Optimization design method of heart-shaped structure magnetron for magnetron sputtering
By defining a circumferential summation function of magnetic induction intensity in the design of a cardioid magnetron, and using a multi-parameter optimization algorithm to optimize the position and orientation of the magnet, the problem of design optimization difficulties in the prior art is solved, and efficient and precise optimization of the magnetron sputtering system and improvement of thin film quality are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNIV OF SCI & TECH BEIJING
- Filing Date
- 2026-02-14
- Publication Date
- 2026-06-12
Smart Images
Figure CN122197307A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the fields of thin film technology and surface engineering technology, and in particular to an optimized design method for a heart-shaped magnetron for magnetron sputtering. Background Technology
[0002] Magnetron sputtering technology, with its advantages of high deposition rate and high film density, has become the mainstream technology in the industrial coating field. As its core component, the magnetron confines electrons near the target surface through a specifically arranged magnetic field, forming a high-density plasma, which is crucial for achieving efficient sputtering. The heart-shaped magnetron is a special unbalanced magnetic field design, with its magnetic field lines exhibiting a unique closed-loop shape on the target surface. This design aims to simultaneously improve target utilization and enhance plasma uniformity in the substrate region, which is of great significance for large-size, high-quality coating.
[0003] However, current cardioid magnetron design relies heavily on empirical magnetic circuit layouts and limited static magnetic field simulations, making it difficult for designers to accurately quantify the mapping relationship between magnetic pole geometry parameters and final coating performance indicators. This results in practical applications where cardioid magnetron design optimization heavily depends on repeated trial and error, leading to long development cycles, high costs, and difficulty in obtaining globally optimal solutions, thus limiting the full realization of its performance potential in high-end coating applications. Summary of the Invention
[0004] This invention provides an optimized design method for a heart-shaped magnetron for magnetron sputtering, which at least partially solves the aforementioned technical problems existing in the prior art.
[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: On one hand, the present invention provides an optimized design method for a heart-shaped magnetron for magnetron sputtering, the optimized design method for the heart-shaped magnetron for magnetron sputtering includes: Establish a polar coordinate system to represent the coordinates of each position on the sputtering surface of a circular target; Based on the aforementioned polar coordinate system, define the function. ; where, function The value is equal to the polar radius coordinate of the target surface. r The summation of the magnetic field strength along the circumference at the location; With film thickness uniformity as the optimization objective, and using a function Multiple selected parameters are used as optimization parameters. A preset multi-parameter optimization algorithm is used for optimization design to obtain the function. The optimal combination of parameters; To satisfy the function The optimal parameter combination is taken as the optimization objective. The position and orientation of the magnet on the magnetron base plate on which the magnet is mounted are taken as optimization parameters. The preset multi-parameter optimization algorithm is used to optimize the design and obtain the optimal position and orientation of the magnet on the magnetron base plate on which the magnet is mounted, so as to realize the design of the heart-shaped magnetron.
[0006] Furthermore, the function The corresponding function curve has two peaks.
[0007] Furthermore, the function The expression is: ; in, These are polar coordinate values; Let the target surface coordinates be The magnetic flux density at that location; ; in, and functions respectively The peak heights of the two peaks in the corresponding function curve; e It is the base of natural numbers; and The standard deviation; and To fix the peak position.
[0008] Furthermore, the selected parameter is and ,as well as and .
[0009] Furthermore, with film thickness uniformity as the optimization objective, and using a function... Multiple selected parameters are used as optimization parameters. A preset multi-parameter optimization algorithm is used for optimization design to obtain the function. The optimal combination of parameters includes: Step 31, Input and ,as well as and The initial value; Step 32: Apply a preset multi-parameter optimization algorithm to obtain new... and ,as well as and The parameter combination; and based on the resulting new and ,as well as and The parameter combination is used to calculate the film thickness uniformity; Step 33: Determine whether the deviation between the calculated film thickness uniformity and the target uniformity meets the requirements; if the deviation does not meet the requirements, return to step 32; if the deviation meets the requirements, then... and ,as well as and The optimal parameter combination is the combination of parameters.
