Method of forming a biomimetic adhesive surface and surface adhesive

Abstract

The application discloses a biomimetic adhesive surface forming method and a surface adhesive body. The biomimetic adhesive surface forming method comprises the following steps: a template with a micropore array surface is prepared, and a precursor solution is prepared; the precursor solution is poured into the template to fill the micropore array surface, and after solidification, the template is demoulded to obtain an adhesive surface intermediate body with an initial microstructure array; a first plate is arranged, the precursor solution is smeared on the surface of the first plate to form a dipping layer, the initial microstructure array of the adhesive surface intermediate body is attached to the dipping layer, and then the initial microstructure array is separated from the dipping layer, so that the precursor solution is left on the end of the initial microstructure array; a second plate is arranged, the adhesive surface intermediate body is abutted to the surface of the second plate and is pressed, and after solidification, the adhesive surface intermediate body is separated from the second plate to obtain a biomimetic adhesive surface with a biomimetic microstructure array. The template of the embodiment of the application can be repeatedly used and can be continuously produced, thereby meeting the demand of industrial large-scale production, and the production cost can be reduced, and the consistency of the microstructure morphology of the product is high.

Description

Technical Field

[0001] This invention belongs to the field of material forming technology, specifically relating to a biomimetic adhesive surface forming method and surface adhesive. Background Technology

[0002] Inspired by the footpads of organisms such as geckos and insects, biomimetic adhesive surfaces with micron / nano-scale array structures have shown great potential in fields such as robotic grasping, climbing devices, medical patches, and non-destructive handling.

[0003] However, the fabrication cost of adhesive surfaces in related technologies is high, and the process is relatively cumbersome, making it difficult to produce them on a large scale and at low cost. For example, some adhesive surfaces are made by directly processing polymer surfaces using technologies such as electron beam etching and femtosecond laser direct writing. However, the processing efficiency is extremely low, and the equipment is expensive, which cannot meet the needs of large-scale applications. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the related art.

[0005] Therefore, embodiments of the present invention propose a biomimetic adhesive surface molding method suitable for production.

[0006] Embodiments of the present invention also propose a surface adhesive.

[0007] The biomimetic adhesive surface molding method of this invention includes:

[0008] A template with a microporous array surface was fabricated, and a precursor solution was prepared.

[0009] The precursor solution is poured into the template to fill the surface of the microporous array. After solidification, it is demolded to obtain an adhesive surface intermediate with an initial microstructure array.

[0010] A first plate is arranged, and a precursor solution is coated on the surface of the first plate to form a dipping layer. The initial microstructure array of the adhesive surface intermediate is attached to the dipping layer and then separated to leave the precursor solution at the end of the initial microstructure array.

[0011] A second plate is arranged, and the intermediate adhesive surface is pressed against and pressed against the surface of the second plate. After curing, the adhesive surface with a biomimetic microstructure array is obtained by separation.

[0012] The templates in this invention can be reused and produced continuously, thereby meeting the needs of large-scale industrial production. This makes the biomimetic adhesion surface easy to commercialize, reduces manufacturing costs, and ensures a high degree of consistency in the microstructure morphology of the product.

[0013] In some embodiments, the step of fabricating a template having a microporous array surface includes:

[0014] Configure the substrate and design the micropore array parameters;

[0015] The micro-hole array parameters are imported into the laser processing equipment, and the process parameters of the laser processing equipment are set based on the micro-hole array parameters. The process parameters of the laser processing equipment include one or more of the following: laser power, scanning speed, number of scans, defocusing amount, pulse frequency, and scanning interval.

[0016] The laser processing equipment is used to ablate an array of micropores on the surface of the substrate.

[0017] In some embodiments, the laser power is 2W to 200W, the scanning speed is 10mm / s to 5000mm / s, the number of scans is 1 to 200, the defocusing amount is -5mm to +5mm, the pulse frequency is 1kHz to 200kHz, and the scanning spacing is 5 micrometers to 200 micrometers.

[0018] And / or, the substrate is an acrylic sheet, a polycarbonate sheet, or a metal sheet.

[0019] In some embodiments, prior to the step of pouring the precursor solution into the template to fill the surface of the microporous array, the method further includes:

[0020] The template is cleaned and dried for 1 to 30 minutes and 5 to 60 minutes respectively.

[0021] A release agent is applied to the surface of the template, the amount of the release agent being applied is from 0.1 mg / cm² to 5 mg / cm², and the release agent is sprayed 1 to 5 times.

[0022] In some embodiments, the precursor solution comprises a polymer and a curing agent, wherein the mass ratio of the polymer to the curing agent is 5:1 to 20:1;

[0023] And / or, the precursor solution is poured into the template to fill the microporous array, and vacuum degassing is used to fill the microporous array with the precursor solution. The vacuum degree of vacuum degassing is -0.06MPa to -0.095MPa, and the vacuum degassing duration is 1min to 30min.

[0024] In some embodiments, in the step of demolding after curing to obtain an adhesive surface intermediate with an initial microstructure array, the demolding angle of the adhesive surface intermediate relative to the template is 10 degrees to 45 degrees, and the demolding speed of the adhesive surface intermediate is 0.1 mm / s to 20 mm / s.

[0025] And / or, in the step of demolding after curing to obtain an adhesive surface intermediate with an initial microstructure array, the demolding temperature of the adhesive surface intermediate is 20 degrees Celsius to 80 degrees Celsius.

[0026] In some embodiments, the step of separating the initial microstructure array of the adhesive surface intermediate from the dip layer after adhesion includes:

[0027] Regulate the temperature and humidity within the workspace;

[0028] The adhesive surface intermediate is brought closer to the dip layer at a first preset speed;

[0029] After the initial microstructure array of the adhesive surface intermediate comes into contact with the dip layer, it remains for a first preset time, and then the adhesive surface intermediate is pulled away from the dip layer at a second preset speed.

[0030] In some embodiments, the temperature in the workspace is between 13 degrees Celsius and 35 degrees Celsius, and the humidity in the workspace is between 20%RH and 70%RH.

