the first encapsulation layer 171 and the third encapsulation layer 173 are inorganic encapsulation layers, and the second encapsulation layer 172 is an organic encapsulation layer. For example, the first encapsulation layer 171 and the third encapsulation layer 173 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 172 can be formed by inkjet printing (IJP).

[0120] It is understood that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer and a cover plate, etc., which are stacked sequentially on the side of the third encapsulation layer 173 away from the substrate 11. The above-mentioned film layers are conventional film layers of the display panel, and will not be described in detail here.

[0121] Based on the same inventive concept, this embodiment also provides a method for manufacturing a display panel, please refer to... Figure 14 and Figure 15 ,in Figure 14 A schematic flowchart illustrating the method for manufacturing the display panel provided in this embodiment is illustrated. Figure 15 Example Figure 14 The corresponding process flow diagram is shown below. Figure 14 and Figure 15 The method for manufacturing the display panel provided in this embodiment will be described in detail.

[0122] Step S11: A substrate 11 is provided, wherein the substrate 11 includes signal traces 111.

[0123] In this embodiment, the substrate 11 has a multi-layer structure, including at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers. A pixel circuit 111 for providing driving signals to a light-emitting device is formed within the substrate 11. Exemplarily, the conductive layers include metal conductive layers. The signal traces 111 are used to electrically connect and transmit various signals, including but not limited to traces for transmitting data signals, traces for transmitting control signals, or active layers in thin-film transistors.

[0124] Step S12: A conductive material layer 30 is fabricated on one side of the signal trace, and the conductive material layer 30 is patterned to obtain a shielding layer 13.

[0125] In step S13, an isolation structure material layer 40 is formed on the side of the shielding layer 13 away from the substrate 11. The isolation structure material layer 40 is patterned to obtain an isolation structure layer 12 including touch traces 121 and isolation structure 122. The shielding layer 13 is located between the touch traces 122 and the signal traces 111 in the substrate 11.

[0126] The isolation structure 122 surrounds a plurality of isolation openings 1201 on the substrate 11. The touch traces 122 at least partially surround the isolation openings 1201. For example, there are gaps 1202 between the isolation structures 121 that surround the corresponding sides of the adjacent isolation openings 1201, and at least a portion of the touch traces 122 are located in the gaps 1202.

[0127] In this embodiment, please refer to Figure 16a Step S12 can be implemented in the following way.

[0128] A conductive material layer 30 is fabricated on one side of the signal trace, and the conductive material layer 30 is patterned to obtain a first electrode 151 and a shielding layer 13 that are mutually insulated.

[0129] like Figure 16a As shown, after step S12, the method provided in this embodiment further includes: forming a pixel defining material layer 50 on the side of the first electrode 151 and the shielding layer 13 away from the substrate 11.

[0130] Please refer to Figure 16b After step S13, the method provided in this embodiment further includes: patterning the pixel defining material layer 50 exposed at the isolation opening 1201 to obtain a pixel defining layer 14 including the pixel opening 1401, wherein the pixel opening 1401 exposes part of the first electrode 151.

[0131] The above-described method for manufacturing a display panel involves creating a shielding layer 13 between the touch trace 122 and the signal trace 111 in the substrate. When the distance between the touch trace 122 and the signal trace 111 in the substrate is relatively close, the shielding layer 13 reduces signal interference between them, ensuring that the display panel 1 has good display effect and touch accuracy, and improving the user experience.

[0132] Based on the same inventive concept, this application also provides an electronic device, which includes the display panel provided in this application, or a display panel prepared by the method for preparing the display panel provided in this embodiment. The electronic device may include smartphones, tablets, in-vehicle display devices, smart wearable devices, televisions, laptops and other devices with display functions.

[0133] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. In the display panel, touch traces and isolation structures are formed by an isolation structure layer. At the same time, a shielding layer is provided between the touch traces and the signal traces in the substrate. This design can reduce signal interference between the touch traces and the signal traces in the substrate when they are close to each other, thereby ensuring that the display panel has good display effect and touch accuracy, and improving the user experience.

[0134] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; An isolation structure layer is located on one side of the substrate. The isolation structure layer includes an isolation structure and touch traces. The isolation structure forms a plurality of isolation openings on the substrate. The touch traces at least partially surround the isolation openings. The isolation structure is insulated from the touch traces. A shielding layer is located between the signal traces and the touch traces in the substrate; In the first embodiment, the orthographic projection of the touch trace on the substrate surrounds the orthographic projection of the isolation opening on the substrate; or, In the second embodiment, the touch traces are discontinuously distributed around the isolation opening.

