Chip heat dissipation packaging structure convenient for heat dissipation

Abstract

The invention belongs to the technical field of chip packaging, and particularly relates to a chip heat dissipation packaging structure convenient for heat dissipation, which comprises a packaging shell, a packaging substrate, chips, a positioning plate and a packaging cover plate, the packaging substrate is fixed in the packaging shell, the chips are respectively arranged on the packaging substrate and the positioning plate, and the positioning plate is arranged between the packaging substrate and the packaging cover plate. A limiting boss is arranged on the inner side of the packaging shell, the bottom of the packaging substrate is fixed to the limiting boss, and a heat dissipation channel is formed by the packaging substrate and the packaging shell through the limiting boss. A heat dissipation channel is formed between the bottom of the packaging substrate and the packaging shell, space is provided for air circulation, and convection and dissipation of heat are accelerated; and meanwhile, a plurality of uniformly distributed heat dissipation holes are formed in the mounting groove of the packaging substrate, a plurality of uniformly distributed heat dissipation grooves are formed in the positioning plate body, and the heat dissipation holes are matched with the heat dissipation grooves, so that the heat dissipation paths are greatly enriched, the heat dissipation efficiency is improved, and the problem of insufficient heat dissipation space of a traditional structure is effectively solved.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, and particularly relates to a chip heat dissipation packaging structure that facilitates heat dissipation. Background Technology

[0002] With the rapid development of electronic technology, the integration level of chips is constantly increasing, and the computing speed is also accelerating. As a result, the heat generated during chip operation is increasing dramatically. The heat dissipation performance of a chip directly affects its operational stability, reliability, and lifespan. If heat cannot be dissipated in time, it will lead to excessively high chip temperatures, resulting in performance degradation, system crashes, or even burnout.

[0003] Currently, traditional chip heat dissipation packaging structures typically involve directly bonding and fixing the chip to a packaging substrate inside the packaging housing, with the packaging cover directly covering the top of the housing. There is almost no dedicated space for heat dissipation between the chip, the packaging substrate, and the packaging cover. This structure has several drawbacks: Firstly, after the chip is bonded, heat is mainly conducted through the packaging substrate to the packaging housing and then dissipated to the outside, resulting in a single heat transfer path. Furthermore, the lack of an effective airflow channel between the chip and the packaging housing leads to heat accumulation around the chip, resulting in low heat dissipation efficiency. Secondly, in traditional packaging structures, the chip is fixed in a relatively simple way, usually by adhesive or soldering. This not only makes disassembly and maintenance inconvenient but also easily damages the chip during the fixing process and does not provide any auxiliary heat dissipation function. Summary of the Invention

[0004] The purpose of this invention is to provide a chip heat dissipation packaging structure that facilitates heat dissipation, aiming to solve the technical problems of traditional chip heat dissipation packaging structures in the prior art, which result in low heat dissipation efficiency, inconvenience in disassembly and maintenance, easy damage to the chip during the fixing process, and failure to provide auxiliary heat dissipation.

[0005] To achieve the above objectives, the present invention provides a chip heat dissipation packaging structure that facilitates heat dissipation, comprising a packaging shell, a packaging substrate, a chip, a positioning plate, and a packaging cover plate. The packaging substrate is fixed inside the packaging shell, the chip is respectively disposed on the packaging substrate and the positioning plate, the positioning plate is disposed between the packaging substrate and the packaging cover plate, and the packaging cover plate covers the top side of the packaging shell.

[0006] The inner side of the packaging shell is provided with a limiting boss, the bottom of the packaging substrate is fixed to the limiting boss, and a heat dissipation channel is formed between the limiting boss and the packaging shell.

[0007] As an optional embodiment of the present invention, four limiting bosses are provided, and all of them are fixed inside the packaging housing; the packaging substrate is fixedly connected to the four limiting bosses respectively.

