A three-dimensional integrated circuit material information management method, system and storage medium

Abstract

A three-dimensional integrated circuit material information management method, system and storage medium, the method comprises: taking a core particle as a unit, constructing and managing a core particle material information library through a visual interface, and the core particle material information library supports hierarchical calling; taking a core particle as a unit, constructing and managing a hierarchical material distribution library through a visual interface, calling the core particle material information library when managing the hierarchical material distribution library, and establishing associated material attribute data of the hierarchical and material attributes; starting a thermodynamic performance analysis simulation, and a simulation engine calling the associated material attribute data from the hierarchical material distribution library for simulation analysis. Based on the core particle material information library and the hierarchical material distribution library, the application realizes centralized management, distribution and editing of 3DIC chip material information, realizes material association and distribution according to the hierarchical, simplifies the maintenance process of the material library, and improves the efficiency of thermal simulation and electromagnetic simulation.

Description

Technical Field

[0001] This invention relates to the field of 3D integrated circuit design automation technology, specifically to a method, system, and storage medium for managing material information of three-dimensional integrated circuits. Background Technology

[0002] With the rapid development of 3D integrated circuit (3DIC) technology, chip complexity is increasing, making thermal management increasingly important. 3D integration technology offers higher power density, meaning heat is more easily accumulated, and hot spots can negatively impact chip performance and lifespan. Furthermore, the 3D stacked structure of integrated circuits increases the complexity of thermal management, especially since thermal coupling effects between stacked layers can cause sharp local temperature increases, affecting device reliability. Therefore, efficient and accurate thermal modeling techniques are crucial for 3DIC design optimization.

[0003] In the design and simulation of 3D integrated circuits (3DIC), the thermodynamic performance analysis of chips, such as steady-state thermal simulation, transient thermal simulation, and linear elasticity simulation, is highly dependent on the material properties used at each layer. Different types of simulation scenarios require the use of corresponding material parameters: for example, metallic materials are often used in the wires or interconnect structures of integrated circuits, while dielectric materials are widely used for isolation between different conductive layers or as capacitor dielectrics. As the complexity of 3DIC chip structures increases, the number of layers in the chip increases, and the types of materials become more diverse, the organization and management of material information becomes more difficult.

[0004] First, existing thermal simulation tools lack a unified and efficient material management mechanism. The creation and editing of material libraries is cumbersome, relying on command lines or fragmented forms, making flexible configuration difficult. Second, due to the lack of a centralized module for managing material properties, the allocation of materials across different cores and layers is complex and error-prone, and the correlation between material properties and simulation parameters is difficult to establish accurately. These problems, to some extent, affect the efficiency of simulation setup and the reliability of results. Summary of the Invention

[0005] To address the aforementioned issues of simulation efficiency and reliability, this invention provides a method, system, and storage medium for managing 3D integrated circuit material information. Based on a chip material information library and a hierarchical material allocation library, it enables centralized management of 3D IC chip material information, allows for material association and allocation at different levels, and improves the efficiency and accuracy of chip design and simulation.

[0006] According to the first aspect, this embodiment provides a method for managing three-dimensional integrated circuit material information, including:

[0007] A core material information database is built and managed on a core particle basis, and the core material information database supports hierarchical access.

[0008] A material allocation library is constructed and managed at the core particle level. When managing the material allocation library at the core particle level, the core particle material information library is called and the material attribute data associated with the hierarchy and material properties is established.

[0009] Initiate the thermodynamic performance analysis simulation. The simulation engine calls the associated material property data from the hierarchical material allocation library for simulation analysis.

[0010] In some embodiments, the steps of building and managing the core material information database further include:

[0011] Obtain the target core particle and select to manage the core particle material information database;

[0012] The material library information for the target core particles is displayed in a list.

[0013] Receive and complete material management operations for the target core particles;

[0014] Save the list to complete the material library management operation for the target core particles.

[0015] In some embodiments, the material management operations for the target core include:

[0016] To add a new material, insert a new line at the end of the list and enter the name and attribute value of the new material.

[0017] Edit materials, modify material attribute values ​​in the rows of materials to be edited in the list; and

[0018] To delete materials, select the target row in the list and delete the material record.

[0019] The material library information includes material names and material properties, including density, thermal conductivity, and specific heat capacity.

