A collection device for a chip manufacturing process

Abstract

The application belongs to the technical field of chip manufacturing, and discloses a collecting device for chip manufacturing process, which comprises a shell and a collector. The upper end of the shell is provided with an inlet, and the collector comprises a cover shell and an air outlet pipe. The application has the following advantages and effects: the gas mixture at the inlet is heated and uniformly dispersed by the heating and uniform air diffuser, so that condensation and blockage at the inlet are avoided. The gas mixture is guided by the outer and inner guide plates, enters the inside of the cover shell from the perforations, enters the air outlet pipe through the holes of the condensation collecting plate, and is discharged along the outlet. In this process, the gas mixture is condensed and forms condensate in the inside of the shell, so that the gas mixture generated in the chip manufacturing process is condensed and collected. The application greatly reduces the dependence on foreign imported equipment and parts, and greatly reduces the production cost of chips in China.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a chip manufacturing process collection device. Background Technology

[0002] Physical vapor deposition (PVD) is commonly used in semiconductor chip manufacturing. It employs physical methods to vaporize a material source surface into gaseous atoms or molecules, which are then deposited onto a substrate surface using low-pressure gas. This process offers advantages such as simplicity, uniform and dense film formation, and strong adhesion to the substrate. However, when PVD is applied to semiconductor manufacturing, a high-temperature gas mixture is generated within the reaction system, requiring condensation and collection. Currently, the direct procurement cost of semiconductor equipment and components used in chip manufacturing can reach hundreds of thousands of US dollars. Therefore, this paper proposes a collection device specifically designed for chip manufacturing processes. Summary of the Invention

[0003] The purpose of this invention is to provide a collection device for chip manufacturing processes, which has the effect of gas condensation and collection specifically for chip manufacturing processes.

[0004] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a collection device for chip manufacturing process, including a housing and a collector located inside the housing, the upper end of the housing is provided with an inlet, the collector includes a cover and an exhaust pipe, the upper end of the exhaust pipe is located inside the cover, the lower end of the exhaust pipe is an outlet, and the cover is provided with a plurality of perforations.

[0005] By adopting the above technical solution, the high-temperature gas mixture enters from the inlet, is extracted from the outlet pipe, flows through the inside of the shell and collector, and some of the substances condense into solid substances during the process, thus completing the collection.

[0006] A further feature of the present invention is that a second channel is formed between the inner sidewall of the outer shell and the outer sidewall of the cover, the inner sidewall of the outer shell is provided with a plurality of outer guide plates, and the outer sidewall of the cover is provided with a plurality of inner guide plates.

[0007] By adopting the above technical solution, during the process of the gas mixture flowing through the second channel, the outer guide plate and the inner guide plate play a role in guiding the airflow. At the same time, the solid substances formed by condensation in the gas mixture adhere to the inner wall of the outer shell, the outer wall of the cover, the surface of the outer guide plate, and the surface of the inner guide plate.

[0008] A further configuration of the present invention is that the outer guide plate is vertically arranged and / or the inner guide plate is vertically arranged.

[0009] A further configuration of the present invention is that the collector further includes a flow deflector, the flow deflector being located on the side wall of the housing, and the flow deflector being arranged intersecting with the inner flow guide plate.

[0010] By adopting the above technical solution, the baffle plate is used to disturb the gas mixture flowing through it. Without affecting the overall flow direction of the gas, it makes the airflow turbulent, increases the contact between the gas mixture and the surface of the inner guide plate, the surface of the outer guide plate, the outer surface of the cover, and the inner surface of the outer shell, and improves the condensation and collection effect.

[0011] A further feature of the present invention is that the spoiler is horizontally arranged and / or each of the spoilers has several interference holes.

[0012] A further configuration of the present invention is that the perforation is located on the side wall of the housing and / or the perforation is located on the bottom wall of the housing, and the upper end of the air outlet pipe is higher than the perforation.

[0013] By adopting the above technical solution, the gas mixture first flows from top to bottom along the second channel, enters the inside of the casing through the perforation, flows from bottom to top inside the casing, and finally enters the outlet pipe from the upper end of the outlet pipe and is discharged along the outlet pipe.

[0014] A further feature of the present invention is that the collector further includes a plurality of condensation collection plates located inside the housing, and the condensation collection plates are provided with a plurality of channels penetrating the condensation collection plates.

[0015] By adopting the above technical solution, the condensation collection plate is used to increase the condensation contact area of ​​the gas mixture and improve the condensation effect. The channels are used to allow gas to pass through.

[0016] A further feature of the present invention is that a first channel is formed between the upper end of the collector and the upper inner wall of the outer shell, the inlet is connected to the first channel, a heating fan is provided below the inlet, and the heating fan is also connected to an extended heat-conducting plate. The outer shell includes a shell, a top cover plate, and a sealing ring located between the top cover plate and the shell. A cooling channel is formed inside the top cover plate, and the cooling channel is used to circulate a cooling medium to cool the area around the sealing ring.

