Electronic control board, air conditioner outdoor unit and air conditioner

Abstract

The application discloses an electric control board, an air conditioner outdoor unit and an air conditioner, and belongs to the technical field of household appliances. The electric control board is divided into a first mounting area, a second mounting area, a third mounting area and a fourth mounting area, and a main control chip circuit, an active power factor correction control circuit, a frequency conversion control circuit, a power input circuit and a function interface circuit are respectively mounted in different mounting areas, so that power devices with relatively large heat generation can be concentrated on the same side, and an electrolytic capacitor and a power factor correction inductor are mounted on the right side of the second mounting area and close to the third mounting area, so that the electrolytic capacitor and the power factor correction inductor can be away from the main control chip circuit and other high-power devices, temperature rise superposition is prevented, the heat dissipation efficiency is improved, the influence of high-frequency signal interference on the work of other module circuits is reduced, the layout design is more reasonable, and the electric control board can adapt to higher frequency and performance control requirements.

Description

[0001] This application is a divisional application with an application date of "2021.12.24", application number "202111603258.7", and application title "Electrical control board, outdoor unit of air conditioner and air conditioner". Technical Field

[0002] This application relates to the technical field of household appliances, and in particular to an electronic control board, an outdoor unit of an air conditioner, and an air conditioner. Background Technology

[0003] As the core control component of an air conditioner, the performance and layout of the electronic control board directly determine the efficiency, reliability, and cost of the entire unit. In related technologies, the electronic control board employs an active frequency converter control scheme, but its design is flawed; the placement of high-heat-generating components limits heat dissipation and prevents it from adapting to higher frequency control. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an electronic control board that optimizes the layout of various functional circuits, making the layout design more reasonable and improving heat dissipation efficiency.

[0005] This application also provides an outdoor air conditioning unit and an air conditioner including the aforementioned electronic control board.

[0006] The electronic control board according to the first aspect embodiment of this application includes: The substrate includes a first mounting area, a second mounting area, a third mounting area, and a fourth mounting area. The substrate includes a first side and a second side along its length. The first mounting area and the second mounting area are arranged sequentially along the width direction of the substrate, close to the first side. The third mounting area and the fourth mounting area are arranged sequentially along the width direction of the substrate, close to the second side. The main control chip circuit is located in the first mounting area; The active power factor correction control circuit and the frequency converter control circuit are both located in the second mounting area; A power input circuit is located in the third mounting area; The functional interface circuit is located in the fourth mounting area; The power input circuit, the active power factor correction control circuit, the frequency converter control circuit, and the functional interface circuit are sequentially connected. The frequency converter control circuit and the functional interface circuit are connected to the main control chip circuit. The first side is located on the left side of the front surface of the substrate, and the second side is located on the right side of the front surface of the substrate. Along the left-right direction of the substrate, the first mounting area is adjacent to the fourth mounting area, and the second mounting area is adjacent to the third mounting area. Perpendicular to the left-right direction of the substrate, the first mounting area and the second mounting area are arranged sequentially from top to bottom, and the fourth mounting area and the third mounting area are arranged sequentially from top to bottom. The active power factor correction control circuit includes an electrolytic capacitor and a power factor correction inductor, which are mounted on the right side of the second mounting area and close to the third mounting area.

[0007] The electronic control board according to the embodiments of this application has at least the following beneficial effects: By dividing the substrate of the electronic control board into a first mounting area, a second mounting area, a third mounting area, and a fourth mounting area, and installing the main control chip circuit, active power factor correction control circuit, frequency converter control circuit, power input circuit, and functional interface circuit in different mounting areas, the main control chip circuit, active power factor correction control circuit, and frequency converter control circuit can be located close to the first side along the length of the substrate, allowing power devices with high heat generation to be concentrated on the same side. At the same time, the power input circuit and functional interface circuit can be located close to the second side along the length of the substrate. Furthermore, the electrolytic capacitor and power factor correction inductor are installed on the right side of the second mounting area and close to the third mounting area, keeping them away from the main control chip circuit and other high-power devices to prevent temperature rise accumulation, improve heat dissipation efficiency, and reduce the impact of high-frequency signal interference on the operation of other module circuits. The layout design is more reasonable, enabling the electronic control board to adapt to higher frequency and performance control requirements.

[0008] According to some embodiments of this application, the active power factor correction control circuit further includes an insulated gate bipolar transistor and a fast recovery diode, and the frequency conversion control circuit includes a first intelligent power module. The insulated gate bipolar transistor, the fast recovery diode, and the first intelligent power module are located close to the first side of the substrate along its length.

[0009] According to some embodiments of this application, the power input circuit includes a common-mode inductor disposed near the lower right corner of the substrate, so as to keep the common-mode inductor away from the insulated-gate bipolar transistor, the fast recovery diode and the first smart power module.

[0010] According to some embodiments of this application, the right side of the third mounting area and the fourth mounting area is close to or coincides with the right side of the substrate.

[0011] According to some embodiments of this application, the sum of the length of the second mounting area and the width of the third mounting area is equal to the length of the substrate, and the sum of the length of the third mounting area and the width of the fourth mounting area is equal to the width of the substrate.

