Vacuum eutectic furnace for chip packaging

Abstract

The invention discloses a vacuum eutectic furnace for chip packaging, and relates to the technical field of vacuum eutectic furnaces. The heating furnace comprises a furnace body, a sealing seat is installed on the upper end face of the furnace body, a sealing cover is hinged to the sealing seat, and a heating disc is installed in the sealing seat; the detection assembly is mounted on the sealing cover and is used for detecting the sintering degree of the chip; the chip clamping plate is vertically inserted into the sealing seat in a sliding manner and is used for bearing a chip; the lifting assembly is used for driving the chip clamping plate to lift upwards; the downward pressing abutting piece is installed in the sealing cover and used for abutting against the chip clamping plate to be tightly attached to the heating disc; and the cooling coil pipe is fixedly mounted in the sealing cover and is connected with the pressing-down abutting piece. The adjustable supporting plate is used for replacing a fixing clamp, clamping and positioning of different kinds of chips can be adapted, the chips can be evenly distributed conveniently, the flexibility is improved, meanwhile, even heating of the chips is guaranteed, and the reliability is improved through even-temperature welding.

Description

Technical Field

[0001] This invention relates to the field of vacuum eutectic furnace technology, and more specifically to a vacuum eutectic furnace for chip packaging. Background Technology

[0002] Vacuum eutectic furnaces are high-end welding equipment for laser devices, aerospace devices, and electric vehicle electronic components. The system consists of modules such as a vacuum system, safety system, reducing atmosphere system, heating / cooling system, and gas flow control system. Compared to traditional chain furnaces, its vacuum welding process can reduce the void ratio of solder joints, significantly improving device reliability. Eutectic bonding is a critical process in chip packaging, requiring the furnace cavity to possess high vacuum, high temperature uniformity, rapid cooling, and real-time visual inspection capabilities. However, existing vacuum eutectic furnaces generally suffer from the following drawbacks: 1. The chip clamp is fixed and cannot be adjusted, resulting in poor flexibility; 2. Poor adhesion between the heating plate and the chip increases the void ratio in the eutectic layer, leading to decreased reliability; 3. Low cooling rate can easily cause chip warping and solder layer cracking; 4. Lack of online sintering detection; sampling requires opening the lid, which disrupts the vacuum.

[0003] Therefore, this invention proposes a vacuum eutectic furnace for chip packaging. Summary of the Invention

[0004] The purpose of this invention is to provide a vacuum eutectic furnace for chip packaging in order to solve the problems mentioned above in the background art.

[0005] To achieve the above objectives, the present invention specifically adopts the following technical solution: A vacuum eutectic furnace for chip packaging, comprising: A furnace body, a sealing seat is installed on the upper surface of the furnace body, a sealing cover is hinged to the sealing seat, and a heating plate is installed inside the sealing seat; A detection component, mounted on the sealing cover, is used to detect the chip sintering degree. The chip clamp is vertically slidably inserted into the sealed seat and is used to support the chip. The lifting component is used to lift the chip clamping plate upwards; A pressure contact element is installed inside the sealing cover and is used to press the chip clamp tightly against the heating plate; The cooling coil is fixedly installed inside the sealing cover and connected to the pressing contact part; Gas control components are mounted on both sides of the sealing cover and are used to inject gas into the sealing seat.

[0006] Furthermore, the sealing cover includes a cover plate hinged to a sealing seat at one end, a handle at the other end of the cover plate, a hydraulic connecting rod hinged at the corner of the end of the cover plate connected to the handle, and the other end of the hydraulic connecting rod movably passes through the upper surface of the furnace body and is hinged inside the furnace body.

[0007] Furthermore, the detection component includes a viewing mirror constructed on the upper end of the cover plate, and two support rods located on both sides of the viewing mirror are constructed on the cover plate. Each support rod is tightly hinged with an L-shaped bracket by bolts, and a detection camera is connected to the end of the L-shaped bracket.

