Capacitor with wave-shaped heat dissipation design and manufacturing method thereof

Abstract

This invention discloses a capacitor with a waveform heat dissipation design and its manufacturing method, relating to the field of capacitor heat dissipation technology. The method includes the following steps: S1, precise material selection stage; S2, core unit welding process; S3, shell structure forming and heat dissipation design; S4, insulation and heat dissipation system assembly; S5, overall assembly and sealing process. This invention utilizes the synergistic heat conduction of the waveform heat dissipation structure and the high-heat-dissipation waveform insulating sheet. The waveform design on the inner wall of the metal shell increases the heat dissipation area. Combined with the elastic contact heat conduction characteristics of the high-heat-dissipation waveform insulating sheet, a low thermal resistance path is formed between the shell and the insulating sheet, enabling rapid heat transfer from the core to the shell. The waveform structure promotes the flow of thermally conductive adhesive, preventing localized heat accumulation.

Description

Technical Field

[0001] This invention relates to the field of capacitor heat dissipation technology, and in particular to a capacitor with waveform heat dissipation design and its manufacturing method. Background Technology

[0002] With the development of power electronics technology, the demand for metallized thin-film parallel-plate power electronic capacitors is gradually increasing. Metallized thin-film parallel-plate power electronic capacitors are capacitors that use polypropylene, polyester, or other plastic films as dielectrics, and deposit nanoscale metal layers as electrodes on the film surface through vacuum evaporation or sputtering processes. Especially in some high-power devices, thin-film parallel-plate power electronic capacitors are widely used due to their high lifespan, low ESL, and low ESR characteristics. With the use of SiC devices and the continuous improvement and iteration of equipment protection requirements, there is a demand for smaller power capacitors, and the current requirements for capacitors are also increasing accordingly.

[0003] However, in existing capacitor manufacturing processes, poor heat dissipation during use leads to a significant increase in the dielectric loss tangent of polypropylene film capacitors at high temperatures. Furthermore, insufficient heat dissipation results in uneven core temperature rise, and fluctuations in the dielectric constant of the polypropylene film cause capacitance deviations exceeding ±5% of the design tolerance. In high-frequency applications of SiC devices, the equivalent series resistance can rise from 5mΩ to over 10mΩ, causing additional heat generation and reducing filtering effectiveness.

[0004] There are already relevant invention patents concerning capacitors that improve heat dissipation and their manufacturing methods, as detailed below:

[0005] Chinese Patent Application No. CN202311218154.3, entitled "A Thin-Film Capacitor with Improved Heat Dissipation and its Manufacturing Method," discloses a thin-film capacitor with improved heat dissipation and its manufacturing method. The capacitor includes: a capacitor body, a heat dissipation sleeve nested and fitted around the capacitor body, a mounting sleeve threaded to the outer side of the lower end of the heat dissipation sleeve, and a shielding sleeve threaded to the inner side of the upper end of the heat dissipation sleeve. It also includes: the outer end of the capacitor body is configured as a shell, and a capacitor core is disposed on the inner side of the middle portion of the shell; a second connecting plug is threadedly connected to the upper left of the heat dissipation sleeve, and the upper surfaces of the heat dissipation sleeve and the second connecting plug are on the same horizontal plane. This thin-film capacitor with improved heat dissipation and its manufacturing method facilitates the assembly and fixing of the thin-film capacitor, improves its heat dissipation, provides excellent heat dissipation, facilitates warning upon detecting fire, and facilitates shielding and moisture absorption of the lead terminals, preventing moisture damage during long-term storage and affecting its use.

[0006] However, while the aforementioned existing patents can increase the heat dissipation area and achieve efficient heat dissipation by having arc-shaped structures on the inner sides of both the top and bottom of the heat sink, they cannot solve the problem of perfectly eliminating air bubbles after injecting encapsulating glue into the capacitor. Summary of the Invention

[0007] The purpose of this application is to provide a capacitor with a waveform heat dissipation design and its manufacturing method, which solves the problem of perfect bubble-free encapsulation after injecting encapsulating glue into existing capacitors.

[0008] This invention selects a metal shell with high heat dissipation performance as the capacitor shell material. The shell has a wave-shaped heat dissipation structure inside. The protruding wave-shaped heat dissipation structure passes through the main heat source inside the capacitor - the core. The heat of the capacitor is dissipated through the protruding structure design. By placing a low thermal resistance thermally conductive soft insulating material inside the capacitor in close contact with the wave-shaped protruding structure of the product shell, the thermal conductivity of the capacitor is not reduced while achieving insulation between the shell and the core.