[0012] According to some embodiments of this application, the first mounting area, the second mounting area, the third mounting area, and the fourth mounting area are all generally rectangular, and the combined area is consistent with the area of ​​the substrate.

[0013] According to some embodiments of this application, in the length direction of the substrate, the first mounting area and the fourth mounting area are arranged side by side, and the second mounting area and the third mounting area are arranged side by side; in the width direction of the substrate, the first mounting area and the second mounting area are arranged side by side, and the third mounting area and the fourth mounting area are arranged side by side.

[0014] According to some embodiments of this application, the length of the substrate is greater than 0 mm and less than or equal to 178 mm, and the width of the substrate is greater than 0 mm and less than or equal to 138 mm.

[0015] An outdoor air conditioning unit according to a second aspect embodiment of this application includes the electronic control board described in the first aspect embodiment.

[0016] The outdoor unit of the air conditioner according to the embodiments of this application has at least the following beneficial effects: The electronic control board of the above embodiment can concentrate the power devices with high heat generation on the same side of the substrate, making the installation of each circuit more compact. Furthermore, by installing the electrolytic capacitor and power factor correction inductor on the right side of the second mounting area and close to the third mounting area, the electrolytic capacitor and power factor correction inductor can be kept away from the main control chip circuit and other high-power devices, preventing the temperature rise from accumulating and improving heat dissipation efficiency. It also helps to reduce the impact of high-frequency signal interference on the operation of other module circuits. The layout design is more reasonable, enabling the electronic control board to adapt to higher frequency and performance control requirements, and is suitable for air conditioner outdoor units.

[0017] An air conditioner according to a third aspect of this application includes the outdoor unit of the air conditioner described in the second aspect of the embodiment.

[0018] The air conditioner adopts all the technical solutions of the outdoor unit of the air conditioner in the above embodiments, and therefore has at least all the beneficial effects brought about by the technical solutions in the above embodiments.

[0019] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing this application. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a three-dimensional structural diagram of an electronic control board according to an embodiment of this application; Figure 2 This is a front view of the electronic control board according to an embodiment of this application; Figure 3 This is a schematic diagram of the mounting area division of a substrate according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an electronic control board with a bracket according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic control board with a heat sink according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of an electrical control box assembly according to an embodiment of this application.

[0021] Figure label: Substrate 100; First mounting area 110; Second mounting area 120; Third mounting area 130; Fourth mounting area 140; Main control chip circuit 200; control chip 210; Active PFC control circuit 300; PFC inductor 310; IGBT 320; FRD 330; Electrolytic capacitor 340; Rectifier bridge 350; Bracket 360; Heat sink 370; Variable frequency control circuit 400; Variable frequency IPM module 410; Power input circuit 500; common mode inductor 510; Functional interface circuit 600; socket 610; Low-power inverter IPM module 700; 1000 electronic control board; Electrical control box 2000; cover plate 2100. Detailed Implementation

[0022] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0023] In the description of this application, it should be understood that the terms "up," "down," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] In the description of this application, the use of terms such as "first," "second," etc., is for the purpose of distinguishing technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0025] In the description of this application, it should be noted that terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application based on the specific content of the technical solution.

[0026] In the description of this application, the description of certain embodiments, specific embodiments, etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same implementation or instance. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] It is understandable that air conditioners typically have an electronic control board (ECU) to control the operation of components such as the compressor and fan, ensuring stable operation of the refrigeration system. This is used in split-type and unitary air conditioners. Taking the ECU of an inverter air conditioner as an example, it usually contains functional modules such as a main chip module, an Intelligent Power Module (IPM), an Active Power Factor Correction (PFC) module, and a power supply module. The circuit components of these functional modules are relatively dispersed, arranged in various parts of the printed circuit board, making the ECU larger and more difficult to install, which contradicts the trend towards miniaturized ECU design. Moreover, the layout of power components that generate a lot of heat limits heat dissipation efficiency and makes it incompatible with higher frequency control requirements. The dispersed components increase the difficulty of wiring, making connection and connection during assembly extremely inconvenient, time-consuming, and affecting production efficiency.

[0028] The embodiments of this application optimize the layout of power devices by rationally designing the layout of each module circuit, which facilitates improved heat dissipation. The installation of each module circuit is more compact, reducing the area occupied by the devices, thereby effectively reducing the overall size of the control board, increasing installation flexibility, and improving the assembly efficiency of the outdoor unit of the air conditioner.

[0029] refer to Figures 1 to 6 The present application describes an electronic control board 1000, which is applicable to an air conditioner and specifically applied to an outdoor unit of an air conditioner. The electronic control board 1000 is described below with specific examples.