[0020] In some embodiments, the step of constructing and managing a hierarchical material allocation library further includes:

[0021] Obtain the target core and select the management-level material allocation library;

[0022] Parse and load the list of process layers of the target core, and display the layer material information of each process layer;

[0023] Receive the associated material attribute data assigned to any process layer in the process layer list, and form the new layer material information for the corresponding process layer;

[0024] Save the new layer material information and update the layer material allocation library.

[0025] The layer material information includes the layer name, metal material, and dielectric material.

[0026] In some embodiments, the step of receiving associated material property data assigned to any process layer in the process layer list further includes:

[0027] Select the metal material cell and / or dielectric material cell for the current process layer;

[0028] When selecting a metal material cell, a drop-down menu containing material library information for the target core particle is loaded into the metal material cell, and the target metal material is selected from the drop-down menu. The material library information comes from the core particle material information library.

[0029] When selecting a dielectric material cell, a drop-down menu containing material library information for the target core is loaded into the dielectric material cell, and the target dielectric material is selected from the drop-down menu. The material library information comes from the core material information database; and the update and modification of the process layer list of the target core are saved.

[0030] According to the second aspect, this embodiment provides a three-dimensional integrated circuit simulation system, including:

[0031] The material library management module is used to build and manage a core material information library at the core particle level. The core material information library supports hierarchical access.

[0032] The hierarchical allocation module is used to build and manage the hierarchical material allocation library at the core particle level. When managing the hierarchical material allocation library, it calls the core particle material information library and establishes the association between the hierarchy and material properties; and

[0033] The simulation module is used to initiate thermodynamic performance analysis simulations. The simulation engine calls associated material property data from the hierarchical material allocation library for simulation analysis.

[0034] According to a third aspect, this embodiment provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. The processor is used to execute the computer program stored in the memory to implement the three-dimensional integrated circuit material information management method of any embodiment of the first aspect.

[0035] According to the fourth aspect, this embodiment provides a computer-readable storage medium storing a computer program that can be executed by a processor to implement the three-dimensional integrated circuit material information management method of any embodiment of the first aspect.

[0036] The three-dimensional integrated circuit material information management method, system, and storage medium according to the above embodiments have the following beneficial effects:

[0037] Two-level architecture design: A two-level database structure is constructed and managed, consisting of a "core particle and core particle material information database" and a "core particle and hierarchical material allocation database." Each core particle has its own dedicated material information database and hierarchical association information, enabling centralized management of material data and flexible configuration of hierarchical material attributes.

[0038] Material library and hierarchical association management module: Displays chip material information, including name and attribute information, through a tabular interactive interface. Users can easily add, modify and delete in the table, improving the efficiency and ease of operation in maintaining chip material information and hierarchical association information.

[0039] By constructing, managing, and using a chip material information database and a hierarchical material allocation database, we can centrally manage 3DIC chip material information and edit, manage, and allocate chip material properties. This enables hierarchical material association and allocation, improving the efficiency and accuracy of chip design and simulation. Attached Figure Description

[0040] Figure 1 This is a flowchart illustrating the main steps of a three-dimensional integrated circuit material information management method in one embodiment.

[0041] Figure 2 for Figure 1 The flowchart illustrates the management and maintenance process of the core material information database for the method shown.

[0042] Figure 3 for Figure 1 The flowchart shown illustrates the management and maintenance process of the hierarchical material allocation library in the method described.

[0043] Figure 4 for Figure 2 The diagram shows the user interface of the core material information database.

[0044] Figure 5 for Figure 3 A schematic diagram of the operation interface of the hierarchical material allocation library shown;

[0045] Figure 6 This is a schematic diagram of the software modules of a three-dimensional integrated circuit simulation system in one embodiment;

[0046] Figure 7 This is a schematic diagram of the hardware structure of a three-dimensional integrated circuit simulation system in one embodiment. Detailed Implementation

[0047] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0048] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0049] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. "Multiple" means two or more. Unless otherwise specified, "connection" or "linkage" in this application includes both direct and indirect connections (linkages).

[0050] Please refer to Figure 1 In one embodiment of the present invention, a three-dimensional integrated circuit material information management method is described. The software module establishes and manages a functional database within a simulation platform and provides a visual editing interface. The aim is to establish an independent chip material information library and an inter-layer association information library for each chip, i.e., a hierarchical material allocation library. Each layer of each chip can select and configure the required materials from the corresponding associated chip material information library, thereby achieving unified management and configuration of the material attributes and associated attributes of each chip and its layers.

