Air path structure of solder printing device, solder printing device and control method

Abstract

This invention discloses the air path structure, solder printing equipment, and control method of a solder printing device. The metal solder printing equipment includes at least a feed tube assembly with a nozzle at its bottom. It includes a main air path, one end of which is connected to the feed tube assembly, and the other end connected to an external air source to provide the extrusion force for pushing the molten solder in the feed tube assembly. A branch air path is also included, one end connected to the main air path and the other end extending to the nozzle outlet of the feed tube assembly. The outlet direction of the branch air path is perpendicular to the outlet direction of the nozzle of the feed tube assembly, forming a protective air curtain when the external air source gas introduced into the branch air path blows towards the nozzle sidewall. By setting a main air path and a branch air path connected to the main air path on the feed tube assembly, and making the outlet direction of the branch air path perpendicular to the nozzle outlet direction, a protective air curtain is formed around the nozzle sidewall. This avoids direct impact of the airflow on the molten solder, preventing splashing or trajectory deviation, and effectively isolates oxygen and reduces solder oxidation.

Description

Technical Field

[0001] This invention belongs to the field of solder printing, specifically, it relates to the air path structure of solder printing equipment, solder printing equipment and control method. Background Technology

[0002] Additive manufacturing of metal solders (such as indium, indium silver, gold tin, etc.) has important applications in semiconductor packaging, infrared device casing sealing, wafer-level packaging, and other fields. This type of technology typically heats the solder to a molten state and uses pneumatics to extrude the molten solder from a nozzle, achieving direct solder writing printing with micron-level precision.

[0003] During the printing process, molten solder readily undergoes an oxidation reaction upon contact with oxygen in the air, generating oxide inclusions. This leads to defects such as porosity and microcracks within the printed solder, reducing its strength, conductivity, and fatigue resistance. Therefore, existing technologies often use inert gases (such as nitrogen or argon) to protect the nozzle exit area and isolate it from oxygen.

[0004] However, existing gas protection solutions have the following shortcomings: First, the gas path driving solder extrusion and the protective gas path are usually independent of each other, requiring separate gas sources, valves and pipelines, which leads to complex equipment structure, increased costs and inconvenient maintenance; Second, in some solutions, the protective gas is blown out along the solder extrusion direction (coaxial or nearly coaxial), and the high-speed airflow can easily impact the molten solder droplets, causing solder splashing and printing trajectory deviation, affecting printing accuracy and consistency.

[0005] Therefore, there is an urgent need for a gas path structure that is simple in structure, highly integrated, and can effectively avoid the interference of protective gas with the solder printing process, so as to improve the performance and reliability of metal solder printing equipment.

[0006] In view of this, the present invention is proposed. Summary of the Invention

[0007] The technical problem to be solved by this invention is to overcome the shortcomings of the prior art and provide an air path structure for solder printing equipment. By setting a main air path and a branch air path connected to the main air path on the material tube assembly, and making the outlet direction of the branch air path perpendicular to the nozzle outlet direction, the two work together to share the same external air source and form a protective air curtain around the nozzle sidewall. This not only avoids the airflow directly impacting the molten solder, causing splashing or trajectory deviation, but also effectively isolates oxygen and reduces solder oxidation, thereby simplifying the air path structure while improving printing accuracy and welding quality.

[0008] Another object of the present invention is to provide a solder printing device.

[0009] Another objective of this invention is to provide a control method.

[0010] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by the present invention is: to provide an air path structure for a metal solder printing device, the metal solder printing device including at least a feed tube assembly, and a nozzle disposed at the bottom of the feed tube assembly, including, The main air passage is connected to the feed tube assembly at one end and to an external air source at the other end, which is used to provide the extrusion force to push the molten solder in the feed tube assembly. The gas distribution path is connected to the main gas path at one end and extends to the nozzle outlet of the material pipe assembly at the other end. The gas outlet direction of the gas distribution path is perpendicular to the gas outlet direction of the nozzle of the material pipe assembly. It is used to form a protective air curtain when the gas from the external gas source introduced into the gas distribution path blows towards the side wall of the nozzle.

[0011] Furthermore, it also includes at least one speed control valve, which is located in the main gas path and / or the branch gas path, for controlling the gas flow rate of the external gas source entering the main gas path or the branch gas path.

