Chip heat dissipation packaging structure convenient for heat dissipation

By setting limiting bosses and heat dissipation holes inside the package housing, combined with heat dissipation grooves and elastic plugs on the positioning plate, multiple heat dissipation paths are formed, solving the problem of low heat dissipation efficiency in traditional chip heat dissipation packaging structures, and achieving efficient heat dissipation and convenient maintenance.

CN121889015APending Publication Date: 2026-04-17HONGZHAN SCIENCE & TECHNOLOGY (SHENZHEN) TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610068727.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-01-19
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Traditional chip heat dissipation packaging structures have low heat dissipation efficiency, are inconvenient to disassemble and repair, and are prone to damaging the chip during the fixing process.

Method used

The packaging substrate is supported by limiting bosses inside the packaging shell to form a heat dissipation channel. Heat dissipation holes are provided on the packaging substrate, and heat dissipation grooves are provided on the positioning plate. Combined with the flexible positioning plug, the chip is fixed, forming multiple heat dissipation paths and simplifying the fixing process.

Benefits of technology

It improves heat dissipation efficiency, enhances chip installation stability and ease of assembly, facilitates maintenance, and ensures chip operational stability and reliability.

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Abstract

The invention belongs to the technical field of chip packaging, and particularly relates to a chip heat dissipation packaging structure convenient for heat dissipation, which comprises a packaging shell, a packaging substrate, chips, a positioning plate and a packaging cover plate, the packaging substrate is fixed in the packaging shell, the chips are respectively arranged on the packaging substrate and the positioning plate, and the positioning plate is arranged between the packaging substrate and the packaging cover plate. A limiting boss is arranged on the inner side of the packaging shell, the bottom of the packaging substrate is fixed to the limiting boss, and a heat dissipation channel is formed by the packaging substrate and the packaging shell through the limiting boss. A heat dissipation channel is formed between the bottom of the packaging substrate and the packaging shell, space is provided for air circulation, and convection and dissipation of heat are accelerated; and meanwhile, a plurality of uniformly distributed heat dissipation holes are formed in the mounting groove of the packaging substrate, a plurality of uniformly distributed heat dissipation grooves are formed in the positioning plate body, and the heat dissipation holes are matched with the heat dissipation grooves, so that the heat dissipation paths are greatly enriched, the heat dissipation efficiency is improved, and the problem of insufficient heat dissipation space of a traditional structure is effectively solved.
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