[0009] A capacitor with a waveform heat dissipation design includes a metal casing. Two waveform heat dissipation structures are disposed on both sides of the inner wall of the metal casing. High-heat-dissipation waveform insulating sheets are fixedly connected to the sides of the two waveform heat dissipation structures that are close to each other. A plurality of capacitor cores are uniformly disposed inside the metal casing between the high-heat-dissipation waveform insulating sheets. The capacitor cores are vertically aligned and horizontally spaced. The metal casing, waveform heat dissipation structures, and high-heat-dissipation waveform insulating sheets are used to improve the heat dissipation capacity of the capacitor. The waveform heat dissipation structures on both sides of the inner wall of the insulating terminals adopt a three-dimensional wave-shaped design, which significantly enhances heat radiation and convection capabilities compared to traditional planar structures.

[0010] As a further improvement of the present invention, heat dissipation panel mating mechanisms are provided horizontally between the capacitor cores. The tops of several heat dissipation panel mating mechanisms are horizontally fixedly connected to two other heat dissipation panel mating mechanisms. All heat dissipation panel mating mechanisms are fixedly connected inside the metal casing body. The bottom of the metal casing body has four symmetrically symmetrically opened mounting holes, and the top of the metal casing body has an injection hole. Two current-carrying copper plates are symmetrically fixedly connected to the outside of the capacitor cores in a vertical direction. The horizontally arranged heat dissipation panel mating mechanisms are in direct contact with the capacitor cores, forming a vertical heat conduction path of "core-heat dissipation panel-metal casing". The two other heat dissipation panel mating mechanisms horizontally connected at their tops further expand the heat dissipation area, constructing a horizontal heat diffusion channel, realizing synchronous heat conduction in both horizontal and vertical directions, and avoiding localized heat accumulation.

[0011] As a further improvement of the present invention, a plurality of insulating terminals are uniformly and fixedly connected to the top of the metal shell body, and a conductive electrode is fixedly connected to the top of each insulating terminal, and the bottom of each insulating terminal is disposed at the top of the heat dissipation panel mating mechanism.

[0012] As a further improvement of the present invention, the inner top of the metal shell body is provided with symmetrical insertion holes on both sides of the glue injection hole. A spring is fixedly connected inside each insertion hole, and a triangular abutment block is fixedly connected to one end of each spring that is close to the other. The triangular abutment block is slidably disposed inside the insertion hole.

[0013] As a further improvement of the present invention, a plurality of limiting sliders are uniformly fixedly connected to the inner wall of the glue injection hole, and a protruding hollow retaining post is provided inside the glue injection hole. A plurality of glue leakage outlets are opened on the side of the protruding hollow retaining post, and a plurality of sliding grooves are also opened on the side of the protruding hollow retaining post. The plurality of protruding hollow retaining posts are slidably connected to the interior of the plurality of sliding grooves. A bottom ring plate is fixedly connected to the bottom end of the protruding hollow retaining post, and the top end of the bottom ring plate is in contact with the inner top surface of the metal shell body.

[0014] As a further improvement of the present invention, two insertion blocks are symmetrically fixedly connected to the top of the bottom ring plate on both sides of the protruding hollow locking post. The two insertion blocks are respectively movably connected inside the two insertion holes. Each insertion block has an abutment groove on the side away from the protruding hollow locking post, and the triangular abutment blocks are all set inside the abutment groove.

[0015] A method for manufacturing a capacitor with a waveform heat dissipation design, comprising the following steps:

[0016] S1, Precise Material Selection Stage: Selecting suitable metal casing, thermally conductive and insulating materials, and encapsulating adhesive;

[0017] S2, Core Unit Welding Process: The current-carrying copper plate and the capacitor core are welded using laser welding. The welded core unit is then connected to the conductive electrode via ultrasonic welding.

[0018] S3, Shell Structure Forming and Heat Dissipation Design: The metal shell body is formed into a wave-shaped heat dissipation structure through stamping. The heat dissipation panel fitting mechanism inserted between the core groups is connected to the wave-shaped heat dissipation structure through interference fit to form a three-dimensional heat dissipation network.

[0019] S4, Insulation and heat dissipation system assembly: A high heat dissipation waveform insulation sheet is embedded between the core assembly and the waveform heat dissipation structure. The high heat dissipation waveform insulation sheet fits perfectly with the waveform heat dissipation structure to achieve elastic contact heat conduction.

[0020] S5, Overall Assembly and Sealing Process: The core unit is fixed to the preset hole of the metal shell body through the insulating terminal. Then, the encapsulation glue is injected into the metal shell body through the protruding hollow fixing post using the vacuum injection process. After the encapsulation glue is cured, the air tightness test is carried out.