[0012] The present invention also provides a metal solder printing device having the above-described gas path structure, and further includes a fixed base plate disposed at the bottom of the feed tube assembly, the fixed base plate having a through hole, the nozzle being assembled in the through hole, and an annular gap being left between the two. The outlet direction of the gas distribution path is perpendicular to the conduction direction of the annular gap.

[0013] Furthermore, the outer periphery of the nozzle gradually narrows from top to bottom into a cone shape, and the wall of the through hole gradually slopes from top to bottom toward the central axis to form a guide surface that matches the outer periphery of the nozzle.

[0014] Furthermore, the angle of the hole wall gradually increases from top to bottom towards the central axis, forming a continuous and smooth concave surface.

[0015] Furthermore, a heating sleeve is provided around the outer periphery of the feed tube assembly, and the inner wall of the heating sleeve is provided with a recessed channel that gradually extends toward the nozzle outlet of the feed tube assembly. The heating jacket and the material tube assembly are assembled to form the gas distribution path; Alternatively, a vent pipe may be installed within the recessed channel to form the aforementioned air distribution path.

[0016] This invention also provides a control method for the metal solder printing equipment described above. A weight sensor is provided on one side of the feed tube assembly to detect the remaining amount of molten solder inside the feed tube assembly. The specific control method steps are as follows: The remaining amount S of molten solder inside the feed tube assembly is detected and obtained in real time by a weight sensor. The speed control valve is adjusted in real time based on the remaining amount S of the molten solder.

[0017] Further, determine the difference between the remaining amount S of the molten solder inside the feed tube assembly and the preset minimum remaining amount S0 of the molten solder; When the remaining amount S is greater than or equal to the preset minimum remaining amount S0 of molten solder, the speed control valve gradually reduces the gas flow rate of the external air source; when the remaining amount S is less than the preset minimum remaining amount S0 of molten solder, the speed control valve is adjusted to the minimum preset opening.

[0018] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: (1) The present invention sets a main air path and a branch air path connected to the main air path on the material tube assembly, and makes the air outlet direction of the branch air path perpendicular to the nozzle outlet direction. The two work together to share the same external air source and form a protective air curtain around the nozzle sidewall. This not only avoids the airflow directly impacting the molten solder, causing splashing or trajectory deviation, but also effectively isolates oxygen and reduces solder oxidation, thereby simplifying the air path structure while improving printing accuracy and welding quality.

[0019] (2) By setting a speed regulating valve on the main gas line, the gas flow rate in the main gas line can be adjusted, and the extrusion pressure applied to the molten solder in the material tube assembly can be changed, thereby precisely controlling the rate at which the solder is extruded from the nozzle; by setting a speed regulating valve on the distribution gas line, the gas flow rate of the protective gas curtain at the nozzle outlet can be changed to adapt to the needs of different solders and different printing environments for anti-oxidation protection.

[0020] (3) The present invention provides a through hole on the fixed base plate, and an annular gap is left between the outer wall of the nozzle and the inner wall of the through hole. The airflow is smoothly turned and flows along the side wall of the nozzle by the guiding effect of the annular gap itself, thereby avoiding the gas directly impacting the molten solder at the nozzle outlet. At the same time, the design of the annular gap ensures that the protective gas can escape evenly from the entire circumference of the nozzle, forming a complete gas curtain barrier and effectively isolating external oxygen.

[0021] (4) By setting up a speed control valve and a weight sensor, the present invention can compensate for the change in extrusion pressure demand caused by the reduction of solder by dynamically adjusting the opening of the speed control valve according to the remaining amount of solder.

[0022] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0023] The accompanying drawings, as part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention, but do not constitute an undue limitation of the invention. Obviously, the drawings described below are merely some embodiments, and those skilled in the art can obtain other drawings based on these drawings without creative effort. In the drawings: Figure 1 This is a schematic diagram of the air circuit structure of the solder printing device of the present invention; Figure 2 This is a cross-sectional view of the air circuit structure of the solder printing device of the present invention; Figure 3 This is a flowchart of the control method of the present invention; Figure 4 This is a flowchart of the control method of the present invention.

[0024] In the picture: 1. Feed tube assembly; 11. Nozzle; 2. Fixed base plate; 3. Heating jacket; 4. Through hole; 5. Main air passage; 6. Distribution air passage; 7. Speed ​​control valve.

