Device and method for disassembling and assembling internal parts of semiconductor vacuum equipment

Abstract

The invention discloses a device and method for disassembling and assembling internal parts of semiconductor vacuum equipment, and the device employs mirror polishing treatment, and comprises a device housing, a transmission lifting mechanism which is in transmission connection with the device housing, and a fixing mechanism which is connected with the transmission lifting mechanism. A detachable and replaceable mounting head is arranged on the fixing mechanism, and a movably adjustable clamping positioning assembly is arranged on the device shell. The device for disassembling and assembling the internal parts of the semiconductor vacuum equipment can be suitable for the environment of a Class 1-level clean room, the interference fit parts of the vacuum equipment can be stably and efficiently installed and taken out, the stability and the position accuracy of the device are guaranteed, stress is uniform in the disassembling and assembling process, disassembling is convenient, it can be guaranteed that a cavity or core parts cannot be damaged, and the service life of the device is prolonged. The assembly requirements of high cleanliness and high reliability of vacuum equipment can be met, and the problems that an electric tool is poor in environment adaptability and a simple tool is unstable in lifting are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor vacuum equipment technology, and more specifically to a device and method for disassembling and assembling internal components of a semiconductor vacuum equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, semiconductor vacuum equipment (such as etching machines, PECVD, vacuum coating machines, and ion implanters) is the core equipment for chip manufacturing. The connection accuracy and cleanliness of its internal components (vacuum chamber flanges and bushings, positioning pins and chambers, electrodes and bases, vacuum bearings and drive shafts, sealing rings and chambers) directly determine the chip manufacturing process accuracy and equipment operation stability.

[0003] Interference fit, as a connection method that can meet the requirements of "high rigidity, high coaxiality, and high sealing" in such equipment, has become the preferred assembly form for core components due to its advantages of zero gap, vibration resistance, and large transmission torque. However, the extreme special nature of the semiconductor vacuum scene makes traditional assembly and disassembly techniques and tooling completely unsuitable, and the need for technology upgrades is urgent.

[0004] Current tooling lacks cleanliness and contamination control, resulting in severe particulate contamination. Traditional tooling often uses ordinary carbon steel and plastic parts, which are prone to rust, wear, and shedding of metal shavings and plastic particles. Mechanical impacts can also generate breakage particles and damage components. Auxiliary media used during hot / cold assembly (such as heating oil and liquid nitrogen residue) can adhere to the surface of parts, making thorough cleaning difficult and affecting component sealing. Furthermore, it lacks portability, often featuring fixed structures without modular design, making it impossible to disassemble and adapt.

[0005] Chinese patent document CN 100436038C discloses a device and method for disassembling and assembling semiconductor vacuum equipment, comprising: a support plate and ball bearing feet under the support plate, wherein the upper surface of the support plate is provided with a plurality of cylinders, which are connected to the ball bearing feet through piston rods. This device achieves disassembly and assembly of vacuum equipment through vacuuming; however, it cannot be used for disassembly and assembly of internal components such as vacuum chamber flanges and bushings, locating pins and chambers, electrodes and bases, vacuum bearings and drive shafts, and sealing rings and chambers. Summary of the Invention

[0006] The purpose of this invention is to solve the problems of uneven force distribution during the installation of semiconductor vacuum equipment, difficulty in disassembly, easy damage to the cavity or core components, and inability to meet the high cleanliness and high reliability assembly requirements of vacuum equipment. This invention provides a device for disassembling and assembling internal components of semiconductor vacuum equipment, which enables the smooth and efficient installation and removal of interference-fit components. The installation process involves uniform force distribution, and disassembly is convenient, ensuring that the cavity or core components are not damaged. It meets the high cleanliness and high reliability assembly requirements of vacuum equipment and effectively solves the problems of poor environmental adaptability of electric tooling and unstable lifting of simple tooling.