[0051] The three-dimensional integrated circuit material information management method of this embodiment includes two main functional modules: core material information database management and application, and hierarchical material allocation database management and application.

[0052] In the management and application of the core material information database, this module displays the material names and their corresponding attribute values ​​in tabular form. Users can open the module's visual interface in the simulation platform to edit existing material attributes or add new materials using key-value pairs. These operations are then saved back to the core material information database. When adding materials using key-value pairs, the material name and its corresponding attribute value are treated as a single unit and added to the core material information database set, thereby improving the maintenance efficiency of the database.

[0053] The core material information database is established at the core particle level. The database contains several core particle material records. Each core particle record contains a unique material name and corresponding attribute information, which facilitates classification management and hierarchical access.

[0054] In the hierarchical material allocation library management and application, this module also displays the material properties corresponding to each level in tabular form and supports the allocation of material properties at each level of the chip. For each chip, users can select the required materials for each level in the chip from the chip's dedicated material library through a visual interface. When a specific material is selected for a certain level of the chip, the various attribute information of that material will be automatically associated with the corresponding level.

[0055] Please refer to Figure 1 The three-dimensional integrated circuit material information management method in one embodiment of the present invention mainly includes steps S100~300, which are described in detail below.

[0056] Step S100: Construct and manage a core material information database based on core particles. The core material information database supports hierarchical access.

[0057] Step S200: Construct and manage the hierarchical material allocation library based on core particles. When managing the hierarchical material allocation library, call the core particle material information library and establish the association between the hierarchy and material properties.

[0058] Step S300: Start the thermodynamic performance analysis simulation. The simulation engine calls the associated material property data from the hierarchical material allocation library for simulation analysis.

[0059] Please refer to this as well. Figure 2 as well as Figure 4 Regarding the construction and management of the core material information database in step S100 above, the following steps are involved when adding or modifying the data information of specific core particles:

[0060] Step S111: Obtain the target core particles that need to be edited, modified, or added, and select to manage the core particle material information library on the simulation platform.

[0061] Step S120: Display the material library information of the current target core in a list. If the target core has already been entered into the database, display the entered material library information of that target core in a list, such as... Figure 4 The target core is Die1; if the target core is a new product that has not yet been entered into the database, an editable blank list of the target core is created.

[0062] Step S130: Receive and complete the material management operations for the target core particle. These operations include adding, editing, and deleting materials. The core particle material database tool uses an intuitive table interface to edit and manage material properties and hierarchies, simplifying the maintenance process of the core particle material database and improving operational efficiency. Figure 4 The material library information 50 for the target core particles, presented in tabular form, includes column headers with material names and various material properties, such as density, thermal conductivity, and specific heat capacity. Each row corresponds to a single material record.

[0063] Please refer to this as well. Figure 2 as well as Figure 4 In step S130, the specific operations for material management of the target core include:

[0064] Step S131: Add a new material. Insert a new line at the end of the list and enter the name and attribute value of the new material; for example, in... Figure 4 Insert a new row at the end of the list, and click the Add button. Enter the name of the new material and the attribute value of the new material in the newly inserted table.

[0065] Step S132: Edit the material. Edit and modify the material attribute values ​​in the row of the material to be edited in the list; for example, double-click the attribute cell of the target material to directly modify the value.

[0066] Step S133: Delete material. Select the target row in the list and delete the material record; for example, select the target material row and click the delete button to remove record 56.

[0067] Step S140: Save the list; After completing the above-mentioned operations of adding, editing, or deleting materials in the target core's material library, click the Apply button 57 to save. After clicking the Apply button 57, all edited content will be automatically synchronized to the core material information library corresponding to the current target core. This database tool supports the creation of an independent material information library for each core, realizing structured management and isolation of core material data.

[0068] In another embodiment, the addition of new materials to the target core particle can be implemented using key-value pairs. When adding materials in key-value pair format, the material name and its corresponding attribute value are treated as a whole and added to the core particle material information database set to improve the maintenance efficiency of the core particle material information database.

[0069] In practice, first create a new material entry, then add several key-value pair attributes to it. First, specify the material name, then add custom attributes to it in key-value pair format. The "key" is the attribute name, and the "value" is the corresponding attribute value. All operation results can be saved to the material library.