[0025] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the invention in any way, but rather to illustrate the concept of the invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0027] In the description of this invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] like Figures 1 to 2 As shown, the present invention provides an air path structure for a metal solder printing device. The metal solder printing device includes at least a feed tube assembly 1, and a nozzle 11 is provided at the bottom of the feed tube assembly 1, comprising: The main air passage 5 is connected to the material tube assembly 1 at one end and to an external air source at the other end, which is used to provide the extrusion force to push the molten solder in the material tube assembly 1. The gas distribution path 6 is connected at one end to the main gas path 5 and at the other end to the outlet of the nozzle 11 of the material pipe assembly 1. The outlet direction of the gas distribution path 6 is perpendicular to the outlet direction of the nozzle 11 of the material pipe assembly 1. It is used to form a protective air curtain when the gas from the external gas source introduced into the gas distribution path 6 blows towards the side wall of the nozzle 11.

[0030] The metal solder printing equipment includes at least a feed tube assembly 1 for containing molten solder, and a nozzle 11 for extruding the molten solder is provided at the bottom of the feed tube assembly 1. The gas path structure includes a main gas path 5 and a branch gas path 6. One end of the main gas path 5 is connected to the feed tube assembly 1, and the other end is connected to an external gas source. The main gas path 5 is used to provide the driving force to push the molten solder in the feed tube assembly 1 out of the nozzle 11, that is, to apply pressure to the molten solder by introducing gas.

[0031] One end of the air distribution path 6 is connected to the main air path 5, thus sharing the same external air source with the main air path 5. The other end of the air distribution path 6 extends to the nozzle 11 outlet of the material pipe assembly 1.

[0032] Specifically, the outlet direction of the gas distribution path 6 is set perpendicular to the outlet direction of the nozzle 11 of the feed tube assembly 1, meaning that the gas ejected from the gas distribution path 6 is blown perpendicular to the solder extrusion direction toward the side wall of the nozzle 11. When gas from an external gas source is introduced into the gas distribution path 6, the gas blown toward the side wall of the nozzle 11 forms a protective gas curtain around the nozzle 11 outlet. This protective gas curtain effectively isolates oxygen in the nozzle 11 outlet area, keeping the molten solder in an inert gas atmosphere during extrusion and subsequent curing, thereby reducing solder oxidation and improving print quality.

[0033] Meanwhile, because the air outlet direction is perpendicular to the material outlet direction, the airflow is prevented from directly impacting the molten solder droplets, thus preventing solder splashing or printing trajectory deviation and ensuring printing accuracy. In addition, the design of the branch air path 6 being connected to the main air path 5 simplifies the air path structure, eliminating the need for a separate protective air source and reducing equipment cost and complexity.

[0034] Furthermore, it also includes at least one speed regulating valve 7, which is disposed on the main air passage 5 and / or the branch air passage 6, for controlling the gas flow rate of the external air source entering the main air passage 5 or the branch air passage 6.

[0035] In this invention, when the speed control valve 7 is installed on the main air path 5, the extrusion pressure applied to the molten solder in the feed tube assembly 1 can be changed by adjusting the gas flow rate in the main air path 5, thereby precisely controlling the rate at which the solder is extruded from the nozzle 11 and achieving flexible adjustment of the printing speed. When the speed control valve 7 is installed on the branch air path 6, the gas flow rate of the protective gas curtain at the nozzle 11 outlet can be changed by adjusting the gas flow rate in the branch air path 6, to adapt to the anti-oxidation protection requirements of different solders and different printing environments. The installation of the speed control valve 7 allows the gas flow rates of the main air path 5 and the branch air path 6 to be adjusted independently or collaboratively, ensuring both efficient extrusion of the molten solder and stable formation of the protective gas curtain, thereby further improving the process adaptability and printing quality of the metal solder printing equipment.

[0036] Of course, when a speed regulating valve 7 is installed on both the main air path 5 and the branch air path 6, the two speed regulating valves 7 can independently adjust the gas flow rate in the main air path 5 and the branch air path 6 without interfering with each other. Through this independent adjustment method, on the one hand, the extrusion rate can be adjusted independently according to the solder characteristics and printing accuracy requirements without affecting the stability of the protective gas curtain; on the other hand, the air flow rate of the protective gas curtain can be adjusted independently according to the ambient oxygen content or the solder oxidation sensitivity without changing the solder extrusion pressure. The two work together to ensure that both the solder extrusion speed and the gas curtain protection effect are within the optimal working range, thereby further improving the process adaptability and printing quality of the metal solder printing equipment.