[0007] The technical solution adopted by this invention to achieve its objective is: a disassembly and assembly device for internal components of a semiconductor vacuum equipment. The device is mirror-polished and includes a housing, a transmission lifting mechanism connected to the housing, and a fixing mechanism connected to the transmission lifting mechanism. A replaceable mounting head is provided on the fixing mechanism, and an adjustable snap-fit ​​positioning component is provided on the housing. In this semiconductor vacuum equipment internal component disassembly and assembly device, all metal parts except the threaded portions are mirror-polished with 400# polish to ensure cleanliness. The device is suitable for Class 1 cleanroom environments. The transmission lifting mechanism drives the mounting head on the fixing mechanism to rise and fall, thereby enabling smooth and efficient installation and removal of interference-fit components of the vacuum equipment. The snap-fit ​​positioning component ensures the stability and positional accuracy of the device. The disassembly and assembly process is characterized by uniform force distribution and convenient disassembly, ensuring that the cavity or core components are not damaged. It is suitable for the high cleanliness and high reliability assembly requirements of vacuum equipment and effectively solves the problems of poor environmental adaptability of electric tooling and unstable lifting of simple tooling.

[0008] Preferably, the device housing is provided with a housing drive seat and an end pressure ring. The housing drive seat enables a transmission connection with the transmission lifting mechanism, facilitating disassembly and assembly, while the end pressure ring is used for press-fitting and positioning with the vacuum equipment.

[0009] Preferably, the end pressure ring is provided with a housing limiting groove, and a PTFE annular washer is provided on the end face of the end pressure ring. The housing limiting groove is provided to facilitate the setting of the snap-fit ​​positioning component, thereby realizing the positioning and limiting of the disassembly and assembly device. The PTFE annular washer on the end pressure ring comes into contact with the vacuum equipment to avoid damage to the product during installation.

[0010] Preferably, the snap-fit ​​positioning component is movably snapped into the housing limiting groove. The snap-fit ​​positioning component includes multiple C-shaped clips, with a PTFE U-shaped pad at one end of each C-shaped clip and a locking positioning component at the other end. The C-shaped clips and locking positioning component are designed to facilitate the connection, fixation, and positioning of the entire assembly / disassembly device with the vacuum equipment. The structure is simple and easy to operate. The PTFE U-shaped pad contacts the vacuum equipment, preventing damage to the product during installation.

[0011] Preferably, the transmission lifting mechanism includes a transmission handle and a lead screw transmission assembly connected to the transmission handle.

[0012] Preferably, the lead screw drive assembly includes a rotating disk and a drive screw, the drive screw being located at the center of the rotating disk, and the drive handle being symmetrically arranged on the side edge of the rotating disk along its radial direction.

[0013] Preferably, the fixing mechanism is located at the lower end of the screw drive assembly, and the fixing mechanism includes a fixing seat and a fixing seat connector, with a quick-connect structure provided on the fixing seat.

[0014] Preferably, a pressure sensor is installed between the transmission screw and the fixed base, a pressure display screen is provided on the rotating disk, and a universal level is located at the center of the rotating disk. To ensure the installation accuracy of the interference fit components and prevent them from being affected, a pressure sensor is installed between the transmission screw and the fixed base. The pressure sensor is connected to the pressure display screen on the rotating disk, allowing for convenient control of the pressure during installation and ensuring precise installation. To ensure levelness, a universal level is located at the center of the rotating disk, facilitating accurate assembly and disassembly during installation and disassembly, thereby protecting the installation accuracy of internal components or preventing damage to components during disassembly, thus facilitating precise assembly and disassembly.

[0015] Preferably, the mounting head includes crimping and unloading parts of various specifications. The mounting head is configured according to the corresponding disassembly and assembly parts, which can meet the disassembly and assembly requirements of various specifications or various parts, and has good versatility.

[0016] The technical solution adopted by the present invention to achieve its second objective is: a method for disassembling and assembling internal components of a semiconductor vacuum device, comprising the following steps: S1: Select the mounting head and install it on the mounting base; S2: Install the disassembly / assembly device on the part to be disassembled / assembled, adjust the position of the snap-fit ​​positioning component and fix it; S3: Align the mounting head with the part to be disassembled or assembled, and adjust it to be level; S4: The installation head is raised and lowered by the transmission lifting mechanism to align with the parts to be disassembled and assembled.