[0010] Furthermore, the preset multi-parameter optimization algorithm is a genetic algorithm or an evolutionary algorithm.
[0011] Furthermore, to satisfy the function The optimal parameter combination is taken as the optimization objective. The position and orientation of the magnet on the magnetron base plate are used as optimization parameters. A preset multi-parameter optimization algorithm is employed for optimization design to obtain the optimal position and orientation of the magnet on the magnetron base plate, including: Step 41, determine the number of magnets n And the range of positional variation of the magnet on the magnetron base plate on which the magnet is mounted; Step 42: Within the range of position changes, determine the initial values for the position and orientation of each magnet; Step 43: Apply a preset multi-parameter optimization algorithm to obtain new values for the magnet's position and orientation; Step 44: Based on the new magnet position and orientation, calculate the magnetic field distribution on the target sputtering surface, and based on the magnetic field distribution calculation results, calculate the function. Follow The relationship of change is fitted using a preset fitting algorithm to obtain... and ,as well as and The current calculated value; Step 45, determine the result. and ,as well as and Check whether the deviation between the current calculated value and the optimal parameter combination meets the requirements; if the deviation does not meet the requirements, return to step 43; if the deviation meets the requirements, the current magnet position and orientation are taken as the optimal position and orientation of the magnet on the magnetron base plate on which the magnet is installed.
[0012] Furthermore, the preset multi-parameter optimization algorithm is a genetic algorithm or an evolutionary algorithm.
[0013] Furthermore, the preset fitting algorithm is the least squares method.
[0014] In another aspect, the present invention also provides an electronic device comprising a processor and a memory; wherein the memory stores at least one instruction, which is loaded and executed by the processor to implement the above-described method.
[0015] In another aspect, the present invention also provides a computer-readable storage medium storing at least one instruction, which is loaded and executed by a processor to implement the above method.
[0016] The beneficial effects of the technical solution provided by this invention include at least the following: This invention defines a circumferential summation function of magnetic induction intensity at each radial position on the target surface. Using the parameters of this function as optimization parameters, a primary optimization design is performed with the goal of achieving optimal film uniformity. Simultaneously, a secondary optimization design is performed using the position and orientation of the magnet as optimization parameters, with the goal of achieving the optimal parameters of the circumferential summation function of magnetic induction intensity. Ultimately, this achieves rapid and precise optimization design of the magnetic field of a heart-shaped magnetron. Using this invention, the magnetron structural parameters and film performance can be accurately correlated, enabling rapid and precise optimization design of heart-shaped magnetrons and improving the overall efficiency and film quality of the magnetron sputtering system. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is an overall flowchart of the optimized design method for a heart-shaped magnetron for magnetron sputtering provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the target sputtering surface coordinate system provided in an embodiment of the present invention; Figure 3 This is provided by the embodiments of the present invention. about A schematic diagram of the changing relationship; Figure 4 The application of genetic algorithms provided in this embodiment of the invention is... parameters and ,as well as and A flowchart illustrating the process of optimizing the design of a heart-shaped magnetron. Figure 5This is a flowchart illustrating the process of optimizing the parameters of a bimodal function based on a physical heuristic gradient descent method and a momentum update algorithm, thereby achieving the optimized design of a heart-shaped magnetron. Figure 6 This is a system block diagram of the electronic device provided in the embodiments of the present invention. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
[0020] First, it should be noted that in the embodiments of the present invention, the words "exemplarily," "for example," etc., are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" in the present invention should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the term "exemplarily" is intended to present the concept in a specific manner. Furthermore, in the embodiments of the present invention, the meaning expressed by "and / or" can be both, or it can be either one or the other.
[0021] First Embodiment
[0022] This embodiment provides a systematic optimization design method for heart-shaped magnetrons used in magnetron sputtering, based on a combination of physical mechanisms and optimization algorithms. The overall process is as follows: Figure 1 As shown. This method can be implemented by an electronic device, which can be a terminal or a server. Specifically, the method includes the following steps: S1, Establish a polar coordinate system to represent the coordinates of each position on the sputtering surface of the circular target; The polar coordinate system established in this embodiment is as follows: Figure 2 As shown.