[0037] The present invention also provides a solder printing device having the air path structure of any of the above embodiments. It further includes a fixed base plate 2 disposed at the bottom of the feed tube assembly 1, the fixed base plate 2 having a through hole 4, the nozzle 11 being assembled in the through hole 4, with an annular gap between them; The outlet direction of the gas distribution path 6 is perpendicular to the conduction direction of the annular gap.

[0038] In this invention, the fixed base plate 2 has a through hole 4, and the nozzle 11 at the bottom of the feed tube assembly 1 is assembled in the through hole 4, with an annular gap between the outer wall of the nozzle 11 and the inner wall of the through hole 4. This annular gap serves as a channel for gas flow and is evenly distributed around the nozzle 11. The outlet direction of the gas distribution path 6 is set perpendicular to the conduction direction of the annular gap.

[0039] Specifically, the gas flowing out of the gas distribution path 6 enters the annular gap perpendicular to its extension direction. After entering, the gas diffuses evenly along the annular gap and finally exits from the outlet between the nozzle 11 and the through hole 4, forming a uniform and stable protective gas curtain around the sidewall of the nozzle 11. Because the outlet direction of the gas distribution path 6 is perpendicular to the conduction direction of the annular gap, the gas does not generate axial impact force when entering the gap. Instead, the airflow is smoothly turned and flows along the sidewall of the nozzle 11 by the guiding effect of the annular gap itself, thus avoiding direct impact of the gas on the molten solder at the outlet of the nozzle 11. At the same time, the design of the annular gap ensures that the protective gas can escape evenly from the entire circumference of the nozzle 11, forming a complete gas curtain barrier, effectively isolating external oxygen, and further improving the anti-oxidation effect during the solder printing process.

[0040] Furthermore, the outer periphery of the nozzle 11 gradually narrows from top to bottom into a cone shape, and the hole wall of the through hole 4 gradually slopes from top to bottom toward the central axis to form a guide surface that matches the outer periphery of the nozzle 11.

[0041] In this invention, the outer periphery of the nozzle 11 gradually narrows into a cone shape from top to bottom, meaning the outer diameter of the nozzle 11 decreases axially towards the outlet direction. Simultaneously, the wall of the through hole 4 on the fixed base plate 2 gradually slopes downwards towards the central axis, forming a guide surface that matches the shape of the outer periphery of the nozzle 11. When the nozzle 11 is assembled in the through hole 4, a uniform annular gap is maintained between the cone-shaped outer periphery of the nozzle 11 and the guide surface of the through hole 4. The width of this gap remains constant or substantially constant axially. This conical mating structure improves the alignment accuracy between the nozzle 11 and the fixed base plate 2, ensuring the accurate position of the nozzle 11 outlet. Furthermore, the annular gap between the guide surface and the outer periphery of the nozzle 11 serves as a flow channel for the protective gas, guiding the gas to flow uniformly downwards along the conical surface, allowing the protective gas to escape stably from around the nozzle 11 outlet, forming a more uniform and complete protective gas curtain.

[0042] In addition, the conical structure facilitates the quick installation and removal of the nozzle 11. When it is necessary to replace or add solder, the nozzle 11 can be easily inserted or pulled out along the guide surface, which improves the ease of operation of the equipment.

[0043] Furthermore, the angle of the hole wall of the through hole 4 gradually increases from top to bottom towards the central axis, forming a continuous and smooth concave surface.

[0044] In this invention, the inclination angle of the concave surface gradually increases with depth, starting from the inlet of the through hole 4, resulting in an arc-shaped surface that curves towards the central axis. When the nozzle 11 is assembled in the through hole 4, an annular gap is formed between the concave surface and the conical outer periphery of the nozzle 11, gradually narrowing from the inlet to the outlet, i.e., the gap width gradually decreases along the gas flow direction. This gradually changing channel structure accelerates the protective gas: the gas enters from the wider inlet end, and its flow velocity increases uniformly as it flows through the gradually narrowing channel, eventually exiting at a higher speed from around the outlet of the nozzle 11, forming a tighter and more stable protective gas curtain. At the same time, the continuous and smooth concave surface avoids eddies and pressure changes during gas flow, ensuring that the airflow is uniformly attached to the sidewall of the nozzle 11, which not only improves the isolation effect of the protective gas curtain but also avoids interference from airflow turbulence on the extrusion of molten solder.

