Vehicle-mounted display device and display panel thereof

Abstract

A kind of vehicle-mounted display device and display panel thereof.The display panel has display area and non-display area located at at least one side of display area, and the display panel includes: display element, located in display area;Silicon-based perception sensor, located in non-display area, silicon-based perception sensor is configured to perceive external environment parameter;Flexible circuit board, display element and silicon-based perception sensor are electrically connected with flexible circuit board.The output signal of silicon-based perception sensor is not prone to significant attenuation with time, so as to improve the stability and accuracy of external environment parameter perception.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to an in-vehicle display device and its display panel. Background Technology

[0002] To enhance the driving and passenger experience, in-vehicle displays typically need to adjust their display parameters according to changes in the external environment, such as automatically adjusting brightness based on ambient light intensity. This is usually achieved by incorporating an LTPSA (Low Temperature Poly-Silicon Ambient Light Sensor) into the display panel. An opening in the panel allows external light to enter the sensing area, thus acquiring ambient light information.

[0003] However, LTPS ALS has several shortcomings. On the one hand, the photosensitive area of ​​LTPS ALS is relatively large, resulting in a larger corresponding window area. For example, the light-emitting area may be greater than 1.81 square millimeters, and a large window area can easily affect the appearance of the display device. On the other hand, the photosensitivity of LTPS ALS has the problem of decay over time. That is, under the same ambient light conditions, the photosensitivity data it collects may drift over time, thus affecting the accuracy of ambient light detection and consequently affecting the display brightness adjustment. Summary of the Invention

[0004] This disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes an in-vehicle display device and its display panel.

[0005] To achieve the above objectives, this disclosure provides a display panel having a display area and a non-display area located on at least one side of the display area. The display panel includes: a display element located in the display area; a silicon-based sensing sensor located in the non-display area, the silicon-based sensing sensor being configured to sense external environmental parameters; and a flexible circuit board, wherein the display element and the silicon-based sensing sensor are both electrically connected to the flexible circuit board.

[0006] In some embodiments, the system further includes an array substrate and a counter substrate disposed opposite each other, the array substrate having a sub-region, and the orthographic projection of the counter substrate onto the array substrate not overlapping the sub-region; the silicon-based sensing sensor is disposed on the array substrate and located in the sub-region.

[0007] In some embodiments, the sub-region includes a first sub-region having a binding area, and the silicon-based sensing sensor is disposed in the first sub-region.

[0008] In some embodiments, the bonding area is provided with a first connection pad and a second connection pad, the display element is electrically connected to the flexible circuit board through the first connection pad, and the silicon-based sensing sensor is electrically connected to the flexible circuit board through the second connection pad; the first connection pad and the second connection pad are arranged side by side along a first direction, and the silicon-based sensing sensor is located on at least one side of the bonding area in the first direction.

[0009] In some embodiments, the display panel further includes a connecting line for connecting the silicon-based sensing sensor and the second connecting pad, the connecting line being disposed on the array substrate and located in the sub-region.

[0010] In some embodiments, the sub-region includes a first sub-region and a second sub-region disposed on two opposite sides of the display area in a second direction, the bonding area is located in the first sub-region, and the silicon-based sensing sensor is located in the second sub-region.

[0011] In some embodiments, the sub-region further includes a third sub-region and a fourth sub-region disposed on two opposite sides of the display area in a first direction, the first direction being perpendicular to the second direction; the bonding area is provided with a first connection pad and a second connection pad, the display element being electrically connected to the flexible circuit board through the first connection pad; the silicon-based sensing sensor is electrically connected to the second connection pad through a first connection line extending from the second sub-region and the third sub-region to the first sub-region, the second connection pad being electrically connected to the flexible circuit board; and / or, the silicon-based sensing sensor is electrically connected to the second connection pad through a second connection line extending from the second sub-region and the fourth sub-region to the first sub-region, the second connection pad being electrically connected to the flexible circuit board.

[0012] In some embodiments, the silicon-based sensing sensor is attached to the array substrate via an anisotropic conductive film.

[0013] In some embodiments, the external environmental parameters include at least one of light intensity parameters, temperature parameters, and color parameters.

[0014] In some embodiments, the silicon-based sensing sensor includes a sensing region and a connection region, with at least a portion of the connection region having pins.

[0015] This disclosure also provides an in-vehicle display device, including the aforementioned display panel.