[0023] S2, Based on the aforementioned polar coordinate system, define the function. ; where, function The value is equal to the polar radius coordinate of the target surface. r The summation of the magnetic field strength along the circumference at the location; In this embodiment, the function The corresponding function curve has two peaks, that is For a reason about The bimodal function, such as Figure 3 As shown. Function The expression is: ; in, These are polar coordinate values; Let the target surface coordinates be The magnetic flux density at that location; ; in, and functions respectively The peak heights of the two peaks in the corresponding function curve; e It is the base of natural numbers; and The standard deviation; and To fix the peak position.
[0024] Based on the above, this embodiment selects the following parameters to describe this function: the peak heights of the two peaks. and and standard deviation and As parameters to be optimized.
[0025] S3, with film thickness uniformity as the optimization objective, uses a function Multiple selected parameters are used as optimization parameters. A multi-parameter optimization algorithm is employed for optimization design to obtain the function. The optimal combination of parameters; Specifically, in this embodiment, the implementation process of S3 is as follows: S31, Input Parameters and ,as well as and The initial value; S32, applying a multi-parameter optimization algorithm, obtains a new... and ,as well as and The parameter combination; where the optimization algorithm can be a genetic algorithm, an evolutionary algorithm, etc.; S33. Calculate the film thickness uniformity based on the parameter combination obtained in S32. The methods for calculating the film thickness uniformity include analytical methods such as empirical formulas, as well as full-process simulation methods for magnetron sputtering. S34: Compare the film thickness uniformity obtained in S33 with the target uniformity. If the deviation between the two does not meet the requirements, return to S32 to recalculate and obtain a new uniformity. and ,as well as and The parameters are combined and iterated repeatedly until the deviation between the calculated film thickness uniformity and the target uniformity meets the predetermined requirements, thus obtaining the optimal parameters. and ,as well as and combination.
[0026] S4, to satisfy the function The optimal combination of parameters is taken as the optimization objective. The position and orientation of the magnet on the magnetron base plate on which the magnet is mounted are taken as optimization parameters. A multi-parameter optimization algorithm is used to optimize the design and obtain the optimal position and orientation of the magnet on the magnetron base plate on which the magnet is mounted, so as to realize the design of the heart-shaped magnetron.
[0027] Specifically, in this embodiment, the implementation process of S4 is as follows: S41, Enter the type, size, and quantity of magnets. ; S42, given The range of positional variation of each magnet on the magnetron base plate on which the magnets are mounted; S43, with The position and orientation of each magnet on the magnetron base plate where the magnets are mounted are optimized parameters, and the function obtained by S3 is used. The optimal parameters are the objective, and optimization design is carried out; the specific steps include: S431, Input Initial values for the position and orientation of each magnet; S432, a multi-parameter optimization algorithm is applied to obtain new values for the magnet's position and orientation; the optimization algorithm can be a genetic algorithm, an evolutionary algorithm, etc. S433, Based on the values of the magnet position and orientation obtained in S432, calculate the magnetic field distribution on the sputtering surface of the target material; wherein, the methods for calculating the magnetic field distribution include analytical methods and numerical methods, etc. S434, based on the magnetic field distribution calculation results of S433, calculate the function. Follow The relationship between the changes is fitted to obtain the corresponding... and ,as well as and Among these, the fitting method can be the least squares method, etc.; S435, combine the parameters obtained from S434 and ,as well as and The optimal result obtained from S3 and ,as well as and If the combined comparison fails to meet the required deviation, return to S432 for recalculation to obtain a new result. and ,as well as and The parameter combination is calculated iteratively until the calculated parameter combination is obtained. and ,as well as and The optimal result obtained from S3 and ,as well as and The process continues until the deviation of the combination meets the predetermined requirements. The optimal values for the magnet position and orientation, i.e., the optimal magnet configuration, are obtained.