[0021] As a further improvement of the present invention, in step S1, the metal shell body is made of copper-aluminum alloy with a thermal conductivity ≥200W / (m·K), the surface of the metal shell body is anodized to enhance corrosion resistance, the thermally conductive insulating material is a silicon-based thermally conductive soft insulating sheet with a thermal resistance ≤0.5K·m² / W, the encapsulating adhesive is a two-component epoxy resin adhesive, the coefficient of thermal expansion of the epoxy resin adhesive after curing matches that of the metal shell, and the epoxy resin adhesive can prevent structural stress cracking caused by temperature changes.

[0022] As a further improvement of the present invention, in step S3, the peak height of the waveform heat dissipation structure is 3-5mm, the wave pitch of the waveform heat dissipation structure is 10-15mm, and the heat dissipation panel fitting mechanism adopts a copper heat sink with a thermal conductivity ≥300W / (m·K).

[0023] As a further improvement of the present invention, in step S5, a guide tube is movably connected to the top of the protruding hollowed-out locking post, a funnel tube is fixedly connected to the top of the guide tube, a stirring cone is provided inside the funnel tube, a connecting rod is fixedly connected to the top of the stirring cone, the outlet of the vacuum injection process is fixedly connected to the top of the funnel tube, and a rotary drive mechanism is fixedly connected to the top of the connecting rod.

[0024] Compared with the prior art, the beneficial effects of this invention are as follows:

[0025] 1. Through the synergistic heat conduction of the waveform heat dissipation structure and the high-heat-dissipation waveform insulating sheet, the waveform design of the inner wall of the metal shell increases the heat dissipation area. Combined with the elastic contact heat conduction characteristics of the high-heat-dissipation waveform insulating sheet, a low thermal resistance path is formed in the "shell-insulating sheet-core assembly" structure, enabling rapid heat transfer from the core assembly to the shell. The waveform structure promotes the flow of thermally conductive adhesive and avoids localized heat accumulation.

[0026] 2. By using the protruding, hollowed-out adhesive outlets and grooves on the sides of the retaining posts to form vertical adhesive channels, combined with a vacuum injection process, the adhesive is allowed to penetrate evenly within the injection holes, filling the tiny gaps between the core assembly and the outer shell to form a seamless sealing layer. The hollowed-out design of the adhesive outlets also reduces structural weight while increasing the contact area between the adhesive and the structure, improving bonding strength and heat conduction efficiency.

[0027] 3. By using the movable locking mechanism of the glue guide tube and the protruding hollow locking post, compared with the traditional glue injection which requires manual and repeated adjustment of the glue guide tube position to ensure alignment with the glue injection hole 110, this design achieves automatic positioning of "insert and be accurate" by sliding the groove 210 of the locking post 206 with the limiting slider 201 on the inner wall of the glue injection hole 110.

[0028] 4. By protruding the hollowed-out retaining post, the injection hole can be directly sealed after the encapsulation glue is injected. This press-flush mechanical self-sealing design eliminates the need for additional sealing plugs or manual glue filling. It directly achieves physical sealing of the injection hole through the structure itself, preventing external dust and moisture from entering and meeting the stringent sealing requirements of high-reliability capacitors.

[0029] 5. Before the encapsulating adhesive has completely solidified, press the protruding, perforated retaining post to allow excess adhesive to overflow from the injection hole onto the outer casing surface. This process automatically fills the tiny gaps between the core assembly and the casing, forming a uniform, bubble-free sealing layer, improving insulation strength and thermal conductivity. The overflowing adhesive also carries away any remaining micro-air bubbles, preventing cavities after curing and ensuring a dense, non-porous encapsulation layer.

[0030] 6. The adhesive delivery tube serves as the adhesive transport channel, and the flared structure of the funnel tube ensures a smooth transition of the adhesive from the vacuum dispensing process outlet to the interior of the metal casing. Furthermore, the stirring cone, driven by a rotary mechanism, rotates the connecting rod, continuously agitating the adhesive during the dispensing process. This prevents filler sedimentation or component stratification, ensuring adhesive uniformity and avoiding stress concentration or performance differences after curing. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a flowchart of the steps of the present invention.

[0033] Figure 2 This is a three-dimensional structural diagram of the capacitor and part of the glue-dispensing device in this invention.

[0034] Figure 3 For the present invention Figure 2 A cross-sectional three-dimensional structural diagram of the central guide tube and the funnel tube.

[0035] Figure 4 This is a three-dimensional structural diagram of the insulating terminal and the metal housing body in this invention.

[0036] Figure 5 This is a three-dimensional structural diagram of the top of the metal outer shell body in this invention.

[0037] Figure 6 For the present invention Figure 5 A cross-sectional three-dimensional structural diagram of the metal outer shell.

[0038] Figure 7 This is a cross-sectional three-dimensional structural diagram of the metal outer shell body in this invention.