[0008] Furthermore, the chip clamping plate includes a rectangular frame plate, a spacer plate is constructed in the middle of the rectangular frame plate, and a rod is constructed at both ends of the bottom of the spacer plate that slides through the heating plate and is inserted into the sealing seat. A strip-shaped through groove is constructed inside the spacer plate, and multiple parallel adjusting support plates that pass through the strip-shaped through groove are slidably installed inside the rectangular frame plate. A positioning screw is installed on the adjusting support plate.

[0009] Furthermore, both sides of the rectangular frame plate are provided with sliding grooves, the adjusting support plate includes a support plate, both sides of the support plate are provided with stepped grooves arranged along its length direction, the middle of the upper surface of the support plate is provided with a protrusion that moves through the partition plate, the positioning screw thread passes through the protrusion and abuts against the partition plate, and both ends of the support plate are provided with guide blocks inserted into the sliding grooves.

[0010] Furthermore, the lifting assembly includes a spring lifting member and a flip lifting member. When the sealing cover flips upward, the flip lifting member drives the chip clamping plate to lift upward. When the sealing cover is fastened to the sealing seat, the spring lifting member drives the chip clamping plate to lift upward.

[0011] Furthermore, the spring lifting member includes a groove constructed at the bottom of the sealing seat, a pushing block is slidably installed in the groove, a lifting spring is connected between the pushing block and the bottom of the groove, an electromagnet for attracting the pushing block is connected to the bottom of the sealing seat, and the insert rod is inserted into the groove and abuts against the pushing block.

[0012] Furthermore, the flipping and lifting component includes a convex plate constructed on a rectangular frame plate, an L-shaped pull rod constructed inside the sealing cover, and a hinge post constructed on one side of both the L-shaped pull rod and the convex plate. A connecting plate is movably sleeved between the two hinge posts. When the sealing cover is flipped upward, the L-shaped pull rod drives the convex plate to move upward through the connecting plate.

[0013] Furthermore, the pressing contact element includes three cylindrical tubes fixedly connected to the top of the sealing cover. A contact rod is slidably installed inside the cylindrical tube. A support spring is connected between the contact rod and the inner end of the cylindrical tube. A movable groove is constructed on the contact rod, and the cooling coil is disposed through the movable groove.

[0014] Furthermore, the gas control assembly includes a mounting frame fixedly connected to both sides of the sealing cover, a gas cylinder mounting slot is constructed in the mounting frame, a gas supply pipe is connected in the gas cylinder mounting slot, and an outlet frame connected to the gas supply pipe is fixedly connected in the sealing cover.

[0015] The beneficial effects of this invention are as follows: 1. This invention replaces the fixed clamp with an adjustable support plate, which can adapt to the clamping and positioning of different types of chips, facilitates the uniform distribution of chips, improves flexibility, and ensures uniform heating of chips, thereby improving reliability through uniform temperature welding.

