Temperature-resistant and wear-resistant electronic wire and preparation method thereof

Abstract

The application discloses a kind of temperature-resistant wear-resistant electronic wire and preparation method thereof, it is related to electronic wire technical field.The electronic wire of the application includes insulating core, sheath layer, insulating core is conductor outer extrusion package insulating layer, conductor is formed by stranding multiple tinned copper wires, and insulating layer is crosslinked polyethylene insulating layer;Sheath layer is made of sheath material, and sheath material includes the following mass parts raw materials: ethylene-vinyl acetate copolymer 100-120 parts, modified nanosheet 4-5 parts, aluminum hydroxide 30-35 parts, magnesium hydroxide 15-19 parts, flame-retardant crosslinking agent 6-7 parts, synergist 2-2.5 parts, antioxidant 1010 0.5-0.6 parts, antioxidant 168 0.3-0.4 parts, polytetrafluoroethylene micro powder 1.5-2 parts, vinyl trimethoxysilane 2-2.5 parts.The introduction of modified nanosheet, flame-retardant crosslinking agent, synergist and the like effectively improves wear resistance, flame retardancy, waterproofness and temperature resistance.

Description

Technical Field

[0001] This invention relates to the field of electronic wire technology, specifically to a temperature-resistant and wear-resistant electronic wire and its preparation method. Background Technology

[0002] Electronic wires are core components in electronic devices and electrical systems that transmit electrical energy and signals, and are widely used in home appliances, automobiles, industrial automation, and other fields. Electronic wires consist of a conductor, an insulation layer, and a sheath layer. The conductor is responsible for transmitting electrical energy and signals, the insulation layer ensures insulation isolation between conductors, and the sheath layer provides protection against the external environment.

[0003] The sheathing material is mostly made of polymeric materials with insulating and protective properties, and common types include polyvinyl chloride, polyethylene, and ethylene-vinyl acetate copolymer. Among them, ethylene-vinyl acetate copolymer is widely used in the field of medium and low voltage electronic wire sheathing due to its good flexibility, excellent processing fluidity, and moderate cost advantage.

[0004] However, ethylene-vinyl acetate copolymer-based sheathing materials still have the following performance shortcomings in practical applications: First, they have poor abrasion resistance. Under frequent friction and dragging, the sheath surface is prone to scratches and wear, which can lead to safety hazards such as short circuits and leakage in electronic wires in severe cases. Second, their flame retardancy and temperature resistance are insufficient. Ethylene-vinyl acetate copolymer itself is a flammable polymer material that is prone to combustion when exposed to high temperatures or open flames. Moreover, its long-term operating temperature is usually no more than 70°C. In environments such as automotive engine compartments and around high-temperature industrial equipment, it is prone to softening and deformation. At the same time, its waterproof sealing performance is also difficult to meet the long-term use requirements of humid and watery environments. Therefore, the abrasion resistance, flame retardancy, waterproofness, and temperature resistance of existing electronic wire sheathing materials still need to be improved. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature- and wear-resistant electronic wire and its preparation method, thereby solving the following technical problems: Existing electronic wire sheathing materials still suffer from poor abrasion resistance, flame retardancy, water resistance, and temperature resistance.

[0006] The objective of this invention can be achieved through the following technical solutions: A temperature-resistant and wear-resistant electronic wire includes an insulated core and a sheath layer. The insulated core is a conductor with an extruded insulation layer. The conductor is formed by stranding multiple tinned copper wires. The insulation layer is a cross-linked polyethylene insulation layer. The sheath layer is made of a sheath material comprising the following raw materials in parts by weight: 100-120 parts of ethylene-vinyl acetate copolymer, 4-5 parts of modified nanosheets, 30-35 parts of aluminum hydroxide, 15-19 parts of magnesium hydroxide, 6-7 parts of flame retardant crosslinking agent, 2-2.5 parts of synergist, 0.5-0.6 parts of antioxidant 1010, 0.3-0.4 parts of antioxidant 168, 1.5-2 parts of polytetrafluoroethylene micro powder, and 2-2.5 parts of vinyltrimethoxysilane; The synergist is prepared by first coating and modifying silicon carbide nanowires with zinc borate, and then reacting them with aminopropylheptyl-cage polysilsesquioxane. The flame retardant crosslinking agent is prepared from phytic acid, piperazine, synergist, silane coupling agent KH-560, and silane coupling agent KH-550; The modified nanosheets are prepared by first intercalating hexagonal boron nitride with tannic acid, then ball milling and exfoliating, and finally surface modification with a flame retardant crosslinking agent.