[0008] As an optional embodiment of the present invention, the top of the packaging substrate is provided with a mounting groove, and a plurality of heat dissipation holes are provided in the mounting groove, and the plurality of heat dissipation holes are evenly arranged in the mounting groove; the bottom side of the chip is disposed in the mounting groove and is attached to the packaging substrate.

[0009] As an optional embodiment of the present invention, the packaging substrate is provided with a plurality of insertion holes, which are evenly arranged on the packaging substrate and located on one side of the mounting groove.

[0010] As an optional embodiment of the present invention, the chip is provided with a plurality of pins, which are uniformly fixed to the chip and adjacent pins are arranged in parallel and spaced apart.

[0011] As an optional embodiment of the present invention, the side of the package housing is provided with a plurality of holes, the plurality of holes being evenly arranged on the package housing, and adjacent holes being arranged in parallel and spaced apart; one end of the pin is fixed to the top of the chip, and the other end passes through the hole and extends out of the package housing.

[0012] As an optional embodiment of the present invention, the positioning plate includes a positioning plate body and a flexible positioning plug. The positioning plate body is provided with a plurality of heat dissipation grooves, which are evenly distributed on the positioning plate body. A plurality of flexible positioning plugs are provided, which are the same number as the number of the sockets. The flexible positioning plugs are arranged to overlap with the sockets. One end of the flexible positioning plug is fixed to the positioning plate body, and the other end is inserted into the socket, thereby fixing the chip to the packaging substrate.

[0013] As an optional embodiment of the present invention, the bottom of the encapsulation cover is provided with an encapsulation groove, and the positioning plate is disposed in the encapsulation groove and fixed to the inner side of the encapsulation cover.

[0014] The above-described technical solutions in the heat dissipation packaging structure for chips provided by the embodiments of the present invention have at least one of the following technical effects:

[0015] 1. Increased heat dissipation space and optimized heat dissipation path: By setting four limiting protrusions inside the packaging shell, the packaging substrate is mounted on the limiting protrusions, forming a heat dissipation channel between the bottom of the packaging substrate and the packaging shell, providing space for air circulation and accelerating the convection and dissipation of heat. At the same time, multiple evenly distributed heat dissipation holes are set in the mounting slot of the packaging substrate, and multiple evenly distributed heat dissipation slots are set on the positioning plate body. The heat dissipation holes and heat dissipation slots work together to form a vertically connected heat dissipation channel. Part of the heat generated by the chip is conducted to the heat dissipation channel through the packaging substrate, and the other part enters the heat dissipation slot of the positioning plate through the heat dissipation holes, and is then dissipated to the outside. This greatly enriches the heat dissipation path, improves heat dissipation efficiency, and effectively solves the problem of insufficient heat dissipation space in traditional structures.

[0016] 2. Improved chip installation stability and assembly convenience: The elastic positioning plug on the positioning plate cooperates with the insertion hole of the packaging substrate, which can not only quickly fix the chip in the mounting slot of the packaging substrate, but also provide a certain buffering effect to avoid damage to the chip during the fixing process. At the same time, this plug-in fixing structure facilitates disassembly and maintenance. When the chip fails, the packaging cover and positioning plate can be easily removed to replace or repair the chip, thus improving the practicality of the packaging structure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A perspective view of a chip heat dissipation packaging structure that facilitates heat dissipation, provided in an embodiment of the present invention.

[0019] Figure 2 A side view of a chip heat dissipation packaging structure that facilitates heat dissipation, provided in an embodiment of the present invention.

[0020] Figure 3 for Figure 2 Sectional view along the middle AA.

[0021] Figure 4 The first view of the chip heat dissipation packaging structure provided in the embodiment of the present invention is shown with the packaging cover plate omitted.

[0022] Figure 5 A perspective view of a chip heat dissipation packaging structure that facilitates heat dissipation, provided in an embodiment of the present invention.