[0017] The beneficial effects of this invention are: the internal component disassembly and assembly device for semiconductor vacuum equipment is suitable for Class 1 cleanroom environments, enabling stable and efficient installation and removal of interference-fit components of vacuum equipment, ensuring the stability and positional accuracy of the device, uniform force distribution during disassembly and assembly, convenient disassembly, and ensuring that the cavity or core components are not damaged. It can meet the high cleanliness and high reliability assembly requirements of vacuum equipment, effectively solving the problems of poor environmental adaptability of electric tooling and unstable lifting of simple tooling. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a disassembly and assembly device for internal components of a semiconductor vacuum device according to the present invention.

[0019] Figure 2 This is a schematic diagram of the internal component disassembly and assembly device of the semiconductor vacuum equipment of the present invention from another angle.

[0020] Figure 3 This is a cross-sectional view of the installation pressure connector of the internal component disassembly and assembly device for semiconductor vacuum equipment of the present invention.

[0021] Figure 4 This is an exploded view of the installation pressure joint of the internal component disassembly and assembly device of the semiconductor vacuum equipment of the present invention.

[0022] Figure 5 This is an exploded view of the installation of the threaded pin take-off head in the disassembly and assembly device for internal components of the semiconductor vacuum equipment of the present invention.

[0023] Figure 6 This is a cross-sectional view of the installation threaded pin head of the internal component disassembly and assembly device for semiconductor vacuum equipment of the present invention.

[0024] Figure 7 This is a schematic diagram illustrating an application of the semiconductor vacuum equipment internal component disassembly and assembly device of the present invention.

[0025] Figure 8 This is an application cross-sectional view of the semiconductor vacuum equipment internal component disassembly and assembly device of the present invention.

[0026] Figure 9 This is a schematic diagram of a disassembly and assembly device for internal components of a semiconductor vacuum device in Embodiment 2.

[0027] Figure 10 This is another structural schematic diagram of the disassembly and assembly device for internal components of the semiconductor vacuum equipment in Embodiment 2.

[0028] Figure 11 This is a schematic diagram of one structure of the stepped pressure head in this invention.

[0029] Figure 12 This is a schematic diagram of one structure of the three-claw head extractor in this invention.

[0030] In the figure: 1. Device housing, 11. Observation window, 12. Device housing transmission seat, 13. End pressure ring, 14. Housing limiting groove, 15. Annular washer, 16. Transmission internal thread; 2. Transmission lifting mechanism; 21. Transmission handle; 22. Screw transmission assembly; 221. Rotary disk; 222. Transmission screw; 223. Universal level. 3. Fixing mechanism; 31. Fixing base; 32. Fixing base connector; 33. Connecting bolt; 34. Nut; 35. Quick-connect structure; 4. Snap-fit ​​positioning components, 41. C-shaped clip, 42. U-shaped pad; 43. Locking and positioning assembly; 431. Locking bolt; 432. Locking handle; 433. Sliding positioning component; 5. Install the head; 51. Crimped connector; 511. Crimping body; 512. Crimped connector quick-connect structure. 52. Threaded pin removal head; 521. Threaded pin removal claw; 522. Threaded pin removal head quick-connect structure. 53. Stepped pressure head; 531. Stepped cylinder; 532. Stepped pressure head quick-connect structure. 54. Three-jaw extractor head; 541. Three-jaw extractor head body; 542. Three claws; 543. Receiving cavity; 544. Three-jaw extractor head quick-connect structure. 6. Vacuum equipment; 61. Pins; 7. Pressure sensor; 8. Pressure display. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Component structures not specifically described in the present invention adopt common prior art.

[0032] Example 1: Vacuum equipment is a device used to create, improve, and maintain a vacuum environment.

[0033] Class 1 cleanroom: A clean environment in which the number of particles with a diameter of ≥0.5μm is ≤1 per cubic foot of air. It is the basic environmental requirement for the assembly and maintenance of core semiconductor components.