[0007] Preferably, the synergist is mixed with anhydrous ethanol, deionized water, sodium dodecylbenzenesulfonate, and silicon carbide nanowires, and then modified by mixing with zinc borate precursor solution. The resulting modified silicon carbide is reacted with aminopropylheptyl-cage polysilsesquioxane in toluene, and then further processed to obtain the final product.

[0008] Preferably, the synergist is prepared by the following method: A1: Add deionized water, zinc acetate, and boric acid to anhydrous ethanol and stir at 60°C for 30-50 min. Then adjust the pH to 4.8-5.2 and filter to obtain the zinc borate precursor solution. A2: Add deionized water, sodium dodecylbenzenesulfonate, and silicon carbide nanowires to anhydrous ethanol and disperse them by ultrasonication for 30-40 min. Then, add zinc borate precursor solution dropwise and reflux at 80 °C for 2 h. After centrifugation, wash the precipitate and dry it to obtain modified silicon carbide. A3: Add modified silicon carbide to toluene and ultrasonically disperse for 30-40 min. Then add aminopropylheptyl-cage polysilsesquioxane and reflux at 110℃ under nitrogen atmosphere for 4-5 h. After centrifugation, wash the precipitate, dry it, and pass it through a 400-mesh sieve to obtain the synergist.

[0009] Preferably, the ratio of anhydrous ethanol, deionized water, zinc acetate, and boric acid in A1 is 20-30 mL: 20-30 mL: 1-1.5 g: 0.3-0.4 g; The ratio of anhydrous ethanol, deionized water, sodium dodecylbenzenesulfonate, silicon carbide nanowires, and zinc borate precursor solution in A2 is 170-210 mL: 30-40 mL: 0.1 g: 4-6 g: 40-60 mL.

[0010] Preferably, the ratio of toluene, modified silicon carbide, and aminopropylheptyl-cage polysilsesquioxane in A3 is 160-240 mL: 4-6 g: 6-9 g.

[0011] Preferably, the flame retardant crosslinking agent is obtained by mixing and reacting anhydrous ethanol, deionized water, phytic acid aqueous solution, piperazine, and synergist, then mixing and reacting with silane coupling agent KH-560 and silane coupling agent KH-550, and then undergoing subsequent processing.

[0012] Preferably, the flame retardant crosslinking agent is prepared by the following method: Deionized water, phytic acid aqueous solution, piperazine, and synergist were added to anhydrous ethanol and ultrasonically dispersed for 30-40 min. Then, the mixture was stirred at 60 °C for 2 h. Silane coupling agent KH-560 and silane coupling agent KH-550 were added, and the pH was adjusted to 4-5. The mixture was reacted at 80 °C for 4-5 h, and then rotary evaporated at 70 °C to remove water and low-boiling substances, thus obtaining the flame-retardant crosslinking agent.

[0013] Preferably, the ratio of the amount of anhydrous ethanol, deionized water, phytic acid aqueous solution, piperazine, synergist, silane coupling agent KH-560, and silane coupling agent KH-550 is 30-35mL: 20-25mL: 10-12g: 3-3.5g: 2-2.5g: 8-10g: 1g; The phytic acid aqueous solution has a mass fraction of 10%.

[0014] Preferably, the modified nanosheets are obtained by ball milling a mixture of tannic acid, hexagonal boron nitride, and sodium dodecylbenzenesulfonate, followed by washing and drying, then mixing and reacting with a flame retardant crosslinking agent solution, and finally undergoing subsequent processing.