2. The display panel as described in claim 1, characterized in that, There are gaps between the isolation structures that enclose the corresponding sides of the adjacent isolation openings, and at least a portion of the touch traces are located in the gaps.

3. The display panel as described in claim 1, characterized in that, The orthographic projection of the touch trace on the substrate completely overlaps with the orthographic projection of the shielding layer on the substrate; or... The orthographic projection of the touch trace on the substrate lies within the orthographic projection of the shielding layer on the substrate.

4. The display panel as described in claim 1, characterized in that, In the first embodiment, the touch traces are continuously distributed around the isolation opening.

5. The display panel as described in claim 4, characterized in that, The orthographic projections of the isolation structures that enclose the adjacent isolation openings on the substrate do not overlap.

6. The display panel as described in claim 4, characterized in that, The display panel further includes a first conductive connection portion, and the isolation structure forming adjacent isolation openings is connected through the first conductive connection portion, wherein the first conductive connection portion is located on the side of the isolation structure layer away from the substrate or the first conductive connection portion is formed by a conductive layer in the substrate near the shielding layer.

7. The display panel as described in claim 1, characterized in that, In the second embodiment, the isolation structure layer further includes an isolation structure connecting portion, through which the isolation structures that enclose adjacent isolation openings are connected.

8. The display panel as described in claim 7, characterized in that, The connection part of the isolation structure is located at the gap between the isolation structures on opposite sides of the adjacent isolation openings.

9. The display panel as described in claim 7, characterized in that, The touch control traces are insulated from the connection points of the isolation structure.

10. The display panel as claimed in claim 7, characterized in that, At the gap between the isolation structures on opposite sides of the adjacent isolation openings, the touch traces are located on opposite sides of the connection portion of the isolation structures.

11. The display panel as claimed in claim 10, characterized in that, The display panel further includes a second conductive connection portion, which connects touch traces located on opposite sides of the isolation structure connection portion. The second conductive connection portion is located on the side of the isolation structure layer away from the substrate, or the second conductive connection portion is formed by a conductive layer close to the substrate.

12. The display panel as described in any one of claims 1-11, characterized in that, The display panel also includes: A pixel defining layer is located on one side of the substrate, and the isolation structure layer is located on the side of the pixel defining layer away from the substrate; The pixel defining layer defines a plurality of pixel openings on the substrate, and the pixel openings are connected to the corresponding isolation openings.

13. The display panel as claimed in claim 12, characterized in that, The pixel delimiting layer is an inorganic pixel delimiting layer.

14. The display panel as claimed in claim 12, characterized in that, The pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride.

15. The display panel as claimed in claim 12, characterized in that, The display panel also includes a light-emitting device. In the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer and a second electrode stacked together, wherein the second electrode overlaps with the isolation structure.

16. The display panel as claimed in claim 15, characterized in that, The first electrode is disposed on the side of the pixel defining layer near the substrate, and at least a portion of the first electrode is exposed through the pixel opening. The first electrode is connected to the pixel circuit in the substrate, wherein the pixel circuit includes the signal trace.

17. The display panel as claimed in claim 16, characterized in that, In a plane perpendicular to the substrate, the shielding layer is located between the touch traces and the pixel circuits in the substrate.

18. The display panel as claimed in claim 15, characterized in that, The first electrode and the shielding layer are made of the same material, or the shielding layer is formed from a conductive layer in the substrate near the isolation structure layer.

19. The display panel as claimed in claim 15, characterized in that, The first electrode and the shielding layer are insulated; On a cross section perpendicular to the plane of the substrate and passing through the center of two adjacent isolation openings, the orthographic projection of the side of the first electrode away from the corresponding isolation opening on the substrate lies within the orthographic projection of the corresponding isolation structure on the substrate.

20. The display panel as claimed in claim 1, characterized in that, The display panel also includes shielded signal traces, the shielding layer is connected to the shielded signal traces, and the shielded signal traces provide a shielding signal to the shielding layer.

21. The display panel as claimed in claim 1, characterized in that, The display panel also includes a touch chip, and the shielding layer is connected to the touch chip. The touch chip provides the shielding layer with a signal opposite to the touch driving signal.

22. The display panel as claimed in claim 20, characterized in that, The shielding signal includes a grounding signal or a negative voltage signal.

