Camera module

Abstract

The invention discloses a camera module. The camera module comprises a flexible assembly, a photosensitive module and a plurality of actuating assemblies, the flexible assembly comprises an inner frame, an outer frame and a plurality of rib assemblies, and each rib assembly is coupled between the inner frame and the outer frame. The photosensitive module is arranged on the inner frame corresponding to the middle opening of the inner frame. The plurality of actuating assemblies are located on the periphery of the photosensitive module and electrically connected with the flexible assembly for pushing the photosensitive module. Each actuating assembly comprises a carrier plate, a first electric connecting pad and a coil. Wherein the carrier plate is arranged on the inner frame; the first electrical connection pad is located on the carrier plate and is electrically connected with the inner frame. The coil is located on the carrier plate and electrically connected with one of the first electrical pads. The flexible assembly is arranged to provide a degree of freedom of motion of the photosensitive module.

Description

Technical Field

[0001] This invention relates to a camera module, and more particularly to a camera module capable of optical image compensation. Background Technology

[0002] A mobile phone camera module mainly consists of a lens, a voice coil motor (VCM), an image sensor (CMOS Image Sensor, CIS), and a substrate (such as a PCB or FPC). The voice coil motor uses the force generated by energizing a coil to drive the lens or image sensor, thereby achieving autofocus compensation. Currently, common voice coil motors on the market include lens-shift and sensor-shift types.

[0003] However, in the design of voice coil motors, the manufacturing process involves first separately fabricating the coil and the coil holder, and then performing micromachining and assembly. This increases the assembly tolerance and the complexity of the assembly process.

[0004] Furthermore, in the design of sensor-shift voice coil motors, the substrate on which the image sensor is mounted has a flexible structure to provide the amplitude of displacement of the image sensor caused by the voice coil motor. Therefore, reliability problems often occur in drop tests. Summary of the Invention

[0005] In view of the above problems, the present invention provides a camera module to solve the problems of existing assembly tolerance, complex assembly process and / or low drop reliability.

[0006] In some embodiments, a camera module includes a flexible component, a photosensitive module, and a plurality of actuating components. The flexible component includes an inner frame, an outer frame, and a plurality of rib assemblies, wherein each rib assembly is coupled between the inner frame and the outer frame. The photosensitive module is disposed on the inner frame corresponding to a central opening in the inner frame. The plurality of actuating components are located around the periphery of the photosensitive module and electrically connected to the flexible component for pushing the photosensitive module. Each actuating component includes a carrier plate, at least one first electrical pad, and a coil. The carrier plate is disposed on the inner frame. At least one first electrical pad is located on the carrier plate and electrically connected to the inner frame. The coil is located on the carrier plate and electrically connected to one of the at least one first electrical pad. Furthermore, the flexible component is configured to provide the photosensitive module with degrees of freedom of movement.

[0007] In some embodiments, the actuation component is a microelectromechanical actuator.

[0008] In some embodiments, the photosensitive module includes a reinforcing member and a photosensitive element. The reinforcing member covers and is coupled to the inner frame through a central opening; the photosensitive element is located in the central opening of the inner frame and is fixed to the reinforcing member.

[0009] In some embodiments, the optical axis of the photosensitive element passes through a central opening in the inner frame. In some embodiments, at least one of the plurality of actuation components includes at least one second electrical pad and at least one via. The at least one second electrical pad is located on a carrier plate; the at least one via penetrates the carrier plate, and each via is coupled between one of the at least one first electrical pad and one of the at least one second electrical pad. Furthermore, the photosensitive element is wire-connected to one of the at least one second electrical pad.

[0010] In some embodiments, the coil is electrically connected to one of the aforementioned at least one second electrical pad.

[0011] In some embodiments, the photosensitive module is welded to the first surface of the inner frame.

[0012] In some embodiments, the photosensitive module is soldered to a first surface of the inner frame, and each first electrical pad is soldered to the aforementioned first surface of the inner frame.

[0013] In some embodiments, at least one of the plurality of actuation components includes at least one via extending through a carrier plate. One end of each via is coupled to one of at least one first electrical pad, and a coil is electrically connected to the other end of the via.

[0014] In some embodiments, a photosensitive module is soldered to a first surface of an inner frame, and a plurality of actuation components are disposed on a second surface of the inner frame, and at least one of at least one first electrical pad is wire-connected to the second surface of the inner frame.

[0015] In some embodiments, each rib assembly includes a first rib and a second rib. The first rib extends in a first direction and is coupled to the outer frame. The second rib extends in a second direction and is coupled between the first rib and the inner frame. The first direction is perpendicular to the second direction.

[0016] In some embodiments, the outer frame protrudes inwardly with a plurality of corner blocks, each corner block being located at a corner of the outer frame. Each rib assembly includes an outer frame rib, at least one connecting rib, and a frame-shaped rib. The outer frame rib extends in a first direction and is coupled between two adjacent corner blocks; at least one connecting rib extends in a second direction and is coupled between the inner frame and the outer frame rib, with the first direction perpendicular to the second direction; and the two opposite corners of the frame-shaped rib are respectively coupled to adjacent corner blocks and the corner ends of the inner frame.