[0045] Furthermore, a heating sleeve 3 is provided around the outer periphery of the feed tube assembly 1, and the inner wall of the heating sleeve 3 is provided with a recessed channel that gradually extends toward the discharge port of the nozzle 11 of the feed tube assembly 1. The heating jacket 3 and the material tube assembly 1 are assembled to form the gas distribution path 6; Alternatively, a vent pipe may be installed within the recessed channel to form the gas distribution path 6.

[0046] In this invention, a heating sleeve 3 is fitted around the outer periphery of the feed tube assembly 1. The heating sleeve 3 is used to heat the solder inside the feed tube assembly 1 to keep it in a molten state. The inner wall of the heating sleeve 3 is provided with a recessed channel that gradually extends towards the outlet of the nozzle 11 of the feed tube assembly 1. The recessed channel extends axially from the top down along the heating sleeve 3 to a position near the outlet of the nozzle 11.

[0047] In one assembly method, the heating jacket 3 and the feed tube assembly 1 cooperate to form a closed channel by the recessed channel on the inner wall of the heating jacket 3 and the outer wall of the feed tube assembly 1. This channel constitutes the aforementioned gas distribution path 6. In another assembly method, a vent pipe is independently installed in the recessed channel. The vent pipe is arranged along the path of the recessed channel. The inlet end of the vent pipe receives gas from the main gas path 5 and the outlet end extends to the discharge point of the nozzle 11. The internal channel of the vent pipe constitutes the gas distribution path 6.

[0048] Regardless of the method used, the gas distribution path 6 is integrated between the heating jacket 3 and the feed tube assembly 1, making full use of the existing structural space of the heating jacket 3 without the need for additional external piping. At the same time, the gas distribution path 6 extends along the inner wall of the heating jacket 3, and the gas can absorb the heat of the heating jacket 3 and be preheated during its flow, preventing cold gas from being directly blown onto the high-temperature nozzle 11 and the molten solder, thereby ensuring the fluidity of the solder and the stability of the printing quality.

[0049] refer to Figure 3-4The present invention also provides a control method for the metal solder printing equipment described in the above embodiments. A weight sensor is provided on one side of the feed tube assembly 1 to detect the remaining amount of molten solder inside the feed tube assembly 1; the specific control method steps are as follows: The remaining amount S of molten solder inside the feed tube assembly 1 is detected and obtained in real time by a weight sensor; The speed control valve 7 adjusts the speed in real time based on the remaining amount S of the molten solder.

[0050] In this invention, the speed control valve 7 is located on the main air path 5 or the branch air path 6 to control the gas flow rate entering the air path. By dynamically adjusting the opening of the speed control valve 7 according to the remaining solder amount, the extrusion pressure demand that changes due to the reduction of solder can be compensated. When there is a large amount of remaining solder, the gas flow rate can be appropriately reduced to avoid excessive extrusion; when there is a small amount of remaining solder and the internal pressure of the feed tube assembly 1 drops, the gas flow rate can be appropriately increased to maintain a stable extrusion rate or to perform a stop-and-fill operation. Through the coordinated control of the weight sensor and the speed control valve 7, closed-loop regulation of the solder extrusion amount can be achieved, ensuring the continuity and uniformity of solder supply during the printing process, avoiding printing line breaks or uneven output caused by changes in the remaining solder amount, thereby improving the consistency and reliability of the printed product.

[0051] Further, determine the difference between the remaining amount S of the molten solder inside the material tube assembly 1 and the preset minimum remaining amount S0 of the molten solder; When the remaining amount S is greater than or equal to the preset minimum remaining amount S0 of molten solder, the speed control valve 7 gradually reduces the gas flow rate of the external gas source; when the remaining amount S is less than the preset minimum remaining amount S0 of molten solder, the speed control valve 7 is adjusted to the minimum preset opening degree.

