A high-precision multi-layer circuit board surface cleaning device and method

Abstract

The application discloses a high-precision multilayer circuit board surface cleaning device, and relates to the technical field of circuit board processing equipment.The high-precision multilayer circuit board surface cleaning device comprises a flushing mechanism, a spraying mechanism and a drying mechanism, and the flushing mechanism comprises a soaking tank used for soaking and flushing multilayer circuit board pieces; a bubbling piece used for generating bubbles to flush the multilayer circuit board pieces is arranged at the bottom of the soaking tank; and a settling flushing frame is arranged above the bubbling piece; and an insert board used for clamping the multilayer circuit board pieces is movably arranged in the settling flushing frame. A high-precision multilayer circuit board surface cleaning method comprises the steps of board clamping, flushing preparation, primary flushing, secondary flushing, spraying and drying. The high-precision multilayer circuit board surface cleaning device realizes convenient and efficient bubble flushing of the multilayer circuit board, reliably and repeatedly cleans the holes on the surface of the multilayer circuit board while protecting the surface of the multilayer circuit board, and through the structural design of the settling flushing frame and the insert board, the structure is utilized multiple times, and the cleaning efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing equipment technology, and in particular to a high-precision multilayer circuit board surface cleaning device and method. Background Technology

[0002] In the electronics manufacturing industry, multilayer PCBs (printed circuit boards) are one of the most crucial components. PCBs are broadly classified into three categories based on the number of layers: single-sided boards, double-sided boards, and multilayer circuit boards. Multilayer PCBs refer to printed boards with three or more conductive pattern layers laminated with insulating materials in between, and the conductive patterns are interconnected as required. Electrical connections between them are typically achieved through copper-plated holes on the cross-section of the PCB.

[0003] Multilayer PCBs are a product of the development of electronic information technology towards high speed, multifunctionality, large capacity, small size, thinness, and lightweight. They carry complex circuit designs and ensure the normal operation of electronic devices. Environmental factors such as temperature, humidity, dust, and chemicals can all negatively affect the performance of multilayer PCBs.

[0004] In existing multilayer PCB cleaning processes, there are many copper-plated holes on the PCB surface. According to the processing type, these can be divided into drill-shaped holes and laser-formed holes. According to the hole type, they can be divided into through holes and blind holes. Because the hole structure easily accumulates dust and various chemical stains, it can even cause blockage of the holes and deformation of the copper plating layer. Therefore, the key to improving the cleaning quality of multilayer PCBs is how to efficiently remove stains from the holes on the PCB. However, existing cleaning methods such as brushing and wiping are prone to damaging surface components and failing to clean thoroughly.

[0005] In addition, there is a final drying stage in the cleaning process. For PCBs with densely packed and easily damaged components, existing technology usually only allows them to be laid out flat and spaced apart in the drying equipment to avoid collisions and wear between the PCBs. However, this also reduces the utilization rate of the space in the drying equipment, thereby greatly reducing the drying efficiency, which is the overall efficiency of the entire cleaning process. Summary of the Invention

[0006] To address the above problems, this invention provides a high-precision multilayer circuit board surface cleaning device and method, which enables convenient and efficient bubble rinsing of multilayer circuit boards. While protecting the surface of the multilayer circuit board, it reliably cleans the holes on the surface of the multilayer circuit board. Through the structural design of the settling rinsing rack and the plug-in board, it achieves the significant effects of multiple structural reuse and improved cleaning efficiency.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] A high-precision multilayer circuit board surface cleaning device includes a rinsing mechanism, a spraying mechanism, and a drying mechanism. The rinsing mechanism includes an immersion tank for soaking and rinsing the multilayer circuit board components. A foaming element is provided at the bottom of the immersion tank to generate bubbles for rinsing the multilayer circuit board components. A settling rinsing rack is placed above the foaming element. A plug-in plate for clamping the multilayer circuit board components is movably disposed within the settling rinsing rack. The plug-in plate slides up and down within a vertically arranged track on the settling rinsing rack. The settling rinsing rack includes a frame body with a top opening for placing the plug-in plate with multilayer circuit board components into the track, and a board removal slot is provided on one side of the bottom of the frame body for removing the plug-in plate with multilayer circuit board components.