[0017] In summary, the camera module provided by any embodiment of the present invention avoids assembly tolerance issues and simplifies the assembly process by using multiple actuation components, each including a carrier plate, at least one first electrical pad, and a coil. Furthermore, the flexible component, including an inner frame, an outer frame, and multiple sets of rib components, provides a decoupling structure for planar movement perpendicular to the optical axis, enabling sensor-moving optical image compensation. In addition, in some embodiments, the actuation component including a first and / or second electrical pad and a via can eliminate the resistance generated by simple wire bonding or other metal wire connections, reducing the possibility of affecting optical image stabilization (OIS) operation. Furthermore, in some embodiments, the overall assembly height of the camera module can be reduced through the configuration of the flexible component, the photosensitive module, and the multiple actuation components. Attached Figure Description

[0018] Figure 1 This is a top view schematic diagram of the camera module in any of the embodiments;

[0019] Figure 2 yes Figure 1 A cross-sectional view of the camera module along the II-II section line;

[0020] Figure 3 These are cross-sectional views of the camera module in other embodiments;

[0021] Figure 4 These are cross-sectional views of the camera module in some of the embodiments;

[0022] Figure 5 This is a top view schematic diagram of a flexible component in some embodiments;

[0023] Figure 6 This is a top view schematic diagram of the flexible component in some other embodiments;

[0024] Figure 7 This is a schematic diagram of the appearance of a camera module including a lens, housing, and magnet in any of the embodiments;

[0025] Figure 8 yes Figure 7 A top view of the camera module, including the lens, housing, and magnet, along section line VIII-VIII; and

[0026] Figure 9 This is a top view schematic diagram of a camera module containing magnets in any of the embodiments.

[0027] In the attached figures, the following labels are used:

[0028] 100: Camera Module

[0029] 10: Flexible components

[0030] 11: Inner frame

[0031] 111: First Surface

[0032] 12: Outer frame

[0033] 121: Corner Block

[0034] 13: Rib assembly

[0035] 131: First rib

[0036] 132: Second rib

[0037] 134: Outer frame ribs

[0038] 135: Connecting rib

[0039] 136: Frame-shaped ribs

[0040] 20: Photosensitive module

[0041] 21: Reinforcing component

[0042] 22: Photosensitive element

[0043] 23: Photosensitive area

[0044] 30: Actuation component

[0045] 31: Carrier board

[0046] 32: First electrical pad

[0047] 33: Coil

[0048] 34: Second electrical pad

[0049] 35: Guide hole

[0050] 36: Conductor

[0051] 38: Third electrical pad

[0052] 39,39': Fourth electrical pad

[0053] 120: Outer shell

[0054] 1201: Upper shell

[0055] 1202: Lower shell

[0056] 130: Lens

[0057] 140: Support component

[0058] 50: Magnet

[0059] OP: Optical axis Detailed Implementation

[0060] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0061] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0062] The camera module 100 is suitable for mobile devices with camera capabilities. For example, mobile devices can be electronic devices such as smartphones, wearable devices, tablets, or tablet devices.

[0063] Please refer to Figures 1 to 4 In some embodiments, the camera module 100 includes a flexible component 10, a photosensitive module 20, and a plurality of actuation components 30.

[0064] The flexible component 10 includes an inner frame 11, an outer frame 12, and multiple sets of rib assemblies 13. The inner frame 11 and the outer frame 12 are connected by the multiple sets of rib assemblies 13, that is, each rib assembly 13 is coupled between the inner frame 11 and the outer frame 12. In some embodiments, the inner frame 11, the outer frame 12, and the multiple sets of rib assemblies 13 may be integrally formed. In other embodiments, the inner frame 11, the outer frame 12, and the multiple sets of rib assemblies 13 may be separate independent elements that are interconnected by assembly to form the flexible component 10. In some embodiments, the flexible component 10 may be a flexible substrate or a silicon substrate.

[0065] The photosensitive module 20 is disposed on the inner frame 11 corresponding to the central opening of the inner frame 11. Here, the flexible component 10 is conductive, and the photosensitive module 20 is also electrically connected to the inner frame 11. Specifically, the inner frame 11, the outer frame 12, and one or more sets of rib assemblies 13 have conductive lines. In other words, the inner frame 11, the outer frame 12, and the rib assembly 13 are each composed of conductive lines and an insulating substrate. The photosensitive module 20 is coupled to the conductive lines of the inner frame 11 and is electrically connected to the circuit traces of the outer frame 12 sequentially via the conductive lines of the inner frame 11 and the conductive lines on the rib assembly 13, thereby enabling electrical signals from circuits outside the camera module 100 to be transmitted to the photosensitive module 20. In some embodiments, the photosensitive module 20 can be a CMOS image sensor (CIS). In some embodiments, the photosensitive module 20 can be a flip-chip package or electrically connected to the inner frame 11 using surface-mount technology (SMT).