[0039] Figure 8 This is a cross-sectional three-dimensional structural diagram of the metal shell body located at the glue injection hole position in this invention.

[0040] Figure 9 For the present invention Figure 8 A magnified three-dimensional structural diagram at point A in the middle.

[0041] Figure 10 This is a three-dimensional structural diagram of the bottom annular plate, the protruding hollowed-out fixing post, and the insertion block in this invention.

[0042] In the diagram: 101, Insulating terminal; 102, Conductive electrode; 103, Current-carrying copper plate; 104, Capacitor core; 105, Metal casing body; 106, Mounting hole; 107, Waveform heat dissipation structure; 108, Heat dissipation panel mating mechanism; 109, High heat dissipation waveform insulating sheet; 110, Glue injection hole; 201, Limiting slider; 202, Insertion hole; 203, Triangular contact block; 204, Spring; 205, Bottom ring plate; 206, Protruding hollow locking post; 207, Insertion block; 208, Contact groove; 209, Glue outlet; 210, Slide groove; 301, Glue guide tube; 302, Funnel tube; 303, Stirring cone; 304, Connecting rod. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] A capacitor with waveform heat dissipation design and its manufacturing method, such as Figure 1 As shown, it includes the following steps:

[0045] S1, Precise Material Selection Stage: Selecting suitable metal casing 105, thermally conductive and insulating materials, and encapsulating adhesive. The metal casing 105 is made of copper-aluminum alloy with a thermal conductivity ≥200W / (m·K). The surface of the metal casing 105 is anodized to enhance corrosion resistance. The thermally conductive and insulating material is a silicon-based thermally conductive soft insulating sheet with a thermal resistance ≤0.5K·m² / W. The encapsulating adhesive is a two-component epoxy resin adhesive. After curing, the coefficient of thermal expansion of the epoxy resin adhesive matches that of the metal casing, and the epoxy resin adhesive can prevent structural stress cracking caused by temperature changes.

[0046] Using different shell materials, different thermal conductivity, and different thermally conductive insulating materials as comparative conditions, the advantages of the present invention and the prior art in terms of heat dissipation effect are analyzed in detail. The specific comparison table is as follows:

[0047] Table 1 Comparison of the effects of different casing and thermally conductive insulation materials on heat dissipation performance

[0048]

[0049] Based on Table 1 above, it can be concluded that the thermal conductivity of copper-aluminum alloy far exceeds that of commonly used aluminum alloys and steel in existing technologies, enabling rapid conduction of heat generated by internal components to the outer casing surface, reducing heat accumulation. Furthermore, the silicon-based thermally conductive soft insulating sheet has extremely low thermal resistance, and its soft properties allow for a tight fit between the casing and internal components, eliminating additional thermal resistance caused by contact gaps and ensuring minimal heat transfer loss. The two-component epoxy resin adhesive has the same coefficient of thermal expansion as the metal casing, avoiding structural cracking caused by differences in thermal expansion and contraction between the adhesive and the casing, as seen in existing technologies. This ensures long-term stability of the heat dissipation channel and prevents structural damage from affecting heat dissipation performance.

[0050] S2, Core unit welding process: The current-carrying copper plate 103 and the capacitor core 104 are welded by laser welding process, and the welded core unit is connected to the conductive electrode 102 by ultrasonic welding.

[0051] S3, Shell Structure Forming and Heat Dissipation Design: The metal shell body 105 is formed into a wave-shaped heat dissipation structure 107 by stamping. The heat dissipation panel fitting mechanism 108 inserted between the core groups is connected to the wave-shaped heat dissipation structure 107 by interference fit, forming a three-dimensional heat dissipation network. The peak height of the wave-shaped heat dissipation structure 107 is 3-5mm, the wave pitch of the wave-shaped heat dissipation structure 107 is 10-15mm, and the heat dissipation panel fitting mechanism 108 adopts a copper heat sink with a thermal conductivity ≥300W / (m·K).

[0052] Using different heat dissipation structures and waveform heat dissipation parameters as comparison conditions, the advantages of the present invention and the prior art in terms of heat dissipation effect are analyzed in detail. The specific comparison table is as follows:

[0053] Table 2 Comparison of the effects of different heat dissipation structure parameters on heat dissipation performance

[0054]

[0055] Based on Table 2 above, it can be concluded that the combination of a 3-5mm peak height and a 10-15mm wave pitch ensures that the heat dissipation surface area is increased by more than 40% compared to a planar structure, while avoiding airflow blockage caused by excessively dense wave pitch and structural redundancy caused by excessively high wave height, thus balancing heat dissipation efficiency and spatial adaptability. The heat dissipation panel uses copper with a thermal conductivity ≥300W / (m・K), far exceeding that of ordinary aluminum alloys in existing technologies. This allows for rapid absorption of heat from the core assembly and transfer to the corrugated outer shell, shortening the heat conduction path. Furthermore, the interference fit between the corrugated outer shell and the insert-type heat dissipation panel forms a three-dimensional heat dissipation mode of "outer shell conduction and panel heat diversion." Compared to existing planar heat dissipation technologies, heat can diffuse from the core assembly in multiple directions, significantly reducing the risk of localized high temperatures.