[0034] Interference fit: In mechanical assembly, the shaft diameter of the parts to be fitted is larger than the hole diameter (or the outer diameter is larger than the inner diameter), and a rigid connection is formed by relying on dimensional interference. Its core advantages are compact structure, high transmission accuracy, and suitability for the high stability requirements of semiconductor equipment.

[0035] PTFE (Tetrafluoroethylene): is an organic compound with the chemical formula C2F4. It is a colorless gas at room temperature and pressure, insoluble in water, and is mainly used as a raw material for manufacturing new heat-resistant plastics, engineering plastics, new fire extinguishing agents, and fog suppressants.

[0036] exist Figure 1 , Figure 2 In the illustrated embodiment, a semiconductor vacuum equipment internal component disassembly and assembly device is mainly used for the installation and removal of interference-fit components. It is adaptable to the assembly of different components through replaceable mounting heads. The metal parts of this tooling are made of 316L stainless steel, and all metal parts except the threaded parts are 400# mirror polished to ensure cleanliness. The entire tooling is suitable for Class 1 cleanroom environments. The material of the parts in contact with the cavity is PTFE to avoid damage to the product during installation.

[0037] A device for disassembling and assembling internal components of a semiconductor vacuum equipment includes a housing 1, a transmission and lifting mechanism 2, a fixing mechanism 3, a snap-fit ​​positioning assembly 4, and a detachable mounting head 5 mounted on the fixing mechanism 3. The mounting head 5 includes various sizes of crimping and removing components. The crimping and removing components are configured according to the structural type of the internal components of the vacuum equipment.

[0038] The device housing 1 has an overall cylindrical structure with multiple observation windows 11. A housing drive seat 12 is located at the center of the top of the housing 1, and an internal drive thread 16 is provided inside the drive seat 12. An end pressure ring 13 extends outward integrally with the cylindrical opening end of the housing 1, and a housing limiting groove 14 is provided on the side of the end pressure ring 13 facing the top of the housing 1. An annular washer 15 is provided at the end of the end pressure ring 13 away from the housing limiting groove 14. The annular washer 15 is made of PTFE material. The PTFE annular washer comes into contact with the vacuum equipment to prevent damage to the product during installation.

[0039] The aforementioned transmission lifting mechanism 2 employs manual lifting transmission. The transmission lifting mechanism 2 includes a transmission handle 21 and a lead screw transmission assembly 22 connected to the transmission handle 21.

[0040] The lead screw drive assembly 22 includes a rotating disk 221 and a drive lead screw 222. The drive lead screw 222 is located at the center of the rotating disk 221, and the drive handle 21 is symmetrically arranged on the side edge of the rotating disk 221 along the radial direction of the rotating disk 221.

[0041] The fixing mechanism 3 includes a fixing base 31 and a pair of fixing base connectors 32. The fixing base 31 is tightly fixed to the lower end of the transmission screw 222 via the pair of fixing base connectors 32 and by connecting bolts 33 and nuts 34. A quick-connect structure 35 is provided at the lower end of the fixing base.

[0042] A snap-fit ​​positioning component 4 is movably installed on the outer casing limiting groove of the device housing 1.

[0043] The snap-fit ​​positioning assembly 4 includes multiple C-shaped clips 41 detachably mounted on the housing limiting groove 14 and U-shaped pads 42 disposed on the C-shaped clips. The C-shaped clips 41 can slide along the housing limiting groove 14 to adjust their circumferential position relative to the device housing 1. A locking positioning assembly 43 is provided at the upper end of the C-shaped clips 41. In this embodiment, the locking positioning assembly 43 includes a locking bolt 431, a locking handle 432 disposed at the upper end of the locking bolt 431, and a sliding positioning member 433 disposed at the lower end of the locking bolt 431. The sliding positioning member is disposed inside the housing limiting groove 14 and can slide along the housing limiting groove 14 to adjust the position of the C-shaped clips. The U-shaped pads 42 are snapped onto the free end of the C-shaped clips 41. The U-shaped pads 42 are made of PTFE material. The PTFE U-shaped pads come into contact with the vacuum equipment to avoid damage to the product during installation.

[0044] The outer casing 1, transmission lifting mechanism, fixing mechanism, and C-shaped clamp of the device are all made of 316L stainless steel.

