Manufacturing method of display panel and display panel

Abstract

A method for manufacturing a display panel and the display panel itself are disclosed. The method includes: forming a plurality of spaced conductive structures on a driving backplane, each conductive structure constituting a sub-pixel, and each conductive structure including an anode electrode; forming a droplet on each conductive structure; energizing a portion of the conductive structures; and forming a first light-emitting layer on the driving backplane. The contact angle between the energized conductive structure and the droplet decreases, such that the droplet covers the anode electrode of the energized conductive structure. In the energized conductive structure, the first light-emitting layer is disposed on the droplet; in the unenergized conductive structure, the first light-emitting layer is directly disposed on the anode electrode. This method for manufacturing a display panel eliminates the need for photolithography, etching, and other techniques, as well as the use of FMM (Focused Mirror Model), thus achieving a balance between display panel resolution and the utilization rate of light-emitting materials.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically to a method for manufacturing a display panel and the display panel itself. Background Technology

[0002] With the development of optoelectronic display technology and semiconductor manufacturing technology, OLED and LCD display technologies have been mass-produced. In the current OLED panel manufacturing process, a fine metal mask (FMM) is generally required during evaporation to pattern the evaporated material. However, this method is often limited by mask precision, thus restricting the display panel resolution. Currently, the method of patterning OLED luminescent materials using photolithography eliminates the need for an FMM and can improve panel resolution. However, this requires photolithography and development, a process involving contact with aqueous solutions (the developer is an aqueous solution) and dry etching. This approach places high demands on OLED encapsulation, as the encapsulation layer can easily be damaged due to aqueous solution intrusion or excessively high dry etching energy, leading to luminescent material failure. Therefore, a manufacturing method is needed that can both ensure display panel resolution and improve the utilization rate of luminescent materials. Summary of the Invention

[0003] The purpose of this invention is to provide a method for manufacturing a display panel and a display panel in general, thereby solving the problem that the manufacturing method cannot simultaneously achieve both the resolution of the display panel and the utilization rate of the luminescent material.

[0004] To achieve the objectives of this invention, the following technical solution is provided:

[0005] In a first aspect, the present invention provides a method for manufacturing a display panel, the display panel comprising a plurality of pixels, each pixel comprising a plurality of sub-pixels, the method for manufacturing the display panel comprising:

[0006] Multiple spaced conductive structures are formed on the driving backplane, each conductive structure constituting a sub-pixel, and the conductive structure includes an anode electrode.

[0007] A droplet is formed on each of the conductive structures;

[0008] A portion of the conductive structure is energized;

[0009] A first light-emitting layer is formed on the drive backplate;

[0010] In this configuration, the contact angle between the conductive structure and the droplet decreases after energization, so that the droplet covers the anode electrode of the conductive structure after energization. In the conductive structure after energization, the first light-emitting layer is disposed on the droplet; in the conductive structure without energization, the first light-emitting layer is disposed on the anode electrode.

[0011] In one embodiment, the contact angle of the droplet before energization is a, and the contact angle of the droplet after energization is b, satisfying: a > b;

[0012] In the orthographic projection in the first direction, the area of ​​the droplet before energization is smaller than the area of ​​the anode electrode, and the area of ​​the droplet after energization is greater than or equal to the area of ​​the anode electrode. The first direction is perpendicular to the drive backplate.

[0013] In one embodiment, an isolation portion is further provided between two adjacent conductive structures, and the isolation portion is disposed on the drive backplate.

[0014] In one embodiment, in the cross-section of the first direction, the spacing between two adjacent isolation portions gradually decreases in the direction away from the drive backplate.

[0015] In one embodiment, each of the conductive structures further includes an auxiliary electrode, with the anode electrode and the auxiliary electrode disposed at a distance from each other on the drive backplate.

[0016] In one embodiment, forming droplets on each of the conductive structures and energizing a portion of the conductive structures includes:

[0017] The droplet is formed on the anode electrode of a portion of the conductive structure, and the droplet is formed on the auxiliary electrode of the remaining portion of the conductive structure;

[0018] A portion of the conductive structure is energized at its anode electrode so that the droplet covers the energized anode electrode of the conductive structure.