[0070] The aforementioned material library information includes material names and material properties. In one embodiment, the material properties include density, thermal conductivity, and specific heat capacity.

[0071] Please refer to this as well. Figure 3 as well as Figure 5 In this embodiment, for Figure 1 The steps in step S200, which involve constructing and managing the material allocation library at different levels, also include:

[0072] Step S210: Obtain the target core and select the management-level material allocation library;

[0073] Step S220: Parse and load the process layer list of the target core, displaying the layer material information of each process layer, such as... Figure 5 The layer material information displayed in the middle is 60;

[0074] Step S230: Receive the associated material attribute data assigned to any process layer in the process layer list, forming new layer material information for the corresponding process layer; for example... Figure 5 The C4 layer of the target core 61 shown displays associated material property data in the drop-down menu. The following example illustrates the allocation operation within a specific individual process layer.

[0075] Please refer to this as well. Figure 3 as well as Figure 5 In this embodiment, the step of receiving the associated material attribute data assigned to any process layer in the process layer list is further subdivided into the following steps:

[0076] Step S231: Select metal material cells and / or dielectric material cells for the current process layer.

[0077] Step S233: When configuring the metal material cell, proceed to step S234.

[0078] Step S234: Load a drop-down menu containing the target core material's material library information into the metal material cell, and select the target metal material from the drop-down menu. The material library information comes from the core material information database. For example, Figure 5 In the C4 layer of the target core 61 shown, select tungsten as the metal material cell.

[0079] Step S235: When configuring the dielectric material cell, proceed to step S236.

[0080] Step S236: Load a drop-down menu containing material library information for the target core material into the dielectric material cell, and select the target dielectric material from the drop-down menu. The material library information is sourced from the core material information database. For example, Figure 5 The C4 layer of the target core 61 shown has a drop-down menu displaying all dielectric materials associated with the core material information library.

[0081] Step S240: Save the updated and modified list of all process layers for the target core. This includes saving the material information for the new layer and updating the layer material allocation library.

[0082] exist Figure 5 In the illustrated embodiment, the layer material information includes the layer name, the metal material, and the dielectric material.

[0083] Please refer to Figure 6 The figure shows the system corresponding to the three-dimensional integrated circuit material information management method. This three-dimensional integrated circuit simulation system 400 includes a material library management module 410, a hierarchical allocation module 420, and a simulation module 430.

[0084] The material library management module 410 is used to build and manage a core material information library at the core particle level, which supports hierarchical access. The hierarchical allocation module 420 is used to build and manage a hierarchical material allocation library at the core particle level. When managing the hierarchical material allocation library, it calls the core material information library and establishes a correlation between the hierarchy and material properties. The simulation module 430 is used to initiate thermodynamic performance analysis simulations. The simulation engine calls the associated material property data from the hierarchical material allocation library for simulation analysis.

[0085] like Figure 7 As shown, the pipelined register layout system 500 includes a central processing unit (CPU) 501, which can perform various appropriate actions and processes based on computer program instructions stored in read-only memory 502 (ROM) or loaded from storage units into random access memory 503 (RAM). The RAM can also store various programs and data required for device operation. The CPU, ROM, and RAM are interconnected via a bus. An input / output (I / O) interface 505 is also connected to the bus.

[0086] Multiple components in the device are connected to the I / O interface, including: input unit 506, such as a keyboard, mouse, etc.; output unit 507, such as various types of displays, speakers, etc.; storage unit 508, such as a disk, optical disk, etc.; and communication unit 509, such as a network card, modem, wireless transceiver, etc. The communication unit 509 allows the device to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0087] The processing unit executes the various methods and processes described above, such as the series of method steps S100 to S300. For example, in some embodiments, method steps S100 to S300 may be implemented as a computer software program tangibly contained in a machine-readable medium, such as a storage unit. In some embodiments, part or all of the computer program may be loaded and / or installed on the device via ROM and / or a communication unit. When the computer program is loaded into RAM and executed by the CPU, one or more steps of the method steps S100 to S300 described above may be performed. Alternatively, in other embodiments, the CPU may be configured to execute method steps S100 to S300 by any other suitable means (e.g., by means of firmware).