[0028] Based on the above, in a feasible embodiment, such as Figure 4 As shown, genetic algorithms can be applied to... parameters and ,as well as and Optimized design was performed, and a full-process simulation method for magnetron sputtering was applied to numerically calculate the electric field distribution, plasma, target sputtering process, and target atomic deposition process sequentially to obtain film thickness uniformity. This method innovatively combines physical mechanisms with optimization algorithms, enabling precise correlation between magnetron structural parameters and coating performance. This improves the overall efficiency and thin film quality of the magnetron sputtering system.
[0029] Furthermore, in another feasible embodiment, the parameters of the bimodal function in S3 can be optimized based on a physically heuristic gradient descent method and a momentum update algorithm. This method can specifically adjust the optimization parameters according to the specific morphology of the film thickness distribution, thereby accelerating the convergence speed. Figure 5 As shown, the specific implementation steps are as follows: S321, Parameter initialization. Randomly initialize parameters within a preset range: , , and Simultaneously set the target film thickness uniformity deviation. .
[0030] S322, Iterative optimization. In each iteration, the following sub-steps are performed: S3221, based on current parameters and fixed peak position and The magnetic induction intensity on the sputtered surface of the target material varies with the radius. Change relationship This relationship is formed by the superposition of two Gaussian peaks, namely: ; It should be noted that, in practice, the fixed peak position and There is an empirical ratio to the target radius, so the positions of these two peaks can be set based on experience.
[0031] S3222, according to The film thickness distribution on the coated surface was calculated to obtain the normalized radial film thickness curve. .
[0032] S3223, according to Calculate the uniformity of film thickness on the coated surface.
[0033] S3224: Determine if the film thickness uniformity meets the target. If yes, proceed to step S323; otherwise, continue to the next step.
[0034] S3225: Determine if there has been a situation where uniformity has not improved after multiple consecutive iterations. If so, adaptively adjust the parameters or randomly reset some parameters to avoid getting trapped in a local optimum. If not, proceed to the next step.
[0035] The method for adjusting the parameters is as follows: The coated surface is divided into three regions: center, middle, and edge. The average film thickness of each region is compared. If the film thickness is the largest in the center region, the amplitude of the outer peak is increased. and the standard deviation of the outer peak At the same time, appropriately reduce the amplitude of the inner peak. If the film thickness is greatest in the edge region, then increase the amplitude of the inner peak. and the standard deviation of the inner peak At the same time, appropriately reduce the amplitude of the outer peak. If the film thickness in the middle region is too low, then simultaneously increase... If the uniformity is still poor, further adjust the standard deviation parameter. and To achieve a smooth distribution.
[0036] S3226, calculate the gradient of film thickness variation based on the film thickness distribution characteristics of the coated surface.
[0037] S3227 uses a momentum update mechanism to update parameters, obtaining the gradient of the film thickness distribution. Then, the momentum coefficient is introduced. Update the momentum corresponding to each parameter using the following formula. : ; Subsequently, the updated momentum is applied to calculate new parameter values, in order to For example, the new parameter value is: ; Other parameter updates are similar. Specifically, It can take the value 0.9.
[0038] S3228 applies boundary constraints to the updated parameters to ensure they are within physically feasible limits.
[0039] S3229, return to S3221 to continue execution.
[0040] S323, output the result.
[0041] After the iteration is complete, output the optimal parameter combination. And the corresponding film thickness uniformity.
[0042] In summary, this embodiment provides an optimized design method for a heart-shaped magnetron for magnetron sputtering. By defining a circumferential summation function of the magnetic induction intensity at each radial position on the target surface, and using the parameters representing this function as optimization parameters, a first optimization design is performed with the goal of achieving optimal film uniformity. Simultaneously, a second optimization design is performed using the magnet's position and orientation as optimization parameters, with the goal of achieving the optimal parameters representing the circumferential summation function of the magnetic induction intensity. Ultimately, this achieves rapid and precise optimization design of the magnetic field of the heart-shaped magnetron. Using the scheme of this embodiment, the magnetron structural parameters and film performance can be accurately correlated, enabling rapid and precise optimization design of the heart-shaped magnetron, thereby improving the overall efficiency and film quality of the magnetron sputtering system.