[0031] And / or, the first preset time is less than 300s;

[0032] And / or, the first preset speed is 0.001 mm / s to 0.1 mm / s, and the second preset speed is 0.1 mm / s to 50 mm / s;

[0033] And / or, the apparent viscosity of the dip layer is from 0.1 Pa·s to 100 Pa·s;

[0034] And / or, the thickness of the dip layer is from 1 micrometer to 500 micrometers;

[0035] And / or, the equivalent diameter of the ends of the biomimetic microstructure array in the biomimetic adhesive surface. satisfy:

[0036] ,and ,in, For the array period, The equivalent width of the hole wall thickness in the initial microstructure array. The surface tension of the dipped layer, , It is an experience index. The thickness of the dip layer, The second preset speed.

[0037] In some embodiments, during the step of abutting and pressing the adhesive surface intermediate against the surface of the second plate, the loading pressure between the adhesive surface intermediate and the second plate is 0.01 MPa to 0.5 MPa, and the holding time is 1 s to 600 s;

[0038] And / or, after the step of curing, the resulting biomimetic adhesive surface with a biomimetic microstructure array is cured by heating at a temperature of 25°C to 150°C for 5 to 240 minutes, or by ultraviolet irradiation at an intensity of [insert intensity here]. to The irradiation time ranges from 1 second to 600 seconds;

[0039] And / or, the step involves abutting and pressing the intermediate adhesive surface with the surface of the second plate, and separating it after curing to obtain a biomimetic adhesive surface with a biomimetic microstructure array. This process is carried out in a vacuum environment with a vacuum degree of -0.02MPa to -0.09MPa, or in an inert gas environment.

[0040] And / or, it further includes secondary curing and / or surface treatment of the biomimetic adhesion surface, wherein the heating temperature for secondary curing is 40 degrees Celsius to 120 degrees Celsius, the heating time for secondary curing is 10 min to 180 min, the surface treatment is plasma surface treatment, the plasma surface treatment time is 10 s to 300 s, or the surface treatment is thin-layer coating treatment, the coating thickness for thin-layer coating treatment is 5 nanometers to 200 nanometers.

[0041] In some embodiments, the micropore array on the template has an equivalent diameter of pore opening of 20 micrometers to 500 micrometers, a pore depth of 20 micrometers to 1000 micrometers, and an equivalent diameter of pore bottom of 5 micrometers to 400 micrometers.

[0042] And / or, the sidewall inclination angle of the micropore array on the template is 20 degrees to 85 degrees;

[0043] And / or, the bottom of the micropore array on the template is flat, raised, or concave.

[0044] The surface adhesive of the present invention has a first surface and a second surface in its thickness direction. The first surface is constructed as a biomimetic adhesive surface with a biomimetic microstructure array. The biomimetic adhesive surface is fabricated using any of the above-described biomimetic adhesive surface forming methods.

[0045] In some embodiments, the biomimetic microstructure array includes a plurality of pillars arranged in an array, each pillar having a body portion and an adsorption portion located at an end of the body portion, the outer diameter of the adsorption portion being larger than the outer diameter of the body portion.

[0046] In some embodiments, the outer diameter of the adsorption portion is 1.05 to 3 times the outer diameter of the body portion;

[0047] And / or, the adsorption portion is recessed in the middle, and the recessed depth of the adsorption portion is from 1 micrometer to 200 micrometers;

[0048] And / or, the adsorption part is in the shape of a mushroom head, a hemispherical shape, a suction cup shape, or an inverted ring shape;

[0049] And / or, the height of the column is from 20 micrometers to 800 micrometers;

[0050] And / or, the sidewall of the main body is a straight wall surface parallel to the axial direction of the main body, or an inclined wall surface at a predetermined angle to the axial direction of the main body, or a stepped wall surface. Attached Figure Description

[0051] Figure 1 This is a flowchart of the biomimetic adhesive surface forming method according to an embodiment of the present invention.

[0052] Figure 2 This is a schematic diagram of the biomimetic adhesive surface forming according to an embodiment of the present invention.

[0053] Figure label:

[0054] 1. Template;

[0055] 2. Precursor solution;

[0056] 3. Adhesive surface intermediate;

[0057] 4. First plate; 41. Dipping layer;

[0058] 5. Second board;

[0059] 7. Surface adhesive; 71. Column; 711. Body part; 712. Adsorption part; 72. Bionic adhesive surface. Detailed Implementation

[0060] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0061] See Figure 1 and Figure 2 The biomimetic adhesive surface molding method of this invention includes:

[0062] S1. Fabricate a template 1 with a microporous array surface and prepare a precursor solution 2. The template 1 can be reused multiple times, thereby reducing manufacturing costs, improving work efficiency, and facilitating the mass production of large-area biomimetic adhesive surfaces.

[0063] S2. After the template 1 is laid flat, the precursor solution 2 is poured into the template 1 to fill the surface of the microporous array, and the precursor solution 2 fills the cavities on the surface of the microporous array. After curing, the template is demolded to obtain the adhesive surface intermediate 3 with the initial microstructure array. The demolded template 1 can be processed for the next batch of production, with high turnover efficiency.

[0064] S3. Arrange the first plate 4, and apply the precursor solution 2 to the surface of the first plate 4 to form a dipping layer 41. After adhering the initial microstructure array of the adhesion surface intermediate 3 to the dipping layer 41, separate them so that the precursor solution 2 remains at the end of the initial microstructure array. In this embodiment, the thickness of the dipping layer 41 can be controlled, thereby controlling the amount of precursor solution 2 left at the end of the initial microstructure array and avoiding adhesion.

[0065] S4. Arrange the second plate 5, press and adhere the intermediate body 3 to the surface of the second plate 5, and separate it after curing to obtain a biomimetic adhesive surface with a biomimetic microstructure array. The precursor solution 2 left at the end of the initial microstructure array can form an adsorption part 712 in the shape of a mushroom head, hemisphere, suction cup or inverted ring after curing, thereby obtaining a biomimetic adhesive surface 72.

[0066] In this embodiment, the working surfaces of both the first plate 4 and the second plate 5 can be generally flat surfaces, such as glass plates. The biomimetic microstructure array of the biomimetic adhesive surface can realize biomimetic footpads of geckos, insects, and other organisms, thereby improving the adhesion effect when the biomimetic adhesive surface comes into contact with other objects.