[0056] S4, Insulation and Heat Dissipation System Assembly: A high-heat-dissipation waveform insulating sheet 109 is embedded between the core assembly and the waveform heat dissipation structure 107. The high-heat-dissipation waveform insulating sheet 109 fits perfectly with the waveform heat dissipation structure 107 to achieve elastic contact heat conduction. Two waveform heat dissipation structures 107 are provided on both sides of the inner wall of the metal shell body 105. The high-heat-dissipation waveform insulating sheet 109 is fixedly connected to the side of the two waveform heat dissipation structures 107 that are close to each other. Several capacitor cores 104 are evenly arranged inside the metal shell body 105 between the high-heat-dissipation waveform insulating sheets 109. The capacitor cores 104 are attached vertically and spaced horizontally. The metal shell body 105, the waveform heat dissipation structure 107, and the high-heat-dissipation waveform insulating sheet 109 are used to improve the heat dissipation capacity of the capacitor. A heat dissipation panel mating mechanism 108 is provided horizontally between each capacitor core 104. Two more heat dissipation panel mating mechanisms 108 are horizontally fixedly connected to the top of several of these mechanisms. All heat dissipation panel mating mechanisms 108 are fixedly connected inside the metal casing body 105. Four mounting holes 106 are symmetrically opened at the bottom of the metal casing body 105, and an injection hole 110 is opened at the top. Two current-carrying copper plates 103 are symmetrically fixedly connected to the outside of the vertically attached capacitor core 104. Several insulating terminals 101 are uniformly fixedly connected to the top of the metal casing body 105. Conductive electrodes 102 are fixedly connected to the top of each insulating terminal 101, and the bottom of each insulating terminal 101 is located at the top of the heat dissipation panel mating mechanism 108. The "perfect fit and elastic contact" characteristics of the waveform heat dissipation structure 107 and the high-heat-dissipation waveform insulating sheet 109 form a low thermal resistance heat conduction path, achieving efficient heat exchange between the core assembly and the heat dissipation structure and avoiding localized heat accumulation. The insulating sheet is made of a high heat dissipation material, which combines the dual functions of insulation and heat conduction to improve heat transfer efficiency.

[0057] S5, Overall Assembly and Sealing Process: The core unit is fixed to the preset holes in the metal housing body 105 via insulating terminals 101. Then, a vacuum encapsulation process is used to inject encapsulating adhesive into the metal housing body 105 through the protruding hollow retaining post 206. After the encapsulating adhesive cures, an airtightness test is performed. The top of the protruding hollow retaining post 206 is movably connected to an adhesive guide tube 301, and the top of the adhesive guide tube 301 is fixedly connected to a funnel tube 302. A stirring cone 303 is installed inside the funnel tube 302, and a connecting rod 304 is fixedly connected to the top of the stirring cone 303. The top of the funnel tube 302 is fixedly connected to the outlet of the vacuum encapsulation process, and a rotary drive mechanism is fixedly connected to the top of the connecting rod 304. Vacuum encapsulation completely eliminates air from inside the metal housing body 105, preventing air bubbles after adhesive curing, ensuring a dense and pore-free encapsulation layer, and improving insulation strength and moisture and dust resistance. Furthermore, the adhesive guide tube 301, serving as the adhesive delivery channel, works in conjunction with the flared structure of the funnel tube 302 to ensure a smooth transition of the adhesive from the vacuum dispensing process outlet to the interior of the metal casing 105. The stirring cone 303, driven by a rotary drive mechanism, rotates the connecting rod 304, continuously stirring the adhesive during the dispensing process to prevent filler sedimentation or component stratification, ensuring adhesive uniformity and avoiding stress concentration or performance differences after curing.

