Resin composition and product thereof

By combining three fillers with different morphologies and particle sizes with epoxy resin in the resin composition and adjusting the dielectric constant ratio, the problem of poor adhesion and insulation in traditional resin compositions is solved, and excellent thermal conductivity, insulation and adhesion of insulating films and prepregs are achieved, meeting the use requirements of metal substrates and circuit substrates.

CN120590754AActive Publication Date: 2025-09-05ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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Patent Information

Application Number
CN202510897065.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-30
Publication Date
2025-09-05
Estimated Expiration
2045-06-30

AI Technical Summary

Technical Problem

When traditional resin compositions improve the thermal conductivity, insulation and adhesion of insulating films and prepregs, there is a problem of poor adhesion and insulation due to improper selection and dosage of fillers with different morphologies and particle sizes, which cannot meet the use requirements of metal substrates and circuit substrates.

Method used

Three fillers with different morphologies, particle sizes and thermal conductivity coefficients (nanofillers, spherical fillers and flake fillers) are combined with epoxy resin. By adjusting their dielectric constant ratios, a thermal conductive path is formed, thermal conductivity is improved, electric field distortion is reduced, and adhesion and insulation are enhanced.

Benefits of technology

The excellent thermal conductivity, insulation and adhesion of the insulating film and prepreg are achieved, meeting the use requirements of metal substrates and circuit substrates, and improving the breakdown voltage and peel strength.

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Abstract

The present invention relates to a resin composition and a product thereof, the resin composition at least comprises an epoxy resin, a mixed filler and a curing agent, the mixed filler comprises a first filler, a second filler and a third filler; wherein the first filler is a nano filler, the particle size D50 of the first filler is 10-100 nm, the heat conductivity coefficient of the first filler is 10-200 W / mk, and the ratio of the dielectric constant of the first filler to the dielectric constant of the epoxy resin is 1: 3-3: 1; the second filler is a spherical filler, the particle size D50 is 10-40 [mu] m, the heat conductivity coefficient is 50-200 W / mk, and the ratio of the dielectric constant of the second filler to the dielectric constant of the epoxy resin is 1: 3-3: 1; the third filler is a flaky filler, the particle size D50 is 20-40 [mu] m, the heat conductivity coefficient is greater than or equal to 150 W / mk, and the ratio of the dielectric constant of the third filler to the dielectric constant of the epoxy resin is 1: 3-3: 1. The insulating adhesive film and the prepreg prepared from the resin composition have excellent thermal conductivity, insulativity and cohesiveness, so that a metal substrate and a circuit substrate can meet use requirements.
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