[0030] Reference Figure 1 As shown, the electronic control board 1000 of the embodiment includes a substrate 100, which is a printed circuit board. The substrate 100 is generally rectangular. A main control chip circuit 200, an active PFC control circuit 300, a frequency converter control circuit 400, a power input circuit 500, and a functional interface circuit 600 are disposed on the substrate 100. Each circuit is composed of corresponding devices connected together. The devices in the main control chip circuit 200, the active PFC control circuit 300, the frequency converter control circuit 400, the power input circuit 500, and the functional interface circuit 600 are arranged on the front side of the substrate 100 to form the overall control circuit of the electronic control board 1000.

[0031] It is understood that the main control chip circuit 200 includes a control chip 210 and passive components connected to the control chip 210. The active PFC control circuit 300 is connected to the power input circuit 500, and the output load of the active PFC control circuit 300 is connected to the frequency converter control circuit 400. The active PFC control circuit 300 can improve the utilization rate of the power supply and reduce the power loss during the conversion process when AC is converted to DC, thereby achieving the purpose of energy saving. The frequency converter control circuit 400 is used to control the operation of the compressor, so that the motor speed of the compressor changes with the frequency of the power supply, thereby controlling the compressor to achieve frequency conversion operation. The power input circuit 500 is used for the input of the power supply of the outdoor unit of the air conditioner. The rectifier circuit converts the input AC power into DC power, thereby supplying power to the control chip 210 and related modules, and can also output power to external components. The functional interface circuit 600 includes a socket 610 and peripheral circuits connected to the socket 610. The socket 610 is used for the output of related load interfaces.

[0032] Reference Figure 2 As shown, Figure 2 The diagram shows the front structure of the electronic control board 1000. The front of the substrate 100 is divided into four areas: a first mounting area 110, a second mounting area 120, a third mounting area 130, and a fourth mounting area 140. The main control chip circuit 200 is mounted in the first mounting area 110, the active PFC control circuit 300 and the frequency converter control circuit 400 are mounted in the second mounting area 120, the power input circuit 500 is mounted in the third mounting area 130, and the functional interface circuit 600 is mounted in the fourth mounting area 140. This arrangement allows the circuits to be laid out according to their respective areas, with the components of each circuit connected to the corresponding mounting areas on the substrate 100.

[0033] Taking the main control chip circuit 200 as an example, the main control chip circuit 200 includes a control chip 210 and peripheral passive components. The control chip 210 and the passive components are soldered on the substrate 100 at the positions corresponding to the first mounting area 110. The passive components are connected to the pins of the control chip 210 through copper lines arranged on the substrate 100. The relative positions between each passive component and the control chip 210 can be arranged according to the size of the first mounting area 110. For example, the passive components include resistors, capacitors, etc. The passive components can be arranged around the control chip 210 or concentrated on one side of the control chip 210.

[0034] Reference Figure 2 As shown, the length direction of the substrate 100 is Figure 2 In the left-right direction shown, the width direction of the substrate 100 is... Figure 2 In the vertical direction shown, the substrate 100 includes a first side and a second side along its length. The first side is the left side of the substrate 100, and the second side is the right side of the substrate 100. The first mounting area 110 and the second mounting area 120 are located near the left side, and the third mounting area 130 and the fourth mounting area 140 are located near the right side. Along the width direction of the substrate 100, the first mounting area 110 and the second mounting area 120 are arranged sequentially from top to bottom, and the third mounting area 130 and the fourth mounting area 140 are arranged sequentially from bottom to top.

[0035] It should be noted that the first mounting area 110 and the second mounting area 120 near the left side of the substrate 100 should be understood as the first mounting area 110 and the second mounting area 120 being located on the left side of the substrate 100 in the left-right direction, and the left side of the first mounting area 110 and the second mounting area 120 may be close to or coincide with the left side of the substrate 100. Similarly, the third mounting area 130 and the fourth mounting area 140 near the right side should be understood as the third mounting area 130 and the fourth mounting area 140 being located on the right side of the substrate 100 in the left-right direction, and the right side of the third mounting area 130 and the fourth mounting area 140 may be close to or coincide with the right side of the substrate 100.

[0036] Reference Figure 2 As shown, the electronic control board 1000 also includes a motor control circuit, which is used to drive the DC motor of the fan. In this embodiment, the motor control circuit is installed in the fourth mounting area 140, that is, both the motor control circuit and the functional interface circuit 600 are installed in the fourth mounting area 140.

[0037] Understandably, the main control board can achieve functions such as active PFC control and regulation, variable frequency compressor control, DC motor control, AC power input, and related load interface control output through the above circuit.

[0038] Reference Figure 1 and Figure 2 As shown, specifically, the active PFC control circuit 300 mainly consists of an insulated-gate bipolar transistor (IGBT), a fast recovery diode (FRD), a PFC inductor 310, and an electrolytic capacitor 340. The frequency converter control circuit 400 mainly consists of a frequency converter microcontroller unit (MCU) and a first intelligent power module, which is a frequency converter IPM module 410. The motor control circuit mainly consists of a second intelligent power module and a control MCU, which is a low-power frequency converter IPM module 700.