[0045] The internal component disassembly and assembly device of this semiconductor vacuum equipment achieves smooth lifting and pressing operations through the transmission handle and rotating disk during use. It is stably connected to the transmission lifting mechanism through the fixing mechanism and ensures that the lower end does not rotate with the transmission lifting mechanism during the rotation lifting and pressing process.

[0046] A replaceable mounting head 5 is provided on the quick-connect structure 35. The mounting head can be a pressure head or a threaded clamp, and the specific configuration can be determined according to the characteristics of the pressing or disassembling components to meet the needs of installation and disassembly. The mounting head is engaged with the mounting components by clamping or pressing, and the tooling and product are positioned and fixed by the snap-fit ​​positioning component 4. Finally, the interference fit components are smoothly installed and removed by the lifting and pressing of the transmission lifting mechanism.

[0047] See Figure 3 , Figure 4 , Figure 5 , Figure 6 In this embodiment, taking the pressing and removal of pin-type components as an example, the mounting head 5 includes a crimping connector 51 for pressing the pin-type components and a threaded pin-removing head 52 for removing the pin-type components. In this embodiment, the crimping component is the crimping connector 51, and the removal component is the threaded pin-removing head 52.

[0048] The crimp connector 51 includes an integrally formed crimp body 511 and a crimp connector quick-connect structure 512. The threaded pin taker 52 includes a threaded pin taker claw 521 and a threaded pin taker quick-connect structure 522. Both the crimp connector quick-connect structure 512 and the threaded pin taker quick-connect structure 522 adopt an external thread structure, while the corresponding quick-connect structure 35 on the fixed base adopts an internal thread hole structure. Of course, in other embodiments, the quick-connect structure 35 can also adopt various quick-connect positioning structures such as insertion holes.

[0049] A method for disassembling and assembling a device for disassembling and assembling internal components of a semiconductor vacuum equipment includes the following steps: S1: Select mounting head 5 and install mounting head 5 on the mounting base; S2: Install the disassembly and assembly device on the part to be disassembled or assembled, adjust the position of the snap-fit ​​positioning component 4 and fix it; S3: Align the mounting head 5 with the part to be disassembled or assembled, and adjust it to be level; S4: The installation head 5 is raised and lowered by the transmission lifting mechanism 2 to align with the parts to be disassembled and assembled.

[0050] In this embodiment, see Figure 7 , Figure 8 The procedure for installing pins using the internal component disassembly and assembly device of semiconductor vacuum equipment is as follows: First, select the crimp connector 51 that enables pin installation and install the crimp connector 51 on the quick-connect structure 35 of the fixed base.

[0051] Then, install the entire disassembly and assembly device at the position of the pin to be installed, and press the annular washer 15 onto the surface of the vacuum device 6. At the same time, the U-shaped pad on the C-shaped clamp 41 can also form a clamping fit with other surfaces of the vacuum device 6.

[0052] Place pin 61 into the pin hole to be installed, and adjust pin 61 so that it is also centered in the pin hole to ensure installation accuracy.

[0053] Finally, the transmission lifting mechanism 2 is operated to press the pin 6 into the pin hole in a balanced manner, thereby completing the assembly of the pin.

[0054] The internal component disassembly and assembly device for this semiconductor vacuum equipment allows for the installation of pins, meeting the requirements for "high rigidity, high coaxiality, and high sealing" between the pins and the vacuum equipment. This achieves precise assembly with zero clearance, vibration resistance, and high transmission torque. It enables the smooth and efficient installation and removal of interference pins in semiconductor vacuum equipment, ensuring uniform force distribution during installation without damaging the cavity or pins, thus meeting the high cleanliness and high reliability assembly requirements of the vacuum equipment.

[0055] Example 2: exist Figure 1 , Figure 2 , Figure 3 In the illustrated embodiment, a semiconductor vacuum equipment internal component disassembly and assembly device is mainly used for the installation and removal of interference-fit components. It is adaptable to the assembly of different components through replaceable mounting heads. The metal parts of this tooling are made of 316L stainless steel, and all metal parts except the threaded parts are 400# mirror polished to ensure cleanliness. The entire tooling is suitable for Class 1 cleanroom environments. The material of the parts in contact with the cavity is PTFE to avoid damage to the product during installation.