[0023] The following are the labeling elements in the figure:

[0024] 1. Encapsulation housing; 2. Encapsulation substrate; 3. Chip; 4. Positioning plate; 5. Encapsulation cover plate;

[0025] 11. Limiting boss; 12. Heat dissipation channel; 13. Pilot hole;

[0026] 21. Mounting slot; 22. Ventilation holes; 23. Insertion hole;

[0027] 31. Pin;

[0028] 41. Positioning plate body; 42. Flexible positioning plug; 43. Heat dissipation groove;

[0029] 51. Encapsulation slot. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0031] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0034] In one embodiment of the present invention, such as Figures 1-5 As shown, a chip heat dissipation packaging structure that facilitates heat dissipation is provided, including a packaging shell 1, a packaging substrate 2, a chip 3, a positioning plate 4, and a packaging cover 5.

[0035] The package housing 1 is a rectangular shell structure with an open top. Four limiting protrusions 11 are welded and fixed to the bottom inner side of the package housing 1. These four protrusions 11 are located at the four corners of the bottom inner side of the package housing 1, and all four protrusions 11 have the same height. The limiting protrusions 11 support the package substrate 2, forming a heat dissipation channel 12 between the bottom of the package substrate 2 and the bottom inner side of the package housing 1. The height of the heat dissipation channel 12 is the same as the height of the limiting protrusions 11. In this embodiment, the height of the limiting protrusions 11 is set to 5-8 mm to ensure sufficient airflow space within the heat dissipation channel 12. Multiple through holes 13 are provided on both sides of the package housing 1. The through holes 13 are circular and evenly spaced, with a spacing of 2-3 mm between adjacent through holes. The diameter of the through holes 13 is slightly larger than the diameter of the pins 31 of the chip 3, facilitating the passage of the pins 31.

[0036] The packaging substrate 2 is a rectangular plate structure made of aluminum alloy or copper alloy with high thermal conductivity to improve heat transfer efficiency. The bottom of the packaging substrate 2 is fixed to the top of four limiting bosses 11 by bolts or welding. Thermally conductive silicone pads are provided on the connection surfaces between the packaging substrate 2 and the limiting bosses 11 to further improve heat transfer. A mounting groove 21 is provided at the center of the top of the packaging substrate 2. The size of the mounting groove 21 matches the bottom dimensions of the chip 3, ensuring that the bottom of the chip 3 fits tightly within the mounting groove 21. Multiple heat dissipation holes 22 are provided at the bottom of the mounting groove 21. These holes are circular through holes, evenly distributed within the mounting groove 21, with a spacing of 1-2 mm between adjacent holes. The heat dissipation holes 22 penetrate the packaging substrate 2, allowing the heat generated by the chip 3 to be conducted to the heat dissipation channel 12 below. The top of the packaging substrate 2 is provided with multiple insertion holes 23 on both sides of the mounting groove 21. The insertion holes 23 are circular blind holes. The multiple insertion holes 23 are evenly spaced. In this embodiment, 4-6 insertion holes 23 are provided on each side. The depth of the insertion holes 23 is 3-5mm.

[0037] Chip 3 is mounted on its bottom side within the mounting groove 21 of the packaging substrate 2. Thermal grease is applied between chip 3 and the bottom of the mounting groove 21 to enhance heat transfer. Multiple pins 31 are fixed to both sides of the top of chip 3. These pins 31 are made of copper, providing excellent electrical and thermal conductivity. The pins 31 are evenly spaced, parallel to each other with a spacing of 2-3 mm, corresponding one-to-one with the vias 13 on the side of the packaging housing 1. One end of each pin 31 is soldered to the top pin 31 pad of chip 3, while the other end passes through the via 13 on the side of the packaging housing 1 and extends 5-8 mm beyond the outer side of the packaging housing 1 for easy connection to external circuitry.