[0017] By adopting the above technical solution, the heating and air distribution device has at least two functions: First, it heats the gas mixture to maintain it at a high temperature, preventing excessive condensation and blockage at the inlet. Second, it evenly guides the gas mixture entering from the inlet to the surrounding area, ensuring a more uniform flow into the second channel.

[0018] A further provision of the present invention includes a weighing system for weighing the shell, the collector, and the condensate deposits, the weighing system comprising a weighing sensor and an industrial control computer.

[0019] By adopting the above technical solution, the present invention is equipped with a load-bearing sensor and an industrial control computer. By weighing through the weighing system and deducting the design weight of the shell and collector, the mass of the condensed material can be obtained. The difference between the mass and the maximum condensation deposition amount designed by the collection device can be determined to determine whether a new collection device needs to be replaced.

[0020] A further configuration of the present invention includes an air inlet pipe, a first flexible hose, an adjusting pipe, and a second flexible hose connected in sequence. The second flexible hose is connected to the inlet, and the outlet is connected to a third flexible hose and an exhaust pipe. The collecting device also includes an adjusting component for adjusting the raising and lowering of the adjusting pipe. An adjusting rope is fixed to the inner wall of the adjusting pipe. The adjusting rope passes downward through the second flexible hose and the inlet and is fixed to the heating and air distribution device. The heating and air distribution device is fixed with at least three vertical guide posts. At least three vertical guide cylinders are fixed to the inner wall of the outer shell. The upper end of the guide post is inserted into the guide cylinder. A movable plunger is fixed to the upper end of the guide post, and a retaining ring for blocking the movable plunger is fixed to the lower end of the guide cylinder.

[0021] By adopting the above technical solution, to reduce interference from the inlet and outlet connecting pipes during weighing, this invention equips the inlet with a second flexible hose and the outlet with a third flexible hose, reducing interference and errors caused by the pipeline system during weighing. Secondly, the large volume of high-temperature gas mixture flowing through the inlet impacts the heating fan, creating a downward impact force. If the heating fan is fixed to the casing or collector, this impact force is transmitted to the casing or collector, causing significant errors in weighing. Furthermore, the flow rate of the high-temperature gas mixture at the inlet is not constant but varies, meaning the impact force on the heating fan also varies, further affecting the accuracy of the weighing system.

[0022] Therefore, to improve the accuracy of weighing condensate deposits in the weighing system, this invention is equipped with an adjusting component and an adjusting rope. At the time when weighing is required, the industrial computer controls the adjusting component to raise the adjusting tube. The adjusting tube, via the adjusting rope, pulls the heating fan a short distance, causing the movable plunger on the guide column of the heating fan a short distance to rise and move away from the retaining ring. At this time, the impact force on the heating fan a short distance is transmitted to the adjusting tube through the adjusting rope, instead of directly to the outer shell or collector, resulting in smaller errors and higher accuracy in the weighing system. After weighing, the industrial computer controls the adjusting component to lower the height of the adjusting tube. The heating fan a short distance descends under its own weight, and the movable plunger on the guide column is stopped by the retaining ring.

[0023] The beneficial effects of this invention are as follows: This invention heats and evenly disperses the gas mixture at the inlet using a heated air distributor, preventing excessive condensation and blockage at the inlet. The gas mixture is guided by outer and inner guide plates, then enters the casing through perforations, passes through the channels of the condensation collection plate, and enters the outlet pipe, exiting through the outlet. During this process, the gas mixture condenses, forming condensate inside the casing, thus achieving the function of condensing and collecting the gas mixture generated during chip manufacturing. This invention greatly reduces our dependence on imported equipment and parts, significantly lowering the production cost of chips in my country. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention.

[0025] Figure 2 This is a schematic diagram of the internal structure of the outer shell of the present invention.

[0026] Figure 3 This is a schematic diagram of the internal structure of the collector of the present invention.

[0027] Figure 4 This is a schematic diagram of the structure between the guide cylinder and the guide column of the present invention.