[0056] A device for disassembling and assembling internal components of a semiconductor vacuum equipment includes a housing 1, a transmission and lifting mechanism 2, a fixing mechanism 3, a snap-fit ​​positioning assembly 4, and a mounting head 5 detachably mounted on the fixing mechanism 3. In this embodiment, the mounting head 1 includes a stepped pressure head 53 for mounting bearings or flanges and a three-jaw jack for removing bearings or flanges.

[0057] The device housing 1 has an overall cylindrical structure with multiple observation windows 11. A housing drive seat 12 is located at the center of the top of the housing 1, and an internal drive thread 16 is provided inside the drive seat 12. An end pressure ring 13 extends outward integrally with the cylindrical opening end of the housing 1, and a housing limiting groove 14 is provided on the side of the end pressure ring 13 facing the top of the housing 1. An annular washer 15 is provided at the end of the end pressure ring 13 away from the housing limiting groove 14. The annular washer 15 is made of PTFE-based material.

[0058] The aforementioned transmission lifting mechanism 2 employs manual lifting transmission. The transmission lifting mechanism 2 includes a transmission handle 21 and a lead screw transmission assembly 22 connected to the transmission handle 21.

[0059] The lead screw drive assembly 22 includes a rotating disk 221 and a drive lead screw 222. The drive lead screw 222 is located at the center of the rotating disk 221, and the drive handle 21 is symmetrically arranged on the side edge of the rotating disk 221 along the radial direction of the rotating disk 221.

[0060] A pressure sensor 7 is installed between the transmission lead screw 222 and the fixed base 31, and a pressure display screen 8 is installed on the rotating disk. As a precision component, the installation pressure affects the component's installation accuracy and service life. To ensure the installation accuracy of the interference fit component and prevent it from being affected, a pressure sensor is installed between the transmission lead screw and the fixed base. The pressure sensor is connected to the pressure display screen on the rotating disk, which facilitates pressure control during installation and ensures accurate installation and disassembly.

[0061] A universal level 223 is installed at the center of the rotating disk. To ensure levelness, the universal level 223 is installed at the center of the rotating disk, which facilitates the installation and disassembly of components, thereby protecting the installation accuracy of internal components or preventing damage to components during disassembly, and facilitating precise installation and disassembly.

[0062] The fixing mechanism 3 includes a fixing base 31 and a pair of fixing base connectors 32. The fixing base 31 is tightly fixed to the lower end of the transmission screw 222 via the pair of fixing base connectors 32 and by connecting bolts 33 and nuts 34. A quick-connect structure 35 is provided at the lower end of the fixing base.

[0063] A snap-fit ​​positioning component 4 is movably installed on the outer casing limiting groove of the device housing 1.

[0064] The snap-fit ​​positioning assembly 4 includes multiple C-shaped clips 41 detachably mounted on the housing limiting groove 14 and U-shaped pads 42 disposed on the C-shaped clips. A locking positioning assembly 43 is provided at the upper end of each C-shaped clip 41. In this embodiment, the locking positioning assembly 43 includes a locking bolt 431, a locking handle 432 disposed at the upper end of the locking bolt 431, and a sliding positioning member 433 disposed at the lower end of the locking bolt 431. The sliding positioning member is disposed inside the housing limiting groove 14 and can slide along the housing limiting groove 14, thereby adjusting the position of the C-shaped clips. The C-shaped clips 41 can slide along the housing limiting groove 14 to adjust the circumferential position of the C-shaped clips 41 relative to the device housing 1. The U-shaped pads 42 are snapped onto the free end of the C-shaped clips 41. The U-shaped pads 42 are made of PTFE-type material.

[0065] The outer casing 1, transmission lifting mechanism, fixing mechanism, and C-shaped clamp of the device are all made of 316L stainless steel.