[0066] Multiple actuation components 30 are located around the photosensitive module 20 and electrically connected to the flexible component 10. Each actuation component 30 includes a carrier plate 31, at least one first electrical pad 32, and a coil 33. The carrier plate 31 is disposed on the inner frame 11, and the first electrical pad 32 and the coil 33 are located on the carrier plate 31. The first electrical pad 32 is electrically connected to the inner frame 11. Specifically, the first electrical pad 32 of each actuation component 30 is coupled to the conductive lines of the inner frame 11, and is electrically connected to the circuit traces of the outer frame 12 sequentially via the conductive lines of the inner frame 11 and the conductive lines on the rib assembly 13, thereby enabling electrical signals from circuits outside the camera module 100 to be transmitted to the actuation component 30. The coil 33 is electrically connected to at least one of the first electrical pads 32. Specifically, coil 33 is electrically connected to the first electrical pad 32 and then coupled to the conductive lines of the inner frame 11. It is also electrically connected to the circuit traces of the outer frame 12 via the conductive lines of the inner frame 11 and the conductive lines on the rib assembly 13, thereby enabling electrical signals from circuits outside the camera module 100 to be transmitted to coil 33. When coil 33 is in a magnetic field, the current through coil 33 cuts the magnetic lines of force, thereby generating a force that adjusts the position of the inner frame 11 and the photosensitive module 20. Here, flexible component 10 is provided to provide the photosensitive module 20 with degrees of freedom of movement. In some embodiments, actuation component 30 is a microelectromechanical actuator (MEMS actuator).

[0067] Please see Figure 5In some embodiments, each rib assembly 13 includes a first rib 131 and a second rib 132. The first rib 131 extends in a first direction and is coupled to the outer frame 12. The second rib 132 extends in a second direction and is coupled between the first rib 131 and the inner frame 11. The first direction is perpendicular to the second direction. In other embodiments, each of the four frame bars of the outer frame 12 has an inwardly projecting portion, which is coupled to one end of the first rib 131 of each rib assembly 13. The other end of each first rib 131 is connected to one end of each second rib 132, and the other end of each second rib 132 is coupled to the outwardly projecting portions on the four frame bars of the inner frame 11. Thus, the flexible assembly 10, through the connection of the first rib 131 and the second rib 132, provides decoupling (i.e., displacement degrees of freedom in the X and Y directions) functionality in the flexible direction, and the multiple rib assemblies 13 provide rotational degrees of freedom in the Z direction.

[0068] Please see Figure 6 In some embodiments, the outer frame 12 protrudes inwardly with a plurality of corner blocks 121, each corner block 121 being located at a corner of the outer frame 12. Each rib assembly 13 includes an outer frame rib 134, at least one connecting rib 135, and a frame-shaped rib 136. The outer frame rib 134 extends in a first direction and is coupled between two adjacent corner blocks 121; at least one connecting rib 135 extends in a second direction and is coupled between the inner frame 11 and the outer frame rib 134, and the first direction is perpendicular to the second direction; and the two opposite corners of the frame-shaped rib 136 are respectively coupled to the corner ends of the adjacent corner blocks 121 and the inner frame 11. In one embodiment, the outer frame 12 has four inwardly protruding corner blocks 121 at its four corners. Each pair of corner blocks 121 is connected to a frame rib 134, and the middle section of each frame rib 134 is perpendicularly coupled to two connecting ribs 135 in the direction towards the inner frame 11. Furthermore, the four corner blocks 121 and the four corner ends of the inner frame 11 are respectively coupled diagonally by frame-shaped ribs 136. In this way, the multiple sets of rib assemblies 13 of the flexible component 10 provide strong decoupling capabilities in the X and Y directions, and can transmit electrical and data signals, offering better wiring layout flexibility, while also providing strong structural rigidity and rotational freedom in the Z direction.

[0069] In some embodiments, the photosensitive module 20 includes a photosensitive element 22. Specifically, one side of the photosensitive element 22 has a photosensitive area 23, and the plane having the photosensitive area 23 is called the photosensitive surface (hereinafter referred to as the surface having the photosensitive area), while the other side opposite the photosensitive surface is the non-photosensitive surface. Accordingly, the photosensitive surface includes the photosensitive area 23 and the non-photosensitive area (not shown in the figures).