[0039] Considering that the components of different circuits vary in form and quantity, different mounting areas are divided according to the requirements of different circuits, and the area occupied by each mounting area on the substrate 100 is not the same. Specifically, in this embodiment, the first mounting area 110 is located at the upper left corner of the substrate 100, the second mounting area 120 is located at the lower left corner of the substrate 100, the third mounting area 130 is located at the lower right corner of the substrate 100, and the fourth mounting area 140 is located at the upper right corner of the substrate 100. The size of each mounting area can be allocated according to the number of components and the installation spacing requirements to meet electrical performance requirements, so that the components of each circuit can make full use of the mounting space of the substrate 100, making the overall circuit installation compact.

[0040] It should be noted that there are no physical boundaries between the various installation areas. The main control chip circuit 200, active PFC control circuit 300, frequency converter control circuit 400, power input circuit 500, and functional interface circuit 600 are arranged reasonably according to the size of their respective installation areas. The areas where the main functional components of each circuit are located can be defined as their corresponding installation areas according to a certain size range. For example, in the main control chip circuit 200, the control chip 210 is the main functional component. The control chip 210 and the peripheral passive components form a circuit. There are certain safety distance requirements between adjacent components. Based on the above safety distance requirements, the area required by the main control chip circuit 200 can be calculated, and the size of the first installation area 110 can be set accordingly. For ease of understanding, let's take... Figure 2 The illustrated embodiment is an example. Figure 2 The position of the dashed line can be understood as the approximate dividing line of each mounting area on the substrate 100. The dividing line can be adjusted according to the distribution of each circuit.

[0041] It is understandable that, while meeting the requirements of strong and weak current isolation, signal interference prevention, and heat dissipation, the area of ​​the substrate 100 can be effectively utilized, making the installation of each circuit more compact and effectively reducing the area of ​​the substrate 100. This is beneficial to reducing the overall volume of the electronic control board 1000, and can also save the material of the substrate 100 and reduce the cost of the electronic control board 1000.

[0042] Reference Figure 1 and Figure 2 As shown, the components in each circuit are arranged on the front side of the substrate 100, and the pins of each component can pass through the substrate 100. The pins of the components are soldered and fixed on the back side of the substrate 100 (not shown in the figure), making the structure more stable and reliable.

[0043] Understandably, referring to Figure 2 As shown, the main control chip circuit 200 occupies a relatively small area, while the active PFC control circuit 300 and the frequency conversion control circuit 400 occupy a relatively large area. Therefore, in this embodiment, the first mounting area 110 and the second mounting area 120 are arranged side by side. The length of the second mounting area 120 is greater than the length of the first mounting area 110, and the width of the second mounting area 120 is greater than the width of the first mounting area 110. The sum of the widths of the first mounting area 110 and the second mounting area 120 is close to the width of the substrate 100, so that the first mounting area 110 and the second mounting area 120 can be arranged side by side on the left side of the substrate 100, thus fully utilizing the space on the left side of the substrate 100 along the width direction.

[0044] Since the second mounting area 120 occupies a large area, in order to make full use of the space on the right side of the substrate 100, in this embodiment, the third mounting area 130 is set on the right side of the second mounting area 120, and the third mounting area 130 extends along the width direction of the substrate 100, so that the sum of the length of the second mounting area 120 and the width of the third mounting area 130 is close to the length of the substrate 100, and the width of the second mounting area 120 is close to the length of the third mounting area 130.

[0045] It can be understood that the fourth mounting area 140 and the third mounting area 130 are arranged side by side on the right side of the substrate 100, such that the sum of the width of the fourth mounting area 140 and the length of the third mounting area 130 is close to the width of the substrate 100. The fourth mounting area 140 extends along the length direction of the substrate 100, such that the sum of the length of the fourth mounting area 140 and the length of the first mounting area 110 is close to the length of the substrate 100. Considering that the space for the motor control circuit is small, and that the motor control circuit needs to be connected to the DC motor through a corresponding interface, the motor control circuit is placed in the fourth mounting area 140, which is a more reasonable layout and saves more space on the substrate 100.

[0046] Reference Figure 2As shown, the first installation area 110, the second installation area 120, the third installation area 130, and the fourth installation area 140 are all roughly rectangular. By reasonably setting the length and width dimensions of the four installation areas, the area formed by the close combination of the four installation areas is basically the same as the area of ​​the substrate 100. This allows the layout of each circuit to make full use of the area of ​​the substrate 100, resulting in a more compact installation, optimized layout design, and a more reasonable distribution of each module circuit. This effectively reduces the area of ​​the substrate 100, thereby reducing the overall volume of the electronic control board 1000, increasing installation flexibility and convenience, and improving the assembly efficiency of the outdoor unit of the air conditioner.

[0047] It is understandable that the mounting areas are arranged in pairs along the length of the substrate 100; at the same time, the mounting areas are also arranged in pairs along the width of the substrate 100. Compared with the layout structure in which the four mounting areas are arranged sequentially along the length, the length of the substrate 100 can be effectively reduced.

