Manufacturing method of bus duct shell and bus duct shell
Through laser selective melting additive manufacturing of aviation-grade aluminum alloy powder and nano-scale thermal conductivity enhanced phase composite powder, combined with laser-assisted hot isostatic pressing and supercritical fluid and magnetic field collaborative processing, the structural stability and thermal conductivity balance problems of the bus duct shell are solved, and the synergistic effects of high-precision installation cavity, increased strength, enhanced heat dissipation and protective performance are achieved.
Patent Information
- Application Number
- CN202511187053.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-25
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2045-08-25
AI Technical Summary
The existing bus duct shell has deficiencies in structural stability, thermal conductivity balance and manufacturing process, resulting in low power transmission efficiency, many safety hazards, and a lack of effective heat dissipation structure design and material micro-control.
Aviation-grade aluminum alloy powder and nano-scale thermal conductivity enhanced phase composite powder are used. Through laser selective melting additive manufacturing and bionic composite methods, combined with laser-assisted hot isostatic pressing, supercritical fluid and magnetic field collaborative processing, a high-precision installation cavity is formed. The bionic composite method forms a high-precision installation cavity, realizes the atomic-level combination of the main shell and the connecting plate, constructs a bionic micro-nano heat dissipation structure and a gradient multifunctional protective layer, and performs intelligent regulation of temperature balance.
The high-precision manufacturing of bus duct shells is achieved. The bionic composite powder method is used to form a high-precision installation cavity, which solves the defects of traditional casting processes, improves the structural strength, thermal conductivity and temperature balance of the shell, reduces the interface thermal resistance, enhances the heat dissipation efficiency and protection performance, and ensures the dimensional stability and long-term reliability of the shell.