[0070] Please see Figure 2In some embodiments, the photosensitive module 20 includes a reinforcing member 21 and a photosensitive element 22, with the photosensitive element 22 fixed to the reinforcing member 21. The reinforcing member 21 covers and couples to the inner frame 11 through a central opening. For example, the inner frame 11 is disposed on the reinforcing member 21, and the photosensitive element 22 is located in the central opening of the inner frame 11 and fixed to the reinforcing member 21. In some embodiments, both the photosensitive element 22 and the inner frame 11 can be fixed to the reinforcing member 21 by an adhesive. In some embodiments, the reinforcing member 21 is a rigid plate, such as a stainless steel plate or other metal sheet. Here, fixing the photosensitive element 22 to the reinforcing member 21 maintains the flatness of the assembled photosensitive module 20.

[0071] In some embodiments, the photosensitive element 22 is disposed corresponding to the central opening of the inner frame 11, and is located within the central opening of the inner frame 11 (e.g., Figure 2 (As shown). Furthermore, one side of the photosensitive element 22 is fixed to the reinforcing member 21, and its other side has a photosensitive area 23 as a photosensitive surface. For example, the photosensitive element 22 is located within the central opening of the inner frame 11 and is disposed on the reinforcing member 21. Therefore, the optical axis OP emitted from the photosensitive surface of the photosensitive element 22 is located within the central opening of the inner frame 11, and the extension line of the optical axis OP passes through the central opening of the inner frame 11, such as... Figure 2 As shown.

[0072] Please see Figure 3 and Figure 4 In some embodiments, the photosensitive module 20 is a photosensitive element 22, and the photosensitive element 22 is welded to the first surface 111 of the inner frame 11 with a photosensitive surface having a photosensitive area 23 corresponding to the central opening of the inner frame 11. Specifically, the photosensitive element 22 is arranged with the photosensitive area 23 aligned with the central opening of the inner frame 11 and welded to the first surface 111 of the inner frame 11 with a non-photosensitive area, so the optical axis OP of the photosensitive element 22 passes through the central opening of the inner frame 11. In other words, the photosensitive surface of the photosensitive element 22 with the photosensitive area 23 is parallel to the central opening of the inner frame 11 and is not on the same plane. Here, the "first surface 111 of the inner frame 11" is a plane of the inner frame 11 perpendicular to the optical axis, and the other plane opposite to the "first surface 111 of the inner frame 11" is the "second surface 112 of the inner frame 11". Furthermore, when the photosensitive element 22 is located on the "first surface 111 of the inner frame 11", the "first surface 111 of the inner frame 11" is closer to the photosensitive surface of the photosensitive element 22 than the "second surface 112 of the inner frame 11". In other words, the "first surface 111 of the inner frame 11" connecting the photosensitive element 22 is adjacent to the photosensitive surface of the photosensitive element 22.

[0073] Here, the aforementioned photosensitive element 22 converts the optical image signal incident on the photosensitive module 20 into an electrical image signal. For example, when the camera module 100 is applied to a mobile device, the aforementioned optical image signal is emitted from outside the mobile device, passes through lens assemblies such as lenses and optical sheets, and then enters the photosensitive element 22 of the photosensitive module 20.

[0074] In some embodiments, at least one of the plurality of actuation components 30 includes at least one second electrical pad 34 and at least one via 35. The at least one second electrical pad 34 is located on a carrier plate 31, and the at least one via 35 penetrates the carrier plate 31. Each via 35 is coupled between one of the at least one first electrical pad 32 and one of the at least one second electrical pad 34. Furthermore, the photosensitive element 22 is electrically connected to one of the at least one second electrical pad 34 via a wire 36 in a wire bonding manner. In some embodiments, a coil 33 is electrically connected to one of the aforementioned at least one second electrical pad 34. Specifically, the coil 33 may be directly electrically connected to the second electrical pad 34, or electrically connected to the second electrical pad 34 via the wire 36. After the coil 33 is electrically connected to the second electrical pad 34 on the carrier plate 31, it will be electrically connected to the first electrical pad 32 at the other end of the guide hole 35 via the guide hole 35 coupled to it, and then electrically connected to the inner frame 11 via the first electrical pad 32.

[0075] In other embodiments, at least one of the plurality of actuation components 30 includes at least one via 35 penetrating the carrier plate 31 and at least one first electrical pad 32 soldered to the first surface 111 of the inner frame 11. One end of each via 35 is coupled to one of the at least one first electrical pad 32, and the other end is electrically connected to a coil 33. For example, the coil 33 may be electrically connected to the first surface 111 of the inner frame 11 via the via 35 and the first electrical pad 32. In some embodiments, the actuation component 30 further includes a second electrical pad 34 coupled to the other end of the via 35 relative to the first electrical pad 32, so that the coil 33 may be electrically connected to the first surface 111 of the inner frame 11 sequentially via the second electrical pad 34, the via 35, and the first electrical pad 32.

[0076] In some other embodiments, a plurality of actuation components 30 are disposed on the second surface 112 of the inner frame 11, and at least one of the first electrical pads 32 is wire-connected to the second surface 112 of the inner frame 11. For example, the actuation component 30 is directly fixed to the second surface 112 of the inner frame 11 with adhesive, and the actuation component 30 is electrically connected to the inner frame 11 through the first electrical pads 32 and the wires 36.