[0019] In one embodiment, a first light-emitting layer is formed on the driving backplane, and the method further includes:

[0020] Move the droplet on the auxiliary electrode so that the droplet is located on the first light-emitting layer of the anode electrode of the same conductive structure;

[0021] Remove the first luminescent layer that is not covered by the droplets.

[0022] In one embodiment, the droplet comprises one or more of n-hexane, cyclohexane, isooctane, n-pentane, n-heptane, cyclopentane, and isopentane; and / or, the droplet further comprises a light-shielding material, the light-shielding material comprising one or more of carbon powder, graphite, activated carbon, manganese dioxide, chromium oxide, and iron tetroxide.

[0023] In one embodiment, it further includes:

[0024] Flip the drive backplate and de-energize the conductive structure to remove all the droplets by gravity.

[0025] Dry the drive backplate and the first light-emitting layer.

[0026] In a second aspect, the present invention provides a display panel, manufactured using the method for manufacturing a display panel according to any one of the various embodiments of the first aspect, comprising:

[0027] Drive backplane;

[0028] Multiple conductive structures are spaced apart on the drive backplate;

[0029] A first light-emitting layer is disposed on a portion of the conductive structure.

[0030] The method for manufacturing a display panel according to the present invention involves dropping droplets with variable contact angles onto each conductive structure. By altering the contact angle between the anode electrode and the droplets through electrowetting, the contact angle between the droplets and the anode electrode decreases after energization, causing the droplets to spread evenly on the surface of the anode electrode and thus shielding it. As a result, only the anode electrode that needs to be covered with the light-emitting layer is not completely shielded, and the corresponding light-emitting material at that location will be formed on the anode electrode. Light-emitting materials of other colors will be blocked by the droplets and will not be deposited onto the anode electrode. The same operation can be used when depositing other colors, thereby completing the formation of light-emitting materials of multiple colors. Furthermore, it eliminates the need for photolithography, etching, or FMM methods. Therefore, the manufacturing method of this display panel can balance the resolution of the display panel and the utilization rate of the light-emitting material. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a flowchart illustrating a method for manufacturing a display panel according to one embodiment;

[0033] Figure 2 This is a flowchart illustrating a method for manufacturing a display panel according to another embodiment;

[0034] Figure 3 This is a structural diagram of a method for manufacturing a display panel according to one embodiment;

[0035] Figure 4 This is a structural diagram of a method for manufacturing a display panel according to another embodiment.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100-Display panel, 10-Drive backplate, 20-Conductive structure, 21-Anode electrode, 22-Auxiliary electrode, 23-Metal wire, 31-First light-emitting layer, 32-Second light-emitting layer, 33-Third light-emitting layer, 40-Droplet, 50-Isolation section, Z-First direction, X-Second direction. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0040] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0041] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0042] Please refer to Figure 3 and Figure 4 The present invention provides a display panel 100, which includes a driving backplate 10, a plurality of conductive structures 20, and a first light-emitting layer 31. The plurality of conductive structures 20 are spaced apart on the driving backplate 10. The first light-emitting layer 31 is disposed on a portion of the conductive structures 20.

[0043] Optionally, the substrate material of the driving backplane 10 can be glass, polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), ITO (indium tin oxide) film, silicon dioxide, amorphous silicon film, etc., without limitation. Specifically, the driving backplane 10 is prepared using a glass substrate and TGV (Through-Glass Via) glass through-hole technology.

[0044] Optionally, the first light-emitting layer 31 is a structure composed of multiple alternating thin layers and barrier layers. When the first light-emitting layer 31 is used to emit red light, the material of the first light-emitting layer 31 can be a phosphorescent material, specifically such as fluorene, PTPP, DCJTB, Tz-Gl, etc. When the first light-emitting layer 31 is used to emit green light, the material of the first light-emitting layer 31 can be a phosphorescent material, specifically such as Alaq3, TDETE, Cousmarin, NpGl, etc. When the first light-emitting layer 31 is used to emit blue light, the material of the first light-emitting layer 31 can be a fluorescent material, phosphorescent material, etc., without limitation.