[0048] It should be noted that the positions of the mounting areas are not limited to the layout shown in the above embodiments. In some embodiments, the first mounting area 110 and the second mounting area 120 can be located near the right side of the substrate 100, and the third mounting area 130 and the fourth mounting area 140 can be located near the left side of the substrate 100. For example, the first mounting area 110 is located at the upper right corner of the substrate 100, the second mounting area 120 is located at the lower right corner of the substrate 100, the third mounting area 130 is located at the lower left corner of the substrate 100, and the fourth mounting area 140 is located at the upper left corner of the substrate 100; alternatively, the positions of the first mounting area 110 and the second mounting area 120 can be interchanged, and the positions of the third mounting area 130 and the fourth mounting area 140 can be interchanged.

[0049] Furthermore, the shape of the mounting area is not limited to the rectangle shown in the above embodiments, but can also be a square or other polygonal shapes. For example, the shape of the second mounting area 120 can be square, the shapes of the first mounting area 110 and the third mounting area 130 are rectangular, and the shape of the fourth mounting area 140 can be adjusted to an "L" shape. The fourth mounting area 140 is adjacent to the first mounting area 110, the second mounting area 120 and the third mounting area 130, so that each mounting area can fit together closely to form a rectangular shape.

[0050] It is understandable that the above-mentioned Figure 2The layout of the illustrated embodiment allows for a more compact installation of the various circuits, effectively reducing the area occupied by the circuits on the substrate 100. In other words, a small-sized substrate 100 can accommodate the installation of each module circuit of the control board 1000. In some embodiments, the length L of the substrate 100 is 178 mm, and the width W of the substrate 100 is 138 mm. Compared to a traditional control board 1000, this significantly reduces the overall size of the control board 1000, making installation more flexible and convenient. It should be noted that by optimizing the layout of the module circuits of the control board 1000, the dimensions of the substrate 100 can satisfy L≤178 mm and W≤138 mm, and the specific dimensions can be selected according to actual installation requirements.

[0051] Reference Figure 3 As shown, Figure 3 The diagram shows the layout of the main functional components in each circuit. In this embodiment, a Cartesian coordinate system is used as the reference coordinate system to illustrate the installation positions of the main functional components. The layout of each circuit is optimized based on the Cartesian coordinate system to make the layout design more reasonable and obtain an optimal layout scheme. Furthermore, the layout of the control board 1000 comprehensively considers the location of external loads. The layout of the module circuit area of ​​the core components comprehensively considers production and circuit signal quality issues. The design adjusts the core components within a specific coordinate range to achieve the purpose of optimized layout.

[0052] Specifically, refer to Figure 3 As shown, the front side of the substrate 100 can be understood as the plane containing the Cartesian coordinates. The top right corner of the substrate 100 is taken as the origin of the coordinate system. The length direction of the substrate 100 is the X-axis direction, the width direction of the substrate 100 is the Y-axis direction, and the Z-axis direction is ignored. The unit of measurement in the coordinate system is mm (millimeters).

[0053] Reference Figure 3 As shown, within the first mounting area 110, the distance between the center of the control chip 210 and the origin along the X-axis is X1, and the distance between the center of the control chip 210 and the origin along the Y-axis is Y1, satisfying: 126mm≤X1≤170mm, 4mm≤Y1≤21mm. According to the Cartesian coordinate system, the coordinate range of the center of the control chip 210 in the coordinate system can be (-170, -4) to (-126, -21). This coordinate range is within the first mounting area 110 and forms a rectangular region. Figure 3 The dashed area within the first installation area 110 represents the adjustable range of the center of the control chip 210. It should be noted that the center of the control chip 210 is referenced to its geometric center; as long as the center of the control chip 210 lies within the aforementioned area, it meets the design requirements.

[0054] For example, the center point coordinates of the control chip 210 can be (-170, -4), (-150, -10), (-126, -4), (-126, -21), etc., without further limitation. They can be selected according to actual installation requirements to optimize the layout of the control chip 210. Passive components are arranged according to the position of the control chip 210, making full use of the area of ​​the first mounting area 110. The mounting area of ​​the control chip 210 does not require heat dissipation from the heat sink 370 and is far away from the condenser of the outdoor unit of the air conditioner, ensuring that the control chip 210 is not affected by interference or temperature. Adjustments can be made within a rectangular range without affecting the overall layout structure and assembly.

[0055] It should be noted that since the origin of the Cartesian coordinate system is located at the upper right corner of the substrate 100, according to the principle of the coordinate system, the first mounting area 110, the second mounting area 120, the third mounting area 130 and the fourth mounting area 140 are all located in the negative value region of the coordinate axis. That is to say, within the corresponding mounting area, negative values ​​are used to represent the corresponding coordinates in the X and Y directions, and the distance between the coordinate point and the origin is calculated as a positive value.

[0056] Reference Figure 2 and Figure 3 As shown, the main functional components of the active PFC control circuit 300 include a PFC inductor 310, an IGBT 320, an FRD 330, and an electrolytic capacitor 340. The distance between the center of the PFC inductor 310 and the origin along the X-axis is X2, and the distance between the center of the PFC inductor 310 and the origin along the Y-axis is Y2, satisfying: 71mm ≤ X2 ≤ 100mm, 95mm ≤ Y2 ≤ 130mm. Therefore, the coordinate range of the center of the PFC inductor 310 can be from (-100, -95) to (-71, -130), meaning... Figure 3 The rectangular area from (-100, -95) to (-71, -130) is the center adjustable area range of the PFC inductor 310.