[0067] The template 1 of this invention can be reused and produced continuously, thereby meeting the needs of industrial-scale mass production, making the biomimetic adhesion surface easy to commercially apply, reducing manufacturing costs, and ensuring a high degree of consistency in the microstructure morphology of the product.

[0068] The inventors recognized that in some micro-nano fabrication technologies, master templates can be manufactured on silicon wafers using photolithography. However, due to the numerous steps involved in semiconductor microfabrication technologies, such as photolithography, which rely on expensive photolithography machines, masks, and cleanroom environments, the cost of preparing a single master template is extremely high. Silicon master templates are fragile and can only be reused a limited number of times. Due to market limitations on equipment such as photolithography machines, they are difficult to use for large-area, low-cost production.

[0069] Therefore, this embodiment of the invention utilizes laser processing technology to scan and process the mold, thereby enabling the mass production and large-area replication of microstructure arrays. Specifically, in step S1, fabricating a template 1 with a microporous array surface includes:

[0070] S101. Configure the substrate and design the micropore array parameters. The substrate can be an acrylic plate, polycarbonate plate, or metal plate, etc. The substrate has low cost, good structural stability, and good structural stability after the micropore array is processed, which is convenient for repeated use.

[0071] When designing the parameters of a micropore array, computer-aided software (such as CAD) can be used. The designed micropore array can be arranged in a circular array, a square array, etc.

[0072] S102. The micro-hole array parameters are imported into the laser processing equipment, and the process parameters of the laser processing equipment are set based on the micro-hole array parameters. The process parameters of the laser processing equipment include one or more of the following: laser power, scanning speed, number of scans, defocusing amount, pulse frequency, and scanning spacing. In this embodiment, the laser type can be carbon dioxide, fiber optic, ultraviolet, etc. In this embodiment, by adjusting one or more of the parameters of laser power, scanning speed, number of scans, defocusing amount, and pulse frequency, scanning spacing, the ablation depth and sidewall morphology can be controlled, thereby scanning and processing on the substrate to create a template 1 containing a large number of micro-hole array structures.

[0073] S103. A micro-hole array is ablated on the surface of the substrate using laser processing equipment. The laser processing in this embodiment is low-cost, flexible, and fast, and the processing area can exceed the square meter level, which is convenient for mass production and more suitable for industrial production applications.

[0074] In some embodiments, the laser power is between 2W and 200W. The laser power can be 2W, 6W, 10W, 22W, 52W, 80W, 120W, or 200W. This embodiment, by controlling the output energy per unit time, can more precisely control the hole depth and diameter of the micro-hole array on the substrate. When the laser power is less than 2W, it easily leads to problems such as insufficient output energy, insufficient hole depth, incomplete hole bottom formation, and slow processing speed. When the laser power is greater than 200W, it easily leads to excessive output energy, excessively fast ablation rate, resulting in hole edge collapse, thickening of the recast layer, expansion of the heat-affected zone, affecting the performance of template 1, and even easily causing template 1 to be scrapped.

[0075] Preferably, the laser power can be from 10W to 80W.

[0076] Furthermore, the scanning speed ranges from 10 mm / s to 5000 mm / s. The scanning speed can be 10 mm / s, 60 mm / s, 100 mm / s, 260 mm / s, 800 mm / s, 1000 mm / s, 1500 mm / s, 3000 mm / s, or 5000 mm / s. In this embodiment, the scanning speed and laser power are matched, which together determine the linear energy and allow for precise control of the taper of the micro-hole and the roughness of the sidewall.

[0077] In this embodiment, the line energy (energy per unit length) E_line satisfies: Where P is the laser power and v is the scanning speed, under the same material and focusing conditions, an increase in E_line usually corresponds to a larger ablation depth and a larger hole taper; an excessively large E_line can easily lead to hole collapse and recast layer.

[0078] Therefore, when the scanning speed is less than 10 mm / s, the scanning speed is too slow, which can easily lead to over-ablation. It can also cause increased taper of the micropores and material splashing, resulting in defects in template 1 and affecting product quality. When the scanning speed is greater than 5000 mm / s, the scanning speed is too fast, which can easily lead to discontinuous ablation, insufficient hole depth, and uncontrollable sidewall morphology, affecting the quality of subsequent biomimetic microstructure arrays.

[0079] Preferably, the scanning speed can be from 100 mm / s to 1500 mm / s.

[0080] Furthermore, the number of scans can range from 1 to 200, and can be 1, 3, 5, 15, 60, 80, 120 or 200. In this embodiment, it can be formed by a single scan or by multiple scans. When multiple scans are used, the ablation depth of a single scan can be controlled by controlling the number of scans, thereby accumulating the total ablation depth. The micropores can form a multi-level step-like or inverted conical shape, which provides better control over the morphology of the micropores and makes the pore shape more stable.

[0081] The cumulative energy index E_total satisfies: =(P·N) / v or N represents the number of scans, which is used to bind the number of scans to power / speed, thereby limiting the repeatability of hole depth and sidewall morphology. When the number of scans exceeds 200, it is easy to cause problems such as melting and accumulation at the bottom of the hole, hole diameter enlargement, sidewall collapse or burrs, and it will also lead to low processing efficiency.

[0082] Preferably, the number of scans can be from 5 to 80.

[0083] Furthermore, the defocus amount is -5mm to +5mm. The defocus amount during laser processing can be -5mm, -3mm, -2.5mm, -2mm, 0, +2mm, +3.6mm or +5mm. In this embodiment, by controlling the defocus amount, the spot diameter and energy distribution can be directly adjusted, the relative size of the orifice and the bottom of the orifice can be controlled, the sidewall tilt angle can be optimized, etc., to improve the forming quality of the micro-hole array.

[0084] Defocus correction: Effective spot diameter .in, The defocus amount is the amount of light in the formula. As can be seen from the formula, an increase in the defocus amount leads to a larger light spot, which in turn leads to a decrease in energy density, resulting in a gentler sidewall tilt angle or a funnel shape.

[0085] When the defocusing amount exceeds the range of this embodiment, it is easy to cause uncontrollable laser energy, which can easily lead to hole collapse, spatter, etc. The hole diameter, hole depth, sidewall morphology, etc. are all out of control, affecting the quality of the micro-hole array.

