Efficient autocatalytic metallization of polymer surfaces
Through electroless deposition and immersion plating processes, copper interconnects are formed on the polymer surface, which solves the problems of numerous metallization steps and uncontrolled etching in the prior art, and realizes a high-efficiency and low-roughness packaging structure, suitable for advanced semiconductor packaging.
Patent Information
- Application Number
- CN202380089698.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-12-28
- Filing Date
- 2023-09-11
- Publication Date
- 2025-08-08
AI Technical Summary
The prior art has many steps, time-consuming and expensive problems in the metallization process of non-conductive surfaces in semiconductor packaging, and the current etchant is not controlled enough to remove copper and nickel alloys, limiting the packaging size reduction ability.
The electroless deposition process is used to deposit cobalt alloy or nickel alloy adhesion layer on the polymer surface, and the copper seed layer is formed by an immersion plating process, followed by the control of the removal of copper and nickel alloys using optimized etchant and process conditions, simplifying the metallization process.
More efficient non-conductive surface metallization is achieved, reducing roughness, improving the size scaling capability of the package, and the etching process is more controlled, suitable for patterning of advanced package interconnects.