[0052] In this invention, when the remaining amount S detected by the weight sensor is greater than or equal to the preset minimum remaining amount S0 of molten solder, the speed control valve 7 gradually reduces the gas flow rate of the external gas source. As the solder is gradually consumed and the internal space of the feed tube assembly 1 increases, the gas flow rate required to maintain the same extrusion pressure will decrease accordingly. By gradually reducing the gas flow rate, excessive solder extrusion or splashing due to excessive pressure can be avoided, thus keeping the extrusion rate stable.

[0053] When the remaining amount S is less than the preset minimum remaining amount S0, it indicates that the molten solder inside the feed tube assembly 1 is nearly exhausted. At this time, the speed control valve 7 is adjusted to the minimum preset opening, reducing the gas flow rate to a minimum. This state serves two purposes: firstly, it reminds the operator to add solder in a timely manner; secondly, it prevents high-speed airflow from being ejected directly when the solder is almost depleted, which could affect printing quality or cause equipment malfunction.

[0054] Through the segmented control strategy described above, the amount of solder extruded remains stable throughout the printing process, and automatically enters a low-speed protection state when the solder is about to run out, thereby improving the automation level of the printing process and the consistency of the finished product.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present invention. The implementation schemes in the above embodiments can also be further combined or replaced. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A pneumatic structure for a metal solder printing device, the metal solder printing device comprising at least a feed tube assembly, wherein a nozzle is provided at the bottom of the feed tube assembly, characterized in that: include, The main air passage is connected to the feed tube assembly at one end and to an external air source at the other end, which is used to provide the extrusion force to push the molten solder in the feed tube assembly. The gas distribution path is connected to the main gas path at one end and extends to the nozzle outlet of the material pipe assembly at the other end. The gas outlet direction of the gas distribution path is perpendicular to the gas outlet direction of the nozzle of the material pipe assembly. It is used to form a protective air curtain when the gas from the external gas source introduced into the gas distribution path blows towards the side wall of the nozzle.

2. The air path structure of the metal solder printing equipment according to claim 1, characterized in that: It also includes at least one speed control valve, which is located in the main gas path and / or the branch gas path, for controlling the gas flow rate of the external gas source entering the main gas path or the branch gas path.

3. A metal solder printing device having the gas path structure as described in claim 1 or 2, characterized in that: It also includes a fixed base plate located at the bottom of the feed tube assembly, the fixed base plate having a through hole, the nozzle being assembled in the through hole, and an annular gap between the two. The outlet direction of the gas distribution path is perpendicular to the conduction direction of the annular gap.

4. The metal solder printing equipment according to claim 3, characterized in that: The outer periphery of the nozzle gradually narrows from top to bottom into a cone shape, and the wall of the through hole gradually slopes from top to bottom toward the central axis to form a guide surface that matches the outer periphery of the nozzle.

5. The metal solder printing equipment according to claim 4, characterized in that: The angle of the hole wall gradually increases from top to bottom towards the central axis, forming a continuous and smooth concave surface.

6. The metal solder printing equipment according to claim 5, characterized in that: A heating sleeve is fitted around the outer periphery of the feed tube assembly, and the inner wall of the heating sleeve is provided with a recessed channel that gradually extends toward the nozzle outlet of the feed tube assembly. The heating jacket and the material tube assembly are assembled to form the gas distribution path; Alternatively, a vent pipe may be installed within the recessed channel to form the aforementioned air distribution path.

7. A control method applied to the metal solder printing equipment according to claim 3, characterized in that: A weight sensor is installed on one side of the feed tube assembly to detect the remaining amount of molten solder inside the feed tube assembly; the specific control method steps are as follows: The remaining amount S of molten solder inside the feed tube assembly is detected and obtained in real time by a weight sensor. The speed control valve is adjusted in real time based on the remaining amount S of the molten solder.

8. The control method according to claim 7, characterized in that: Determine the difference between the remaining amount S of molten solder inside the feed tube assembly and the preset minimum remaining amount S0 of molten solder; When the remaining amount S is greater than or equal to the preset minimum remaining amount S0 of molten solder, the speed control valve gradually reduces the gas flow rate of the external air source; when the remaining amount S is less than the preset minimum remaining amount S0 of molten solder, the speed control valve is adjusted to the minimum preset opening.

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