A method for preparing an insulated wire
By using modified polyamide-imide varnish to form a multi-layer insulation structure, the problem of insufficient flexibility of polyamide-imide insulated wires at high temperatures is solved, enabling tight arrangement of wires in complex slots and lightweight motors.
Patent Information
- Application Number
- CN202511694936.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-19
- Publication Date
- 2026-03-10
- Estimated Expiration
- 2045-11-19
AI Technical Summary
Polyamide-imide insulated wires lack flexibility at high temperatures, leading to cracking of the enamel film. This restricts the tight arrangement of insulated wires in complex slots, affecting the slot fill factor and power density of motors.
Modified polyamide-imide varnish is used as the topcoat layer. By mixing modified polyamide-imide intermediate with solvent, a multi-layer insulation structure is formed, including a base layer, an optional intermediate layer and a modified topcoat layer, which improves the flexibility and heat resistance of the insulated wire.
It maintains good electrical insulation performance at high temperatures, avoids cracking, adapts to complex slot arrangement, improves motor slot fill factor, reduces stator core volume and weight, and achieves lightweighting.