[0077] Here, the aforementioned first electrical pad 32 is an electrical pad located on the carrier plate 31 and electrically connected to the inner frame 11, while the aforementioned second electrical pad 34 is an electrical pad located on the carrier plate 31 at the other end of the guide hole 35 relative to the first electrical pad 32. For example, the first electrical pad 32 can be electrically connected to the first surface 111 or the second surface 112 of the inner frame 11; the second electrical pad 34 can be electrically connected to the coil 33 or the photosensitive element 22.

[0078] As can be seen from the above, by integrating the coil 33 with electrical connection elements (such as electrical pads 32 / 34, guide holes 35 and wires 36), the actuation component 30 can eliminate the resistance generated by simply making electrical connections using wire bonding technology, thereby reducing the occurrence of situations that affect optical anti-vibration.

[0079] In some embodiments, the non-photosensitive area on the photosensitive surface of the photosensitive element 22 has at least one third electrical pad 38. Here, the third electrical pad 38 is an electrical pad located on the non-photosensitive area of ​​the photosensitive element 22 and electrically connected to the inner frame 11.

[0080] In some embodiments, the inner frame 11 has at least one fourth electrical pad 39 / 39', which can be electrically connected to the actuator 30 or the photosensitive module 20. Here, the fourth electrical pad 39 / 39' refers to an electrical pad located on the inner frame 11.

[0081] For example, the actuation component 30 can be directly soldered to the first electrical pad 32 and the fourth electrical pad 39, or the first electrical pad 32 and the fourth electrical pad 39 can be connected by wire 36 in a wire bonding manner to achieve an electrical connection between the actuation component 30 and the inner frame 11.

[0082] For example, the photosensitive module 20 can be directly soldered to the third electrical pad 38 and the fourth electrical pad 39', thereby allowing the photosensitive module 20 to be directly soldered to the inner frame 11; or the photosensitive module 20 can be sequentially connected to the third electrical pad 38, the wire 36, the second electrical pad 34, the via 35, the first electrical pad 32, and the fourth electrical pad 39, thereby achieving an electrical connection between the photosensitive module 20 and the inner frame 11. In other words, the aforementioned photosensitive module 20 can be electrically connected to the inner frame 11 via the wire 36, the via 35, the electrical pads, or a combination thereof, or directly soldered to the inner frame 11.

[0083] In some embodiments, the aforementioned via 35 may be a through-silicon via (TSV) or a through-glass via (TGV).

[0084] In some embodiments, the aforementioned conductor 36 may be a gold wire, silver wire, or other metal wire, and may be electrically connected using wire bonding technology.

[0085] Please see Figure 1and Figure 2 In some embodiments, the camera module 100 includes a flexible component 10, a photosensitive module 20, and four actuation components 30. The flexible component 10 includes an inner frame 11, an outer frame 12, and multiple sets of rib assemblies 13. The photosensitive module 20 consists of a photosensitive element 22 and a reinforcing member 21, and multiple third electrical pads 38 are located on the photosensitive surface of the photosensitive element 22. The reinforcing member 21 covers the central opening of the inner frame 11, and both the inner frame 11 and the photosensitive element 22 are attached to the reinforcing member 21 with adhesive. The four actuation components 30 are located on the four sides of the photosensitive module 20, and each actuation component 30 includes a carrier plate 31, multiple first electrical pads 32 disposed on the carrier plate 31, multiple second electrical pads 34 and a coil 33, and multiple guide holes 35 penetrating the carrier plate 31. Each carrier plate 31 is soldered to a fourth electrical pad 39 on the inner frame 11 with a first electrical pad 32. On the other side of the carrier plate 31, opposite to the inner frame 11, a coil 33 and multiple second electrical pads 34 are provided. The coil 33 is connected to a portion of the second electrical pads 34 via wires 36 (the connection state is not shown in the attached figure) or directly electrically connected to a portion of the second electrical pads 34. The first electrical pads 32 and the second electrical pads 34 are located at opposite ends of the through-holes 35 penetrating the carrier plate 31. Multiple third electrical pads 38 are located on the non-photosensitive area surrounding the photosensitive area 23 of the photosensitive element 22, and the third electrical pads 38 are electrically connected to a portion of the second electrical pads 34 via wires 36 using a wire bonding technique. Based on this, the photosensitive element 22 is sequentially electrically connected to the conductive lines of the inner frame 11 via the third electrical pad 38, the wire 36, the second electrical pad 34, the guide hole 35, the first electrical pad 32, and the fourth electrical pad 39, and can transmit electrical signals from the circuit outside the camera module 100 to the photosensitive module 20. The coil 33 is sequentially electrically connected to the conductive lines of the inner frame 11 via the second electrical pad 34, the guide hole 35, the first electrical pad 32, and the fourth electrical pad 39, and when the current passing through the coil 33 cuts the magnetic lines of force of the magnetic field, it generates a force that pushes the flexible component 10, thereby adjusting the position of the photosensitive module 20 and making it movable.