[0086] Furthermore, the pulse frequency ranges from 1 kHz to 200 kHz, and can be 1 kHz, 10 kHz, 50 kHz, 60 kHz, 77 kHz, 80 kHz, 100 kHz, 120 kHz, 188 kHz, or 200 kHz. This embodiment allows for more precise control over single-pulse energy and the heat accumulation from multiple pulses by controlling the pulse frequency, thereby enabling more precise control over sidewall morphology, sidewall roughness, and the recast layer. When the pulse frequency exceeds 200 kHz, excessive heat accumulation can easily occur, leading to problems such as localized carbonization, melt collapse, and thickening of the recast layer. When the pulse frequency is less than 1 kHz, it results in low processing efficiency and increased sidewall ripples.

[0087] Preferably, the pulse frequency is 10 kHz to 80 kHz.

[0088] Furthermore, the scanning spacing is from 5 micrometers to 200 micrometers. The scanning spacing can be 5 micrometers, 15 micrometers, 20 micrometers, 66 micrometers, 70 micrometers, 80 micrometers, 120 micrometers, 168 micrometers, or 200 micrometers. In this embodiment, the scanning spacing determines the edge integrity of the micropore array of the template and the surface energy density.

[0089] The area energy density (used for filling / area scanning) is E_area = P / (v·h) (J / mm²). Where h is the scanning interval. If E_area is too small, it is easy to miss scans / incomplete aperture shape; if it is too large, it is easy to cause thermal superposition and weakening of aperture walls.

[0090] When the scanning spacing is less than 5 micrometers, thermal superposition is likely to occur, leading to problems such as over-ablation, thinning of the hole spacer wall, and melt-through. When the scanning spacing is greater than 200 micrometers, missed scans are likely to occur, resulting in hole gaps.

[0091] In applications, the appropriate parameter range can be selected within the above parameter range based on the substrate material and the type of laser, making it highly practical.

[0092] The morphology mapping of micropores can be:

[0093] The pore depth H of the micropores increases monotonically with E_total, and approximately satisfies the following condition above the material threshold: .

[0094] The orifice diameter D_top of the micropore is positively correlated with the defocusing amount. The bottom diameter D_bottom of the aperture can remain stable under light defocus and moderate E_total, thus obtaining a conical / trumpet-shaped profile. Among them, k1, k2, and k3 are constants.

[0095] The sidewall inclination angle θ of the micropore can be represented by D_top, D_bottom, and H: For laser-processed templates, a large sidewall inclination angle is not required, as the mushroom-shaped structure can be achieved by dipping.

[0096] In some embodiments, before the step of pouring the precursor solution 2 into the template to fill the microporous array surface, the method further includes:

[0097] S201. Clean and dry the template. The cleaning time is 1 to 30 minutes, and the drying time is 5 to 60 minutes. Ultrasonic cleaning or solvent cleaning can be used. The cleaning time can be 1 minute, 5 minutes, 10 minutes, 15 minutes, 19 minutes, or 30 minutes to remove residual oil stains, avoid demolding failure, or avoid defects in hole pattern replication.

[0098] The drying time can be 5 min, 15 min, 36 min, 40 min, 55 min, or 60 min, depending on the amount of water adhering to the template surface after cleaning. Too short a drying time will result in residual water droplets within the microporous array, while too long a drying time will lead to longer work cycles and reduced production efficiency.

[0099] S202. Apply a release agent to the template surface. The amount of release agent applied is 0.1 mg / cm² to 5 mg / cm², and the number of applications is 1 to 5. The application amount of release agent can be 0.1 mg / cm², 1 mg / cm², 1.5 mg / cm², 2.3 mg / cm², 3 mg / cm², 4 mg / cm², or 5 mg / cm². If the amount of release agent applied is too small, demolding will be difficult, which may lead to sticking and breakage of the molded column during subsequent demolding of the biomimetic adhesion surface, resulting in damage to the biomimetic adhesion surface. If the amount of release agent applied is too large, it will occupy the space within the micropore array, resulting in waste of release agent and making subsequent cleaning difficult. It may also cause the micropore details of the template to become blunt, and the end shape to become rounded.

[0100] The release agent in this embodiment can be applied in one spray or in multiple sprays, which makes it easier to control the thickness of a single spray and improves the uniformity of the spray.

[0101] In some embodiments, the precursor solution 2 of this embodiment includes a polymer and a curing agent, with a polymer-to-curing agent mass ratio of 5:1 to 20:1. The polymer can be PDMS polymer or silicone, etc. When there is too little curing agent, it is easy to cause incomplete curing and adhesion contamination, affecting the quality of the product. When there is too much curing agent, it is easy to cause the product to be too brittle and have large shrinkage, affecting the product's performance.

[0102] In step S2, during the process of pouring the precursor solution 2 into the template to fill the microporous array, vacuum degassing is used to allow the precursor solution 2 to fill the microporous array. The entire process can be carried out under vacuum, thereby allowing the precursor solution 2 to enter the cavity of the microporous array, increasing the density. The vacuum degree for vacuum degassing is -0.06MPa to -0.095MPa, and the vacuum degassing duration is 1 min to 30 min. When the vacuum degree is insufficient, it is easy to cause residual air bubbles, resulting in pores in the product. When the vacuum degree is too high, it is easy to cause problems such as loss of volatile components and viscosity drift, which is not conducive to product molding.

[0103] In some embodiments, in step S2 above, after curing, the adhesive surface intermediate 3 with an initial microstructure array is obtained by demolding. The demolding angle of the adhesive surface intermediate 3 relative to the template is 10 degrees to 45 degrees, and can be 10 degrees, 15 degrees, 20 degrees, 30 degrees, 40 degrees, or 45 degrees. The demolding speed of the adhesive surface intermediate 3 is 0.1 mm / s to 20 mm / s. The demolding speed of the adhesive surface intermediate 3 can be 0.1 mm / s, 1 mm / s, 2 mm / s, 4 mm / s, 8 mm / s, 15 mm / s, or 20 mm / s. This embodiment avoids problems such as broken columns or collapse by controlling the demolding angle, and avoids problems such as tearing or breakage due to excessively fast demolding speed, while also avoiding morphological stretching and deformation due to excessively slow demolding speed. This embodiment improves the quality and integrity of the initial microstructure array on the adhesive surface intermediate 3 by controlling the demolding speed and angle, thereby improving the quality of the product.