[0009] As a further improvement to the above solution, the foaming component includes a deposition base plate disposed at the bottom of the immersion tank, wherein bubble generators are evenly spaced on the deposition base plate; and a screen is disposed directly above the bubble generators.

[0010] As a further improvement to the above solution, the bubble generator is provided with an upward-facing bubble outlet, which is truncated cone-shaped.

[0011] As a further improvement to the above solution, handles are provided on both sides of the upper part of the frame, and a mesh fixing component is provided at the bottom of the frame for fixing the frame to the screen; the mesh fixing component is a conical structure whose size matches the size of the holes on the screen.

[0012] As a further improvement to the above solution, an outwardly extending retrieval port is provided on one side of the top of the immersion tank, and a retrieval bucket-shaped groove for workers to tilt and flip the frame on the other side of the immersion tank; detachable slide rails are provided between the two sides of the retrieval bucket-shaped groove and the temperature control device.

[0013] As a further improvement to the above solution, a temperature control device is provided inside the immersion tank; an observation window is provided on the side of the immersion tank; and a conveyor is provided on the side of the immersion tank to the spraying mechanism.

[0014] As a further improvement to the above solution, the plug-in board is clamped on both sides of the multi-layer circuit board, and the plug-in board has slots for accommodating the sides of the multi-layer circuit board; the bottom of the track is flush with the board picking slot.

[0015] As a further improvement to the above solution, vertically upward partition posts are provided at both ends of the upper surface of the plug-in board; positioning holes that cooperate with the partition posts are provided at both ends of the lower surface of the plug-in board at the corresponding positions of the partition posts.

[0016] A cleaning method using the above-mentioned multilayer circuit board surface cleaning apparatus includes the following steps:

[0017] The assembly process involves inserting multi-layer circuit boards into the plug-in boards on both sides through slots to form a plug-in board with multi-layer circuit boards.

[0018] Rinsing preparation: The immersion tank is filled with cleaning solution, and a settling rinsing rack is placed in the cleaning solution. The part of the settling rinsing rack with handles protrudes above the surface of the cleaning solution. The temperature control device is activated and the temperature in the immersion tank is controlled at 45-60℃. The bubble generator is activated and sprays a large number of bubbles into the cleaning solution.

[0019] In one rinse, the plug-in board with multi-layer circuit board components is placed into the track through the top opening of the settling rinse rack, and then waited for it to be fully immersed in the cleaning solution and fall naturally to the bottom with the track;

[0020] Secondary rinsing: Lift the settling rinse rack from one side of the hopper-shaped trough and lean it against the inner wall of the hopper-shaped trough. Take out the plug-in board with multi-layer circuit board components through the plate removal trough. Then restore the position of the settling rinse rack, flip the plug-in board with multi-layer circuit board components and put it back into the track from the top opening of the settling rinse rack. Wait for it to be completely immersed in the cleaning solution and fall naturally to the bottom with the track.

[0021] Spraying involves conveying the plug-in board with multi-layer circuit boards to the spraying mechanism for spraying to remove residual cleaning solution from the surface of the multi-layer circuit boards.

[0022] The drying process involves stacking multiple settling and rinsing racks containing multi-layered circuit boards inside the settling and rinsing racks, and separating them vertically using the partition posts and positioning holes on the plug-in board; then, the drying mechanism removes residual moisture from the surface of the multi-layered circuit boards.

[0023] As a further improvement to the above scheme,

[0024] During the rinsing preparation step, the temperature control device maintains the temperature in the immersion tank at 50°C.