[0045] Optionally, the display panel 100 includes multiple pixels, each pixel includes multiple sub-pixels, and each sub-pixel corresponds to a different light-emitting layer. Specifically, each pixel includes three sub-pixels of different colors, and each pixel includes three spaced-apart conductive structures 20, a first light-emitting layer 31, a second light-emitting layer 32, and a third light-emitting layer 33. The first light-emitting layer 31, the second light-emitting layer 32, and the third light-emitting layer 33 are disposed on the conductive structure 20 in a one-to-one correspondence. Furthermore, the first light-emitting layer 31, the second light-emitting layer 32, and the third light-emitting layer 33 are made of different materials to generate sub-pixels of different colors. In a specific embodiment, the first light-emitting layer 31 is used to emit red light, the second light-emitting layer 32 is used to emit green light, and the third light-emitting layer 33 is used to emit blue light.

[0046] Please refer to Figures 1 to 4 The present invention provides a method for manufacturing a display panel 100, used to prepare the display panel 100 as described in any of the foregoing embodiments. The method for manufacturing the display panel 100 includes:

[0047] Step S10: A plurality of spaced conductive structures 20 are formed on the driving backplate 10. Each conductive structure 20 constitutes a sub-pixel. The conductive structure 20 includes an anode electrode 21.

[0048] Step S20: Form droplets 40 on each conductive structure 20;

[0049] Step S30: Energize a portion of the conductive structure 20;

[0050] Step S40: A first light-emitting layer 31 is formed on the driving backplate 10.

[0051] In this case, the contact angle between the conductive structure 20 and the droplet 40 after being energized becomes smaller, so that the droplet 40 covers the anode electrode 21 of the conductive structure 20 after being energized. In the conductive structure 20 after being energized, the first light-emitting layer 31 is disposed on the droplet 40; in the conductive structure 20 without being energized, the first light-emitting layer 31 is directly disposed on the anode electrode 21.

[0052] Optionally, in step S10, multiple conductive structures 20 are spaced apart in the second direction X. The spacing between the multiple conductive structures 20 may be equal or unequal, and is not limited. Optionally, the anode electrode 21 may be a metal with high conductivity and low resistivity (such as aluminum or silver) or a transparent conductive oxide (such as ITO), and is not limited. The first direction Z is the thickness direction of the display panel 100, and the second direction X is the length direction or width direction of the display panel 100.

[0053] Optionally, in step S20, the surface of the anode electrode 21 is a hydrophilic surface. After the droplet 40 is dropped in, the droplet 40 and the surface of the anode electrode 21 will form a large contact angle, that is, the liquid will stand on the surface of the anode electrode 21.

[0054] Optionally, the method of forming the first light-emitting layer 31 in step S40 can be vapor deposition, inkjet printing, etc. The evaporation method of vapor deposition can be resistance heating (tungsten wire / crucible), electron beam heating (high melting point materials such as oxides), laser heating (instantaneous evaporation), etc., without limitation.

[0055] The manufacturing method of the display panel 100 of the present invention involves dropping droplets 40 with variable contact angles onto each conductive structure 20. The contact angle between the anode electrode 21 and the droplets 40 is changed through the electrowetting effect. After energizing, the contact angle between the droplets 40 and the anode electrode 21 becomes smaller, meaning that the droplets will spread flat on the surface of the anode electrode 21, thereby blocking the anode electrode 21. Thus, only the anode electrode 21 that needs to be covered with the light-emitting layer is not completely blocked, and the light-emitting material corresponding to that position will be formed on the anode electrode 21. Other colors of light-emitting material will be blocked by the droplets 40 and will not be deposited onto the anode electrode 21. The same operation can be used when depositing other colors, thereby completing the formation of light-emitting materials of multiple colors. Moreover, there is no need for photolithography, etching, or other methods, nor is there a need to use FMM or other methods. Therefore, the manufacturing method of the display panel 100 can balance the resolution of the display panel 100 and the utilization rate of the light-emitting material.

[0056] Please refer to Figure 3 and Figure 4 In one embodiment, the contact angle of the droplet 40 before energization is a, and the contact angle of the droplet 40 after energization is b, satisfying: a > b;

[0057] In the orthographic projection in the first direction Z, the area of ​​the droplet 40 before energization is smaller than the area of ​​the anode electrode 21, and the area of ​​the droplet 40 after energization is greater than or equal to the area of ​​the anode electrode 21. The first direction Z is perpendicular to the drive backplate 10.