[0066] The internal component disassembly and assembly device of this semiconductor vacuum equipment achieves smooth lifting and pressing operations through the transmission handle and rotating disk during use. It is stably connected to the transmission lifting mechanism through the fixing mechanism and ensures that the lower end does not rotate with the transmission lifting mechanism during the rotation lifting and pressing process.

[0067] A replaceable mounting head 5 is provided on the quick-connect structure 35. The mounting head can be a pressure head or a threaded clamp, and the specific configuration can be determined according to the characteristics of the pressing or disassembling components to meet the needs of installation and disassembly. The mounting head is engaged with the mounting components by clamping or pressing, and the tooling and product are positioned and fixed by the snap-fit ​​positioning component 4. Finally, the interference fit components are smoothly installed and removed by the lifting and pressing of the transmission lifting mechanism.

[0068] In this embodiment, taking the pressing and removal of vacuum bearings or flanges as an example, the mounting head 5 includes a stepped pressing head 53 for pressing the vacuum bearing or flange and a three-jaw extractor 54 for removing the vacuum bearing or flange. The pressing component is the stepped pressing head 53, and the removing component is the three-jaw extractor 54.

[0069] like Figure 11 As shown, the stepped pressure head 53 includes a stepped cylinder 531 and a stepped pressure head quick-connect structure 532. Press fitting is achieved by fitting the small cylinder at the lower end of the stepped cylinder 531 with the inner diameter of the vacuum bearing.

[0070] like Figure 12 As shown, the three-jaw extractor 54 includes a three-jaw extractor body 541, three jaws 542, a receiving cavity 543 disposed inside the three-jaw extractor body 541, and a three-jaw extractor quick-connect structure 544.

[0071] In this embodiment, the disassembly of a vacuum bearing using a semiconductor vacuum equipment internal component disassembly and assembly device includes the following steps: Step 1: Select the three-jaw extractor 54 and install the three-jaw extractor 54 on the mounting base 31; Step 2: Install the disassembly and assembly device on the vacuum bearing to be disassembled, adjust the position of the snap-fit ​​positioning component 4 and fix it; Step 3: Align the three-jaw jack 54 with the vacuum bearing to be disassembled and level the device; Step 4: The three-jaw pick 54 is lifted and lowered by the transmission lifting mechanism 2 to align with the vacuum bearing to be disassembled for disassembly.

[0072] In this embodiment, see Figure 9 , Figure 10 The procedure for installing pins using the internal component disassembly and assembly device of semiconductor vacuum equipment is as follows: First, select a three-jaw pick 54 of suitable specifications for vacuum bearing installation, and install the three-jaw pick 54 on the quick-connect structure 35 of the fixed base.

[0073] Then, install the entire disassembly and assembly device at the position of the vacuum bearing to be installed, and press the annular washer 15 onto the surface of the vacuum equipment. At the same time, the U-shaped pad on the C-clamp 41 can also form a clamping fit with other surfaces of the vacuum equipment.

[0074] The vacuum bearing is gripped by a three-jaw jack 54 and leveled to ensure gripping accuracy.

[0075] Finally, place the transmission handle 21, which drives the transmission screw 222 to rotate. The rotation of the transmission screw 222 drives the three-jaw pick 54 and the vacuum bearing to move together, thereby slowly and smoothly removing the vacuum bearing.

[0076] Other types of interference-fit components, such as flanges, bushings, and magnetorheological fluid components, can have appropriate mounting heads selected based on actual conditions. By changing the mounting head with the corresponding structure, different types of components can be installed and clamped conveniently and quickly. Simultaneously, the pressure display and universal level allow observation of the applied pressure and levelness during installation, ensuring installation accuracy. The assembly process can be monitored in real-time through the observation window on the device housing. This system enables smooth and efficient installation and removal of interference-fit components in semiconductor vacuum equipment, solving problems such as uneven stress during installation, difficult disassembly, and potential damage to the cavity or core components. It meets the high cleanliness and high reliability assembly requirements of vacuum equipment.