[0016] Other objects and features of the present invention will become clear from reading the specification, claims and drawings of this application. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a plan view of a display panel according to an embodiment of the present invention.

[0019] Figure 2 This is a plan view of a display panel according to another embodiment of the present invention.

[0020] Figure 3 This is a plan view of a display panel according to another embodiment of the present invention.

[0021] Figure 4 This is a structural schematic diagram of a display panel according to an embodiment of the present invention.

[0022] Figure 5 This is a structural schematic diagram of a display panel according to another embodiment of the present invention.

[0023] Figure 6 This is a structural schematic diagram of the silicon-based sensing sensor of the display panel according to an embodiment of the present invention.

[0024] Explanation of key component symbols:

[0025] 10. Display panel;

[0026] 100. Display components;

[0027] 200. Silicon-based sensing sensor; 210. Sensing area; 220. Connection area;

[0028] 300. Flexible printed circuit board;

[0029] 400, Array substrate; 410, Sub-region; 411, First sub-region; 411a, Bonding area; 412, Second sub-region;

[0030] 500, Opposing substrate; 600, Driver chip; 700, Circuit board;

[0031] x, the first direction; y, the second direction. Detailed Implementation

[0032] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0034] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0035] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0036] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0037] As the intelligence of automotive display devices increases, these devices typically need to adjust their brightness based on ambient light intensity to improve readability in bright light environments and reduce glare in low light conditions. One related technology involves using integrated ambient light sensors for detection, such as LTPS-based integrated ambient light sensors. However, the applicant's research has revealed that these polysilicon integrated ambient light sensors still have stability limitations. In LTPS-based ALS solutions, even with constant ambient light intensity, the photosensitive output data may still drift, causing sampling results under the same ambient light conditions to change over time. Applying this type of ambient light sensor to automotive display devices could lead to different ambient light detection results under the same lighting conditions, thus affecting the accuracy and reliability of functions such as automatic brightness adjustment.

[0038] To address the aforementioned problems, this invention provides a display panel 10, which can be applied to in-vehicle display devices, such as central control displays, instrument displays, passenger-side displays, and rear-seat entertainment displays. Of course, this display panel 10 can also be applied to other display devices requiring environmental sensing capabilities. The display panel 10 has a display area and a non-display area located on at least one side of the display area. The display area is used for image display, and the non-display area can be used for connection structures, wiring structures, bonding structures, and sensing structures, etc., which are not listed here. The display panel 10 includes a display element 100, a silicon-based sensing sensor 200, and a flexible circuit board 300. The display element 100 is located in the display area, and the silicon-based sensing sensor 200 is located in the non-display area. Both the display element 100 and the silicon-based sensing sensor 200 are electrically connected to the flexible circuit board 300.

[0039] The display element 100 can be a liquid crystal display element, an organic light-emitting diode display element, a light-emitting diode display element, a micro light-emitting diode display element, or other display elements capable of displaying functions. The silicon-based sensing sensor 200 is configured to sense external environmental parameters, including at least one of light intensity parameters, temperature parameters, and color parameters. The light intensity parameter can be used to characterize the intensity of ambient light, the temperature parameter can be used to characterize the ambient temperature or the temperature surrounding the display panel 10, and the color parameter can be used to characterize the color, color temperature, or spectral composition of the ambient light.

[0040] It should be noted that the silicon-based sensing sensor 200 has more stable photosensitivity characteristics compared to LTPS ALS. Under the same ambient light conditions, the output signal of the silicon-based sensing sensor 200 is less prone to significant attenuation over time, thus improving the stability and accuracy of ambient light detection. When applied to automotive display devices, it allows the display to more reliably adjust its brightness according to the ambient light intensity, reducing the risk of misadjustment caused by sensor output drift.

[0041] This embodiment incorporates a silicon-based sensing sensor 200 within the display panel 10, enabling the display panel 10 to acquire external environmental parameters in addition to its display function. Compared to LTPS ALS, silicon-based ambient light sensor chips not only have superior photosensitivity but also a smaller photosensitive area. For example, some commercially available silicon-based photosensors have an area of ​​only 0.19 mm². 2 Up to 0.79mm 2 The specific dimensions can be determined based on the actual sensor chip selected. Because silicon-based ambient light sensor chips are relatively small, their corresponding light-receiving area or window area can also be reduced accordingly, thus minimizing the impact on the appearance of the vehicle display device.