[0088] Those skilled in the art will understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc., and can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0089] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. A method for managing material information of three-dimensional integrated circuits, characterized in that, include: A core material information database is interactively constructed and managed through a visual interface, with core particles as the unit of measurement. The core material information database supports hierarchical access. A hierarchical material allocation library is interactively constructed and managed through a visual interface, with each core particle as the unit. When managing the hierarchical material allocation library, the core particle material information library is invoked, and material attribute data associated with the hierarchy and material properties is established. The associated material attribute data is at least based on metallic materials and dielectric materials to classify the core particle material information library. When a target core particle is obtained and the hierarchical material allocation library is selected for management, the process layer list of the target core particle is parsed and loaded. Metal material cells and / or dielectric material cells are selected for the current process layer. Metal materials and / or dielectric materials associated with the core particle material information library are displayed in the metal material cells and / or dielectric material cells through drop-down menus. The selected target metal materials and target dielectric materials are received, the modifications are saved, and the hierarchical material allocation library is updated. Initiate thermodynamic performance analysis simulation. The simulation engine calls the associated material property data from the hierarchical material allocation library for simulation analysis.

2. The three-dimensional integrated circuit material information management method as described in claim 1, characterized in that, The step of constructing and managing the core material information database through a visual interface also includes: Obtain the target core particle and select to manage the core particle material information database; The material library information of the target core particles is displayed in a list; Receive and complete the material management operations for the target core; Save the list to complete the material library management operation for the target core.

3. The three-dimensional integrated circuit material information management method as described in claim 2, characterized in that, The material management operations for the target core include: To add a new material, insert a new line at the end of the list and enter the name and attribute value of the new material. Edit materials, modify material attribute values ​​in the rows of the materials to be edited in the list; and To delete materials, select the target row in the list and delete the material record.

4. The three-dimensional integrated circuit material information management method as described in claim 3, characterized in that, The material library information includes material names and material properties, including density, thermal conductivity, and specific heat capacity.

5. The three-dimensional integrated circuit material information management method as described in claim 2, characterized in that, The step of building and managing a hierarchical material allocation library through a visual interface also includes: Obtain the target core particle and select to manage the material allocation library at the specified level; The process layer list of the target core is parsed and loaded, and the layer material information of each process layer is displayed; Receive the associated material attribute data assigned to any process layer in the process layer list, and form new layer material information for the corresponding process layer; Save the new layer material information and update the layer material allocation library.

6. The three-dimensional integrated circuit material information management method as described in claim 5, characterized in that, The material information of the layer includes the layer name, the metal material, and the dielectric material.

7. The three-dimensional integrated circuit material information management method as described in claim 6, characterized in that, The step of receiving the associated material attribute data assigned to any process layer in the process layer list further includes: Select the metal material cell and / or dielectric material cell for the current process layer; When the metal material cell is selected, a drop-down menu including the material library information of the target core particle is loaded in the metal material cell, and the target metal material is selected from the drop-down menu. The material library information comes from the core particle material information library. When the dielectric material cell is selected, a drop-down menu containing material library information of the target core particle is loaded into the dielectric material cell, and the target dielectric material is selected from the drop-down menu. The material library information is derived from the core particle material information library; and Save updates and modifications to the list of process layers for the target core.

8. A three-dimensional integrated circuit simulation system, characterized in that, include: The material library management module is used to interactively build and manage a core material information library through a visual interface, with the core material information library supporting hierarchical access. The hierarchical allocation module is used to interactively construct and manage a hierarchical material allocation library through a visual interface, based on core particles. When managing the hierarchical material allocation library, it calls the core particle material information library and establishes material attribute data associated with the hierarchy and material properties. The associated material attribute data classifies the core particle material information library based at least on metallic and dielectric materials. When a target core particle is obtained and the hierarchical material allocation library is selected for management, the module parses and loads the process layer list of the target core particle, selects a metallic material cell and / or a dielectric material cell for the current process layer, and displays the metallic and / or dielectric materials associated with the core particle material information library through drop-down menus in the metallic and / or dielectric material cells. The module receives the selected target metallic and dielectric materials, saves the modifications, and updates the hierarchical material allocation library. as well as The simulation module is used to initiate thermodynamic performance analysis simulations. The simulation engine calls the associated material property data from the hierarchical material allocation library for simulation analysis.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, The processor is used to execute the computer program stored in the memory to implement the three-dimensional integrated circuit material information management method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The storage medium stores a computer program that can be executed by a processor to implement the three-dimensional integrated circuit material information management method as described in any one of claims 1 to 7 or the three-dimensional integrated circuit simulation system as described in claim 8.

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