[0058] Optionally, in the orthographic projection in the first direction Z, the maximum spacing of the droplets 40 before energization in the second direction X is d1, and the size of the anode electrode 21 in the second direction X is d2, satisfying: d1≤0.5d2. d1 can specifically be 0.1d2, 0.2d2, 0.3d2, 0.4d2, 0.5d2, etc., without restriction.

[0059] By utilizing the electrowetting effect, the contact angle between the anode electrode 21 and the droplet 40 is changed. After energizing, the contact angle between the anode electrode 21 and the droplet 40 becomes smaller, meaning that the droplet will spread evenly on the surface of the anode electrode 21, thus blocking the anode electrode 21. It is necessary to ensure that the amount of droplet 40 spread evenly can completely cover the anode electrode 21 (the area after spreading is greater than or equal to the area of ​​the anode electrode 21). Therefore, the anode electrode 21 corresponding to the color of the light-emitting layer must not be completely blocked. The light-emitting layer at this position will be deposited onto the anode electrode 21, while the light-emitting layers of other colors will be blocked by the droplet 40 and will not be deposited onto the corresponding anode electrode 21, thus achieving accurate deposition of the light-emitting layer.

[0060] Please refer to Figure 3 In one embodiment, an isolation portion 50 is provided between two adjacent conductive structures 20, and the isolation portion 50 is disposed on the drive back plate 10.

[0061] Optionally, the material of the isolation part 50 may be metal (such as magnesium, silver, copper, aluminum, titanium and molybdenum, etc.) and alloys of these metals, inorganic oxides (such as aluminum oxide, silicon dioxide, etc.) and organic transparent materials (such as ITO, etc.), silicon nitride (SiNx), silicon oxide (SiO2), silicon oxynitride (SiON), etc., without limitation.

[0062] Optionally, the surface of the isolation section 50 facing away from the drive backplate 10 is higher than the surface of the anode electrode 21 facing away from the drive backplate 10.

[0063] Optionally, the fabrication process of the isolation portion 50 can be photolithography, etching, deposition, etc., without limitation. Specifically, an electron beam lithography or laser direct writing technology is used to fabricate a mask, photoresist is spin-coated on the driving backplate 10, exposed through the mask after pre-baking, and the isolation portion 50 pattern is formed after development; reactive ion etching (RIE) or plasma etching is used, and the sidewall morphology of the isolation pillar is precisely defined by controlling the gas flow rate (such as CF4, O2), power (50~500W) and time (seconds) to reduce carrier migration across pixels; or wet etching is used, which can remove material uniformly over a large area. It is necessary to control the concentration of the etching solution (such as HF acid concentration of 1%~5%), temperature (20℃~30℃) and time to avoid over-etching and breakage of the isolation portion 50.

[0064] The red (R), green (G), and blue (B) sub-pixels need to be physically separated by the isolation section 50 to prevent the light-emitting layer materials from interpenetrating during the evaporation process, which could lead to color mixing (color bleeding), decreased purity, or uneven brightness. The isolation section 50 can also block the electrical connection between adjacent anode electrodes 21 to avoid the risk of short circuits.

[0065] Please refer to Figure 3 In one embodiment, in the cross section of the first direction Z, the spacing between two adjacent isolation portions 50 gradually decreases in the direction away from the drive back plate 10.

[0066] Optionally, the cross-sectional shape of the isolation section 50 in the first direction Z can be trapezoidal, rectangular, etc., without limitation. Specifically, the trapezoid can be an isosceles trapezoid.

[0067] Optionally, the angle between the sidewall of the isolation section 50 and the driving backplate 10 is 60°-80°, specifically 60°, 65°, 70°, 75°, 80°, etc., without limitation. This range can balance the structural stability and etching uniformity of the isolation section 50. Too small an angle may cause sidewall collapse, while too large an angle may cause the risk of carrier migration across pixels.

[0068] Optionally, in the second direction X, the dimension of the surface of the isolation portion 50 facing the drive back plate 10 is L1, and the dimension of the surface of the isolation portion 50 facing away from the drive back plate 10 is L2, satisfying: L5 ≤ L2 / L1 ≤ 2.