[0042] Meanwhile, since both the display element 100 and the silicon-based sensing sensor 200 are electrically connected to the flexible circuit board 300, the sensing data collected by the silicon-based sensing sensor 200 can be output to the external control circuit board 700 through the flexible circuit board 300. This avoids the need to set up a separate flexible circuit board 300 for the silicon-based sensing sensor 200, which helps to reduce the number of connection structures, reduce the space occupied in the non-display area, and improve the integration of the display panel 10.

[0043] In this embodiment, by employing a silicon-based sensing sensor 200, the small size, high sensitivity, and good on / off response stability of silicon-based sensors can be utilized to detect external environmental parameters within a small area. Especially in automotive display scenarios, the silicon-based sensing sensor 200 can be placed in a non-display area without occupying the display area, thereby reducing the impact on the pixel arrangement and display effect of the display area. The ink screen printing area in the non-display area can shield the sensor while ensuring partial light transmission, making the sensor difficult to observe from the external side, thus improving the overall aesthetic integrity of the automotive display device.

[0044] In some embodiments, the display panel 10 further includes an array substrate 400 and an opposing substrate 500, which are disposed opposite to each other. The array substrate 400 can serve as a circuit carrier substrate for the display panel 10, and structures such as pixel lines, display elements, connecting lines, connecting pads, and silicon-based sensing sensors can be disposed thereon. The opposing substrate 500 is disposed opposite to the array substrate 400.

[0045] Depending on the type of display panel 10, the opposing substrate 500 can take different forms. For example, when the display panel 10 is a liquid crystal display panel, the opposing substrate 500 can be a color filter substrate, and the display panel 10 may also include a liquid crystal layer located between the array substrate 400 and the color filter substrate. The array substrate 400 may include a thin-film transistor array layer and pixel electrodes, and the color filter substrate may include a color filter layer and a black matrix. As another example, when the display panel 10 is an organic light-emitting diode (OLED) display panel, the opposing substrate 500 can be a cover plate, an encapsulation substrate, or a protective substrate, and the display element 100 may include a first electrode, a light-emitting functional layer, and a second electrode arranged sequentially. Yet another example, when the display panel 10 is an OLED display panel, the opposing substrate 500 can be a cover plate or a protective substrate, and the display element 100 may include multiple OLED chips, Mini LED chips, or Micro LED chips.

[0046] In some embodiments, the array substrate 400 has a sub-region 410, and the orthographic projection of the opposing substrate 500 onto the array substrate 400 does not overlap with the sub-region 410. In other words, the sub-region 410 can be an area of ​​the array substrate 400 exposed relative to the opposing substrate 500, or it can be understood as an area of ​​the array substrate 400 not covered by the opposing substrate 500. The sub-region 410 can be located in a non-display area, or at least partially correspond to a non-display area. A silicon-based sensing sensor 200 is disposed on the array substrate 400 and located in the sub-region 410.

[0047] In this embodiment, by placing the silicon-based sensing sensor 200 in a sub-region 410 of the array substrate 400, the silicon-based sensing sensor 200 does not increase the thickness of the display panel since the sub-region 410 is not covered by the opposing substrate 500. Furthermore, the sub-region 410 offers high structural flexibility, facilitating the installation, bonding, and wiring of the silicon-based sensing sensor 200. In addition, the sub-region 410 is typically located near the flexible circuit board 300 or the bonding area 411a; placing the silicon-based sensing sensor 200 in this region shortens the data transmission path and improves connection reliability.

[0048] In some embodiments, see 1. Figure 2 and Figure 4 Sub-region 410 includes a first sub-region 411 having a bonding region 411a. The bonding region 411a can be used to set connection pads and to realize electrical connection between the array substrate 400 and the flexible circuit board 300. The silicon-based sensing sensor 200 can be disposed in the first sub-region 411. That is, in this embodiment, the silicon-based sensing sensor 200 and the bonding region 411a are located on the same side or in the same region.

[0049] It should be noted that, since the bonding area 411a is itself used to connect to the flexible circuit board 300, when the silicon-based sensing sensor 200 is also located in the first sub-region 411 with the bonding area 411a, the silicon-based sensing sensor 200 can be connected to the connection pads in the bonding area 411a via a shorter connecting wire, and then electrically connected to the external circuit board 700 via the flexible circuit board 300. This can shorten the electrical connection path between the silicon-based sensing sensor 200 and the flexible circuit board 300, reduce the area occupied by the connecting wire, and reduce the risk of parasitic capacitance and signal interference.