[0016] 2. The lifting component provided in this invention can not only lift the chip clamping plate when changing chips for easier operation, but also lift the chip clamping plate away from the heating plate after heating and soldering is completed, thereby accelerating the cooling efficiency. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is another perspective view of the three-dimensional structure of the present invention; Figure 3 This is the present invention. Figure 1 Half-section view of the three-dimensional structure; Figure 4 This is the present invention. Figure 2 Partial sectional view of the three-dimensional structure; Figure 5 This is a three-dimensional structural diagram of the sealing cap of the present invention in another state; Figure 6 This is the present invention. Figure 5 Half-section of the three-dimensional structure; Figure 7 This is a three-dimensional structural diagram of the chip clamp of the present invention; Reference numerals: 1. Furnace body; 2. Sealing seat; 3. Sealing cover; 301. Cover plate; 302. Handle; 303. Hydraulic connecting rod; 4. Heating plate; 5. Detection assembly; 501. Lens; 502. Support rod; 503. L-shaped bracket; 504. Detection camera; 6. Chip clamp; 601. Rectangular frame plate; 6011. Sliding groove; 602. Spacer plate; 603. Insert rod; 604. Strip groove; 605. Adjusting support plate; 6051. Support plate; 6052. Stepped groove; 6053. Protrusion; 6054. Guide block; 606. Positioning screw 7. Lifting assembly; 701. Spring lifting component; 7011. Column groove; 7012. Push block; 7013. Lifting spring; 7014. Electromagnet; 702. Tilting lifting component; 7021. Protruding plate; 7022. L-shaped tie rod; 7023. Hinge column; 7024. Connecting plate; 8. Downward pressing contact component; 801. Column tube; 802. Contact rod; 803. Support spring; 804. Movable groove; 9. Cooling coil; 10. Gas control assembly; 1001. Mounting frame; 1002. Gas cylinder mounting groove; 1003. Gas supply pipe; 1004. Gas outlet frame. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0019] like Figures 1-5 As shown, an embodiment of the present invention provides a vacuum eutectic furnace for chip packaging, comprising: Furnace body 1, a sealing seat 2 is installed on the upper surface of furnace body 1, a sealing cover 3 is hinged on the sealing seat 2, a heating plate 4 is installed inside the sealing seat 2, furnace body 1 is made of double-layer stainless steel water-cooled wall, and the sealing seat 2 is equipped with a fluororubber ring, which is resistant to high temperature. The heating plate 4 is set inside the sealing seat 2 to increase the welding temperature of the chip. Detection component 5 is installed on the sealing cover 3 and is used to detect the chip sintering degree; The chip clamp 6 is vertically slidably inserted into the sealing seat 2 and is used to receive the chip; The lifting component 7 is used to lift the chip clamp 6 upward. On the one hand, it can lift the chip clamp 6 when changing chips to increase the operating space. On the other hand, it can lift the chip clamp 6 during the chip soldering process and during the cooling process, so that it is separated from the heating plate 4. After it is no longer in direct contact with the heating plate 4, the cooling speed will be accelerated, thereby improving the cooling efficiency of the chip. The pressing contact 8 is installed inside the sealing cover 3 and is used to press the chip clamp 6 tightly against the heating plate 4. When the sealing cover 3 is fastened on the sealing seat 2, the pressing contact 8 will press against the chip clamp 6, thereby making the chip clamp 6 and the heating plate 4 in close contact and improving the heat conduction efficiency. Cooling coil 9 is fixedly installed inside sealing cover 3 and connected to pressing contact member 8. It is connected to water-cooled wall of furnace body 1, and water circulates therein to absorb heat in sealing seat 2. The gas control component 10 is installed on both sides of the sealing cover 3 and is used to inject gas into the sealing seat 2. It can introduce reducing gases such as nitrogen, hydrogen or formic acid to form a reducing atmosphere, further suppressing oxidation, improving solder wettability, and increasing welding reliability.

[0020] like Figure 1 As shown, the specific structure of the sealing cover 3 of the present invention is disclosed. The sealing cover 3 includes a cover plate 301 with one end hinged to the sealing seat 2, and a handle 302 constructed at the other end of the cover plate 301. A hydraulic connecting rod 303 is hinged at the corner of the end of the cover plate 301 connected to the handle 302. The other end of the hydraulic connecting rod 303 movably passes through the upper surface of the furnace body 1 and is hinged inside the furnace body 1. It should be noted that one end of the cover plate 301 is the hinged end and the other end is the movable end, wherein the movable end is connected to the hydraulic connecting rod 303. The cover plate 301 can be automatically pushed and flipped upward by the hydraulic connecting rod 303, thereby realizing automatic lifting and lowering of the cover plate 301 without manual pushing, increasing convenience. At the same time, the hydraulic connecting rod 303 adopts a dual-mode electro-hydraulic actuator. Under normal conditions, it can be energized to realize automatic pushing. When the equipment is damaged or the power is cut off, the clutch can be manually adjusted, and the sealing cover 3 can be lifted by manually raising the handle 302, increasing the fault tolerance of the device.

[0021] like Figure 2 As shown, the specific structure of the detection component 5 of the present invention is disclosed. The detection component 5 includes a viewing mirror 501 constructed on the upper end of the cover plate 301. Two support rods 502 located on both sides of the viewing mirror 501 are constructed on the cover plate 301. Each support rod 502 is tightly hinged with an L-shaped bracket 503 by bolts. Both L-shaped brackets 503 are tightly hinged to the support rods 502 by bolts to facilitate angle adjustment. A detection camera 504 is connected to the end of the L-shaped bracket 503. It should be noted that there are two types of detection cameras 504. One is an AI automatic recognition camera used to observe the sintering degree of the weld joint, and the other is an infrared temperature control camera used to observe the heat distribution inside the sealing seat 2 in real time.