[0058] The metal casing 105 has symmetrically arranged insertion holes 202 on both sides of the glue injection hole 110 at its inner top. A spring 204 is fixedly connected inside each insertion hole 202, and a triangular abutment block 203 is fixedly connected to the end of each spring 204 that is close to each other. The triangular abutment block 203 is slidably disposed inside the insertion hole 202. Several limiting sliders 201 are evenly fixedly connected to the inner wall of the glue injection hole 110. A protruding hollow retaining post 206 is provided inside the glue injection hole 110. Several glue leakage outlets 209 are opened on the side of the protruding hollow retaining post 206, and several sliding grooves 210 are also opened on the side of the protruding hollow retaining post 206. The protruding hollow retaining posts 206 are slidably connected inside the sliding grooves 210. A bottom ring plate 205 is fixedly connected to the bottom end of the protruding hollow retaining post 206, and the top of the bottom ring plate 205 is in contact with the inner top surface of the metal casing 105. Two insertion blocks 207 are symmetrically fixedly connected to the top of the bottom ring plate 205 on both sides of the protruding hollow retaining post 206. The two insertion blocks 207 are movably connected inside the two insertion holes 202. Each insertion block 207 has an abutment groove 208 on the side away from the protruding hollow retaining post 206, and triangular abutment blocks 203 are all located inside the abutment groove 208. The glue outlet 209 on the side of the protruding hollow retaining post 206 and the sliding groove 210 form a glue guiding channel. Combined with the vacuum glue injection process, this allows the glue to penetrate evenly in the vertical direction, filling the tiny gaps between the core assembly and the outer shell, forming a seamless sealing layer. The hollow design of the glue outlet 209 also reduces structural weight while increasing the contact area between the glue and the structure, improving bonding strength and heat conduction efficiency.

[0059] The specific operation flow of a capacitor with a waveform heat dissipation design and its manufacturing method in this invention is as follows: First, the inner wall of the metal casing 105 is manufactured into a waveform heat dissipation structure 107. Then, a high-heat-dissipation waveform insulating sheet 109 is fixed on one side of the two waveform heat dissipation structures 107 close to each other. After the outer frame is manufactured, several heat dissipation panel mating mechanisms 108 are uniformly and vertically fixed inside the metal casing 105, with the spacing between the heat dissipation panel mating mechanisms 108 being the diameter of the capacitor core 104. Then, several capacitor cores 104 with a height similar to that inside the metal casing 105 are vertically arranged and connected to form a core group through a current-carrying copper plate 103. The completed core group is fixedly installed between the heat dissipation panel mating mechanisms 108. After installation, several horizontal heat dissipation panel mating mechanisms 108 are installed at the top of the vertical heat dissipation panel mating mechanisms 108, thereby enabling the electrical energy of the capacitor core 104 to be transferred to the top of the metal casing 105. Furthermore, several insulating terminals 101 and conductive electrodes 102 are fixedly connected to the top of the metal casing 105. The design of the waveform heat dissipation structure 107 and the high-heat-dissipation waveform insulating sheet 109 enables this capacitor to have excellent heat dissipation performance. The synergistic heat conduction of the waveform heat dissipation structure 107 and the high-heat-dissipation waveform insulating sheet 109 increases the heat dissipation area of ​​the waveform design on the inner wall of the metal casing 105. Combined with the "elastic contact thermal conductivity" characteristic of the high-heat-dissipation waveform insulating sheet 109, a low thermal resistance path is formed between the casing and the insulating sheet, enabling rapid heat transfer from the core to the casing. The waveform structure promotes air / thermal conductive adhesive flow, preventing localized heat accumulation.

[0060] The top of the metal casing 105 is also provided with an injection hole 110. Before the internal components of the metal casing 105 are installed and fixed, several limiting sliders 201 are fixedly connected to the inner wall of the injection hole 110. A protruding hollow retaining post 206 is slidably designed inside the injection hole 110. Several glue outlets 209 and grooves 210 are evenly provided on the side of the protruding hollow retaining post 206. Several limiting sliders 201 are slidably connected inside several grooves 210. After the protruding hollow retaining post 206 is slidably installed, a bottom ring plate 205 is fixed on the side of the protruding hollow retaining post 206 near the inside of the metal casing 105. Two insertion blocks 207 are symmetrically arranged on the side of the bottom ring plate 205 near the protruding hollow retaining post 206, and abutment grooves 208 are symmetrically opened on the side of the two insertion blocks 207 that are far apart from each other. Then, insertion holes 202 are made at the corresponding positions of the metal casing body 105 and the two insertion blocks 207. Springs 204 are fixedly connected inside the insertion holes 202, and triangular abutment blocks 203 are fixed on the side of the springs 204 near the protruding hollow locking post 206, so that the triangular abutment blocks 203 slide inside the insertion holes 202. After all components are manufactured, the protruding hollow locking post 206 is pulled upward, so that the abutment groove 208 and the triangular abutment block 203 are locked together, thereby ensuring that the protruding hollow locking post 206 is always exposed above the metal casing body 105 when there is no downward pressure. The glue outlet 209 on the side of the protruding hollow locking post 206 and the slide groove 210 form a vertical glue guiding channel. With the vacuum glue injection process, the glue is allowed to penetrate evenly in the glue injection hole 110, filling the tiny gaps between the core assembly and the casing, forming a sealing layer without dead corners. The hollow design of the glue outlet 209 reduces structural weight while increasing the contact area between the glue and the structure, improving bonding strength and heat conduction efficiency. Furthermore, the limiting slider 201 on the inner wall of the glue injection hole 110 slides in conjunction with the groove 210 of the protruding hollow retaining post 206, limiting the horizontal displacement of the post during glue injection, ensuring a precise glue injection path, preventing glue overflow or uneven distribution, and improving sealing consistency.

