Adhesive member and electronic device including the same
By incorporating an adhesive component between the housing and cover of the electronic device, particularly by increasing the thickness of the adhesive layer in the second region, the problem of weak connection between the housing and cover is solved, resulting in a more robust structure and extending the device's lifespan and reliability.
Patent Information
- Application Number
- CN202480020677.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-05
- Filing Date
- 2024-01-24
- Publication Date
- 2025-10-28
AI Technical Summary
In the process of integrating multiple functions and miniaturizing existing electronic devices, the connection strength and stability between the housing and the cover are insufficient, resulting in an inadequate structure that affects the service life and reliability of the device.
An adhesive layer is provided between the housing and the cover using an adhesive component, including a first adhesive layer and a second adhesive layer, with a base layer disposed between the two, and the thickness of the adhesive layer is increased in the second region to enhance the connection strength, providing a greater thickness that extends along the edge direction of the support component.
It improves the connection strength and stability between the housing and the cover, enhances the structural robustness of the electronic device, and extends the service life and reliability of the equipment.