Warping detection device based on optical image
Through the optical image warpage detection device, combined with shadow moiré technology and automatic phase stepping technology, the accuracy and efficiency problems of existing warpage detection methods are solved, and efficient non-contact warpage detection is realized, which is suitable for PCB and wafer warpage detection.
CN120740448APending Publication Date: 2025-10-03LEADING OPTICAL TECH (JIANGSU) CO LTD
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Patent Information
- Application Number
- CN202410319918.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2025-10-03
AI Technical Summary
Technical Problem
Existing warpage detection methods rely on human visual measurement for accuracy and are prone to scratching workpieces, or are accurate but inefficient, making it difficult to meet factory production needs.
Method used
The warpage detection device based on optical image is adopted, which utilizes shadow moiré technology and automatic phase stepping technology, combined with modular design, including optical measurement module, adjustment mechanism and lifting assembly, to achieve non-contact and efficient detection.
Benefits of technology
It achieves fast and efficient detection of chip out-of-plane displacement, has the advantages of non-contact measurement and improves detection efficiency, and is suitable for online PCB warpage detection and wafer warpage detection.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of optical detection, in particular to a warpage detection device based on an optical image, which comprises a frame body, a working table and a warpage detection device, and is characterized in that the working table is arranged in the frame body; the control unit is electrically connected with each unit and is used for adjusting the working state of each unit; the workpiece placing unit is arranged on the working table top and internally provided with a first lifting assembly used for adjusting a grating and a second lifting assembly used for adjusting the position of a workpiece; the optical measuring unit is used for measuring the workpiece in the workpiece placing unit; the control panel unit is used for adjusting working condition parameters of the warping detection device; and the display unit is used for displaying the detection data of the workpiece and displaying the working condition information of the warping detection device. According to the method, the shadow Moore technology is used as a basic basis for image observation, and sufficient accurate data is provided by combining automatic phase stepping; the chip detection device can quickly and efficiently detect the chip, has the advantage of non-contact measurement, and also has better detection efficiency.
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