[0104] Furthermore, after curing and demolding, an adhesion surface intermediate 3 with an initial microstructure array is obtained. The demolding temperature of the adhesion surface intermediate 3 is between 20 degrees Celsius and 80 degrees Celsius. The demolding temperature can be 20 degrees Celsius, 30 degrees Celsius, 50 degrees Celsius, 60 degrees Celsius, 75 degrees Celsius, or 80 degrees Celsius, thereby controlling the interfacial adhesion strength, improving the yield during demolding, avoiding structural softening and collapse at excessively high temperatures, and avoiding excessive adhesion strength at excessively low temperatures, which could lead to column breakage or tearing.

[0105] In some embodiments, step S3, during the process of separating the initial microstructure array of the adhesion surface intermediate 3 from the dip layer 41 after adhesion, includes:

[0106] S301. Adjust the temperature and humidity in the workspace.

[0107] The temperature within the working space ranges from 13°C to 35°C, and can be 13°C, 15°C, 20°C, 25°C, 30°C, or 35°C. The humidity within the working space ranges from 20%RH to 70%RH, and can be 20%RH, 30%RH, 35%RH, 40%RH, 50%RH, 60%RH, or 70%RH. Within this temperature and humidity range, the viscosity of the dipping layer 41, as well as the curing time of the initial microstructure array and the dipping layer 41, can be well controlled to ensure good uniformity and consistency in quality across multiple batches of production.

[0108] Preferably, the temperature in the workspace is between 20 and 28 degrees Celsius, and the humidity in the workspace is between 30% and 60% RH.

[0109] In this embodiment, the apparent viscosity of the dipping layer 41 is from 0.1 Pa·s to 100 Pa·s, and the apparent viscosity of the dipping layer 41 can be 0.1 Pa·s, 0.5 Pa·s, 1 Pa·s, 10 Pa·s, 20 Pa·s, 50 Pa·s, or 100 Pa·s. The thickness of the dipping layer 41 is from 1 micrometer to 500 micrometers, and the thickness of the dipping layer 41 can be 1 micrometer, 5 micrometers, 10 micrometers, 60 micrometers, 100 micrometers, 150 micrometers, 300 micrometers, or 500 micrometers. If the apparent viscosity of the dipping layer 41 is too low, it is easy to drip and the end structure after dipping will be unstable. If the apparent viscosity of the dipping layer 41 is too high, it is easy to have problems such as stringing, rough morphology, and poor product quality.

[0110] If the dip layer 41 is too thick, it can easily lead to adhesive overflow during subsequent dipping processes, causing contamination. It can also result in too much precursor solution 2 remaining at the end of the initial microstructure array. If the dip layer 41 is too thin, it can easily lead to insufficient precursor solution 2 at the end of the initial microstructure array, affecting the molding quality of the subsequent biomimetic microstructure array.

[0111] Preferably, the apparent viscosity of the dip layer 41 is 0.5 Pa·s to 20 Pa·s, and the thickness of the dip layer 41 is 10 micrometers to 150 micrometers.

[0112] S302, the adhesive surface intermediate 3 is brought closer to the adsorption layer 41 at a first preset speed. The first preset speed is 0.001 mm / s to 0.1 mm / s, and the first preset speed can be 0.001 mm / s, 0.005 mm / s, 0.01 mm / s, 0.08 mm / s, 0.095 mm / s or 0.1 mm / s.

[0113] S303. After the initial microstructure array of the surface intermediate 3 to be adhered to comes into contact with the adsorption layer 41, it remains in contact for a first preset time, and then the surface intermediate 3 is pulled away from the adsorption layer 41 at a second preset speed. The first preset time is less than 300s, and the first preset time can be 1s, 10s, 30s, 60s, 100s, 200s or 300s. The second preset speed is 0.1mm / s to 50mm / s; the second preset speed can be 0.1mm / s, 0.2mm / s, 0.5mm / s, 5mm / s, 10mm / s, 15mm / s, 30mm / s or 50mm / s.

[0114] In this embodiment, the first preset speed, the second preset speed, and the first preset time are adapted to parameters such as the thickness of the dipping layer 41, the apparent viscosity, and the temperature and humidity of the working space. This avoids problems such as filament snagging, tailing, and solution splashing caused by excessively fast approach or pull-out speeds, and avoids problems such as insufficient liquid volume at the ends of the initial microstructure array, incomplete end formation, and solution backflow caused by excessively slow approach or pull-out speeds. By controlling the first preset dwell time, this embodiment can prevent adhesion between the ends of the initial microstructure array.

[0115] Preferably, the first preset speed is 0.005 mm / s to 0.08 mm / s, the first preset time is 1 s to 60 s, and the second preset speed is 0.5 mm / s to 15 mm / s. This allows for better determination of the stretching and necking positions of the liquid bridge formed between the dipping layer 41 and the initial microstructure array, control of the liquid bridge volume and the amount of precursor solution 2 remaining at the end of the initial microstructure array, and ensures product quality.

[0116] In some embodiments, the equivalent diameter of the ends of the biomimetic microstructure array in the biomimetic adhesive surface satisfy:

[0117] ,and ,in, For the array period, The equivalent width of the hole wall thickness in the initial microstructure array. To reduce the surface tension of the dip layer 41, , It is an experience index. To achieve the thickness of the dip layer 41, The second preset speed is used. In this embodiment, the parameters of the dipping process can be determined based on the equivalent diameter of the end of the desired biomimetic microstructure array and the performance parameters of the dipping layer 41, so as to ensure the product quality of the biomimetic microstructure array formed by the dipping process.

[0118] In some embodiments, step S4 can be performed under vacuum conditions, with a vacuum level of -0.02 MPa to -0.09 MPa. The vacuum level can be -0.02 MPa, -0.03 MPa, -0.04 MPa, -0.06 MPa, -0.08 MPa, or -0.09 MPa, thereby avoiding air bubbles and problems such as end-morphological shrinkage of the biomimetic microstructure array. Alternatively, it can be performed under an inert gas environment. Preferably, the vacuum level is -0.04 MPa to -0.08 MPa.