[0015] Preferably, the modified nanosheets are prepared as follows: B1: Tannic acid, hexagonal boron nitride, and sodium dodecylbenzenesulfonate were mixed and ball-milled for 6-7 hours, then washed with deionized water and dried to obtain hexagonal boron nitride nanosheets. B2: Add flame retardant crosslinking agent to deionized water and disperse ultrasonically, then add hexagonal boron nitride nanosheets and stir at 80℃ for 2-3 hours. After centrifugation, washing and drying of the precipitate, modified nanosheets are obtained.

[0016] Preferably, the mass ratio of tannic acid, hexagonal boron nitride, and sodium dodecylbenzenesulfonate in B1 is 12:6:1.3-1.5; The mass ratio of deionized water, flame retardant crosslinking agent, and hexagonal boron nitride nanosheets in B2 is 200-220:5:6.

[0017] Preferably, the sheath material is prepared using the following method: Ethylene-vinyl acetate copolymer was added to a 140℃ two-roll mill and pre-melted for 3-4 minutes. Then, modified nanosheets, aluminum hydroxide, magnesium hydroxide, flame retardant crosslinking agent, synergist, antioxidant 1010, antioxidant 168, polytetrafluoroethylene micro powder, and vinyltrimethoxysilane were added and mixed at 40 r / min for 15-20 minutes. The mixture was then transferred to a flat vulcanizing machine and hot-pressed at 170℃ and 10MPa for 10-12 minutes. Finally, it was heat-treated at 100℃ for 1 hour to obtain the sheath material.

[0018] A method for preparing a temperature- and wear-resistant electronic wire includes the following steps: S1: Twist 5-10 tin-plated copper wires with a diameter of 0.1-0.3mm together to form a conductor; S2: A 0.1-0.3mm thick cross-linked polyethylene insulation layer is extruded onto the surface of the conductor at 180-200℃, and the insulated wire core is obtained after cooling and shaping. S3: Extruding sheath material onto the outer surface of the insulated wire core at 140-160℃ to form a sheath layer with a thickness of 0.2-0.4mm. After cooling and shaping, a temperature-resistant and wear-resistant electronic wire is obtained.

[0019] The beneficial effects of this invention are: This invention provides a temperature-resistant and wear-resistant electronic wire and its preparation method. The invention improves the wear resistance, flame retardancy, water resistance and temperature resistance of the electronic wire sheath material through the following method.

[0020] (1) The hexagonal boron nitride in the modified nanosheets of this invention has a layered crystal structure and low shear energy characteristics, which makes it easy for the interlayer to slip under external force, thereby reducing the direct contact between the material and the friction pair and reducing the friction coefficient; the aminopropylheptyl-cage polysilsesquioxane in the synergist has a long heptyl chain, which can form a lubricating layer on the material surface and further enhance the friction reduction effect; the silicon carbide nanowires in the synergist can form a rigid skeleton in the ethylene-vinyl acetate copolymer matrix, effectively bearing the friction load, inhibiting the plastic deformation and shedding of the matrix, and reducing the generation of wear debris; the grafting modification of silicon carbide nanowires by aminopropylheptyl-cage polysilsesquioxane can improve its compatibility and dispersibility with the matrix and ensure the stability of the rigid skeleton; the silane coupling agents KH-560 and KH-550 in the flame retardant crosslinking agent and the tannic acid modification in the modified nanosheets can all optimize the interface bonding between the filler and the ethylene-vinyl acetate copolymer matrix, reduce interface defects, and avoid the aggravation of local wear caused by stress concentration.