[0025] In the drying step, the operating temperature of the drying mechanism is 80℃; the height of the separator column is 5-8cm; and the depth of the positioning hole is 1cm.

[0026] Compared with the prior art, the beneficial effects of the cleaning equipment in this invention are as follows:

[0027] 1. By designing a settling and rinsing rack, along with a plug-in board and a bubble generator, a convenient and efficient bubble rinsing of multi-layer circuit boards can be achieved. During the rinsing process, the bubbles generated by the bubble generator pass through the screen to form finer bubbles that float in the cleaning solution. These bubbles collide with the multi-layer circuit boards falling in the bubble generator. A large number of bubbles vibrate and wash away the stains on the surface of the multi-layer circuit boards during the impact. Bubbles passing through the holes on the surface of the multi-layer circuit boards will continuously push or impact the stains that remain or block the holes, flushing them out or carrying them away.

[0028] 2. The cleaning solution decomposes or reacts these stains, forming precipitates that are deposited on the sedimentation plate. The frustum-shaped design of the foaming nozzle prevents precipitates from accumulating and clogging the nozzle. The sliding rail design allows for the removal of the bucket-shaped hopper, facilitating subsequent cleaning of the sediment on the sedimentation plate.

[0029] 3. The combination of the screen and the screen fixing parts can further fix the sedimentation washing rack in the immersion tank; the observation window makes it easy for staff to observe the inside of the immersion tank, and the hopper-shaped trough makes it easy for staff to tilt and lean the sedimentation washing rack.

[0030] The beneficial effects of the cleaning method in this invention are as follows:

[0031] 1. Multiple forward and reverse rinsing processes thoroughly clean the upper and lower surfaces of multi-layer circuit boards and further enhance the impact of rinsing on dirt in the holes of multi-layer circuit boards.

[0032] 2. The design of placing the components at the top and removing them at the bottom can improve the efficiency of the workers' collaborative processing; at the same time, the design of the multi-layer circuit board components through the partition columns and positioning holes on the plug-in board can achieve safe stacking of multiple layers in the settling and rinsing rack, which greatly improves the processing efficiency of the subsequent drying process. Attached Figure Description

[0033] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0034] Figure 2 This is a top view of the structure of the present invention.

[0035] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure of AA.

[0036] Figure 4 This is a three-dimensional structural diagram of the settling and rinsing frame in this invention.

[0037] Figure 5 This is a schematic diagram showing the positional relationship between the plug-in board and the multilayer circuit board in this invention.

[0038] Figure 6This is a schematic diagram showing the positional relationship of the positioning holes on the plug-in board in this invention.

[0039] In the diagram: 1. Immersion tank; 2. Foaming component; 3. Conveying component; 4. Settling and rinsing rack; 5. Multilayer circuit board component; 11. Temperature control device; 12. Picking port; 13. Picking rack hopper-shaped groove; 14. Slide rail fit; 15. Observation window; 21. Sedimentation bottom plate; 22. Bubble generator; 23. Bubble nozzle; 24. Screen; 41. Frame; 42. Track; 43. Picking plate groove; 44. Insertion plate; 45. Divider column; 46. Positioning hole; 47. Handle; 48. Slot; 49. Screen fixing component. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solution, the present invention will be described in detail below with reference to embodiments. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0041] like Figures 1-6 As shown, the specific solution of this embodiment is as follows: a high-precision multilayer circuit board surface cleaning device, including a rinsing mechanism, a spraying mechanism and a drying mechanism. The rinsing mechanism includes an immersion tank 1 for immersing and rinsing the multilayer circuit board 5; a foaming element 2 for generating bubbles to rinse the multilayer circuit board 5 is provided at the bottom of the immersion tank 1, and a settling rinsing rack 4 is placed above the foaming element 2; a plug-in plate 44 for clamping the multilayer circuit board 5 is movably arranged in the settling rinsing rack 4, and the plug-in plate 44 slides up and down in a vertically arranged track 42 on the settling rinsing rack 4; the settling rinsing rack 4 includes a frame body 41 with a top opening for placing the plug-in plate 44 with the multilayer circuit board 5 into the track 42, and a board removal slot 43 for removing the plug-in plate 44 with the multilayer circuit board 5 is provided on one side of the bottom of the frame body 41.

