High thermal conductivity low cost aluminum alloy and additive manufacturing method thereof
By designing an Al-Cu-Fe-Cr-Ti-Zr alloy and optimizing the selective laser melting process, the processing difficulty and cost issues of high thermal conductivity aluminum alloys in selective laser melting technology have been solved, resulting in aluminum alloy materials with high density and excellent mechanical properties, suitable for manufacturing high thermal conductivity precision components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHAANXI XINGHUAYE 3D TECH CO LTD
- Filing Date
- 2026-04-21
- Publication Date
- 2026-06-12
AI Technical Summary
Existing high thermal conductivity aluminum alloys face challenges in selective laser melting (SLM) technology, including high processing difficulty, high cost, and susceptibility to cracking. This is particularly true when manufacturing complex morphologies and multifunctional components, which limits their integrated application in fields such as heat exchangers.
A high thermal conductivity, low-cost aluminum alloy containing Al, Cu, Fe, Cr, Ti, and Zr elements was designed. By optimizing the selective laser melting process parameters, alloy powder was prepared and the impurity content was controlled to form a nano-reinforcing phase and a heterogeneous nucleation core. The forming process was optimized to improve density and mechanical properties.
It achieves high density and excellent tensile mechanical properties of high thermal conductivity and low cost aluminum alloy, with room temperature tensile strength greater than 350MPa, yield strength greater than 200MPa, elongation greater than 6%, and thermal conductivity greater than 150 W/(m·K), making it suitable for 3D printing precision components.
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Figure CN122189443A_ABST