Glass polishing auxiliary material cooling correction method based on digital twin thermal field simulation
By using a digital twin thermal field simulation model, boundary conditions are corrected in real time and the processing sequence is optimized, which solves the problem of thermal field mapping distortion in existing technologies, realizes high-precision thermal field prediction and cooling compensation, and ensures the stability and efficiency of the polishing process.
Patent Information
- Application Number
- CN202610527789.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-21
- Publication Date
- 2026-07-24
- Estimated Expiration
- 2046-04-21
AI Technical Summary
Existing computational simulation models lack real-time numerical representation of nonlinear thermal accumulation in the physical computation domain and dynamic iteration mechanism for boundary conditions. This results in severe distortion in the mapping between virtual space and physical processing, failing to provide accurate numerical reference for cooling correction. Furthermore, the CNC path generation algorithm fails to construct a time-series constraint operator that integrates the material thermal diffusivity coefficient and the viscoelastic constitutive model of the polishing pad. This makes it difficult to solve for the optimal processing sequence in complex constraint space, resulting in the inability to effectively predict and avoid the risk of thermal failure.
By constructing a digital twin thermal field simulation model, the machine tool spindle load and polishing fluid rheological parameters are collected in real time to correct the boundary conditions, generate a three-dimensional thermal energy density map, and calculate the cooling time of the thermal energy region by combining the springback characteristics of the polishing pad and the thermal diffusivity of the workpiece. A time-series constraint matrix is constructed, the machining sequence is optimized using a genetic algorithm, a thermally optimized CNC program is generated, and the glazing risk index is calculated in real time through the synchronous evolution of the digital twin and the physical entity, triggering cooling compensation.
It achieves high-precision prediction of thermal field evolution, maintains the micropore activity of the polishing pad surface, extends the service life of auxiliary materials, ensures stable removal rate, eliminates surface damage caused by thermal revisiting, and achieves a balance between processing accuracy and production efficiency.