[0028] In the diagram, 1. Outer shell; 11. Shell; 12. Top cover plate; 121. Cooling channel; 13. Guide cylinder; 131. Baffle ring; 14. Outer guide plate; 15. Inlet; 2. Collector; 21. Cover; 211. Perforation; 22. Exhaust pipe; 23. Inner guide plate; 24. Baffle plate; 241. Baffle hole; 25. Condensation collection plate; 251. Channel; 3. Heating and air distribution device; 31. Guide column; 32. Movable plunger; 4. Heating extension plate; 5. First channel; 6. Second channel; 7. Third channel; 8. Inlet pipe; 81. First hose; 82. Adjusting pipe; 83. Second hose; 84. Adjusting rope; 9. Third hose; 91. Extraction pipe. Detailed Implementation

[0029] A collection device for chip manufacturing processes, such as Figures 1 to 4As shown, the device includes an outer shell 1 and a collector 2 located inside the outer shell 1. The outer shell 1 includes an upper cover plate 12, a housing 11, and a sealing ring installed between the upper cover plate 12 and the housing 11. A cooling channel 121 is formed inside the upper cover plate 12, which is used to circulate a cooling medium to cool the area around the sealing ring. The collector 2 includes a cover 21. A first channel 5 is formed between the upper end of the cover 21 and the upper inner wall of the outer shell 1. An inlet 15 is provided on the outer shell 1, which is connected to the first channel 5. A second channel 6 is formed between the four side walls of the cover 21 and the four side walls of the inner wall of the outer shell 1. A certain distance is formed between the bottom of the cover 21 and the bottom of the outer shell 1. A through hole 211 is provided at the lower end of the bottom wall and the side wall of the cover 21. A third channel 7 is formed inside the cover 21, and the second channel 6 and the third channel 7 are connected through the through hole 211.

[0030] A heating and air distribution device 3 is installed in the first channel 5. The upper end of the heating and air distribution device 3 is connected to the inlet 15. The heating and air distribution device 3 is used to heat the gas mixture entering at the inlet 15 and disperse and guide it to the surrounding area so that it can smoothly enter the second channel 6 from the first channel 5. The heating and air distribution device 3 is connected to an extended heat-conducting plate to expand the heating area of ​​the gas.

[0031] Multiple external guide plates 14 are provided on the inner sidewall of the outer casing 1, and multiple inner guide plates 23 and multiple baffles 24 are fixed on the outer sidewall of the cover 21. The external guide plates 14, inner guide plates 23, and baffles 24 are all located within the second channel 6. The external guide plates 14 and inner guide plates 23 are vertically arranged, while the baffles 24 are horizontally arranged, with the inner guide plates 23 and baffles 24 arranged intersecting each other. The baffles 24 have elongated baffle holes 241. The inner guide plates 23 and outer guide plates 14 are used to guide the gas mixture downwards, while the baffles 24 are used to create turbulence and improve the condensation effect.

[0032] Collector 2 includes an outlet pipe 22 and multiple condensation collection plates 25. The upper end of the outlet pipe 22 is located inside the casing 21, and is higher than the perforation 211. The outlet pipe 22 passes downward through the casing 21 and the outer shell 1, and is located outside the outer shell 1. The lower end of the outlet pipe 22 is the outlet. The condensation collection plates 25 are located inside the casing 21. Some of the condensation collection plates 25 are horizontally arranged, and some are vertically arranged, intersecting each other. The condensation collection plates 25 have multiple channels 251 that penetrate the condensation collection plates 25, allowing gas to pass through. The gas mixture in the second channel 6 passes through the perforation 211 and enters the third channel 7. After passing through the channels 251, it enters the interior of the outlet pipe 22 from the upper end and exits from the lower end of the outlet pipe 22.

[0033] Gas flow direction: The gas mixture enters the first channel 5 from the inlet, is heated by the heating fan 3 and the extended heating plate, and is guided to the surrounding area, entering the second channel 6. Under the combined action of the outer guide plate 14, the inner guide plate 23 and the baffle plate 24, it flows, passes through the perforation 211 and enters the third channel 7, and is discharged from the outlet pipe 22. During this process, some substances in the gas mixture condense on the inner wall of the outer shell 1, the surface of the cover 21, the surface of the outer guide plate 14, the surface of the inner guide plate 23, the surface of the baffle plate 24 and the surface of the condensation collection plate 25 to form solid condensate.

[0034] The chip manufacturing process collection device also includes a weighing system for weighing the casing 1, collector 2, and condensate deposits. The weighing system includes a weighing sensor and an industrial control computer, with the casing 1 connected to the weighing sensor. The collection device also includes an inlet pipe 8, a first flexible hose 81, an adjusting pipe 82, and a second flexible hose 83 connected in sequence. The second flexible hose 83 is connected to the inlet 15, and the outlet is connected to a third flexible hose 9 and an exhaust pipe 91. The collection device also includes an adjusting component for adjusting the raising and lowering of the adjusting pipe 82. The adjusting component can be of the form of a hydraulic cylinder, pneumatic cylinder, or other existing structures, as long as it can adjust the raising and lowering of the pipe. An adjusting rope 84 is fixed to the inner wall of the adjusting pipe 82. The adjusting rope 84 passes downward through the second flexible hose 83 and the inlet 15 and is fixed to the heating and air distribution device 3. The heating and air distribution device 3 is fixed with at least three vertical guide posts 31, and at least three vertical guide cylinders 13 are fixed to the inner wall of the casing 1. There is a one-to-one correspondence between the guide posts 31 and the guide cylinders 13. The upper end of the guide post 31 is inserted into the guide cylinder 13. A movable plunger 32 is fixed at the upper end of the guide post 31, and a retaining ring 131 for blocking the movable plunger 32 is fixed at the lower end of the guide cylinder 13.