[0021] (2) In the flame retardant crosslinking agent of the present invention, phytic acid can generate phosphoric acid and polyphosphoric acid upon combustion, which can promote the dehydration and char formation of the ethylene-vinyl acetate copolymer matrix; piperazine releases inert gas upon heating, which can dilute combustible gas and combine with phosphorus to form an intumescent char layer; the cage structure of silicon carbide nanowires and aminopropylheptyl-cage polysilsesquioxane in the synergist can enhance the strength of the intumescent char layer and prevent the char layer from cracking and collapsing; the glassy boron trioxide generated by the decomposition of zinc borate at high temperature in the synergist can cover the material surface to enhance the char layer barrier effect; aluminum hydroxide and magnesium hydroxide can also be cooled by endothermic decomposition and react with phosphorus and nitrogen The system synergistically enhances the density and stability of the char layer; the silica ceramic protective layer formed by the high-temperature decomposition of aminopropylheptyl-cage polysilsesquioxane forms a composite barrier layer with the decomposition products of zinc borate and hydroxide, further blocking the spread of flame; silane coupling agents KH-560 and KH-550 can improve the compatibility of flame retardant crosslinking agents, synergists and ethylene-vinyl acetate copolymer matrix, ensuring uniform dispersion of flame retardant components and eliminating flame retardant failure points caused by agglomeration; the amino groups in the aminopropylheptyl-cage polysilsesquioxane molecule can participate in gas-phase flame retardancy, capture combustion free radicals, and supplement the gas-phase flame retardant mechanism.

[0022] (3) The hexagonal boron nitride nanosheets in the modified nanosheets of this invention are randomly dispersed in the ethylene-vinyl acetate copolymer matrix to form a maze-like barrier path, which prolongs the water molecule penetration path and reduces the diffusion rate; the aminopropylheptyl-cage polysilsesquioxane in the synergist has a hydrophobic heptyl long chain, which can improve the hydrophobicity of the material after being grafted onto the silicon carbide surface; the silane coupling agent in the flame retardant crosslinking agent hydrolyzes to form siloxane bonds, which also have hydrophobicity, can reduce the surface energy of the material and reduce water molecule adsorption; the modification of hexagonal boron nitride by tannic acid and the interface optimization effect of silane coupling agent can reduce the interfacial pores between the matrix and the filler and eliminate water molecule penetration channels; the synergist can fill the gaps between the molecular chains of ethylene-vinyl acetate copolymer and form covalent bonds with the matrix through silane coupling agent, which can improve the interfacial bonding force and further block the water penetration caused by the interfacial pores; the salts generated by the reaction of phytic acid and piperazine are uniformly dispersed in the crosslinking network and will not form hydrophilic channels, thus avoiding the deterioration of water resistance.

[0023] (4) The hexagonal boron nitride in the modified nanosheets of this invention has excellent thermal conductivity, which can quickly transfer heat and avoid local overheating that causes the matrix to soften and deform; the silicon carbide nanowires in the synergist have high modulus, which can enhance the rigidity of the matrix and improve the heat deformation resistance; the rigid units of the cage-shaped polysilsesquioxane grafted thereon are combined with the ethylene-vinyl acetate copolymer matrix, which can increase the glass transition temperature of the polymer; the flame retardant crosslinking agent makes the ethylene-vinyl acetate copolymer matrix form a three-dimensional crosslinking network, which restricts the thermal movement of molecular chains and improves the heat deformation resistance stability; the synergist and the flame retardant crosslinking agent work together to increase the crosslinking density of the matrix. The higher the crosslinking density, the more significantly the molecular chain movement is restricted, and the higher the heat deformation temperature; aluminum hydroxide and magnesium hydroxide decompose and absorb heat when heated, which can delay the increase of matrix temperature and indirectly improve the heat deformation resistance.

[0024] (5) The hexagonal boron nitride in the modified nanosheets of this invention and the silicon carbide nanowires in the synergist have excellent heat resistance and are not easily decomposed at high temperatures. They can maintain the reinforcing effect on the matrix and block oxygen and heat from penetrating into the matrix. The silica protective layer formed by the decomposition of aminopropylheptyl-cage polysilsesquioxane at high temperatures can further delay the oxidation of the internal matrix. Antioxidant 1010 and antioxidant 168 work synergistically to inhibit the high-temperature oxidative degradation of ethylene-vinyl acetate copolymer and reduce molecular chain breakage. The flame retardant crosslinking agent contains Phytic acid-derived phosphorus and piperazine-derived nitrogen can capture free radicals generated by thermal oxidation, forming a synergistic anti-aging system with antioxidants; the cross-linked network of the ethylene-vinyl acetate copolymer matrix and the cage-like structure of the cage-like polysilsesquioxane can stabilize the matrix chemical structure and reduce the degradation rate at high temperatures; the rigid support of silicon carbide nanowires can maintain the integrity of the material's mechanical structure and reduce the strength loss caused by matrix softening at high temperatures; the strong interfacial bonding between the synergist and the matrix can avoid the deterioration of mechanical properties caused by interfacial debonding at high temperatures.