[0061] After the capacitor is assembled, it is glued using a glue-injecting device. A funnel tube 302 is fixedly connected to the bottom of the glue-injecting device, and a glue guide tube 301 is fixedly connected to the bottom of the funnel tube 302. The glue guide tube 301 is fitted onto the top of the protruding hollow retaining post 206. A stirring cone 303 is installed inside the funnel tube 302, and a connecting rod 304 fixed to the top of the stirring cone 303 is connected to the output end of the upper rotary motor. The rotation of the stirring cone 303 will continuously stir the glue before it is injected, thus minimizing air bubbles in the encapsulating glue injected into the metal casing 105. The connection between the glue-injecting device and the rotary motor described above is common knowledge in the prior art and will not be elaborated further in this invention. When the glue guide tube 301 is fitted onto the top of the protruding hollow retaining post 206, precise positioning is achieved through the track of the slide groove 210 and the limiting slider 201, ensuring that the glue injection path is vertical and without deviation, avoiding uneven distribution or overflow of glue due to positional deviation, and improving the consistency of the sealing layer. Compared to traditional glue injection, which requires manual and repeated adjustments of the glue guide tube to ensure alignment with the glue injection hole 110, this design achieves automatic positioning with "instant accuracy" by sliding the groove 210 of the locking post 206 with the limiting slider 201 on the inner wall of the glue injection hole 110.

[0062] After the adhesive is injected into the metal casing 105, the guide tube 301 is removed. Then, the protruding hollow retaining post 206 is pressed downwards, causing the triangular contact block 203 to disengage from the contact groove 208. When it moves to the limit slider 201 and abuts against the top of the slide groove 210, the protruding hollow retaining post 206 becomes flush with the surface of the metal casing 105. This also achieves the effect of sealing the injection hole 110. Furthermore, since the encapsulating adhesive inside the metal casing 105 is not completely cured at this time, excess adhesive will overflow onto the surface of the metal casing 105, thus achieving perfect encapsulation of the interior of the metal casing 105. This press-flush mechanical self-sealing design eliminates the need for additional sealing plugs or manual filling, directly achieving physical sealing of the injection hole 110 through the structure itself, preventing external dust and moisture intrusion and meeting the stringent sealing requirements of high-reliability capacitors. Furthermore, before the encapsulating adhesive has fully cured, pressing the retaining post causes excess adhesive to overflow from the injection hole 110 onto the outer casing surface. This process automatically fills the tiny gaps between the core assembly and the casing, forming a uniform sealing layer without dead corners or air bubbles, thus improving insulation strength and thermal conductivity. The overflowing adhesive also carries away any residual micro-air bubbles, preventing the formation of cavities after curing and ensuring a dense, non-porous encapsulation layer.

[0063] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A capacitor with a wave-shaped heat dissipation design, comprising a metal housing body (105), characterized in that, Two waveform heat dissipation structures (107) are provided on both sides of the inner wall of the metal shell body (105). A high-heat-dissipation waveform insulating sheet (109) is fixedly connected to the side of each of the two waveform heat dissipation structures (107) that is close to each other. A plurality of capacitor cores (104) are evenly arranged inside the metal shell body (105) between the high-heat-dissipation waveform insulating sheets (109). The capacitor cores (104) are vertically aligned and horizontally spaced. The metal shell body (105), the waveform heat dissipation structures (107), and the high-heat-dissipation waveform insulating sheets are all connected. The insulating sheet (109) is used to improve the heat dissipation capacity of the capacitor. Heat dissipation panel mating mechanisms (108) are provided horizontally between the capacitor cores (104). The tops of several heat dissipation panel mating mechanisms (108) are horizontally fixedly connected to two other heat dissipation panel mating mechanisms (108). All heat dissipation panel mating mechanisms (108) are fixedly connected inside the metal casing body (105). The bottom of the metal casing body (105) has four symmetrically arranged mounting holes (106), and the top of the metal casing body (105) has a glue injection hole (110). Vertically... Two current-carrying copper plates (103) are symmetrically fixed to the outside of the capacitor core (104) with the direction fitting. The top of the metal shell body (105) is symmetrically provided with insertion holes (202) on both sides of the glue injection hole (110). Springs (204) are fixedly connected inside each insertion hole (202). Triangular abutment blocks (203) are fixedly connected to the ends of the springs (204) that are close to each other. The triangular abutment blocks (203) are slidably disposed inside the insertion holes (202). Several limiting sliders are uniformly fixedly connected to the inner wall of the glue injection hole (110). 201), the inside of the glue injection hole (110) is provided with a protruding hollow retaining post (206), the side of the protruding hollow retaining post (206) is provided with a number of glue leakage holes (209), the side of the protruding hollow retaining post (206) is also provided with a number of sliding grooves (210), the number of protruding hollow retaining posts (206) are slidably connected to the inside of the number of sliding grooves (210), the bottom end of the protruding hollow retaining post (206) is fixedly connected with a bottom ring plate (205), the top end of the bottom ring plate (205) is in contact with the inner top surface of the metal shell body (105).