[0035] At the time when weighing is required, the industrial computer controls the adjusting mechanism to raise the adjusting tube 82. The adjusting tube 82, through the adjusting rope 84, pulls the heating air distributor 3 a short distance, causing the movable plunger 32 on the guide post 31 of the heating air distributor 3 to rise and move away from the retaining ring 131. At this time, the impact force on the heating air distributor 3 is transmitted to the adjusting tube 82 through the adjusting rope 84, and is not directly transmitted to the outer shell 1 or the collector 2, resulting in smaller errors and higher accuracy in the weighing system. After weighing is completed, the industrial computer controls the adjusting mechanism to lower the height of the adjusting tube 82. The heating air distributor 3 descends under its own weight, and the movable plunger 32 on the guide post 31 descends to the retaining ring 131 and is blocked by the retaining ring 131.

Claims

1. A collection device for a chip manufacturing process, characterized in that: Includes an outer shell (1) and a collector (2) located inside the outer shell (1). The upper end of the outer shell (1) is provided with an inlet (15). The collector (2) includes a cover (21) and an air outlet (22). The upper end of the air outlet (22) is located inside the cover (21), and the lower end of the air outlet (22) is the outlet. The cover (21) has several perforations (211).

2. The collection device for a chip manufacturing process according to claim 1, characterized in that: A second channel (6) is formed between the inner sidewall of the outer shell (1) and the outer sidewall of the cover (21). The inner sidewall of the outer shell (1) is provided with a plurality of outer guide plates (14), and the outer sidewall of the cover (21) is provided with a plurality of inner guide plates (23).

3. The collection device for a chip manufacturing process according to claim 2, characterized in that: The outer guide plate (14) is vertically arranged and / or the inner guide plate (23) is vertically arranged.

4. A collection device for a chip manufacturing process according to claim 2 or 3, characterized in that: The collector (2) also includes a spoiler plate (24), which is located on the side wall of the cover (21) and is arranged crosswise with the inner guide plate (23).

5. The collection device for a chip manufacturing process according to claim 4, characterized in that: The spoiler (24) is horizontally positioned and / or each of the spoilers (24) has several interference flow holes (241).

6. The collection device for a chip manufacturing process according to claim 1, characterized in that: The perforation (211) is located on the side wall of the cover (21) and / or the perforation (211) is located on the bottom wall of the cover (21), and the upper end of the air outlet pipe (22) is higher than the perforation (211).

7. The collection device for a chip manufacturing process according to claim 1, characterized in that: The collector (2) also includes a plurality of condensation collection plates (25) located inside the housing (21), and the condensation collection plates (25) are provided with a plurality of channels (251) penetrating the condensation collection plates (25).

8. The collection device for a chip manufacturing process according to claim 1, characterized in that: A first channel (5) is formed between the upper end of the collector (2) and the inner upper wall of the outer shell (1). The inlet (15) is connected to the first channel (5). A heating fan (3) is provided below the inlet (15). The heating fan (3) is also connected to an extended heat-conducting plate. The outer shell (1) includes a shell (11), an upper cover plate (12), and a sealing ring located between the upper cover plate (12) and the shell (11). A cooling channel (121) is formed in the upper cover plate (12). The cooling channel (121) is used to circulate cooling medium to cool the area around the sealing ring.

9. The collection device for a chip manufacturing process according to claim 8, characterized in that: It also includes a weighing system for weighing the shell (1), the collector (2) and the condensate deposits, the weighing system including a weighing sensor and an industrial control computer.

10. A collection device for a chip manufacturing process according to claim 9, characterized in that: It also includes an air inlet pipe (8), a first hose (81), an adjusting pipe (82), and a second hose (83) connected in sequence. The second hose (83) is connected to the inlet (15). The outlet is connected to a third hose (9) and an exhaust pipe (91). The collection device also includes an adjusting component, which is used to adjust the raising and lowering of the adjusting pipe (82). An adjusting rope (84) is fixed to the inner wall of the adjusting pipe (82). The adjusting rope (84) passes down through the second hose (83) and the inlet (15) and is fixed to the heating and air distribution device (3). The heating and air distribution device (3) is fixed with at least three vertical guide posts (31). At least three vertical guide cylinders (13) are fixed to the inner wall of the outer shell (1). The upper end of the guide post (31) is inserted into the guide cylinder (13). A movable plunger (32) is fixed to the upper end of the guide post (31). A retaining ring (131) for blocking the movable plunger (32) is fixed to the lower end of the guide cylinder (13).

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