[0050] Specifically, in this embodiment, the bonding area 411a is provided with a first connection pad and a second connection pad. The display element 100 is electrically connected to the flexible circuit board 300 through the first connection pad, and the silicon-based sensing sensor 200 is electrically connected to the flexible circuit board 300 through the second connection pad. The first connection pad and the second connection pad are arranged side by side along a first direction x, and the silicon-based sensing sensor 200 is located on at least one side of the bonding area 411a in the first direction x.

[0051] In this embodiment, the first and second connection pads are used to connect different types of signal paths. The first connection pad can be used to transmit display drive signals, while the second connection pad can be used to transmit sensing data collected by the silicon-based sensing sensor 200. By separately setting the first and second connection pads, the display signal connection path and the sensing signal connection path can be structurally distinguished, avoiding signal connection confusion. Furthermore, the first and second connection pads are arranged side-by-side along the first direction x, which facilitates the centralized placement of the display signal connection terminal and the sensing signal connection terminal within the same bonding area 411a, enabling the flexible circuit board 300 to be electrically connected to both the display element 100 and the silicon-based sensing sensor 200 simultaneously.

[0052] In this embodiment, the silicon-based sensing sensor 200 is located on at least one side of the bonding area 411a in the first direction x, so that the silicon-based sensing sensor 200 can be arranged close to the second connection pad. In this way, the length of the connection line between the silicon-based sensing sensor 200 and the second connection pad can be shortened, thereby reducing the space occupied by the trace and reducing the risk of attenuation or interference of the sensing signal during transmission.

[0053] Optionally, see Figure 1 The silicon-based sensing sensor 200 is located on the left side of the bonding region 411a in the first direction x. Alternatively, see... Figure 2 The silicon-based sensing sensor 200 is located on the right side of the bonding region 411a in the first direction x.

[0054] In this embodiment, the display panel 10 further includes a connecting line for connecting the silicon-based sensing sensor 200 and the second connecting pad. The connecting line is disposed on the array substrate 400 and located in sub-region 410. One end of the connecting line is electrically connected to the silicon-based sensing sensor 200, and the other end is electrically connected to the second connecting pad. The sensing data collected by the silicon-based sensing sensor 200 is transmitted to the second connecting pad via the connecting line, and then transmitted to the external control circuit board 700 via the flexible circuit board 300.

[0055] In this embodiment, the connecting lines are positioned on the array substrate 400 and located in the sub-region 410, thus avoiding the connecting lines from passing through the display area. Since the display area is typically used to house the display elements 100 or pixel circuits, if the connecting lines pass through the display area, it may affect the pixel arrangement, aperture ratio, light emission uniformity, or display effect. By placing the connecting lines in the sub-region 410, an electrical connection between the silicon-based sensing sensor 200 and the flexible circuit board 300 can be achieved without affecting the structure of the display area.

[0056] In other embodiments, see Figure 3 and Figure 5 Sub-region 410 includes a first sub-region 411 and a second sub-region 412, which are respectively located on two opposite sides of the display area in the second direction y. A bonding area 411a is located in the first sub-region 411, and the silicon-based sensing sensor 200 is located in the second sub-region 412. That is, the bonding area 411a and the silicon-based sensing sensor 200 can be located on opposite sides of the display area, respectively. Figure 3 The fact that the three silicon-based sensing sensors 200 are used to characterize possible positions (left, center, right) does not mean that the second sub-region 412 is provided with three silicon-based sensing sensors 200 arranged side by side.

[0057] This arrangement in this embodiment is suitable for situations where a large number of devices or connection structures are already present on the side where the bonding area 411a is located. For example, the first sub-region 411 may contain a driver chip 600, a flexible circuit board 300, a first connection pad, a second connection pad, and other fan-out traces. If the silicon-based sensing sensor 200 is continued to be placed in the first sub-region 411, it may lead to overcrowding in the first sub-region 411 and increase the difficulty of wiring. By placing the silicon-based sensing sensor 200 in the second sub-region 412 opposite to the first sub-region 411, the device layout in the non-display area can be dispersed, improving the structural layout flexibility of the display panel 10.