[0119] Furthermore, during the process of pressing and bonding the surface intermediate 3 with the surface of the second plate 5, the loading pressure between the surface intermediate 3 and the second plate 5 is 0.01 MPa to 0.5 MPa, specifically 0.01 MPa, 0.05 MPa, 0.1 MPa, 0.2 MPa, 0.3 MPa, or 0.5 MPa. The holding time is 1 s to 600 s, specifically 1 s, 5 s, 15 s, 60 s, 100 s, 120 s, 300 s, or 600 s. This embodiment, by controlling the loading pressure and holding time, ensures that the precursor solution 2 at the end of the surface intermediate 3 spreads out, avoiding adhesion or end deformation, thus improving the molding quality of the biomimetic microstructure array.

[0120] Preferably, the loading pressure between the adhesive surface intermediate 3 and the second plate 5 is 0.05 MPa to 0.2 MPa, and the holding time is 5 s to 120 s.

[0121] Furthermore, after curing, the biomimetic adhesive surface with a biomimetic microstructure array is obtained through heat curing. The heating temperature is between 25°C and 150°C, and the heating time is between 5 min and 240 min, and the heating time is 5 min, 15 min, 20 min, 60 min, 100 min, 120 min, or 240 min. This embodiment ensures complete curing and easy separation through reasonable temperature and time, while ensuring a stable connection between the dipped precursor solution 2 and the original initial microstructure array. It avoids shrinkage or stress cracking due to excessively high temperature, and insufficient curing due to excessively low temperature, resulting in adhesion residue during separation.

[0122] Preferably, the heating and curing temperature is 60 degrees Celsius to 120 degrees Celsius, and the heating time is 20 minutes to 120 minutes.

[0123] Alternatively, ultraviolet (UV) irradiation can be used for curing, with an irradiation intensity of [insert value here]. to The irradiation time ranges from 1 second to 600 seconds. By controlling the intensity of ultraviolet irradiation, the curing effect can be optimized, avoiding the internal stress caused by the sequential curing of the surface and inner layers when the irradiation intensity is too high, and avoiding the poor connection stability between the dipped precursor solution 2 and the original initial microstructure array when the irradiation intensity is too low.

[0124] Preferably, the irradiation intensity can be The irradiation time is from 10 seconds to 180 seconds.

[0125] In some embodiments, after step S4, the method further includes:

[0126] Step S5 involves secondary curing and / or surface treatment of the biomimetic adhesion surface. The heating temperature for secondary curing is 40°C to 120°C, and the heating time for secondary curing is 10 min to 180 min. This improves the crosslinking degree and morphological stability of the dipped precursor solution 2 and the original initial microstructure array, and avoids problems such as stress concentration cracking and catalysis.

[0127] Surface treatment can be performed using plasma surface treatment, with a treatment time ranging from 10 to 300 seconds. Alternatively, a thin-layer coating treatment can be used, with a coating thickness ranging from 5 nanometers to 200 nanometers. Surface treatment can adjust the surface's coefficient of friction, adhesion, and other properties, improving application performance. At the same time, over-treatment should be avoided to prevent surface aging and decreased adhesion.

[0128] In some embodiments, the equivalent diameter of the pores in the micropore array on the template is from 20 micrometers to 500 micrometers, and the equivalent diameter of the pores can be 20 micrometers, 30 micrometers, 50 micrometers, 100 micrometers, 30 micrometers, 360 micrometers, or 500 micrometers. The pore depth is from 20 micrometers to 1000 micrometers, and the pore depth can be 20 micrometers, 30 micrometers, 50 micrometers, 100 micrometers, 500 micrometers, 600 micrometers, 750 micrometers, or 1000 micrometers. The equivalent diameter of the pore bottom is from 5 micrometers to 400 micrometers, and the equivalent diameter of the pore bottom can be 5 micrometers, 15 micrometers, 20 micrometers, 55 micrometers, 160 micrometers, 250 micrometers, or 400 micrometers.

[0129] This embodiment optimizes the dimensions of the micropore structure in the micropore array on the template, ensuring the structural accuracy, dimensional accuracy, and desired adhesion of the formed biomimetic microstructure array, thus improving the biomimetic effect. Relevant parameters can be measured using microscopy, profilometry, etc.

[0130] Preferably, the micropore array on the template has an equivalent diameter of 50 micrometers to 300 micrometers at the opening, a depth of 50 micrometers to 600 micrometers, and an equivalent diameter of 20 micrometers to 250 micrometers at the bottom.

[0131] Furthermore, the sidewall inclination angle of the micropore array on the template is 20 degrees to 85 degrees; it can be obtained by the equivalent diameter of the orifice opening and the equivalent diameter of the orifice bottom. The sidewall inclination angle of the micropore array on the template can be 20 degrees, 40 degrees, 45 degrees, 60 degrees, 75 degrees, 80 degrees or 85 degrees. By controlling the sidewall inclination angle in the micro-control array, the morphology during molding can be better controlled, which is more convenient for subsequent molding and demolding.

[0132] Preferably, the sidewall inclination angle of the micropore array on the template is 60 to 85 degrees.

[0133] Furthermore, the bottom of the micropore array on the template is flat, raised, or concave. For example, the bottom of the micropore array on the template is arc-shaped or conical.

[0134] The surface adhesive 7 of this embodiment of the invention has a first surface and a second surface in its thickness direction. The first surface is constructed as a biomimetic adhesive surface 72 with a biomimetic microstructure array. The biomimetic adhesive surface is made using any of the above-mentioned biomimetic adhesive surface molding methods.

[0135] The surface adhesive 7 in this embodiment is flexible, and the biomimetic adhesive surface is formed on the surface adhesive 7. When the biomimetic adhesive surface is formed, the complete structure of the surface adhesive 7 can be integrally formed.