2. A capacitor with a wave-shaped heat dissipation design according to claim 1, characterized in that: The top of the metal shell body (105) is uniformly fixedly connected with a number of insulating terminals (101), and the top of each insulating terminal (101) is fixedly connected with a conductive electrode (102). The bottom of each insulating terminal (101) is located at the top of the heat dissipation panel mating mechanism (108).

3. A capacitor with a wave-shaped heat dissipation design according to claim 2, characterized in that: The top of the bottom ring plate (205) is symmetrically fixed to two insertion blocks (207) on both sides of the protruding hollowed-out locking post (206). The two insertion blocks (207) are respectively movably connected inside the two insertion holes (202). Each insertion block (207) has an abutment groove (208) on the side away from the protruding hollowed-out locking post (206). The triangular abutment blocks (203) are all set inside the abutment groove (208).

4. A method of manufacturing the capacitor as claimed in any one of claims 1 to 3, characterized in that, The specific steps include: S1, Precise material selection stage: Selecting suitable metal casing (105), thermally conductive and insulating materials, and encapsulating adhesive; S2, Core unit welding process: The current-carrying copper plate (103) and the capacitor core (104) are welded by laser welding process, and the welded core unit is connected to the conductive electrode (102) by ultrasonic welding. S3, Shell structure forming and heat dissipation design: The metal shell body (105) is formed into a wave heat dissipation structure (107) by stamping. The heat dissipation panel fitting mechanism (108) inserted between the core groups is connected to the wave heat dissipation structure (107) by interference fit to form a three-dimensional heat dissipation network. S4, Insulation and heat dissipation system assembly: A high heat dissipation waveform insulating sheet (109) is embedded between the core assembly and the waveform heat dissipation structure (107). The high heat dissipation waveform insulating sheet (109) fits perfectly with the waveform heat dissipation structure (107) to achieve elastic contact heat conduction. S5, Overall assembly and sealing process: The core unit is fixed to the preset hole of the metal shell body (105) through the insulating terminal (101), and then the encapsulation glue is injected into the metal shell body (105) through the protruding hollow fixing post (206) using the vacuum injection process. After the encapsulation glue is cured, the air tightness test is performed.

5. The manufacturing method of a capacitor with waveform heat dissipation design as described in claim 4, characterized in that: In step S1, the metal shell body (105) is made of copper-aluminum alloy with a thermal conductivity ≥200W / (m·K). The surface of the metal shell body (105) is anodized to enhance corrosion resistance. The thermally conductive insulating material is a silicon-based thermally conductive soft insulating sheet with a thermal resistance ≤0.5K·m² / W. The encapsulating adhesive is a two-component epoxy resin adhesive. After curing, the coefficient of thermal expansion of the epoxy resin adhesive matches that of the metal shell. The epoxy resin adhesive can prevent structural stress cracking caused by temperature changes.

6. The manufacturing method of a capacitor with waveform heat dissipation design as described in claim 4, characterized in that: In step S3, the peak height of the waveform heat dissipation structure (107) is 3-5mm, the wave pitch of the waveform heat dissipation structure (107) is 10-15mm, and the heat dissipation panel fitting mechanism (108) adopts a copper heat sink with a thermal conductivity ≥300W / (m·K).

7. The method of claim 4, wherein the capacitor is manufactured with a wave-shaped heat dissipation design. In step S5, a guide tube (301) is movably connected to the top of the protruding hollowed-out locking column (206), a funnel tube (302) is fixedly connected to the top of the guide tube (301), a stirring cone (303) is provided inside the funnel tube (302), a connecting rod (304) is fixedly connected to the top of the stirring cone (303), the outlet of the vacuum injection process is fixedly connected to the top of the funnel tube (302), and a rotary drive mechanism is fixedly connected to the top of the connecting rod (304).

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