High-performance modified phenolic resin plastic and preparation method thereof

By introducing polyamino polyether and nano-boron nitride into phenolic resin, a high-density cross-linked network and a dense composite structure are formed, which solves the problem of micropores easily generated in phenolic resin at high temperatures, improves its thermal stability and mechanical properties, and makes it suitable for aerospace and automotive manufacturing.

CN120888159AActive Publication Date: 2025-11-04CHANGSHU SOUTHEAST PLASTIC CO LTD
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Patent Information

Application Number
CN202511417829.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-30
Publication Date
2025-11-04
Estimated Expiration
2045-09-30

AI Technical Summary

Technical Problem

Existing phenolic resins are prone to developing micropores and defects at high temperatures, which limits further optimization of the carbon residue rate, and their high-temperature resistance is insufficient in the aerospace and automotive manufacturing fields.

Method used

By introducing polyamino polyether and nano-boron nitride into phenolic prepolymer, a high-density CNC crosslinked network is formed. A dense BN-carbon composite network is constructed through vacuum dehydration and batch addition of nano-boron nitride, thereby improving the thermal stability and mechanical properties of the material.

Benefits of technology

It significantly improves the carbon residue, thermal decomposition temperature, tensile strength, and impact strength of phenolic resin plastics, reduces micropore volume, and enhances the thermal stability and mechanical properties of the material, making it suitable for aerospace, automotive manufacturing, and high-performance composite materials.

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Abstract

The invention discloses a high-performance modified phenolic resin plastic and a preparation method thereof, and belongs to the field of phenolic resin. The preparation method comprises the following steps: adding polyamino polyether which has the molecular weight of 1500-3000 and contains 2-4 amino functional groups into a phenolic prepolymer, reacting at 85-90 DEG C for 1-1.5 hours to form a C-N-C bond cross-linked network, adding 20-50 nm nano boron nitride and a toughening agent in batches, and carrying out reduced pressure dehydration twice and curing at 160-170 DEG C, thereby obtaining the high-temperature-resistant nano boron nitride composite material. The carbon residue rate of the product is 75.0%-80.0%, the thermal decomposition temperature is 420.0-440.0 DEG C, the tensile strength is 82.5-92.0 MPa, the elongation at break is 3.6%-4.2%, the micropore volume is 0.012-0.020 cm < 3 > / g, and the thermal stability and the mechanical property are remarkably improved. The material is suitable for the fields of aerospace and high-performance composite materials, and has the advantages of low cost, long service life and the like.
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