[0136] In some embodiments, the biomimetic microstructure array includes a plurality of columns 71 arranged in an array. Each column 71 has a body portion 711 and an adsorption portion 712 located at the end of the body portion 711. The outer diameter of the adsorption portion 712 is larger than the outer diameter of the body portion 711. The adsorption portion 712 is mushroom-shaped, hemispherical, suction cup-shaped, or inverted ring-shaped. The sidewall of the body portion 711 is a straight wall surface parallel to the axial direction of the body portion 711, or an inclined wall surface at a predetermined angle to the axial direction of the body portion 711, or a stepped wall surface. It can be replicated by a template, resulting in good overall structural stability and improved service life.

[0137] Furthermore, the outer diameter of the adsorption part 712 is 1.05 to 3 times the outer diameter of the main body part 711; the outer diameter of the adsorption part 712 can be 1.05, 1.15, 1.2, 2, 2.5, 2.75 or 3 times the outer diameter of the main body part 711, which facilitates ensuring the structural stability of the biomimetic microstructure array, and also facilitates ensuring the adhesion effect after molding, thereby improving service life and usage effect.

[0138] Preferably, the outer diameter of the adsorption part is 1.2 to 2.5 times the outer diameter of the main body part.

[0139] Furthermore, in this embodiment, the adsorption part has a concave center, with a concave depth ranging from 1 micrometer to 200 micrometers. The concave depth of the adsorption part can be 1 micrometer, 3 micrometers, 5 micrometers, 30 micrometers, 60 micrometers, 80 micrometers, 100 micrometers, or 200 micrometers, which can improve the adhesion effect when in contact with objects, facilitate production, enhance practicality, and improve biomimetic effects.

[0140] Preferably, the concave depth of the middle part of the adsorption section is 5 micrometers to 80 micrometers.

[0141] Optionally, the height of the column can be from 20 micrometers to 800 micrometers, specifically 20 micrometers, 30 micrometers, 50 micrometers, 200 micrometers, 500 micrometers, 750 micrometers, or 800 micrometers. This ensures structural stability, improves the contact effect and overall flexibility of the biomimetic adhesive surface after contact with the object, and avoids the difficulties in processing and quality control caused by excessively small column heights, while also preventing the column from tipping over due to excessively large heights, which would affect the adhesion effect.

[0142] Preferably, the height of the column is between 50 micrometers and 500 micrometers.

[0143] The biomimetic adhesive surface forming method and surface adhesive of this invention can solve the industrialization bottleneck problem of "difficulty in low-cost, large-scale, and rapid preparation" of large-area, high-performance biomimetic adhesive surfaces. This allows for wide application in fields requiring low-cost, high-volume, and large-area products, such as flexible electronic device mounting, large-area robot gripping patches, medical dressings, and industrial roll surface modification, thereby improving application effectiveness.

[0144] This invention combines "laser direct writing molding" with "dipping and transfer molding," cleverly utilizing the flexibility of laser processing and the simplicity of dipping processes to create a new path for low-cost, fast-paced, and large-area biomimetic surface preparation. The laser-processed template substrate has high mechanical strength and, with the addition of a release agent, can be reused hundreds of times without damage, significantly reducing unit cost and ensuring high consistency in the microstructure morphology of batch products.

[0145] This invention provides a non-metallic reusable template system for mass production. It eliminates the need for expensive and fragile silicon, metal, or precision polymer molds, instead employing inexpensive laser-processed sheet templates and a simple demolding process. This allows the template to be reused hundreds of times, resulting in extremely low unit production costs. By flexibly adjusting the laser path and parameters, microstructure units of different shapes, sizes, and spacings can be designed on the same template, and even gradient structures can be created, thereby controlling the properties of the adhesion surface as needed.

[0146] The embodiments of the present invention form product features with unique process fingerprints. The microstructure morphology of the products prepared by the above-mentioned specific process is directly defined by laser parameters and may have edge transition zone features generated by the dipping process, which is different from the products of related technologies and is more practical.

[0147] The combined process of "laser processing + dip-and-formation" in this invention involves using direct laser processing to create reusable physical templates. By controlling laser ablation parameters, template micro-pit geometric features (such as sidewall inclination and pit bottom protrusions) capable of forming high-performance adhesion morphologies are prepared. The entire process includes four core steps: laser scanning, dip-and-formation, pressing, and curing. It is simple to operate and has a short production cycle. Laser processing can easily achieve one-time forming of large-area templates. Combined with continuous dip-and-formation technology, it is theoretically possible to achieve roll-to-roll continuous production, which is easily scalable.

[0148] The surface adhesive of this invention provides a biomimetic adhesive surface formed on a flexible or rigid substrate. The biomimetic microstructure array is replicated by a laser template, and a film edge thickening feature, formed by a dipping process, naturally transitions to the microstructure region at the substrate edge or in a specific area. The biomimetic adhesive surface of this invention has anisotropic microstructure geometry determined by the morphology of the laser template, and thus exhibits a direction-dependent coefficient of friction.

[0149] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0150] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0151] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0152] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0153] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0154] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for forming a biomimetic adhesive surface, characterized in that, include: A template with a microporous array surface is fabricated, and a precursor solution is prepared. The template is a reusable physical template. The microporous array surface is formed by direct ablation on the substrate surface using a laser processing device. The precursor solution is poured into the template to fill the surface of the microporous array. After solidification, it is demolded to obtain an adhesive surface intermediate with an initial microstructure array. Arrange the first plate and apply a precursor solution to the surface of the first plate to form a pick-up layer; Regulate the temperature and humidity within the workspace; The adhesive surface intermediate is brought closer to the dip layer at a first preset speed; After the initial microstructure array of the adhesive surface intermediate comes into contact with the dip layer, it remains for a first preset time, and then the adhesive surface intermediate is pulled away from the dip layer at a second preset speed. The equivalent diameter of the end of the biomimetic microstructure array in the biomimetic adhesive surface satisfy: ,and ,in, For the array period, The equivalent width of the hole wall thickness in the initial microstructure array. The surface tension of the dipped layer, , It is an experience index. The thickness of the dip layer, The second preset speed is η, and the apparent viscosity is η. The parameters of the dipping process are determined based on the equivalent diameter of the end of the biomimetic microstructure array to be obtained and the performance parameters of the dipping layer. A second plate is arranged, and the adhesive surface intermediate is pressed against and pressed against the surface of the second plate. After curing, the adhesive surface with a biomimetic microstructure array is obtained by separation. The biomimetic adhesive surface forming method is suitable for roll-to-roll continuous production and can prepare large-area biomimetic adhesive surfaces of square meters or more.