23. The display panel as claimed in claim 1, characterized in that, On a cross-section perpendicular to the plane of the substrate and passing through the center of two adjacent isolation openings, the distance between the touch trace and the adjacent isolation structure is 4μm-6μm.

24. The display panel as claimed in claim 1, characterized in that, On a cross-section perpendicular to the plane of the substrate and passing through the center of two adjacent isolation openings, the size of the touch trace is 3μm-7μm.

25. The display panel as described in any one of claims 1-11, characterized in that, The isolation structure layer includes a first isolation layer and a second isolation layer stacked together. The second isolation layer is disposed on the side of the first isolation layer away from the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate.

26. The display panel as claimed in claim 25, characterized in that, The isolation structure layer further includes a third isolation layer. In the direction away from the substrate, the third isolation layer, the first isolation layer and the second isolation layer are stacked in sequence, and the orthogonal projection of the first isolation layer on the substrate is located within the orthogonal projection of the third isolation layer on the substrate.

27. The display panel as claimed in claim 26, characterized in that, The orthographic projection of the third isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate.

28. The display panel as claimed in claim 26, characterized in that, The first isolation layer is made of aluminum, silver or copper, the second isolation layer is made of titanium or molybdenum, and the third isolation layer is made of molybdenum or titanium.

29. The display panel as described in any one of claims 1-11, characterized in that, The display panel further includes a first encapsulation layer, which includes multiple encapsulation units, and different encapsulation units are used to encapsulate light-emitting devices within different isolation openings.

30. The display panel as claimed in claim 29, characterized in that, The orthographic projection of the packaging unit on the substrate is outside the orthographic projection of the touch trace on the substrate.

31. The display panel as claimed in claim 29, characterized in that, The packaging unit is located outside the gap between the touch trace and the corresponding isolation structure.

32. The display panel as claimed in claim 29, characterized in that, The display panel further includes a second encapsulation layer located on the side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covers the encapsulation unit.

33. The display panel as claimed in claim 32, characterized in that, The second encapsulation layer fills the gap between the isolation structure and the touch trace, and the second encapsulation layer also covers the touch trace.

34. The display panel as claimed in claim 32, characterized in that, The second encapsulation layer has a flat surface on the side away from the substrate.

35. The display panel as claimed in claim 32, characterized in that, The display panel further includes a third encapsulation layer, which is located on the side of the second encapsulation layer away from the substrate.

36. The display panel as claimed in claim 35, characterized in that, The first and third encapsulation layers are inorganic encapsulation layers, while the second encapsulation layer is an organic encapsulation layer.

37. A method for manufacturing a display panel, characterized in that, The method includes: A substrate is provided, wherein the substrate includes signal traces; A conductive material layer is fabricated on one side of the signal trace, and the conductive material layer is patterned to obtain a shielding layer; An isolation structure material layer is formed on the side of the shielding layer away from the substrate. The isolation structure material layer is patterned to obtain an isolation structure layer including touch traces and isolation structures. The shielding layer is located between the touch traces and the signal traces in the substrate. The isolation structure forms a plurality of isolation openings on the substrate. The touch traces at least partially surround the isolation openings. The isolation structure is insulated from the touch traces. In the first embodiment, the orthographic projection of the touch trace on the substrate surrounds the orthographic projection of the isolation opening on the substrate; or, In the second embodiment, the touch traces are discontinuously distributed around the isolation opening.

38. The method for manufacturing a display panel as described in claim 37, characterized in that, The step of fabricating a conductive material layer on one side of the signal trace and patterning the conductive material layer to obtain a shielding layer includes: A conductive material layer is fabricated on one side of the signal trace, and the conductive material layer is patterned to obtain a first electrode and a shielding layer that are mutually insulated.

39. The method for manufacturing a display panel as described in claim 38, characterized in that, After fabricating a conductive material layer on one side of the signal trace and patterning the conductive material layer to obtain a shielding layer, the method further includes: A pixel-defining material layer is formed on the side of the first electrode and the shielding layer away from the substrate.

40. The method for manufacturing a display panel as described in claim 38, characterized in that, After fabricating an isolation structure material layer on the side of the shielding layer away from the substrate, and patterning the isolation structure material layer to obtain an isolation structure layer including touch traces and isolation structures, the method further includes: The pixel defining material layer exposed at the isolation opening is patterned to obtain a pixel defining layer including the pixel opening, wherein the pixel opening partially exposes the first electrode.

41. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-36, or a display panel prepared by any one of the preparation methods in claims 37-40.

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