[0069] The inclined side of the trapezoid can adjust the light propagation path by adjusting the angle, effectively suppressing light penetration from adjacent pixels. The gradual slope of the trapezoidal cross-section can balance the differences in thermal expansion coefficients of multi-layer stacked structures (such as the hole transport layer and electron transport layer of OLEDs), reducing the risk of interlayer peeling or cracking. In high-temperature and high-humidity environments, the trapezoidal structure can absorb some thermal stress, improving device reliability. The side of the trapezoidal isolation portion 50 can enhance the adhesion of the encapsulation layer. Combined with inorganic / organic stacked encapsulation, the water and oxygen barrier performance is improved, extending device lifespan.

[0070] Please refer to Figure 4 In one embodiment, each conductive structure 20 further includes an auxiliary electrode 22, with the anode electrode 21 and the auxiliary electrode 22 disposed at intervals on the drive backplate 10.

[0071] Optionally, the voltage level of the auxiliary electrode 22 can be controlled by an integrated circuit.

[0072] Optionally, the auxiliary electrode 22 may be made of metal (such as Cr, Mo) or transparent conductive oxide (such as ITO), etc., without limitation.

[0073] Optionally, the auxiliary electrode 22 is connected to the metal line 23 for transmitting control signals. The auxiliary electrode 22 can share the original metal layers of the display panel 100, such as the source / drain metal layer and the gate metal layer. If there is insufficient space in the original metal layers of the display panel 100, a separate metal layer can be fabricated for controlling the auxiliary electrode 22.

[0074] Optionally, the auxiliary electrode 22 and the anode electrode 21 are located in the same plane, and this plane is perpendicular to the first direction Z. In the projection of the first direction Z, the auxiliary electrode 22 can be located above, below, to the left, to the right, or in other positions of the anode electrode 21, without limitation.

[0075] Optionally, the auxiliary electrode 22 and the anode electrode 21 have the same positional relationship in multiple sub-pixels and multiple pixels.

[0076] Optionally, each auxiliary electrode 22 is connected to a corresponding metal line 23, so that each auxiliary electrode 22 is connected one-to-one with the electrode of each sub-pixel to control the signal of the auxiliary electrode 22, thereby avoiding the movement deviation of the droplet 40 caused by signal crosstalk.

[0077] With the auxiliary electrode 22, the display panel 100 of this invention no longer requires an isolation block. The isolation block requires multiple processes such as photolithography, etching, and deposition to form its physical structure. The auxiliary electrode 22, however, can be directly driven by voltage to move the droplet 40 through electrode array design (such as coplanar electrodes or 3D electrodes), eliminating the complex photolithography-etching process and reducing equipment cost and cycle time. The array of the auxiliary electrode 22 can be designed with sub-micron precision, adapting to high-resolution displays, while traditional isolation blocks are limited by photolithography precision, making it difficult to achieve the same density. Isolation blocks may fracture or detach due to uneven etching or material stress, while the auxiliary electrode 22, being a planar structure, has no risk of physical structural defects, improving device durability. The display panel 100 without an isolation block can reduce overall thickness and device weight, making it suitable for wearable devices, ultra-thin mobile phones, and other applications.

[0078] In one embodiment, steps S20 and S30 include:

[0079] Droplets 40 are formed on the anode electrode 21 of the partially conductive structure 20, and droplets 40 are formed on the auxiliary electrode 22 of the remaining partially conductive structure 20.

[0080] A current is applied to the anode electrode 21 of the partially conductive structure 20 so that the droplet 40 covers the energized anode electrode 21 of the conductive structure 20.

[0081] This configuration allows for the formation of the first light-emitting layer 31, where a portion of the first light-emitting layer 31 can be directly located on the anode electrode 21, while another portion of the first light-emitting layer 31 is located on the side of the droplet 40 facing away from the anode electrode 21. The first light-emitting layer 31 located on the droplet 40 can be removed in subsequent processes, thus enabling the first light-emitting layer 31 to be precisely formed on the anode electrode 21.