[0057] It should be noted that the PFC inductor 310 is the core component of the active PFC control circuit 300. It operates at a high temperature, and the impact of temperature on surrounding components must be comprehensively considered. The PFC inductor 310 is installed in the region (-100, -95) to (-71, -130) mentioned above, close to the edge of the substrate 100. Based on the circuit structure and component characteristics, the PFC inductor 310 is kept away from the core control area and other high-power components to prevent the temperature rise from accumulating, which is beneficial to improving heat dissipation efficiency and reducing the impact of high-frequency signal interference on the operation of other module circuits.

[0058] Reference Figure 3As shown, the distance between the center of IGBT320 and the origin along the X-axis is X3, and the distance between the center of IGBT320 and the origin along the Y-axis is Y3, satisfying: 156mm≤X3≤191mm, 70mm≤Y3≤89mm. That is to say, the adjustable coordinate range of the center of IGBT320 can be from (-191, -70) to (-156, -89).

[0059] It should be noted that the IGBT320 generates a significant amount of heat during operation. Figure 3 In the illustrated embodiment, to improve the heat dissipation efficiency of the IGBT320, the IGBT320 device body is extended beyond the coordinate range of the substrate 100. It can be understood that the maximum coordinate of the control board 1000 in the Y-axis direction is X=-178. The heat sink 370 and the bracket 360 work together to dissipate heat from the IGBT320 device body. The pins of the IGBT320 device are fixed to the substrate 100 by soldering. The IGBT320 device body does not depend on the substrate 100. The bracket 360 supports the IGBT320. The heat sink 370 is located in the second mounting area 120 and close to the air duct area of ​​the outdoor unit of the air conditioner, thereby improving the heat dissipation efficiency of the IGBT320 and achieving heat dissipation of the device under higher carrier frequency control.

[0060] Reference Figure 3 As shown, the distance between the center of the FRD330 and the origin along the X-axis is X4, and the distance between the center of the FRD330 and the origin along the Y-axis is Y4, satisfying: 143mm≤X4≤148mm, 70mm≤Y4≤89mm. That is, the adjustable coordinate range of the FRD330's center can be from (-148, -70) to (-143, -89). Figure 3 As shown, the distribution area of ​​FRD330 is consistent with the center line of IGBT320, which helps to improve the efficiency of factory production and save PCB layout space.

[0061] Reference Figure 3 As shown, the distance between the center of electrolytic capacitor 340 and the origin along the X-axis is X5, and the distance between the center of electrolytic capacitor 340 and the origin along the Y-axis is Y5, satisfying: 63mm≤X5≤95mm, 50mm≤Y5≤85mm. That is, the adjustable coordinate range of the center of electrolytic capacitor 340 can be from (-95, -50) to (-63, -85). Figure 3 As shown, the electrolytic capacitor 340 and the PFC inductor 310 are installed on the right side of the second mounting area 120 and close to the third mounting area 130, without affecting the installation of the heat sink 370.

[0062] Reference Figure 2 and Figure 3As shown, the frequency converter control circuit 400 includes a frequency converter IPM module 410 and an MCU (not shown in the attached figure). The distance between the center of the frequency converter IPM module 410 and the origin along the X-axis is X6, and the distance between the center of the frequency converter IPM module 410 and the origin along the Y-axis is Y6, satisfying: 124mm≤X6≤174mm, 31mm≤Y6≤66mm. That is to say, the adjustable coordinate range of the center of the frequency converter IPM module 410 can be (-174, -31) to (-124, -66). It should be noted that the adjustment area of ​​the frequency converter IPM module 410 and the adjustment area of ​​the control chip 210 are adjacent, which is beneficial to minimizing the control signal loop and reducing interference. Moreover, the power device is located far from the high-temperature side of the condenser, reducing the impact of the condenser temperature on the heat dissipation of the power device.

[0063] Reference Figure 2 and Figure 3 As shown, the second mounting area 120 is also equipped with a rectifier circuit, which includes a rectifier bridge 350 for rectifying the input AC power into DC power. The distance between the center of the rectifier bridge 350 and the origin along the X-axis is X7, and the distance between the center of the rectifier bridge 350 and the origin along the Y-axis is Y7, satisfying: 133mm≤X7≤172mm, 98mm≤Y7≤123mm. That is to say, the adjustable coordinate range of the center of the rectifier bridge 350 can be (-172, 98) to (-133, -123).

[0064] It should be noted that the position of the rectifier bridge 350 can be adjusted according to actual layout requirements. The area where the rectifier bridge 350 is installed is close to the top corner of the substrate 100, which is separated from other power devices by a certain distance, which is beneficial to improving heat dissipation.