[0022] like Figure 7The chip clamp 6 of the present invention is shown to have a specific structure and installation configuration. The chip clamp 6 includes a rectangular frame plate 601, a spacer plate 602 in the middle of the rectangular frame plate 601, and insert rods 603 that slide through the heating plate 4 and are inserted into the sealing seat 2 at both ends of the bottom of the spacer plate 602. A strip-shaped through groove 604 is formed in the spacer plate 602. A plurality of parallel adjusting support plates 605 that pass through the strip-shaped through groove 604 are slidably installed in the rectangular frame plate 601. Positioning screws are installed on the adjusting support plates 605. Button 606 and spacer 602 are intermediate components. The insert rods 603 at both ends of the spacer are slidably inserted into the sealing seat 2, which allows the rectangular frame plate 601 to move vertically up and down as a whole. The rectangular frame plate 601 and spacer 602 are components that directly contact the heating plate 4. They can be made of graphite composite plate material to improve heat conduction efficiency. The adjustment support plate 605 on it is a modular design. On the one hand, it can flexibly adjust the installation spacing of the chip, and on the other hand, it can clamp the chip to improve stability.

[0023] like Figure 7 As shown, the specific structure of the adjusting support plate 605 of the present invention is disclosed. Sliding grooves 6011 are constructed on both sides of the rectangular frame plate 601. The adjusting support plate 605 includes a support plate 6051. Stepped grooves 6052 are constructed on both sides of the support plate 6051 along its length direction. The stepped grooves 6052 are mainly used to support the chip edge and can also provide abutment support to the chip side, achieving clamping and fixing. This increases the chip enclosure and improves heat conduction efficiency. A central portion of the upper surface of the support plate 6051 is constructed with… The protrusion 6053 of the spacer plate 602 is active, and the positioning screw 606 is threaded through the protrusion 6053 and abuts against the spacer plate 602. Both ends of the support plate 6051 are constructed with guide blocks 6054 inserted into the sliding groove 6011. It should be noted that the protrusion 6053 and guide block 6054 on the support plate 6051 are both rectangular, which can guide the movement direction of the support plate 6051 and ensure its horizontal movement. The positioning screw 606 is used to fix its position and ensure the stability of the chip clamping.

[0024] like Figure 3 and Figure 6As shown, the specific composition of the lifting component 7 of the present invention is disclosed. The lifting component 7 includes a spring lifting member 701 and a flip lifting member 702. When the sealing cover 3 flips upward, the flip lifting member 702 drives the chip clamping plate 6 to lift upward. When the sealing cover 3 is fastened on the sealing seat 2, the spring lifting member 701 drives the chip clamping plate 6 to lift upward. The spring lifting member 701 lifts the chip clamping plate 6 in the cooling step during the welding process, so that it is separated from the heating plate 4, avoiding the residual heat of the heating plate 4 from affecting the chip cooling and improving the cooling efficiency. The flip lifting member 702 can use the flipping of the sealing cover 3 as a driving force to automatically lift the chip clamping plate 6, so that its upper surface is raised to the upper side of the sealing seat 2, which is convenient for personnel to operate, increases the operating space, and improves convenience.