[0082] In one embodiment, step S40 further includes:

[0083] The droplet 40 on the auxiliary electrode 22 is moved so that the droplet 40 is located on the first light-emitting layer 31 of the anode electrode 21 of the same conductive structure 20;

[0084] Remove the first luminescent layer 31 covered by the undroplet 40.

[0085] Optionally, the method for moving the droplet 40 on the auxiliary electrode 22 is as follows: a voltage difference is generated between the anode electrode 21 and the auxiliary electrode 22 of the same conductive structure 20, and the electrowetting effect drives the droplet 40 to move from the auxiliary electrode 22 to the anode electrode 21. Specifically, by controlling the voltage difference between the anode electrode 21 and the auxiliary electrode 22, the droplet 40 will move from the high-voltage region to the low-voltage region under the drive of the potential gradient. The anode electrode 21 applies high voltage to attract the front end of the droplet 40, and the auxiliary electrode 22 reduces the voltage to reduce the adhesion force at the rear end, forming a net driving force to propel the droplet 40 forward.

[0086] Optionally, the method for removing the first luminescent layer 31 without droplet 40 coverage can be laser irradiation, specifically using a grid / parallel line pattern with a spot spacing of 50μm-200μm and a scanning speed of 10μm / s-500μm / s. Ultraviolet laser with a low energy density (0.3J / cm²) is used. 2 -0.5J / cm 2 Precise illumination of the driving backplate 10 pixels destroys the molecular structure of the organic light-emitting material in the first light-emitting layer 31 through photochemical effect, leaving only the part covered with droplets 40.

[0087] With the auxiliary electrode 22 installed, the display panel 100 no longer needs a pixel definition layer. Traditional pixel definition layers require complex processes such as photolithography, development, and etching to form. Removing the pixel definition layer eliminates the costs associated with photolithography, developer / etching solutions, and other related expenses. The pixel-definition layer-free design is compatible with continuous production processes such as high-speed inkjet printing and nanoimprinting, avoiding the intermittent exposure and development steps of traditional photolithography and increasing throughput per unit time.

[0088] Please refer to Figure 4In one specific implementation, taking the vapor deposition sequence of red sub-pixel-green sub-blue sub-pixel as an example, each pixel has three equally spaced conductive structures 20. Each conductive structure 20 includes an auxiliary electrode 22 and an anode electrode 21 spaced apart. The three conductive structures 20 are then respectively used to form a first light-emitting layer 31, a second light-emitting layer 32, and a third light-emitting layer 33. Droplets 40 are dropped onto the auxiliary electrode 22 corresponding to the red sub-pixel and the anode electrodes 21 corresponding to the green and blue sub-pixels. The anode electrodes 21 corresponding to the green and blue sub-pixels are energized, causing the droplets 40 to cover the corresponding anode electrodes 21. The anode electrode 21 corresponding to the red sub-pixel is not energized and is not blocked by the droplets 40, and a red first light-emitting layer 31 is formed by vapor deposition. After vapor deposition, the anode electrode 21 corresponding to the red sub-pixel is energized, causing the droplets 40 to move from the auxiliary electrode 22 to the corresponding anode electrode 21. Laser irradiation removes the first light-emitting layer 31 not blocked by the droplets 40 (including the portion of the droplets 40 facing away from the anode electrode 21 and the portion between pairs of sub-pixels), completing the fabrication of the first light-emitting layer 31 corresponding to the red sub-pixel. The green and blue sub-pixels are processed in a similar manner, with the anode electrodes 21 corresponding to the red and blue sub-pixels energized and the droplets 40... The anode electrode 21 corresponding to the red and blue sub-pixels is covered; the anode electrode 21 corresponding to the green sub-pixel is not energized, and the auxiliary electrode 22 corresponding to the green sub-pixel is energized, so that the droplet 40 moves to the auxiliary electrode 22 corresponding to the green sub-pixel; the green second light-emitting layer 32 is deposited by evaporation, the auxiliary electrode 22 corresponding to the green sub-pixel is de-energized, the anode electrode 21 corresponding to the green sub-pixel is energized, so that the droplet 40 moves to the anode electrode 21 corresponding to the green sub-pixel, and then the second light-emitting layer 32 without droplet 40 is removed by laser to complete the preparation of the second light-emitting layer 32 corresponding to the green sub-pixel; ensuring that the droplet 40 in the red and green sub-pixels is located on the anode electrode 21, the droplet 40 in the blue sub-pixel is driven to the corresponding auxiliary electrode 22, and the blue third light-emitting layer 33 is formed by evaporation, and the droplet 40 in the blue sub-pixel is driven from the auxiliary electrode 22 to the anode electrode 21, and the excess third light-emitting layer 33 is removed by laser irradiation.