[0042] like Figures 1-6 As shown, in a preferred embodiment of the above, the foaming component 2 includes a deposition base plate 21 disposed at the bottom of the immersion tank 1, and bubble generators 22 are evenly spaced on the deposition base plate 21; a screen 24 is disposed directly above the bubble generators 22.

[0043] like Figures 1-6 As shown, in a preferred embodiment of the above, the bubble generator 22 is provided with a bubble outlet 23 facing upwards, and the bubble outlet 23 is frustoconical.

[0044] like Figures 1-6 As shown, in a preferred embodiment, the frame 41 is provided with handles 47 on both sides of the upper part, and the bottom of the frame 41 is provided with a mesh fixing member 49 for fixing the frame 41 to the screen 24; the mesh fixing member 49 is a conical structure whose size matches the size of the holes on the screen 24.

[0045] like Figures 1-6 As shown, in a preferred embodiment, the top side of the immersion tank 1 is provided with an outwardly extending retrieval port 12, and the other side of the immersion tank 1 is a retrieval bucket-shaped groove 13 for workers to tilt and flip the frame 41; the two sides of the retrieval bucket-shaped groove 13 are provided with detachable slide rails 14 that cooperate with the temperature control device 11.

[0046] like Figures 1-6 As shown, in a preferred embodiment of the above, a temperature control device 11 is provided in the immersion tank 1; an observation window 15 is provided on the side of the immersion tank 1; and a conveyor 3 leading to the spraying mechanism is provided on the side of the immersion tank 1.

[0047] like Figures 1-6 As shown, in a preferred embodiment, the plug-in board 44 is clamped on both sides of the multilayer circuit board 5, and the plug-in board 44 has slots 48 for accommodating the sides of the multilayer circuit board 5; the bottom of the track 42 is flush with the board taking slot 43.

[0048] like Figures 1-6 As shown, in a preferred embodiment, the upper surface of the plug-in plate 44 is provided with vertically upward partition posts 45 at both ends; the lower surface of the plug-in plate 44 is provided with positioning holes 46 at the corresponding positions of the partition posts 45 to cooperate with the partition posts 45.

[0049] A cleaning method using the above-mentioned multilayer circuit board surface cleaning apparatus includes the following steps:

[0050] The multi-layer circuit board 5 is inserted into the plug-in board 44 on both sides through the slot 48 to form a plug-in board 44 with multi-layer circuit board 5.

[0051] Rinsing preparation: The immersion tank 1 is filled with cleaning solution, and a settling rinsing rack 4 is placed in the cleaning solution. The part of the settling rinsing rack 4 with handle 47 is exposed above the surface of the cleaning solution. The temperature control device 11 is activated and the temperature in the immersion tank 1 is controlled at 45°C. The bubble generator 22 is activated and a large number of bubbles are sprayed into the cleaning solution.

[0052] In one rinse, the plug-in board 44 with multi-layer circuit board 5 is placed into the track 42 from the top opening of the settling rinse rack 4, and then waits for it to be fully immersed in the cleaning solution and fall naturally to the bottom with the track 42.

[0053] For the second rinse, lift the settling rinse rack 4 from one side of the hopper-shaped groove 13 and lean it against the inner wall of the hopper-shaped groove 13. Take out the plug-in board 44 with multi-layer circuit board 5 through the plate taking groove 43. Then restore the position of the settling rinse rack 4, flip the plug-in board 44 with multi-layer circuit board 5 and put it into the track 42 again from the top opening of the settling rinse rack 4. Wait for it to be completely immersed in the cleaning solution and fall naturally to the bottom with the track 42.