2. The biomimetic adhesive surface molding method according to claim 1, characterized in that, The steps for fabricating a template with a microporous array surface include: Configure the substrate and design the micropore array parameters; The micro-hole array parameters are imported into the laser processing equipment, and the process parameters of the laser processing equipment are set based on the micro-hole array parameters. The process parameters of the laser processing equipment include one or more of the following: laser power, scanning speed, number of scans, defocusing amount, pulse frequency, and scanning spacing. The laser processing equipment is used to ablate an array of micropores on the surface of the substrate.

3. The biomimetic adhesive surface molding method according to claim 2, characterized in that, The laser power is 2W to 200W, the scanning speed is 10mm / s to 5000mm / s, the number of scans is 1 to 200, the defocusing amount is -5mm to +5mm, the pulse frequency is 1kHz to 200kHz, and the scanning spacing is 5μm to 200μm. And / or, the substrate is an acrylic sheet, a polycarbonate sheet, or a metal sheet.

4. The biomimetic adhesive surface forming method according to claim 1, characterized in that, Before the step of pouring the precursor solution into the template to fill the surface of the microporous array, the method further includes: The template is cleaned and dried for 1 to 30 minutes and 5 to 60 minutes respectively. A release agent is applied to the surface of the template, the amount of the release agent being applied is from 0.1 mg / cm² to 5 mg / cm², and the release agent is sprayed 1 to 5 times.

5. The biomimetic adhesive surface molding method according to claim 1, characterized in that, The precursor solution comprises a polymer and a curing agent, wherein the mass ratio of the polymer to the curing agent is from 5:1 to 20:

1. And / or, the precursor solution is poured into the template to fill the surface of the microporous array, and vacuum degassing is used to fill the surface of the microporous array with the precursor solution. The vacuum degree of vacuum degassing is -0.06MPa to -0.095MPa, and the vacuum degassing duration is 1min to 30min.

6. The biomimetic adhesive surface forming method according to claim 1, characterized in that, After curing, the adhesive surface intermediate is demolded to obtain an initial microstructure array. The demolding angle of the adhesive surface intermediate relative to the template is 10 degrees to 45 degrees, and the demolding speed of the adhesive surface intermediate is 0.1 mm / s to 20 mm / s. And / or, in the step of demolding after curing to obtain an adhesive surface intermediate with an initial microstructure array, the demolding temperature of the adhesive surface intermediate is 20 degrees Celsius to 80 degrees Celsius.

7. The biomimetic adhesive surface molding method according to claim 1, characterized in that, The temperature in the workspace is between 13 degrees Celsius and 35 degrees Celsius, and the humidity in the workspace is between 20%RH and 70%RH. And / or, the first preset time is less than 300s; And / or, the first preset speed is 0.001 mm / s to 0.1 mm / s, and the second preset speed is 0.1 mm / s to 50 mm / s; And / or, the apparent viscosity of the dip layer is from 0.1 Pa·s to 100 Pa·s; And / or, the thickness of the dip layer is from 1 micrometer to 500 micrometers.

8. The biomimetic adhesive surface molding method according to claim 1, characterized in that, In the step of pressing the adhesive surface intermediate against the surface of the second plate, the loading pressure between the adhesive surface intermediate and the second plate is 0.01MPa to 0.5MPa, and the holding time is 1s to 600s. And / or, after the step of curing, the resulting biomimetic adhesive surface with a biomimetic microstructure array is cured by heating at a temperature of 25°C to 150°C for 5 to 240 minutes, or by ultraviolet irradiation at an intensity of [insert intensity here]. to The irradiation time ranges from 1 second to 600 seconds; And / or, the step involves abutting and pressing the intermediate adhesive surface with the surface of the second plate, and separating it after curing to obtain a biomimetic adhesive surface with a biomimetic microstructure array. This process is carried out in a vacuum environment with a vacuum degree of -0.02MPa to -0.09MPa, or in an inert gas environment. And / or, it further includes secondary curing and / or surface treatment of the biomimetic adhesion surface, wherein the heating temperature for secondary curing is 40 degrees Celsius to 120 degrees Celsius, the heating time for secondary curing is 10 min to 180 min, the surface treatment is plasma surface treatment, the plasma surface treatment time is 10 s to 300 s, or the surface treatment is thin-layer coating treatment, the coating thickness for thin-layer coating treatment is 5 nanometers to 200 nanometers.

9. The biomimetic adhesive surface molding method according to any one of claims 1 to 8, characterized in that, The micropore array on the template has an equivalent diameter of 20 micrometers to 500 micrometers at the opening, a depth of 20 micrometers to 1000 micrometers, and an equivalent diameter of 5 micrometers to 400 micrometers at the bottom. And / or, the sidewall inclination angle of the micropore array on the template is 20 degrees to 85 degrees; And / or, the bottom of the micropore array on the template is flat, raised, or concave.

10. A surface adhesive, characterized in that, The surface adhesive has a first surface and a second surface in its thickness direction. The first surface is constructed as a biomimetic adhesive surface with a biomimetic microstructure array. The biomimetic adhesive surface is fabricated using the biomimetic adhesive surface molding method according to any one of claims 1 to 9.

11. The surface adhesive according to claim 10, characterized in that, The biomimetic microstructure array includes multiple pillars arranged in an array. Each pillar has a body portion and an adsorption portion located at the end of the body portion. The outer diameter of the adsorption portion is larger than the outer diameter of the body portion.

12. The surface adhesive according to claim 11, characterized in that, The outer diameter of the adsorption part is 1.05 to 3 times the outer diameter of the main body part; And / or, the adsorption portion is recessed in the middle, and the recessed depth of the adsorption portion is from 1 micrometer to 200 micrometers; And / or, the adsorption part is in the shape of a mushroom head, a hemispherical shape, a suction cup shape, or an inverted ring shape; And / or, the height of the column is from 20 micrometers to 800 micrometers; And / or, the sidewall of the main body is a straight wall surface parallel to the axial direction of the main body, or an inclined wall surface at a predetermined angle to the axial direction of the main body, or a stepped wall surface.

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