[0089] In one embodiment, the droplet 40 includes one or more of n-hexane, cyclohexane, isooctane, n-pentane, n-heptane, cyclopentane, and isopentane.

[0090] Specifically, n-hexane has a boiling point of 69℃ and is chemically stable; cyclohexane has a boiling point of 80.7℃ and is chemically stable; and isooctane has a boiling point of 98℃-99℃ and is highly chemically stable.

[0091] The droplet 40 is a non-polar, non-hydrophilic, non-corrosive, and volatile organic liquid, which ensures that the droplet 40 can be completely and easily removed after preparation. Since the surfaces of the anode electrode 21 and the auxiliary electrode 22 are hydrophilic, after the droplet 40 is dropped in, a large contact angle will be formed between the droplet 40 and the surfaces of the anode electrode 21 and the auxiliary electrode 22, meaning that the liquid will stand upright on the surfaces of the anode electrode 21 and the auxiliary electrode 22.

[0092] In one embodiment, the droplet 40 further includes a light-shielding material, which includes one or more of carbon powder, graphite, activated carbon, manganese dioxide, chromium oxide, and iron tetroxide.

[0093] The light-shielding material with a high light-shielding rate can effectively block the exposure light source (such as ultraviolet light or deep ultraviolet light), protecting the underlying first light-emitting layer 31 from erosion by the developer or laser corrosion. When the exposure light source (such as ultraviolet light) irradiates the driving backplate 10, the area below the droplet 40 with the light-shielding material is not exposed due to being blocked, and the first light-emitting layer 31 remains intact. In the area not covered by the droplet 40 with the light-shielding material, the chemical properties of the first light-emitting layer 31 change after exposure (such as increased solubility), and it dissolves and is removed in the developer, leaving only the first light-emitting layer 31 on the target anode electrode 21.

[0094] Please refer to Figure 2 In one embodiment, it further includes:

[0095] Step S50: Flip the drive backplate 10 and de-energize the conductive structure 20 to remove all droplets 40 by gravity.

[0096] Step S60: Dry the driving backplate 10 and the first light-emitting layer 31.

[0097] Optionally, in step S50, the method of flipping the drive backplate 10 can be to use a robotic arm to grip and flip the drive backplate 10. Specifically, the robotic arm may include an actuator (arm, etc.), a drive system (such as a motor, hydraulic or pneumatic device), a control system (such as a PLC, microcontroller, etc.), and sensors. Due to the large contact angle between the droplet 40 and the anode electrode 21, the droplet 40 will easily detach from the anode electrode 21 under the action of gravity.

[0098] Optionally, in step S60, N2 is used to blow away the driving backplate 10 to completely evaporate the droplet 40 agent. After completion, other processes such as cathode formation and encapsulation are performed sequentially in the existing manner. Specifically, a cathode electrode is deposited on the first light-emitting layer 31 to form a complete electric field-driven light-emitting circuit, while ensuring electrical isolation between sub-pixels. The cathode electrode is uniformly deposited on the substrate by vacuum evaporation, magnetron sputtering, or chemical vapor deposition (CVD). The cathode electrode is a metal with high conductivity and low resistivity (such as aluminum or silver) or a transparent conductive oxide (such as ITO), etc., without limitation. After the cathode layer is deposited, plasma cleaning or UV ozone treatment is performed to remove residual contaminants on the surface and improve the adhesion between the encapsulation material and the driving backplate 10. Organic-inorganic composite encapsulation materials are used, such as epoxy resin, silicone (organic layer) and SiO2, SiN. X (Inorganic layers) are stacked alternately. The inorganic layers are used to provide high barrier properties (water vapor transmission rate <10). -5 g / m 2 The organic layer (·day) is used to relieve stress and fill defects. The encapsulation material can be applied by spin coating, spraying, or lamination, followed by UV curing or thermal curing.