[0025] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. The embodiments described below are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0027] Unless otherwise specified, the following information pertains to some of the raw materials used in the following embodiments and comparative examples of this invention: Ethylene-vinyl acetate copolymer, model: Yangzi BASF V6110M; polytetrafluoroethylene micro powder purchased from Shanghai Kanglang Biotechnology Co., Ltd., item number: KL816159.

[0028] Example 1: A method for preparing a temperature-resistant and wear-resistant electronic wire is as follows: S1: Add 20 mL of deionized water, 1 g of zinc acetate, and 0.3 g of boric acid to 20 mL of anhydrous ethanol and stir at 60 °C for 30 min. Then adjust the pH to 4.8 with 0.1 mol / L acetic acid and filter through a 0.45 μm filter membrane to obtain the zinc borate precursor solution. S2: Add 30 mL of deionized water, 0.1 g of sodium dodecylbenzenesulfonate, and 4 g of silicon carbide nanowires (50-100 nm in diameter and 10-20 μm in length) to 170 mL of anhydrous ethanol and sonicate for 30 min. Then, add 40 mL of zinc borate precursor solution dropwise at 0.5 mL / min and reflux and stir at 80 °C for 2 h. After centrifugation and washing three times with anhydrous ethanol, vacuum dry at 60 °C for 6 h to obtain modified silicon carbide. S3: Add 4g of modified silicon carbide to 160mL of toluene and ultrasonically disperse for 30min. Then add 6g of aminopropylheptyl-cage polysilsesquioxane and reflux at 110℃ under nitrogen atmosphere for 4h. After centrifugation and washing the precipitate three times with toluene, vacuum dry at 145℃ for 8h and finally pass through a 400-mesh sieve to obtain the synergist. S4: Add 20 mL of deionized water, 10 g of 10% phytic acid aqueous solution, 3 g of piperazine, and 2 g of synergist to 30 mL of anhydrous ethanol and ultrasonically disperse for 30 min. Then stir at 60 °C for 2 h. Add 8 g of silane coupling agent KH-560 and 1 g of silane coupling agent KH-550 and adjust the pH to 4 with acetic acid. React at 80 °C for 4 h and then remove water and low-boiling substances by rotary evaporation at 70 °C to obtain flame retardant crosslinking agent. S5: 12g tannic acid, 6g hexagonal boron nitride and 1.3g sodium dodecylbenzenesulfonate were mixed and ball-milled at 500r / min for 6h, then washed with deionized water 5 times and vacuum dried at 60℃ for 12h to obtain hexagonal boron nitride nanosheets. S6: Add 5g of flame retardant crosslinking agent to 200mL of deionized water and ultrasonically disperse for 30min. Then add 6g of hexagonal boron nitride nanosheets and stir at 80℃ for 2h. After centrifugation and washing with deionized water 3 times, vacuum dry at 80℃ for 6h to obtain modified nanosheets. S7: Add 100g of ethylene-vinyl acetate copolymer to a 140℃ two-roll mill and pre-melt for 3min. Then add 4g of modified nanosheets, 30g of aluminum hydroxide, 15g of magnesium hydroxide, 6g of flame retardant crosslinking agent, 2g of synergist, 0.5g of antioxidant 1010, 0.3g of antioxidant 168, 1.5g of polytetrafluoroethylene micro powder, and 2g of vinyltrimethoxysilane and mix at 40r / min for 15min. Then transfer to a flat vulcanizing machine and hot press at 170℃ and 10MPa for 10min. Finally, heat treat at 100℃ for 1h to obtain the sheath material. S8: Five tin-plated copper wires with a diameter of 0.1mm are twisted together to form a conductor; S9: A 0.1 mm thick cross-linked polyethylene insulation layer is extruded onto the conductor surface at 180°C, and after cooling and shaping, an insulated wire core is obtained; S10: Extruding sheath material onto the outer surface of the insulated wire core at 140℃ to form a 0.2mm thick sheath layer, and obtaining a temperature-resistant and wear-resistant electronic wire after cooling and shaping.