[0043] Second Embodiment
[0044] This embodiment provides an electronic device, such as... Figure 6 As shown, the electronic device includes a processor and a memory; wherein the processor and the memory can be connected via a communication bus; the memory stores at least one instruction, which is loaded and executed by the processor to implement the method of the first embodiment described above. Furthermore, the electronic device may also include a transceiver, the processor and the transceiver can be connected via a communication bus, and the transceiver is used to communicate with other devices.
[0045] Below, in conjunction with Figure 6 A detailed introduction to each component of this electronic device is provided below: The processor is the control center of the electronic device. The electronic device may include multiple processors, each of which can be a single-core processor (single-CPU) or a multi-core processor (multi-CPU). The term "processor" can refer to a single processor or a collective term for multiple processing elements. For example, a processor can be one or more central processing units (CPUs), other general-purpose processors, application-specific integrated circuits (ASICs), or one or more integrated circuits configured to implement embodiments of the present invention, such as one or more digital signal processors (DSPs), one or more field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor. The processor can perform various functions of the electronic device by running or executing software programs stored in memory and by calling data stored in memory.
[0046] In a specific implementation, as one example, the processor may include one or more CPUs, for example... Figure 6 CPU0 and CPU1 shown are, of course, merely illustrative examples.
[0047] The memory is used to store the software program that executes the solution of the present invention, and the processor controls its execution. For specific implementation methods, please refer to the above method embodiments, which will not be repeated here.
[0048] Optionally, the memory may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto. The memory may be integrated with the processor or exist independently, and may be accessed through the interface circuit of the electronic device ( Figure 6 (Not shown in the image) is coupled to the processor; however, this embodiment of the invention does not impose specific limitations on this.
[0049] The transceiver may include a receiver and a transmitter. Figure 6 (Not shown separately). The receiver is used to implement the receiving function, and the transmitter is used to implement the transmitting function. The transceiver can be integrated with the processor or exist independently, and can be connected through the interface circuit of the electronic device (…). Figure 6 (Not shown in the image) is coupled to the processor, and this embodiment of the invention does not specifically limit this.
[0050] In addition, it should be noted that, Figure 6 The structure of the electronic device shown is not intended to limit the device. Actual devices may include more or fewer components than shown, or combine certain components, or have different component arrangements. Furthermore, the technical effects achieved by this electronic device when performing the method of the first embodiment described above can be referenced to the technical effects described in the first embodiment; therefore, they will not be repeated here.
[0051] Third Embodiment
[0052] This embodiment provides a computer-readable storage medium storing at least one instruction, which is loaded and executed by a processor to implement the method of the first embodiment described above. The computer-readable storage medium may be a ROM, random access memory, CD-ROM, magnetic tape, floppy disk, or optical data storage device, etc. The instruction stored therein can be loaded and executed by a processor in a terminal.
[0053] Furthermore, it should be noted that the present invention can be provided as a method, apparatus, or computer program product. Therefore, embodiments of the present invention can take the form of a completely or partially hardware embodiment, a completely or partially software embodiment, or an embodiment combining software and hardware aspects. Moreover, when implemented in software, embodiments of the present invention can take the form of a computer program product implemented on one or more computer-usable storage media containing computer-usable program code. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any usable medium accessible to a computer or a data storage device such as a server or data center containing one or more sets of usable media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. A semiconductor medium can be a solid-state drive (SSD).
[0054] Embodiments of the present invention are described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.
[0055] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1The functions specified in one or more boxes. These computer program instructions may also be loaded onto a computer or other programmable data processing terminal equipment to cause a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.
[0056] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element. Furthermore, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone, where A and B can be singular or plural. Additionally, the character " / " in this text generally indicates an "or" relationship between the preceding and following objects, but it can also indicate an "AND / OR" relationship. Please refer to the context for specific interpretations. "At least one" refers to one or more items, while "more than" refers to two or more items. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, at least one of a, b, or c can be represented as: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.
[0057] Furthermore, it is understood that in various embodiments of the present invention, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.
[0058] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.