[0086] Please see Figure 3In other embodiments, the camera module 100 includes a flexible component 10, a photosensitive module 20, and four actuation components 30. The photosensitive element 22 and the four actuation components 30 are all located on the same side of the flexible component 10. The flexible component 10 includes an inner frame 11, an outer frame 12, and multiple sets of rib assemblies 13, and the inner frame 11 has multiple fourth electrical pads 39 / 39' on the side of the inner frame 11 closest to the photosensitive element 22 (i.e., the first surface 111). The photosensitive module 20 is the photosensitive element 22, and the photosensitive element 22 has a photosensitive area 23 and a non-photosensitive area surrounding the photosensitive area 23, and the non-photosensitive area has multiple third electrical pads 38. The photosensitive area 23 of the photosensitive element 22 corresponds to the central opening of the inner frame 11 and is soldered to a fourth electrical pad 39' on the first surface 111 of the inner frame 11 via multiple third electrical pads 38 on the non-photosensitive area, so as to transmit electrical signals from the circuit outside the camera module 100 to the photosensitive module 20. Four actuation components 30 are located on the four sides of the photosensitive module 20, and each actuation component 30 includes a carrier plate 31, multiple first electrical pads 32, multiple second electrical pads 34, a coil 33 disposed on the carrier plate 31, and multiple guide holes 35 penetrating the carrier plate 31. Some actuation components 30 have guide holes 35 penetrating their carrier plate 31, with the two ends of the guide holes 35 being the first electrical pad 32 and the second electrical pad 34, respectively. The side of the actuation component 30 with the first electrical pad 32 is closer to the inner frame 11, while the other side has the coil 33. The coil 33 is connected to the second electrical pad 34 and is electrically connected to the inner frame 11 via the guide hole 35, the first electrical pad 32 and the fourth electrical pad 39. Therefore, when the current passing through the coil 33 cuts the magnetic field lines, it generates a force that pushes the flexible component 10, thereby adjusting the position of the photosensitive module 20 and making it movable.

[0087] Please see Figure 4In some embodiments, the camera module 100 includes a flexible component 10, a photosensitive module 20, and four actuation components 30. The photosensitive element 22 and the four actuation components 30 are located on different sides of the flexible component 10. The flexible component 10 includes an inner frame 11, an outer frame 12, and multiple sets of rib assemblies 13, and the inner frame 11 has multiple fourth electrical pads 39' on the side of the inner frame 11 closest to the photosensitive element 22 (i.e., the first surface 111). The photosensitive module 20 is the photosensitive element 22, and the photosensitive element 22 has a photosensitive area 23 and a non-photosensitive area surrounding the photosensitive area 23, and the non-photosensitive area has multiple third electrical pads 38. The photosensitive area 23 of the photosensitive element 22 corresponds to the central opening of the inner frame 11 and is soldered to a fourth electrical pad 39' on the first surface 111 of the inner frame 11 via a plurality of third electrical pads 38 on the non-photosensitive area, so as to transmit electrical signals from circuits outside the camera module 100 to the photosensitive module 20. Four actuation components 30 are located on the second surface 112 of the inner frame 11 (i.e., the other side relative to the first surface 111) and on the four sides of the central opening of the inner frame 11. Each actuation component 30 includes a carrier plate 31, a plurality of first electrical pads 32 disposed on the carrier plate 31, and a coil 33. The first electrical pads 32 and the coil 33 are located on the same plane of the carrier plate 31, while the other plane of the carrier plate 31 is fixed to the inner frame 11 with adhesive. The coil 33 is connected to the first electrical pad 32 and is electrically connected to the inner frame 11 via the wire 36 and the fourth electrical pad 39. Therefore, when the current passing through the coil 33 cuts the magnetic lines of force of the magnetic field, a force is generated to push the flexible component 10, thereby adjusting the position of the photosensitive module 20 and making it movable.

[0088] In some embodiments, although the aforementioned actuation component 30 is disposed on the inner frame 11, its surface adjacent to the flexible component 10 is simultaneously adjacent to the area where the inner frame 11, the multiple sets of rib components 13, and the outer frame 12 are located, such as... Figure 1 and Figure 9 As shown.

[0089] Please see Figure 5In some embodiments, each rib assembly 13 includes a first rib 131 and a second rib 132. The first rib 131 extends in a first direction and is coupled to the outer frame 12. The second rib 132 extends in a second direction and is coupled between the first rib 131 and the inner frame 11. The first direction is perpendicular to the second direction. In some embodiments, each of the four frame bars of the outer frame 12 has an inwardly projecting portion, which is coupled to one end of the first rib 131 of each rib assembly 13. The other end of each first rib 131 is connected to one end of each second rib 132, and the other end of each second rib 132 is coupled to the outwardly projecting portions on the four frame bars of the inner frame 11. Thus, the flexible assembly 10, through the connection of the first rib 131 and the second rib 132, provides decoupling (i.e., displacement degrees of freedom in the X and Y directions) functionality in the flexible direction, and the multiple rib assemblies 13 provide rotational degrees of freedom in the Z direction.