[0025] like Figure 6 The specific structure of the spring lifting member 701 of the present invention is disclosed. It is used to ensure the sealing performance of the sealing seat 2 while enabling the chip clamp 6 to be lifted inside the sealing seat 2. The spring lifting member 701 includes a groove 7011 constructed at the bottom of the sealing seat 2. This groove 7011 is not connected to the outside. A pushing block 7012 is slidably installed in the groove 7011. A lifting spring 7013 is connected between the pushing block 7012 and the bottom of the groove 7011. A stepped annular groove is constructed at the bottom end of the pushing block 7012. One end of the lifting spring 7013 is connected to the stepped annular groove, and the other end is connected to the groove 7011. The distance between the bottom end of the pushing block 7012 and the bottom of the groove 7011 is less than five millimeters. An electromagnet 7014 for attracting the pushing block 7012 is connected to the bottom end of the sealing seat 2. An insert rod 603 is inserted into the groove 7011 and abuts against the pushing block 7012. Regarding block 7012, it should be noted that when the sealing cover 3 is flipped upwards, the flipping lifting component 702 will drive the chip clamping plate 6 to move upwards. At this time, the insertion rod 603 is not in contact with the pushing block 7012 in the column groove 7011. At this time, the electromagnet 7014 is in the open state. The electromagnet 7014 can attract the pushing block 7012 through the sealing seat 2, causing the lifting spring 7013 to compress. At this time, the pushing block 7012 and the column groove 7011 are in contact with each other. When the sealing cover 3 is flipped and fastened, the bottom end of the insertion rod 603 will contact the pushing block 7012, and then the heating and welding operation will be performed. After that, when the cooling process is started, the electromagnet 7014 can be turned off. At this time, the lifting spring 7013 will push the insertion rod 603 upwards, thereby causing the rectangular frame plate 601 to move upwards as a whole and detach from the heating plate 4, so as to avoid the residual heat of the heating plate 4 from affecting the cooling of the chip and improve the cooling efficiency.

[0026] like Figure 6The specific structure of the flipping and lifting component 702 of the present invention is disclosed. The flipping and lifting component 702 includes a protruding plate 7021 constructed on a rectangular frame plate 601, an L-shaped pull rod 7022 constructed inside the sealing cover 3, and a hinge post 7023 constructed on one side of both the L-shaped pull rod 7022 and the protruding plate 7021. A connecting plate 7024 is movably sleeved between the two hinge posts 7023. When the sealing cover 3 flips upward, the L-shaped pull rod 7022 drives the protruding plate 7021 to move upward through the connecting plate 7024. It should be noted that the two ends of the connecting plate 7024 are respectively rotatably sleeved on the protruding plate 7021 and the connecting plate 7022. The L-shaped pull rod 7022 is hinged to the hinge post 7023 to form a hinge connection. At the same time, the connecting plate 7024 is detachable and can be easily replaced with the chip clamp 6. When the sealing cover 3 is flipped upward, the L-shaped pull rod 7022 moves upward along the arc around the hinge point of the sealing cover 3, thereby driving the convex plate 7021 to move upward through the connecting plate 7024. The rectangular frame plate 601 is limited by the insertion rod 603 and can only move up and down to ensure the stability of the lifting. After being lifted, the position is above the sealing seat 2, which makes it convenient for personnel to operate the chip and increases convenience.

[0027] like Figure 3 and Figure 6 The specific structure of the pressing contact 8 of the present invention is disclosed. The pressing contact 8 includes three cylindrical tubes 801 fixedly connected to the top of the inner part of the sealing cover 3. A contact rod 802 is slidably installed inside the cylindrical tube 801. A support spring 803 connects the contact rod 802 to the inner end of the cylindrical tube 801. A movable groove 804 is constructed on the contact rod 802. A cooling coil 9 is disposed through the movable groove 804. The contact rod 802 is always pushed by the support spring 803. When the sealing cover 3 is closed, the lower ends of the three contact rods 802 will respectively abut against the two side edges of the rectangular frame plate 601 and the spacer plate 602, thereby forming a triangular positioning to ensure the rectangular frame... The close contact between plate 601 and heating plate 4 ensures efficient heat conduction. It should be noted that the elastic force of support spring 803 is less than that of lifting spring 7013. When the device is in the cooling process, lifting spring 7013 will drive push block 7012 to move upward. At this time, support spring 803 will be pushed upward, thus compressing it, allowing rectangular frame plate 601 to move upward smoothly and detach from heating plate 4, thereby improving cooling efficiency. At the same time, the support spring 803 can also apply a constant downward push to the abutment rod 802, thereby counteracting the impact force released by lifting spring 7013, allowing push block 7012 to move upward slowly, avoiding chip vibration and ensuring stability.