[0054] Spraying: The plug-in board 44 with multi-layer circuit board 5 is sent to the spraying mechanism by the conveyor 3 to remove the cleaning liquid remaining on the surface of the multi-layer circuit board 5.

[0055] Drying involves stacking multiple settling and rinsing racks 4 with multi-layer circuit board components 5 inside the settling and rinsing rack 4, and separating them vertically by the cooperation of the partition posts 45 on the plug-in plate 44 and the positioning holes 46; then the residual moisture on the surface of the multi-layer circuit board components 5 is dried and removed by the drying mechanism.

[0056] As a preferred embodiment of the above embodiments

[0057] A cleaning method using the above-mentioned multilayer circuit board surface cleaning apparatus includes the following steps:

[0058] The multi-layer circuit board 5 is inserted into the plug-in board 44 on both sides through the slot 48 to form a plug-in board 44 with multi-layer circuit board 5.

[0059] Rinsing preparation: The immersion tank 1 is filled with cleaning solution, and a settling rinsing rack 4 is placed in the cleaning solution. The part of the settling rinsing rack 4 with handle 47 is exposed above the surface of the cleaning solution. The temperature control device 11 is activated and the temperature in the immersion tank 1 is controlled at 50°C. The bubble generator 22 is activated and a large number of bubbles are sprayed into the cleaning solution.

[0060] In one rinse, the plug-in board 44 with multi-layer circuit board 5 is placed into the track 42 from the top opening of the settling rinse rack 4, and then waits for it to be fully immersed in the cleaning solution and fall naturally to the bottom with the track 42.

[0061] For the second rinse, lift the settling rinse rack 4 from one side of the hopper-shaped groove 13 and lean it against the inner wall of the hopper-shaped groove 13. Take out the plug-in board 44 with multi-layer circuit board 5 through the plate taking groove 43. Then restore the position of the settling rinse rack 4, flip the plug-in board 44 with multi-layer circuit board 5 and put it into the track 42 again from the top opening of the settling rinse rack 4. Wait for it to be completely immersed in the cleaning solution and fall naturally to the bottom with the track 42.

[0062] Spraying: The plug-in board 44 with multi-layer circuit board 5 is sent to the spraying mechanism by the conveyor 3 to remove the cleaning liquid remaining on the surface of the multi-layer circuit board 5.

[0063] Drying involves stacking multiple settling and rinsing racks 4 containing multi-layer circuit board components 5 within the settling and rinsing rack 4, and separating them vertically using the partition posts 45 on the insert plate 44 that engage with the positioning holes 46; subsequently, a drying mechanism removes residual moisture from the surface of the multi-layer circuit board components 5. In the rinsing preparation step, the temperature control device 11 maintains the temperature in the immersion tank 1 at 50°C;

[0064] The operating temperature of the drying mechanism is 80℃; the height of the partition column 45 is 5cm; and the depth of the positioning hole 46 is 1cm.

[0065] As a preferred embodiment of the above embodiments

[0066] A cleaning method using the above-mentioned multilayer circuit board surface cleaning apparatus includes the following steps:

[0067] The multi-layer circuit board 5 is inserted into the plug-in board 44 on both sides through the slot 48 to form a plug-in board 44 with multi-layer circuit board 5.

[0068] Rinsing preparation: The immersion tank 1 is filled with cleaning solution, and a settling rinsing rack 4 is placed in the cleaning solution. The part of the settling rinsing rack 4 with handle 47 is exposed above the surface of the cleaning solution. The temperature control device 11 is activated and the temperature in the immersion tank 1 is controlled at 60°C. The bubble generator 22 is activated and a large number of bubbles are sprayed into the cleaning solution.

[0069] In one rinse, the plug-in board 44 with multi-layer circuit board 5 is placed into the track 42 from the top opening of the settling rinse rack 4, and then waits for it to be fully immersed in the cleaning solution and fall naturally to the bottom with the track 42.