[0065] Reference Figure 2 and Figure 3 As shown, the motor control circuit includes a low-power inverter IPM module 700. The distance between the center of the low-power inverter IPM module 700 and the origin along the length direction is X8, and the distance between the center of the low-power inverter IPM module 700 and the origin along the width direction is Y8, satisfying: 50mm≤X8≤100mm, 18mm≤Y8≤50mm. That is to say, the adjustable coordinate range of the center of the low-power inverter IPM module 700 can be (-100, -18) to (-50, -50).

[0066] It is understood that the DC motor control circuit and the main power devices are laid out separately from the high-voltage section. Considering both device heat generation and electromagnetic interference (EMI) requirements, the low-power inverter IPM module 700 is positioned above the second mounting area 120 and the third mounting area 130. Furthermore, to improve the heat dissipation of the low-power inverter IPM module 700, a heat sink (not shown in the attached diagram) is installed at its location to enhance heat dissipation efficiency.

[0067] It should be noted that the fourth mounting area 140 has an interface for connecting to the DC motor wiring, and the mounting structure of the control board 1000 has reserved an opening corresponding to the fourth mounting area 140. The principle of the motor control circuit is to achieve relative independence between the high-voltage control and MCU control areas, thereby reducing mutual interference and improving production efficiency. The low-power frequency conversion IPM module 700 is distributed in the high-temperature area away from the condenser, which has better heat dissipation performance and is convenient for wiring.

[0068] It is understandable that the main heat source of the electronic control board 1000 is the core power control device, including IGBT320, frequency converter IPM module 410, FRD330 and rectifier bridge 350. Through the layout of the above embodiment, IGBT320, frequency converter IPM module 410, FRD330 and rectifier bridge 350 are reasonably distributed in the second mounting area 120, and heat sink 370 is set in the second mounting area 120. The heat sink 370 dissipates heat from the above devices, so that the heat of high heat-generating devices is evenly distributed on the surface of heat sink 370. Moreover, the mounting area of ​​high heat-generating devices is close to the air duct, which can effectively improve the heat dissipation efficiency.

[0069] Reference Figure 4 and Figure 5 As shown, a bracket 360 is provided at the second mounting area 120, and the heat sink 370 is mounted on the bracket 360, thereby supporting the heat sink 370 and reducing the pressure of the heat sink 370 on the intelligent power module and rectifier module. In this embodiment, the upper surface of the heat sink 370 is distributed with heat sink fins, and the bottom surface of the heat sink 370 is a heat-conducting surface. During assembly, the bottom surface of the heat sink 370 is in close contact with the surfaces of the IGBT 320, the inverter IPM module 410, the FRD 330, and the rectifier bridge 350, so that the heat from the heat source can be transferred to the heat sink 370 and dissipated through the heat sink fins.

[0070] Figure 4 The diagram shows the connection between the bracket 360 and the substrate 100, wherein the bracket 360 is disposed around the IGBT 320, the frequency converter IPM module 410, the FRD 330 and the rectifier bridge 350; Figure 5The diagram shows an assembly schematic of the heat sink 370. The heat sink fins extend in a direction perpendicular to the front of the substrate 100. The heat sink 370 is separated from surrounding components by a certain safety distance to ensure heat dissipation performance. Considering that the bracket 360 occupies a certain space in the second mounting area 120, the area of ​​the second mounting area 120 is larger than the area of ​​other mounting areas.

[0071] Reference Figure 1 , Figure 2 and Figure 4 As shown, the power input circuit 500 is located in the third mounting area 130. After passing through the power input circuit 500, the AC power is converted into DC power through rectification. The power input circuit 500 includes a common mode inductor 510, which is located near the lower right corner of the substrate 100 and away from other power devices.

[0072] The electrical control board 1000 adopts the above-mentioned layout for optimization. The size of the electrical control board 1000 can reach 178mm*138mm or smaller. The optimized layout of power devices meets the requirement of achieving higher carrier frequency control under the same device specifications. Moreover, the full frequency conversion control and ultra-high frequency PFC carrier frequency are highly integrated, achieving EMI compatibility design and realizing a high-frequency low-interference highly integrated control scheme.

[0073] Reference Figure 1 and Figure 2 As shown, the functional interface circuit 600 includes a film capacitor and multiple sockets 610. Sockets 610 are used to connect relevant loads inside the outdoor unit of the air conditioner, such as fans, compressors, sensors, etc. Different loads are connected to different sockets 610. Different types of sockets 610 are provided in the fourth mounting area 140. In the embodiment, multiple sockets 610 are arranged along the length of the fourth mounting area 140, and all multiple sockets 610 are located near the upper edge of the substrate 100.

[0074] Reference Figure 3 As shown, the adjustable coordinate range of socket 610 can be from (-88, 0) to (0, 10), where the area with coordinate Y=0 is the upper edge position of substrate 100. Different types of socket 610 can adjust their position according to the actual load.