[0077] This semiconductor vacuum equipment internal component assembly / disassembly device is suitable for installing and removing interference-fit components in cleanroom environments, meeting Class 1 cleanliness requirements. Primarily used for the installation and removal of interference-fit components, it utilizes replaceable mounting heads to accommodate different components. The metal components are made of 316L stainless steel, and all metal parts, except for threaded sections, undergo 400# mirror polishing to ensure cleanliness requirements. The entire device is suitable for Class 1 cleanroom environments. The parts in contact with the cavity are made of PTFE material to prevent product damage during installation. The mechanical transmission lifting mechanism, through a combination of a rotating handle, transmission screw, and fixed base, achieves smooth, uniform lifting without electric drive, solving the problems of poor environmental adaptability of electric tooling and unstable lifting of simple tooling. The design concept of adapting to multiple component specifications through replaceable mounting heads protects the tooling's versatility. It offers enhanced environmental adaptability, eliminates safety hazards, has a simple and reliable structure, lower maintenance costs, and is easy to operate.

Claims

1. A device for disassembling and assembling internal components of a semiconductor vacuum equipment, characterized in that: The disassembly and assembly device is mirror polished and includes a device housing (1), a transmission lifting mechanism (2) connected to the device housing, and a fixing mechanism (3) connected to the transmission lifting mechanism (2). A disassembly and replacement mounting head (5) is provided on the fixing mechanism (3), and an adjustable snap-fit ​​positioning component (4) is provided on the device housing (1).

2. The semiconductor vacuum equipment internal component disassembly and assembly device according to claim 1, characterized in that: The device housing (1) is provided with a housing transmission seat (12) and an end pressure ring (13).

3. The semiconductor vacuum equipment internal component disassembly and assembly device according to claim 2, characterized in that: The end pressure ring (13) is provided with a housing limiting groove (14), and a PTFE annular washer (15) is provided on the end face of the end pressure ring (13).

4. The semiconductor vacuum equipment internal component disassembly and assembly device according to claim 3, characterized in that: The snap-fit ​​positioning component (4) is movably snapped onto the outer shell limiting groove (14). The snap-fit ​​positioning component (4) includes multiple C-shaped clips (41), a PTFE U-shaped pad (42) is provided at one end of the C-shaped clip (41), and a locking positioning component (43) is provided at the other end of the C-shaped clip.

5. The semiconductor vacuum equipment internal component disassembly and assembly device according to any one of claims 1 to 4, characterized in that: The transmission lifting mechanism (2) includes a transmission handle (21) and a screw transmission assembly (22) connected to the transmission handle (21).

6. The semiconductor vacuum equipment internal component disassembly and assembly device according to claim 5, characterized in that: The lead screw drive assembly (22) includes a rotating disk (221) and a drive screw (222). The drive screw (222) is located at the center of the rotating disk (221), and the drive handle (21) is symmetrically arranged on the side edge of the rotating disk (221) along the radial direction of the rotating disk (221).

7. The semiconductor vacuum equipment internal component disassembly and assembly device according to claim 5, characterized in that: The fixing mechanism (3) is located at the lower end of the screw drive assembly (22). The fixing mechanism (3) includes a fixing seat (31) and a fixing seat connector (32). A quick-connect structure (35) is provided on the fixing seat (31).

8. The semiconductor vacuum equipment internal component disassembly and assembly device according to claim 7, characterized in that: A pressure sensor (7) is provided between the transmission screw (222) and the fixed seat (31), a pressure display screen (8) is provided on the rotating disk (221), and a universal level (223) is provided at the center of the rotating disk (221).

9. The semiconductor vacuum equipment internal component disassembly and assembly device according to any one of claims 1 to 4, characterized in that: The mounting head (5) includes various sizes of crimping parts and removal parts.

10. A method for disassembling and assembling internal components of a semiconductor vacuum device using the disassembly and assembly device according to any one of claims 1 to 9, characterized in that: Includes the following steps: S1: Select the mounting head and install it on the mounting base; S2: Install the disassembly / assembly device on the part to be disassembled / assembled, adjust the position of the snap-fit ​​positioning component and fix it; S3: Align the mounting head with the part to be disassembled or assembled, and adjust it to be level; S4: The installation head is raised and lowered by the transmission lifting mechanism to align with the parts to be disassembled and assembled.

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