[0058] In this embodiment, sub-region 410 further includes a third sub-region and a fourth sub-region disposed on opposite sides of the display area in the first direction x, wherein the first direction x is perpendicular to the second direction y. Thus, the first sub-region 411, the second sub-region 412, the third sub-region, and the fourth sub-region can be arranged around the display area. Specifically, the first sub-region 411 and the second sub-region 412 are located on opposite sides of the display area in the second direction y, and the third and fourth sub-regions are located on opposite sides of the display area in the first direction x.

[0059] The bonding area 411a is provided with a first connection pad and a second connection pad. The display element 100 is electrically connected to the flexible circuit board 300 through the first connection pad. The silicon-based sensing sensor 200 can be electrically connected to the second connection pad through a first connection line, and the second connection pad is electrically connected to the flexible circuit board 300. The first connection line extends to the first sub-region 411 via the second sub-region 412 and the third sub-region. Alternatively, the silicon-based sensing sensor 200 can be electrically connected to the second connection pad through a second connection line, and the second connection pad is electrically connected to the flexible circuit board 300. The second connection line extends to the first sub-region 411 via the second sub-region 412 and the fourth sub-region. Alternatively, the first connection line and the second connection line can be provided simultaneously.

[0060] When the silicon-based sensing sensor 200 is located in the second sub-region 412 and the second connecting pad is located in the first sub-region 411, they are situated on opposite sides of the display area. If the connecting line were to directly cross the display area, it could affect the display element 100, pixel circuitry, or other optical structures within the display area. Therefore, in this embodiment, the first or second connecting line is routed around the non-display area, extending from the second sub-region 412 to the first sub-region 411 via a third or fourth sub-region. This allows the connecting line to bypass the display area while simultaneously achieving electrical connection between the silicon-based sensing sensor 200 and the second connecting pad.

[0061] When either the first or second connecting line is selected, the route can be routed through either the third or fourth sub-region, depending on the arrangement of other devices or lines in the display panel 10. For example, if the third sub-region already has many traces or devices, the second connecting line can be routed through the fourth sub-region; if space is limited in the fourth sub-region, the first connecting line can be routed through the third sub-region. When both the first and second connecting lines are selected, they can transmit different types of sensor data separately, or they can form redundant transmission paths to improve signal transmission reliability.

[0062] In some embodiments, the silicon-based sensing sensor 200 is attached to the array substrate 400 via an anisotropic conductive film. The anisotropic conductive film may be disposed between the silicon-based sensing sensor 200 and the array substrate 400. See also... Figure 6The silicon-based sensing sensor 200 may include a sensing region 210 and a connection region 220, with at least a portion of the connection region 220 having pins. The sensing region 210 is used to receive external environmental information and generate sensing signals corresponding to external environmental parameters. The connection region 220 is used to realize the electrical connection between the silicon-based sensing sensor 200 and the array substrate 400.

[0063] It should be noted that anisotropic conductive film (ACF) has the characteristics of being conductive in the thickness direction and insulating or substantially insulating between adjacent positions in the planar direction. When the silicon-based sensing sensor 200 is attached to the array substrate 400 via the anisotropic conductive film, the pins in the connection area 220 of the silicon-based sensing sensor 200 can be electrically connected to the corresponding pads or conductive structures on the array substrate 400 through the anisotropic conductive film, while short circuits are less likely to occur between adjacent pins. Therefore, the anisotropic conductive film can simultaneously achieve mechanical fixation and electrical connection of the silicon-based sensing sensor 200, which is particularly suitable for sensor chips with small pin pitch.

[0064] In some embodiments, the silicon-based sensing sensor 200 can be mounted on the array substrate 400 using the same or compatible bonding process as the driving chip 600. For example, the driving chip 600 can be bonded to the array substrate 400 using a COG (Chip On Glass) process, and the silicon-based sensing sensor 200 can also be bonded to the array substrate 400 using a COG process. Therefore, the silicon-based sensing sensor 200 can be assembled using the existing bonding process platform of the display panel 10 without introducing a significantly different sensor mounting process, thus reducing process complexity. Specifically, the silicon-based sensing sensor 200 can be electrically connected to corresponding pads on the array substrate 400 via an anisotropic conductive film. During the bonding process, the pins of the silicon-based sensing sensor 200 are aligned with the pads on the array substrate 400, and mechanical fixation and electrical connection are achieved through methods such as thermoforming. Since this bonding method is compatible with the COG bonding process of the display driver chip 600, the silicon-based sensing sensor 200 can be bonded simultaneously with or in an adjacent process during the fabrication of the display panel 10, thereby improving sensor integration efficiency. Furthermore, the silicon-based sensing sensor 200 in this embodiment can be selectively configured according to different product requirements. That is, within the same display panel 10, the silicon-based sensing sensor 200 can be selectively bonded to the array substrate 400 based on configuration requirements. When a product requires light sensing, temperature sensing, or color sensing functions, the silicon-based sensing sensor 200 can be bonded to the corresponding area using the COG process; when the product does not require the corresponding sensing function, the silicon-based sensing sensor 200 can be left unbonded, retaining the basic display functions of the display panel 10. Thus, flexible switching between different functions can be achieved without significantly altering the display panel 10.