[0090] Please see Figure 6 In some embodiments, the outer frame 12 protrudes inwardly with a plurality of corner blocks 121, each corner block 121 being located at a corner of the outer frame 12. Each rib group 13 includes an outer frame rib 134, at least one connecting rib 135, and a frame-shaped rib 136. The outer frame rib 134 extends in a first direction and is coupled between two adjacent corner blocks 121; at least one connecting rib 135 extends in a second direction and is coupled between the inner frame 11 and the outer frame rib 134, and the first direction is perpendicular to the second direction; and the two opposite corners of the frame-shaped rib 136 are respectively coupled to the corner ends of the adjacent corner blocks 121 and the inner frame 11. In some embodiments, the outer frame 12 has four inwardly protruding corner blocks 121 at its four corners. Each pair of corner blocks 121 is connected to a frame rib 134, and the middle section of each frame rib 134 is perpendicularly coupled to two connecting ribs 135 in the direction towards the inner frame 11. Furthermore, the four corner blocks 121 and the four corner ends of the inner frame 11 are respectively coupled diagonally by frame-shaped ribs 136. In this way, the multiple sets of ribs in the flexible component 10 provide strong decoupling capabilities in the X and Y directions (i.e., displacement degrees of freedom in the X and Y directions), and the multiple sets of ribs 13 can provide the transmission of electrical and data signals, with better wiring layout flexibility, while also providing strong structural rigidity and rotational degrees of freedom in the Z direction.

[0091] Please see Figure 7 and Figure 8The camera module 100 further includes a housing 120 and a lens 130. For example, the housing 120 includes an upper housing 1201 and a lower housing 1202, and the lens 130 is disposed on the upper housing 1201. The housing 120 has a receiving space to receive the flexible component 10, the photosensitive module 20, and a plurality of actuation components 30. In some embodiments, the outer frame 12 of the flexible component 10 is located outside the housing 120 for electrical connection with other electronic components of the mobile device.

[0092] In some embodiments, the camera module 100 further includes an autofocus (AF) component (not shown) located between the lens 130 and the photosensitive module 20. The composition and operation of the autofocus component are well-known in the art and will not be described further.

[0093] In some embodiments, multiple magnets 50 are respectively provided above the multiple sets of actuation components 30, and are arranged corresponding to the coil 33 (e.g., Figure 8 and Figure 9 (As shown). Magnets 50 are fixedly mounted on the support member 140, which is disposed on the outer frame 12 and connected to the housing 1201 and the lens 130. Specifically, multiple magnets 50 can be embedded in the support member 140, making them adjacent to the coil 33 of the actuation component 30. The Lorentz force generated by the coupling induction between the magnetic force of the magnets 50 and the coil 33 of the actuation component 30 serves as the actuating force, enabling the flexible component 10 to guide the movement of the photosensitive module 20.

[0094] Please see Figure 8 and Figure 9In some embodiments, the camera module 100 includes a flexible component 10, a photosensitive module 20, four actuators 30, multiple magnets 50, a housing 120, a lens 130, and a support member 140. The lens 130 is disposed on the housing 120, and the flexible component 10, the photosensitive module 20, the multiple actuators 30, the magnets 50, and the support member 140 are located within the housing 120 (except for a portion of the outer frame 12 of the flexible component 10 located outside the housing 120). The housing includes an upper housing 1201 and a lower housing 1202. The flexible component 10 includes an inner frame 11, an outer frame 12, and multiple sets of rib assemblies 13, and is located on the lower housing 1202. The support member 140 is disposed on the outer frame 12 and connects the upper housing 1201 and the lens 130. Each magnet 50 is disposed on the support member 140 and located between the upper housing 1201 and each actuator 30. The photosensitive module 20 comprises a photosensitive element 22 and a reinforcing member 21, with multiple third electrical pads 38 located on the photosensitive surface of the photosensitive element 22. The reinforcing member 21 covers the central opening of the inner frame 11 and is mounted on the lower housing 1202. Both the inner frame 11 and the photosensitive element 22 are attached to the reinforcing member 21 with adhesive. Four actuation components 30 are located on the four sides of the photosensitive module 20, and each actuation component 30 includes a carrier plate 31, multiple first electrical pads 32, multiple second electrical pads 34, and a coil 33 disposed on the carrier plate 31, as well as multiple guide holes 35 penetrating the carrier plate 31. Each carrier plate 31 is welded to a fourth electrical pad 39 on the inner frame 11 with a first electrical pad 32, and a coil 33 and multiple second electrical pads 34 are provided on the other side of the carrier plate 31 opposite to the inner frame 11. The coil 33 is electrically connected to a portion of the second electrical pads 34 and is adjacent to the magnet 50. The first electrical pad 32 and the second electrical pad 34 are located at both ends of the through hole 35 penetrating the carrier plate 31. Multiple third electrical pads 38 are located on the non-photosensitive area surrounding the photosensitive area 23 of the photosensitive element 22, and the third electrical pads 38 and some of the second electrical pads 34 are electrically connected via wires 36 using a wire bonding technique. Based on this, the photosensitive element 22 is sequentially electrically connected to the conductive lines of the inner frame 11 via the third electrical pads 38, wires 36, second electrical pads 34, through hole 35, first electrical pads 32, and fourth electrical pads 39, and can transmit electrical signals from external circuits of the camera module 100 to the photosensitive module 20. The coil 33 is electrically connected to the conductive lines of the inner frame 11 in sequence via the second electrical pad 34, the guide hole 35, the first electrical pad 32 and the fourth electrical pad 39. When the current passing through the coil 33 cuts the magnetic field lines provided by the magnet 50, it generates a force that pushes the flexible component 10, thereby adjusting the position of the photosensitive module 20 and making it movable.