[0099] The present invention provides an electronic device, including a housing and a display panel 100 manufactured by the manufacturing method of any of the foregoing embodiments or the display panel 100 manufactured by any of the foregoing embodiments, wherein the display panel 100 is housed in the housing.

[0100] Optionally, electronic devices may also include control boards, interfaces, power supplies, and other components.

[0101] The control board is suitable for receiving signals from external devices (such as video signals) and converting them into signals that the drive circuit can understand. The control board can also be used for image processing to optimize the display effect of the image.

[0102] The interface can be HDMI, DisplayPort, USB-C, etc., without restriction, so that electronic devices can connect to external devices (such as computers, game consoles, media players, etc.).

[0103] The enclosure is designed to provide physical protection and support for electronic devices, while protecting internal components from dust, moisture, and other external factors.

[0104] The power supply is suitable for providing the power required by electronic devices, and the power supply can be a built-in power adapter or a battery.

[0105] Other components may include touchscreens, speakers, cameras, sensors, etc.

[0106] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0107] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel includes multiple pixels, and each pixel includes multiple sub-pixels. The method for manufacturing the display panel includes: Multiple spaced conductive structures are formed on the driving backplane, each conductive structure constituting a sub-pixel, and the conductive structure includes an anode electrode. A droplet is formed on each of the conductive structures; A portion of the conductive structure is energized; A first light-emitting layer is formed on the drive backplate; In this configuration, the contact angle between the conductive structure and the droplet decreases after energization, so that the droplet covers the anode electrode of the conductive structure after energization. In the conductive structure after energization, the first light-emitting layer is disposed on the droplet; in the conductive structure without energization, the first light-emitting layer is directly disposed on the anode electrode.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The contact angle of the droplet before energization is a, and the contact angle of the droplet after energization is b, satisfying: a > b; In the orthographic projection in the first direction, the area of ​​the droplet before energization is smaller than the area of ​​the anode electrode, and the area of ​​the droplet after energization is greater than or equal to the area of ​​the anode electrode. The first direction is perpendicular to the drive backplate.

3. The method for manufacturing a display panel according to claim 2, characterized in that, An isolation portion is provided between two adjacent conductive structures, and the isolation portion is disposed on the drive back plate.

4. The method for manufacturing a display panel according to claim 3, characterized in that, In the cross-section in the first direction, the spacing between two adjacent isolation portions gradually decreases in the direction away from the drive backplate.

5. The method for manufacturing a display panel according to claim 1, characterized in that, Each of the conductive structures further includes an auxiliary electrode, with the anode electrode and the auxiliary electrode disposed at a distance from each other on the drive backplate.

6. The method for manufacturing a display panel according to claim 5, characterized in that, Forming droplets on each of the conductive structures and energizing a portion of the conductive structures includes: The droplet is formed on the anode electrode of a portion of the conductive structure, and the droplet is formed on the auxiliary electrode of the remaining portion of the conductive structure; A portion of the conductive structure is energized at its anode electrode so that the droplet covers the energized anode electrode of the conductive structure.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The first light-emitting layer is formed on the driving backplate, and the system further includes: Move the droplet on the auxiliary electrode so that the droplet is located on the first light-emitting layer of the anode electrode of the same conductive structure; Remove the first luminescent layer that is not covered by the droplets.

8. The method for manufacturing a display panel according to claim 1, characterized in that, The droplets include one or more of n-hexane, cyclohexane, isooctane, n-pentane, n-heptane, cyclopentane, and isopentane; and / or The droplet also includes a light-shielding material, which includes one or more of the following: carbon powder, graphite, activated carbon, manganese dioxide, chromium oxide, and iron tetroxide.

9. The method for manufacturing a display panel according to any one of claims 1 to 8, characterized in that, Also includes: Flip the drive backplate and de-energize the conductive structure to remove all the droplets by gravity. Dry the drive backplate and the first light-emitting layer.

10. A display panel, characterized in that, The display panel is manufactured using the manufacturing method of any one of claims 1 to 9, comprising: Drive backplane; Multiple conductive structures are spaced apart on the drive backplate; A first light-emitting layer is disposed on a portion of the conductive structure.

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