[0059] In the several embodiments provided by this invention, it should be understood that the disclosed devices, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of functional modules / units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the shown or discussed mutual couplings or direct couplings or communication connections may be through some interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms. Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, i.e., they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs. Additionally, the functional units in the various embodiments of this invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0060] If the method is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0061] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention. It should be pointed out that although preferred embodiments of the present invention have been described, those skilled in the art, once they understand the basic inventive concept of the present invention, can make several improvements and modifications without departing from the principles described herein. These improvements and modifications should also be considered within the scope of protection of the present invention. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.
Claims
1. An optimized design method for a heart-shaped magnetron for magnetron sputtering, characterized in that, include: Establish a polar coordinate system to represent the coordinates of each position on the sputtering surface of a circular target; Based on the aforementioned polar coordinate system, define the function. ; where, function The value is equal to the polar radius coordinate of the target surface. r The summation of the magnetic field strength along the circumference at the location; With film thickness uniformity as the optimization objective, and using a function Multiple selected parameters are used as optimization parameters. A preset multi-parameter optimization algorithm is used for optimization design to obtain the function. The optimal combination of parameters; To satisfy the function The optimal parameter combination is taken as the optimization objective. The position and orientation of the magnet on the magnetron base plate on which the magnet is mounted are taken as optimization parameters. The preset multi-parameter optimization algorithm is used to optimize the design and obtain the optimal position and orientation of the magnet on the magnetron base plate on which the magnet is mounted, so as to realize the design of the heart-shaped magnetron.
2. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 1, characterized in that, function The corresponding function curve has two peaks.
3. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 2, characterized in that, function The expression is: ； in, These are polar coordinate values; Let the target surface coordinates be The magnetic flux density at that location; ； in, and functions respectively The peak heights of the two peaks in the corresponding function curve; e It is the base of natural numbers; and The standard deviation; and To fix the peak position.
4. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 3, characterized in that, The selected parameter is and ,as well as and .
5. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 4, characterized in that, With film thickness uniformity as the optimization objective, and using a function Multiple selected parameters are used as optimization parameters. A preset multi-parameter optimization algorithm is used for optimization design to obtain the function. The optimal combination of parameters, include: Step 31, Input and ,as well as and The initial value; Step 32: Apply a preset multi-parameter optimization algorithm to obtain new... and ,as well as and The parameter combination; and based on the resulting new and ,as well as and The parameter combination is used to calculate the film thickness uniformity; Step 33: Determine whether the deviation between the calculated film thickness uniformity and the target uniformity meets the requirements; if the deviation does not meet the requirements, return to step 32; if the deviation meets the requirements, then... and ,as well as and The optimal parameter combination is the combination of parameters.
6. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 5, characterized in that, The preset multi-parameter optimization algorithm is a genetic algorithm or an evolutionary algorithm.
7. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 1, characterized in that, To satisfy the function The optimal parameter combination is taken as the optimization objective. The position and orientation of the magnet on the magnetron base plate are used as optimization parameters. A preset multi-parameter optimization algorithm is employed for optimization design to obtain the optimal position and orientation of the magnet on the magnetron base plate, including: Step 41, determine the number of magnets n And the range of positional variation of the magnet on the magnetron base plate on which the magnet is mounted; Step 42: Within the range of position changes, determine the initial values for the position and orientation of each magnet; Step 43: Apply a preset multi-parameter optimization algorithm to obtain new values for the magnet's position and orientation; Step 44: Based on the new magnet position and orientation, calculate the magnetic field distribution on the target sputtering surface, and based on the magnetic field distribution calculation results, calculate the function. Follow The relationship of change is fitted using a preset fitting algorithm to obtain... and ,as well as and The current calculated value; Step 45, determine the result. and ,as well as and Check whether the deviation between the current calculated value and the optimal parameter combination meets the requirements; if the deviation does not meet the requirements, return to step 43; if the deviation meets the requirements, the current magnet position and orientation are taken as the optimal position and orientation of the magnet on the magnetron base plate on which the magnet is installed.
8. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 7, characterized in that, The preset multi-parameter optimization algorithm is a genetic algorithm or an evolutionary algorithm.
9. The optimized design method for a heart-shaped magnetron for magnetron sputtering as described in claim 7, characterized in that, The preset fitting algorithm is the least squares method.