[0028] like Figure 2 and Figure 4The specific structure of the gas control component 10 of the present invention is disclosed. The gas control component 10 includes a mounting frame 1001 fixedly connected to both sides of the sealing cover 3. A gas cylinder mounting groove 1002 is constructed inside the mounting frame 1001. A gas supply pipe 1003 is connected inside the gas cylinder mounting groove 1002. An outlet frame 1004 connected to the gas supply pipe 1003 is fixedly connected inside the sealing cover 3. It should be noted that an airflow channel is constructed inside the outlet frame 1004. The gas supply pipe 1003 and the airflow channel are connected... One end is connected, and the bottom and horizontal sides of the air outlet frame 1004 are constructed with air outlet holes that are connected to the airflow channel to evenly distribute inert gas, so as to ensure the uniformity of gas filling in the sealing seat 2. The air supply pipe 1003 is equipped with an electromagnetic control valve and a pressure valve to automatically judge the pressure in the sealing seat 2 to control the flow of air. The gas cylinder mounting groove 1002 is mainly used to install gas cylinders. It has an end pipe for connecting the gas cylinder, and the other end of the end pipe is connected to the air supply pipe 1003.

[0029] Overall workflow: 1. Loading: Open the sealing cover 3, the hydraulic connecting rod 303 supports the chip clamping plate 6 automatically pulled up by the flipping lifting component 702 to increase the operating space. By removing the connecting plate 7024, the chip clamping plate 6 can be completely removed. Then, the chip is placed on the new chip clamping plate 6 and clamped and positioned by adjusting the support plate 605. After that, the chip clamping plate 6 is placed in the sealing seat 2 and connected to the L-shaped pull rod 7022 by the connecting plate 7024. The sealing cover 3 is fastened, and the flipping lifting component 702 pushes the chip clamping plate 6 down to the heating plate 4. The pressing contact component 8 presses against the contact and applies pressure. 2. Vacuuming: Start the vacuum pump to rapidly reduce the air pressure; 3. Heating: The heating plate 4 is heated to the eutectic temperature, and the heat transfer efficiency is improved by the insert rod 603; 4. Inspection: The 504 inspection camera monitors the solder melting, wetting, and void conditions in real time, and the images are transmitted to the industrial control computer for AI analysis; 5. Cooling: Turn on the cooling coil 9 and circulate water. Connect the chip clamp 6 to the cooling coil 9 using the contact rod 802 to achieve contact cooling. At the same time, disconnect the electromagnet 7014 from the push block 7012, causing the push block 7012 to rise against the insertion rod 603, and the chip clamp 6 to detach from the heating plate 4, thereby improving the overall cooling efficiency. 6. Vacuum breaking: Reduced gas is injected into the sealing base 2 through the gas control component 10 to improve the solder joint quality. Alternatively, air can be injected to atmospheric pressure until cooling is complete. Then, the sealing cover 3 is opened and the chip is removed.

[0030] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum eutectic furnace for chip packaging, characterized by, Include: The furnace body (1), the upper end face of the furnace body (1) is provided with a sealing seat (2), the sealing cover (3) is hinged on the sealing seat (2), and the heating disc (4) is installed in the sealing seat (2); Detection assembly (5), installed on the sealing cover (3) and used for detecting chip sintering degree; Chip clamping plate (6), vertically slidingly inserted into the sealing seat (2) and used for receiving chip; Lifting assembly (7) for driving chip clamping plate (6) to lift up; The lower pressing contact (8) is installed in the sealing cover (3) and used for pressing the chip clamping plate (6) closely to the heating disc (4); Cooling coil (9), fixedly installed in the sealing cover (3) and arranged in connection with the lower pressing contact (8); Gas control assembly (10), installed on both sides of the sealing cover (3) and used for injecting gas into the sealing seat (2).

2. The vacuum eutectic furnace for chip packaging according to claim 1, wherein, The sealing cover (3) includes a cover plate (301) hinged on the sealing seat (2), the other end of the cover plate (301) is provided with a handle (302), the cover plate (301) is connected with the handle (302), and the handle (302) is hinged with a hydraulic connecting rod (303) at one end corner. The other end of the hydraulic connecting rod (303) is movably penetrated through the upper end face of the furnace body (1) and hinged in the furnace body (1).