[0038] The positioning plate 4 includes a positioning plate body 41 and elastic positioning plugs 42. The positioning plate body 41 is a rectangular plate structure made of engineering plastic, which has good insulation and mechanical strength. The thickness of the positioning plate body 41 is 3-5mm, and multiple heat dissipation grooves 43 are formed on its surface. The heat dissipation grooves 43 are rectangular grooves, and the multiple heat dissipation grooves 43 are evenly distributed on the positioning plate body 41. The spacing between adjacent heat dissipation grooves 43 is 2-3mm, the depth of the heat dissipation grooves 43 is 1-2mm, and the length is the same as the length of the positioning plate body 41, which facilitates the dissipation of heat on the surface of the positioning plate body 41. Multiple elastic positioning plugs 42 are provided, and their number is the same as the number of insertion holes 23 on the packaging substrate 2. In this embodiment, 8-12 elastic positioning plugs 42 are provided. The elastic positioning plugs 42 are made of elastic plastic and have a certain elastic deformation capability. One end is fixed to the bottom of the positioning plate body 41 by injection molding, and the other end is a free end with a conical structure, which facilitates insertion into the insertion hole 23 of the packaging substrate 2. The length of the flexible positioning plug 42 matches the depth of the socket 23. When the flexible positioning plug 42 is inserted into the socket 23, its top is in close contact with the bottom of the socket 23. The elastic force of the flexible positioning plug 42 presses the chip 3 into the mounting groove 21 to prevent the chip 3 from shaking.

[0039] The encapsulation cover 5 is a rectangular cover structure made of aluminum alloy, which has good thermal conductivity and mechanical strength. An encapsulation groove 51 is formed at the bottom of the encapsulation cover 5. The size of the encapsulation groove 51 matches the size of the positioning plate 4. The positioning plate 4 is placed inside the encapsulation groove 51 and fixed to the inside of the encapsulation cover 5 by bolts or clips. The encapsulation cover 5 covers the top side of the encapsulation housing 1. A sealing gasket is provided between the encapsulation cover 5 and the top edge of the encapsulation housing 1 to improve the sealing performance of the encapsulation structure and prevent dust and moisture from entering the encapsulation housing 1.

[0040] Assembly process

[0041] First, weld and fix the four limiting bosses 11 to the four corners of the bottom inner side of the encapsulation housing 1 to ensure that the height of the four limiting bosses 11 is consistent.

[0042] Next, the encapsulation substrate 2 is placed on top of the four limiting protrusions 11 and fixed by bolts or welding to ensure that the encapsulation substrate 2 is placed horizontally, and a heat dissipation channel 12 is formed between the bottom of the encapsulation substrate 2 and the bottom of the inner side of the encapsulation housing 1.

[0043] Apply a layer of thermal grease to the bottom of the mounting groove 21 of the packaging substrate 2, and then place the bottom side of the chip 3 into the mounting groove 21 so that the pins 31 of the chip 3 face the side aperture 13 of the packaging housing 1.

[0044] Align the elastic positioning plug 42 at the bottom of the positioning plate 4 with the insertion hole 23 on the packaging substrate 2, press the positioning plate 4 firmly so that the elastic positioning plug 42 is inserted into the insertion hole 23, and the chip 3 is pressed and fixed in the mounting groove 21 by the elastic force of the elastic positioning plug 42.

[0045] Pass the pin 31 of chip 3 through the hole 13 on the side of the package housing 1 to ensure that the pin 31 extends smoothly out of the outside of the package housing 1 without deformation or breakage.

[0046] Apply a small amount of glue to the encapsulation groove 51 of the encapsulation cover plate 5, and place the positioning plate 4 into the encapsulation groove 51 to fix the positioning plate 4 to the encapsulation cover plate 5.

[0047] Finally, the encapsulation cover 5 is placed on the top side of the encapsulation housing 1, so that the encapsulation cover 5 fits tightly with the top edge of the encapsulation housing 1, and the sealing gasket is deformed under pressure to achieve a seal.