[0075] Reference Figure 6As shown, during assembly, the control board 1000 is mounted on the control box 2000 to form the control box assembly. The control board 1000 and the cover plate 2100 of the control box 2000 are fixedly connected. The control box assembly is installed upside down on the body of the outdoor unit of the air conditioner. That is to say, after installation, the circuit components on the control board 1000 are all facing downwards, and the control box 2000 has a reserved opening. The sockets 610 are concentrated on one side of the control board 1000 and close to the opening. The opening faces the side of the outdoor unit of the air conditioner, which makes it convenient for workers to plug the plugs of each load wiring into the corresponding sockets 610, improving wiring efficiency. Moreover, the wiring can be concentrated on the same side of the control board 1000 for routing, making the wiring more reasonable and the operation simpler, effectively improving the assembly efficiency of the outdoor unit of the air conditioner.

[0076] This application also provides an outdoor air conditioning unit (not shown in the accompanying drawings), including the electrical control board 1000 described in the above embodiment. The electrical control board 1000 is installed inside the outdoor air conditioning unit. Specifically, the electrical control board 1000 can be installed within an electrical control box 2000 to form an electrical control box assembly. Components such as the fan and compressor inside the outdoor air conditioning unit are all connected to the electrical control board 1000. The electrical control board 1000 adopts the layout described in the above embodiment, making the installation of each module circuit more compact and the layout design more reasonable. High-heat-generating components are installed close to the air duct, effectively improving heat dissipation efficiency and reducing component temperature rise. Optimized power component layout meets the requirement of achieving higher carrier frequency control under the same component specifications. Furthermore, the high integration of full-frequency conversion control and ultra-high frequency PFC carrier frequency achieves EMI compatibility design, enabling a high-frequency, low-interference, highly integrated control scheme.

[0077] This application also provides an air conditioner (not shown in the accompanying drawings), which includes the outdoor unit of the air conditioner described above. The air conditioner adopts all the technical solutions of the outdoor unit of the air conditioner described above, and therefore has at least all the beneficial effects brought about by the technical solutions of the above embodiments.

[0078] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. An electronic control board, characterized in that, include: The substrate includes a first mounting area, a second mounting area, a third mounting area, and a fourth mounting area. The substrate includes a first side and a second side along its length. The first mounting area and the second mounting area are arranged sequentially along the width direction of the substrate, close to the first side. The third mounting area and the fourth mounting area are arranged sequentially along the width direction of the substrate, close to the second side. The main control chip circuit is located in the first mounting area; The active power factor correction control circuit and the frequency converter control circuit are both located in the second mounting area; A power input circuit is located in the third mounting area; The functional interface circuit is located in the fourth mounting area; The power input circuit, the active power factor correction control circuit, the frequency converter control circuit, and the functional interface circuit are sequentially connected. The frequency converter control circuit and the functional interface circuit are connected to the main control chip circuit. The first side is located on the left side of the front surface of the substrate, and the second side is located on the right side of the front surface of the substrate. Along the left-right direction of the substrate, the first mounting area is adjacent to the fourth mounting area, and the second mounting area is adjacent to the third mounting area. Perpendicular to the left-right direction of the substrate, the first mounting area and the second mounting area are arranged sequentially from top to bottom, and the fourth mounting area and the third mounting area are arranged sequentially from top to bottom. The active power factor correction control circuit includes an electrolytic capacitor and a power factor correction inductor, which are mounted on the right side of the second mounting area and close to the third mounting area.

2. The electronic control board according to claim 1, characterized in that, The active power factor correction control circuit further includes an insulated gate bipolar transistor and a fast recovery diode. The frequency conversion control circuit includes a first intelligent power module. The insulated gate bipolar transistor, the fast recovery diode, and the first intelligent power module are located near the first side of the substrate along its length.

3. The electronic control board according to claim 2, characterized in that, The power input circuit includes a common-mode inductor, which is positioned near the lower right corner of the substrate to keep it away from the insulated-gate bipolar transistor, the fast recovery diode, and the first smart power module.

4. The electronic control board according to claim 1, characterized in that, The right side of the third mounting area and the fourth mounting area is close to or coincides with the right side of the substrate.

5. The electronic control board according to claim 1, characterized in that, The sum of the length of the second mounting area and the width of the third mounting area is equal to the length of the substrate, and the sum of the length of the third mounting area and the width of the fourth mounting area is equal to the width of the substrate.

6. The electronic control board according to claim 1 or 5, characterized in that, The first mounting area, the second mounting area, the third mounting area, and the fourth mounting area are all approximately rectangular, and the combined area is the same as the area of ​​the substrate.

7. The electronic control board according to claim 1, characterized in that, Along the length of the substrate, the first mounting area and the fourth mounting area are arranged side by side, and the second mounting area and the third mounting area are arranged side by side; along the width of the substrate, the first mounting area and the second mounting area are arranged side by side, and the third mounting area and the fourth mounting area are arranged side by side.

8. The electronic control board according to claim 1 or 7, characterized in that, The length of the substrate is greater than 0 mm and less than or equal to 178 mm, and the width of the substrate is greater than 0 mm and less than or equal to 138 mm.

9. An outdoor unit for an air conditioner, characterized in that, Includes the electronic control board according to any one of claims 1 to 8.

10. An air conditioner, characterized in that, Includes the outdoor unit of the air conditioner as described in claim 9.

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