3. The vacuum eutectic furnace for chip packaging according to claim 2, wherein, The detection assembly (5) includes a perspective mirror (501) constructed on the upper end of the cover plate (301), two support rods (502) are constructed on the cover plate (301) and located on both sides of the perspective mirror (501), the support rods (502) are closely hinged with L-shaped supports (503) through bolts, and the L-shaped supports (503) are connected with detection cameras (504) at the ends.

4. The vacuum eutectic furnace for chip packaging according to claim 1, wherein, The chip clamping plate (6) includes a rectangular frame plate (601), a spacer plate (602) is constructed in the middle of the rectangular frame plate (601), two insertion rods (603) are constructed at the both ends of the bottom of the spacer plate (602), the insertion rods (603) are movably penetrated through the heating disc (4) and inserted into the sealing seat (2), a strip-shaped through slot (604) is constructed in the spacer plate (602), a plurality of adjusting support plates (605) are movably installed in the rectangular frame plate (601), the adjusting support plates (605) are parallel to each other and penetrate through the strip-shaped through slot (604), and positioning knobs (606) are installed on the adjusting support plates (605).

5. The vacuum eutectic furnace for chip packaging according to claim 4, wherein Both sides of the rectangular frame plate (601) are constructed with sliding grooves (6011), the adjusting support plate (605) includes a support plate (6051), both sides of the support plate (6051) are constructed with stepped grooves (6052) arranged along the length direction of the support plate (6051), a protruding block (6053) is constructed on the middle of the upper surface of the support plate (6051) and movably penetrates through the spacer plate (602), the positioning knob (606) is threaded through the protruding block (6053) and abuts against the spacer plate (602), and guide blocks (6054) are constructed at both ends of the support plate (6051) and inserted into the sliding grooves (6011).

6. The vacuum eutectic furnace for chip packaging according to claim 5, wherein, The lifting assembly (7) comprises a spring lifting piece (701) and a turnover lifting piece (702), when the sealing cover (3) is turned up, the chip clamping plate (6) is lifted up by the turnover lifting piece (702), when the sealing cover (3) is buckled on the sealing seat (2), the chip clamping plate (6) is lifted up by the spring lifting piece (701).

7. The vacuum eutectic furnace for chip packaging according to claim 6, wherein The spring lifting piece (701) comprises a column groove (7011) arranged on the bottom of the sealing seat (2), a push block (7012) is slidably arranged in the column groove (7011), a lifting spring (7013) is connected between the push block (7012) and the bottom of the column groove (7011), the bottom end of the sealing seat (2) is connected with an electromagnet (7014) for adsorbing the push block (7012), and the plug rod (603) is inserted in the column groove (7011) and abuts against the push block (7012).

8. The vacuum eutectic furnace for chip packaging according to claim 6, wherein, The turnover lifting piece (702) comprises a convex plate (7021) arranged on the rectangular frame plate (601), an L-shaped pull rod (7022) is arranged in the sealing cover (3), the L-shaped pull rod (7022) and one side of the convex plate (7021) are both provided with a hinge column (7023), and a connecting plate (7024) is movably sleeved between the two hinge columns (7023), when the sealing cover (3) is turned up, the L-shaped pull rod (7022) drives the convex plate (7021) to move up through the connecting plate (7024).

9. The vacuum eutectic furnace for chip packaging according to claim 7, wherein, The downward pressing abutting piece (8) comprises three column pipes (801) fixedly connected to the top of the sealing cover (3), an abutting rod (802) is slidably arranged in the column pipe (801), a supporting spring (803) is connected between the abutting rod (802) and the inner end of the column pipe (801), a movable groove (804) is arranged on the abutting rod (802), and the cooling coil (9) is arranged in the movable groove (804).

10. The vacuum eutectic furnace for chip packaging according to claim 1, wherein, The gas control assembly (10) comprises mounting frames (1001) fixedly connected to the two sides of the sealing cover (3), the mounting frame (1001) is provided with a gas cylinder mounting groove (1002), the gas cylinder mounting groove (1002) is connected with a gas supply pipe (1003), and the sealing cover (3) is fixedly connected with an air outlet frame (1004) connected with the gas supply pipe (1003).

Images