Ball bonding chopper tip structure capable of increasing height of convex point of gold ball
By adding a cavity structure inside the tip of the ball welding cutting knife to form a round table-shaped gold ball bump, the problem of two stacking of gold ball bump height control in the prior art is solved, and efficient production and high yield gold ball bump preparation are achieved.
CN120511201APending Publication Date: 2025-08-19GUOBO ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202510523009.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2025-08-19
AI Technical Summary
Technical Problem
The existing ball welding splitting knives require two stacking processes to achieve height control of the gold ball bumps, resulting in high process difficulty, low production efficiency and high reliability risks.
Method used
Design a ball welding cutting knife tip structure, add a cavity structure inside to form a round table-shaped golden ball bump, and increase the height and width of the golden ball bump through a one-time stacking process to reduce the difficulty of the stacking process.
Benefits of technology
Effectively reduce the number of stacking processes, improve production efficiency, reduce process difficulty, and improve production yield and reliability.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to a unique tip structure suitable for a ball bonding chopper, the unique tip structure comprises a conventional structure and a cavity structure, the conventional structure comprises a wire hole, a first inner tangent plane, a second inner tangent plane, an inner cavity chamfer height, an appearance chamfer, an appearance surface angle and an appearance size, and the cavity structure comprises an upper platform, a platform taper and a platform height. The method has the advantages that an extra cavity structure is added in the tip, the height of a Ball Height above a single-layer gold ball bump Ball Thickness is increased, the overall height of the single-layer gold ball bump is effectively increased, the number of times of a stacking process is reduced, and the production efficiency is improved; the width of the single-layer Top Diameter is increased, the process difficulty of the stacking process is reduced, and the production yield is improved.
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