[0070] For the second rinse, lift the settling rinse rack 4 from one side of the hopper-shaped groove 13 and lean it against the inner wall of the hopper-shaped groove 13. Take out the plug-in board 44 with multi-layer circuit board 5 through the plate taking groove 43. Then restore the position of the settling rinse rack 4, flip the plug-in board 44 with multi-layer circuit board 5 and put it into the track 42 again from the top opening of the settling rinse rack 4. Wait for it to be completely immersed in the cleaning solution and fall naturally to the bottom with the track 42.

[0071] Spraying: The plug-in board 44 with multi-layer circuit board 5 is sent to the spraying mechanism by the conveyor 3 to remove the cleaning liquid remaining on the surface of the multi-layer circuit board 5.

[0072] Drying involves stacking multiple settling and rinsing racks 4 containing multi-layer circuit board components 5 within the settling and rinsing rack 4, and separating them vertically using the partition posts 45 on the insert plate 44 that engage with the positioning holes 46; subsequently, a drying mechanism removes residual moisture from the surface of the multi-layer circuit board components 5. In the rinsing preparation step, the temperature control device 11 maintains the temperature in the immersion tank 1 at 50°C;

[0073] The operating temperature of the drying mechanism is 80℃; the height of the partition column 45 is 8cm; and the depth of the positioning hole 46 is 1cm.

[0074] It should be noted that, in this document, the terms "including," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Specific examples have been used in this document to illustrate the principles and implementation methods of the present invention. These examples are merely for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be pointed out that, due to the limitations of written expression and the objective existence of infinite specific structures, those skilled in the art can make several improvements, modifications, or variations without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, variations, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A high-precision surface cleaning method for multilayer circuit boards, characterized in that, Includes the following steps: The multi-layer circuit board (5) is inserted into the plug-in board (44) on both sides through the slot (48) to form a plug-in board (44) with multi-layer circuit board (5). Rinsing preparation: The immersion tank (1) is filled with cleaning liquid, and a settling rinsing rack (4) is placed in the cleaning liquid. The part of the settling rinsing rack (4) with a handle (47) is exposed above the liquid surface of the cleaning liquid. The temperature control device (11) is activated and the temperature in the immersion tank (1) is controlled at 45-60℃. The bubble generator (22) is activated and sprays a large number of bubbles into the cleaning liquid. The bubble generator (22) is set at the bottom of the immersion tank (1) and a screen (24) is set directly above it. The plug-in board (44) with multi-layer circuit board components (5) is located above the liquid surface of the immersion tank (1) and is waiting to fall. In one rinse, insert the plug-in board (44) with multi-layer circuit board components (5) into the track (42) through the top opening of the settling rinse rack (4), and then wait for it to be fully immersed in the cleaning solution and fall naturally to the bottom along the track (42); Secondary rinsing: Lift the settling rinse rack (4) from one side of the rack hopper (13) and lean it against the inner wall of the rack hopper (13). Take out the plug-in board (44) with multi-layer circuit board components (5) through the plate taking slot (43). Then restore the position of the settling rinse rack (4). Turn the plug-in board (44) with multi-layer circuit board components (5) over and put it into the track (42) again from the top opening of the settling rinse rack (4). Wait for it to be completely immersed in the cleaning solution and fall naturally to the bottom with the track (42). During the first and second rinsing processes, the bubbles generated by the bubble generator (22) pass through the screen (24) to form finer bubbles that float in the cleaning solution and collide with the multi-layer circuit board (5) that is falling in the cleaning solution. A large number of bubbles vibrate and wash away the stains on the surface of the multi-layer circuit board (5) during the impact process. The bubbles passing through the holes on the surface of the multi-layer circuit board (5) will continuously push or impact the stains that remain or block the holes. Spraying: The plug-in board (44) with multi-layer circuit board (5) is sent to the spraying mechanism by the conveyor (3) to remove the cleaning liquid remaining on the surface of the multi-layer circuit board (5). Drying involves stacking multiple settling and rinsing racks (4) with multi-layer circuit board components (5) inside the settling and rinsing rack (4), and separating them into upper and lower sections by the cooperation of the partition column (45) on the plug-in plate (44) and the positioning hole (46); then the residual moisture on the surface of the multi-layer circuit board components (5) is dried and removed by the drying mechanism.