[0065] In this embodiment, the partitioning of the sensing area 210 and the connection area 220 also improves the reliability of the sensor 200 arrangement. The sensing area 210 can be oriented towards the incident direction of external environmental signals to receive ambient light, heat, or color information; the connection area 220 can be configured to correspond to the pads on the array substrate 400 to achieve electrical connection via pins. This avoids pins occupying the sensing area 210, reducing the impact of the connection structure on the sensing effect.

[0066] In some embodiments, the silicon-based sensing sensor 200 may include a silicon-based ambient light sensor chip. The silicon-based ambient light sensor chip is used to sense the intensity of ambient light and output a light intensity parameter. Further, the silicon-based sensing sensor 200 may also include at least one of a temperature sensor and a color sensor. The temperature sensor is used to sense the ambient temperature or the temperature surrounding the display panel 10 and output a temperature parameter. The color sensor is used to sense the color, color temperature, or spectral composition of the ambient light and output a color parameter.

[0067] In some embodiments, the silicon-based sensing sensor 200 is an integrated sensor chip, which includes at least one of an ambient light sensing unit, a temperature sensing unit, and a color sensing unit. The ambient light sensing unit can be used to implement light sensing functionality, the temperature sensing unit can be used to implement temperature sensing functionality, and the color sensing unit can be used to implement color sensing functionality. In other embodiments, the silicon-based sensing sensor 200 is a sensor module, which includes a silicon-based ambient light sensor chip and may further include a temperature sensor chip and a color sensor chip. The aforementioned different sensing units or different sensor chips can be integrated within the same package structure, or they can be disposed in the same mounting area and jointly connected to the flexible circuit board 300.

[0068] In some embodiments, at least two channels of sensing data from the silicon-based sensing sensor 200 can be transmitted via the flexible circuit board 300 at different time periods. In other words, at least two channels of sensing data from the silicon-based sensing sensor 200 can be transmitted via the flexible circuit board 300 in a time-division multiplexing manner. For example, at least two of the light intensity parameter, temperature parameter, and color parameter can be output through the same transmission channel at different time periods. In this way, multiple types of sensing data can be transmitted even with limited connection resources on the flexible circuit board 300.

[0069] Transmitting sensor data using time-division multiplexing reduces the number of independent signal lines required by the sensor module. Transmitting different types of sensor data sequentially at different time intervals avoids signal conflicts caused by multiple data streams simultaneously occupying the same transmission channel. Furthermore, due to the limited space on the flexible circuit board 300 in the display panel 10, time-division multiplexing reduces the number of lines on the flexible circuit board 300, simplifying its structure.

[0070] In some embodiments, an ink layer or a light-shielding layer may be provided in the non-display area. The ink layer or light-shielding layer may have a preset transmittance, for example, the ink layer may have a transmittance of about 5%, allowing ambient light to pass through this area and reach the sensing area 210 of the silicon-based sensing sensor 200. Since the silicon-based sensing sensor 200 can have high sensitivity, ambient light detection can still be achieved even if the light intensity is reduced after passing through the ink layer. In this way, it is possible to avoid forming a large, obvious window on the cover plate or the surface of the display panel 10, thereby improving the appearance of the display panel 10. Thus, the silicon-based sensing sensor 200 can be hidden behind the ink layer or light-shielding layer in the non-display area, reducing the impact of the sensor on the appearance integrity of the display panel 10 while realizing the detection of external environmental parameters.

[0071] This embodiment also provides an in-vehicle display device. The in-vehicle display device includes the display panel 10 in any of the above embodiments. The in-vehicle display device may also include a circuit board 700. The circuit board 700 can receive external environmental parameters output by the silicon-based sensing sensor 200 through the flexible circuit board 300, and control the in-vehicle display device or other functional modules in the vehicle according to the external environmental parameters.