[0048] Heat dissipation principle

[0049] The heat generated by chip 3 during operation is dissipated through the following pathways:

[0050] The bottom side of the chip 3 conducts heat to the packaging substrate 2 through thermal grease. The packaging substrate 2 conducts some of the heat to the limiting protrusion 11, and then conducts it to the packaging shell 1 through the limiting protrusion 11. Finally, the heat is dissipated to the outside through the surface of the packaging shell 1.

[0051] Part of the heat on the bottom side of chip 3 is directly conducted to the heat dissipation channel 12 below through the heat dissipation holes 22 on the packaging substrate 2. The air in the heat dissipation channel 12 is heated and convection, which carries away the heat and dissipates it to the outside.

[0052] Part of the heat from the top of chip 3 is conducted to the outside of the package housing 1 through pin 31, and the other part is conducted to the positioning plate 4. The positioning plate 4 increases the heat dissipation area through the heat dissipation groove 43 on its surface, and dissipates the heat into the space between the package cover plate 5 and the positioning plate 4.

[0053] The encapsulation cover 5 absorbs the heat emitted by the positioning plate 4 and quickly dissipates it to the outside through the heat dissipation fins on top, completing the entire heat dissipation process.

[0054] The heat dissipation packaging structure of chip 3 in this embodiment effectively improves heat dissipation efficiency through multiple heat dissipation paths and optimized structural design, ensuring the working stability and reliability of chip 3, while also being easy to assemble and convenient for maintenance and replacement.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip heat dissipation packaging structure for easy heat dissipation, characterized in that, The package includes a package housing, a package substrate, a chip, a positioning plate, and a package cover. The package substrate is fixed inside the package housing. The chip is disposed on the package substrate and the positioning plate. The positioning plate is disposed between the package substrate and the package cover. The package cover is disposed on the top side of the package housing. The inner side of the packaging shell is provided with a limiting boss, the bottom of the packaging substrate is fixed to the limiting boss, and a heat dissipation channel is formed between the limiting boss and the packaging shell.

2. The chip heat dissipation packaging structure according to claim 1, characterized in that, The limiting protrusions are provided in four places, and all of them are fixed inside the packaging shell; the packaging substrate is fixedly connected to the four limiting protrusions respectively.

3. The chip heat dissipation packaging structure according to claim 1, characterized in that, The top of the packaging substrate is provided with a mounting groove, and a plurality of heat dissipation holes are provided in the mounting groove, which are evenly distributed in the mounting groove; the bottom side of the chip is disposed in the mounting groove and is attached to the packaging substrate.

4. The chip heat dissipation packaging structure according to claim 3, characterized in that, The packaging substrate is provided with a plurality of insertion holes, which are evenly arranged on the packaging substrate and located on one side of the mounting groove.

5. The chip heat dissipation packaging structure according to claim 1, characterized in that, The chip has multiple pins, which are evenly fixed to the chip, with adjacent pins arranged in parallel and spaced apart.

6. The chip heat dissipation packaging structure according to claim 5, characterized in that, The package housing has multiple holes on its side, which are evenly distributed on the package housing with adjacent holes arranged in parallel and spaced apart. One end of the pin is fixed to the top of the chip, and the other end passes through the hole and extends out of the package housing.

7. The chip heat dissipation packaging structure according to claim 4, characterized in that, The positioning plate includes a positioning plate body and a flexible positioning plug. The positioning plate body is provided with multiple heat dissipation slots, which are evenly distributed on the positioning plate body. Multiple flexible positioning plugs are provided, which are the same number as the sockets. The flexible positioning plugs are arranged to overlap with the sockets. One end of the flexible positioning plug is fixed to the positioning plate body, and the other end is inserted into the socket, thereby fixing the chip to the packaging substrate.

8. A chip heat dissipation packaging structure for easy heat dissipation according to claim 1, characterized in that, The bottom of the encapsulation cover is provided with an encapsulation groove, and the positioning plate is disposed in the encapsulation groove and fixed to the inner side of the encapsulation cover.

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