2. The high-precision multilayer circuit board surface cleaning method according to claim 1, characterized in that, During the rinsing preparation step, the temperature control device (11) controls the temperature in the immersion tank (1) at 50°C; In the drying step, the working temperature of the drying mechanism is 80℃; the height of the separator column (45) is 5-8cm; and the depth of the positioning hole (46) is 1cm.

3. A high-precision multilayer circuit board surface cleaning device based on the high-precision multilayer circuit board surface cleaning method according to any one of claims 1-2, comprising a rinsing mechanism, a spraying mechanism, and a drying mechanism, characterized in that, The rinsing mechanism includes an immersion tank (1) for soaking and rinsing the multi-layer circuit board (5); a bubbler (2) for generating bubbles to rinse the multi-layer circuit board (5) is provided at the bottom of the immersion tank (1), and a settling rinsing rack (4) is placed above the bubbler (2); a plug-in plate (44) for clamping the multi-layer circuit board (5) is movably arranged inside the settling rinsing rack (4), and the plug-in plate (44) slides up and down in a vertically arranged track (42) on the settling rinsing rack (4); the settling rinsing rack ( 4) Includes a frame (41) with a top opening for placing a plug-in board (44) with multi-layer circuit board components (5) into a track (42), and a board removal slot (43) for removing the plug-in board (44) with multi-layer circuit board components (5) on one side of the bottom of the frame (41); vertically upward partition posts (45) are provided at both ends of the upper surface of the plug-in board (44); and positioning holes (46) that cooperate with the partition posts (45) are provided at both ends of the lower surface of the plug-in board (44) at the corresponding positions of the partition posts (45).

4. The high-precision multilayer circuit board surface cleaning device according to claim 3, characterized in that, The foaming component (2) includes a deposition base plate (21) disposed at the bottom of the immersion tank (1), on which bubble generators (22) are evenly spaced; a screen (24) is disposed directly above the bubble generators (22).

5. The high-precision multilayer circuit board surface cleaning device according to claim 4, characterized in that, The bubble generator (22) is provided with a bubble outlet (23) facing upwards, and the bubble outlet (23) is frustum-shaped.

6. The high-precision multilayer circuit board surface cleaning device according to claim 4, characterized in that, The frame (41) is provided with handles (47) on both sides of the upper part, and the bottom of the frame (41) is provided with a mesh fixing member (49) for fixing the frame (41) on the screen (24); the mesh fixing member (49) is a conical structure whose size matches the size of the holes on the screen (24).

7. A high-precision multilayer circuit board surface cleaning device according to claim 3, characterized in that, The immersion tank (1) has an outwardly extending pick-up port (12) on one side of its top, and the other side of the immersion tank (1) is a pick-up bucket-shaped groove (13) for workers to tilt and flip the frame (41); the two sides of the pick-up bucket-shaped groove (13) are provided with detachable slide rails (14) to cooperate with the temperature control device (11).

8. A high-precision multilayer circuit board surface cleaning device according to claim 3, characterized in that, A temperature control device (11) is provided inside the immersion tank (1); an observation window (15) is provided on the side of the immersion tank (1); and a conveyor (3) leading to the spraying mechanism is provided on the side of the immersion tank (1).

9. A high-precision multilayer circuit board surface cleaning device according to claim 3, characterized in that, The plug-in board (44) is clamped on both sides of the multi-layer circuit board (5), and the plug-in board (44) has a slot (48) for accommodating the side of the multi-layer circuit board (5); the bottom of the track (42) is flush with the board taking slot (43).

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