[0072] In one application scenario, a silicon-based sensing sensor 200 acquires light intensity parameters, and a circuit board 700 controls the display brightness of the display panel 10 based on these parameters. For example, when the light intensity parameters indicate strong ambient light, the circuit board 700 can increase the display brightness of the display panel 10 to improve visibility; when the light intensity parameters indicate weak ambient light, the circuit board 700 can decrease the display brightness of the display panel 10 to reduce glare and improve viewing comfort.

[0073] In another application scenario, the silicon-based sensing sensor 200 acquires temperature parameters, and the circuit board 700 can control the air conditioning component to cool or heat based on these parameters. For example, when the temperature parameters indicate a high ambient temperature, the circuit board 700 can control the air conditioning component to increase its cooling capacity; when the temperature parameters indicate a low ambient temperature, the circuit board 700 can control the air conditioning component to increase its heating capacity.

[0074] In another application scenario, the silicon-based sensing sensor 200 acquires color parameters, and the circuit board 700 can control the ambient lighting components to emit light of corresponding colors based on these parameters. For example, when the color parameters indicate that the ambient light is warm, the circuit board 700 can control the ambient lighting components to emit warm-toned light; when the color parameters indicate that the ambient light is cool, the circuit board 700 can control the ambient lighting components to emit cool-toned light. This allows the ambient lighting effect inside the vehicle to be coordinated with the external ambient light conditions, improving the cabin environment experience.

[0075] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area located on at least one side of the display area, the display panel comprising: The display element is located in the display area; A silicon-based sensing sensor is located in the non-display area, and the silicon-based sensing sensor is configured to sense external environmental parameters; The flexible circuit board, wherein the display element and the silicon-based sensing sensor are both electrically connected to the flexible circuit board.

2. The display panel according to claim 1, characterized in that, It also includes an array substrate and a counter substrate arranged opposite each other, the array substrate having a sub-region, and the orthographic projection of the counter substrate on the array substrate not overlapping the sub-region; The silicon-based sensing sensor is disposed on the array substrate and located in the sub-region.

3. The display panel according to claim 2, characterized in that, The sub-region includes a first sub-region with a binding area, and the silicon-based sensing sensor is disposed in the first sub-region.

4. The display panel according to claim 3, characterized in that, The bonding area is provided with a first connection pad and a second connection pad. The display element is electrically connected to the flexible circuit board through the first connection pad, and the silicon-based sensing sensor is electrically connected to the flexible circuit board through the second connection pad. The first connection pad and the second connection pad are arranged side by side along a first direction, and the silicon-based sensing sensor is located on at least one side of the bonding area in the first direction.

5. The display panel according to claim 4, characterized in that, The display panel also includes a connecting line for connecting the silicon-based sensing sensor and the second connecting pad, the connecting line being disposed on the array substrate and located in the sub-region.

6. The display panel according to claim 2, characterized in that, The sub-region includes a first sub-region and a second sub-region disposed on two opposite sides of the display area in a second direction, with the bonding area located in the first sub-region and the silicon-based sensing sensor located in the second sub-region.

7. The display panel according to claim 6, characterized in that, The sub-region further includes a third sub-region and a fourth sub-region disposed on two opposite sides of the display area in the first direction, wherein the first direction is perpendicular to the second direction; The bonding area is provided with a first connection pad and a second connection pad, and the display element is electrically connected to the flexible circuit board through the first connection pad. The silicon-based sensing sensor is electrically connected to the second connection pad via a first connection line extending from the second sub-region and the third sub-region to the first sub-region; the second connection pad is electrically connected to the flexible circuit board; and / or The silicon-based sensing sensor is electrically connected to the second connection pad via a second connection line extending from the second sub-region and the fourth sub-region to the first sub-region. The second connection pad is electrically connected to the flexible circuit board.

8. The display panel according to any one of claims 1 to 7, characterized in that, The silicon-based sensing sensor is attached to the array substrate via an anisotropic conductive film.

9. The display panel according to any one of claims 1 to 7, characterized in that, The external environmental parameters include at least one of light intensity parameters, temperature parameters, and color parameters.

10. The display panel according to any one of claims 1 to 7, characterized in that, The silicon-based sensing sensor includes a sensing area and a connection area, and at least a portion of the connection area is provided with pins.

11. A vehicle-mounted display device, characterized in that, The display panel includes any one of claims 1 to 10.

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