[0095] In summary, the camera module 100 provided in any embodiment of the present invention avoids assembly tolerance issues and simplifies the assembly process by using a combination of multiple actuation components 30 and flexible components 10, each including a carrier plate 31, at least one first electrical pad 32, and a coil 33 (partially including a guide hole 35 and a wire 36). Furthermore, the flexible component 10 with multiple sets of rib components 13 provides more flexible planar displacement and overall structural rigidity. In addition, in some embodiments, the overall assembly height can be reduced through the configuration of the flexible component 10, the photosensitive module 20, and the multiple actuation components 30.

[0096] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A camera module, characterized in that, Include: A flexible component includes an inner frame, an outer frame, and multiple sets of rib assemblies, wherein each of the rib assemblies is coupled between the inner frame and the outer frame; A photosensitive module is disposed on the inner frame corresponding to the middle opening of the inner frame; as well as Multiple actuation components, located around the photosensitive module and electrically connected to the flexible component, are used to actuate the photosensitive module, wherein each actuation component includes: A carrier plate is disposed on the inner frame; At least one first electrical pad is located on the carrier plate and electrically connected to the inner frame; and A coil, located on the carrier plate, is electrically connected to one of the at least one first electrical pad; The flexible component is configured to provide the photosensitive module with degrees of freedom of movement.

2. The camera module as described in claim 1, characterized in that, The actuation component is a microelectromechanical actuator.

3. The camera module as described in claim 1, characterized in that, The photosensitive module includes: A reinforcing member, covering the central opening of the inner frame and coupled to the inner frame; and The photosensitive element is located in the central opening of the inner frame and is fixed to the reinforcing member.

4. The camera module as described in claim 3, characterized in that, The optical axis of the photosensitive element passes through the central opening of the inner frame.

5. The camera module as described in claim 3 or 4, characterized in that, At least one of the plurality of actuation components includes: At least one second electrical pad is located on the carrier plate; and At least one via extends through the carrier plate, wherein each via is coupled between one of the at least one first electrical pad and one of the at least one second electrical pad; The photosensitive element is wire-connected to one of the at least one second electrical pad.

6. The camera module as described in claim 5, characterized in that, The coil is electrically connected to one of the at least one second electrical pad.

7. The camera module as described in claim 1, characterized in that, The photosensitive module is welded to the first surface of the inner frame.

8. The camera module as described in claim 7, characterized in that, Each of the first electrical pads is welded to the first surface of the inner frame.

9. The camera module as described in claim 7, characterized in that, At least one of the plurality of actuation components includes: At least one via extends through the carrier plate, wherein one end of each via is coupled to one of the at least one first electrical pad, and the coil is electrically connected to the other end of the via.

10. The camera module as described in claim 7, characterized in that, The plurality of actuation components are disposed on the second surface of the inner frame, and at least one of the at least one first electrical pad is wire-connected to the second surface of the inner frame.

11. The camera module as described in claim 1, characterized in that, in: Each of the rib assemblies includes: A first rib, extending in a first direction, is coupled to the outer frame; and The second rib extends in a second direction and is coupled between the first rib and the inner frame, wherein the first direction is perpendicular to the second direction.

12. The camera module as described in claim 1, characterized in that, in: The outer frame protrudes inward with multiple corner blocks, each corner block being located at a corner of the outer frame; as well as Each of the rib assemblies includes: The outer frame ribs extend in a first direction and are coupled between two adjacent corner blocks; At least one connecting rib, extending in a second direction, is coupled between the inner frame and the outer frame rib, wherein the first direction is perpendicular to the second direction; and A frame-shaped rib, wherein two opposite corners of the frame-shaped rib are respectively coupled to the adjacent corner block and the corner end of the inner frame.

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