[0029] Example 2: A method for preparing a temperature-resistant and wear-resistant electronic wire is as follows: S1: Add 25 mL of deionized water, 1.3 g of zinc acetate, and 0.35 g of boric acid to 25 mL of anhydrous ethanol and stir at 60 °C for 40 min. Then adjust the pH to 5 with 0.1 mol / L acetic acid and filter through a 0.45 μm filter membrane to obtain the zinc borate precursor solution. S2: Add 35 mL of deionized water, 0.1 g of sodium dodecylbenzenesulfonate, and 5 g of silicon carbide nanowires (50-100 nm in diameter and 10-20 μm in length) to 190 mL of anhydrous ethanol and sonicate for 35 min. Then, add 50 mL of zinc borate precursor solution dropwise at 0.5 mL / min and reflux and stir at 80 °C for 2 h. After centrifugation and washing 4 times with anhydrous ethanol, vacuum dry at 60 °C for 7 h to obtain modified silicon carbide. S3: Add 5g of modified silicon carbide to 200mL of toluene and ultrasonically disperse for 35min. Then add 7.5g of aminopropylheptyl-cage polysilsesquioxane and reflux at 110℃ under nitrogen atmosphere for 4.5h. After centrifugation and washing the precipitate with toluene 4 times, vacuum dry at 150℃ for 9h and finally pass through a 400-mesh sieve to obtain the synergist. S4: Add 23 mL of deionized water, 11 g of 10% phytic acid aqueous solution, 3.3 g of piperazine, and 2.3 g of synergist to 33 mL of anhydrous ethanol and ultrasonically disperse for 35 min. Then stir at 60 °C for 2 h. Add 9 g of silane coupling agent KH-560 and 1 g of silane coupling agent KH-550 and adjust the pH to 4.5 with acetic acid. React at 80 °C for 4.5 h and then remove water and low-boiling substances by rotary evaporation at 70 °C to obtain flame retardant crosslinking agent. S5: 12g tannic acid, 6g hexagonal boron nitride and 1.4g sodium dodecylbenzenesulfonate were mixed and ball-milled at 600r / min for 6.5h, then washed with deionized water 6 times and vacuum dried at 60℃ for 13h to obtain hexagonal boron nitride nanosheets. S6: Add 5g of flame retardant crosslinking agent to 210mL of deionized water and ultrasonically disperse for 40min. Then add 6g of hexagonal boron nitride nanosheets and stir at 80℃ for 2.5h. After centrifugation and washing with deionized water 4 times, vacuum dry at 80℃ for 7h to obtain modified nanosheets. S7: Add 110g of ethylene-vinyl acetate copolymer to a 140℃ two-roll mill and pre-melt for 3.5min. Then add 4.5g of modified nanosheets, 33g of aluminum hydroxide, 17g of magnesium hydroxide, 6.5g of flame retardant crosslinking agent, 2.3g of synergist, 0.55g of antioxidant 1010, 0.35g of antioxidant 168, 1.8g of polytetrafluoroethylene micro powder, and 2.3g of vinyltrimethoxysilane and mix at 40r / min for 18min. Then transfer to a flat vulcanizing machine and hot press at 170℃ and 10MPa for 11min. Finally, heat treat at 100℃ for 1h to obtain the sheath material. S8: Eight tin-plated copper wires with a diameter of 0.2mm are twisted together to form a conductor; S9: A 0.2mm thick cross-linked polyethylene insulation layer is extruded onto the conductor surface at 190℃, and after cooling and shaping, an insulated wire core is obtained; S10: Extruding sheath material onto the outer surface of the insulated wire core at 150℃ to form a 0.3mm thick sheath layer, and obtaining a temperature-resistant and wear-resistant electronic wire after cooling and shaping.

[0030] Example 3: A method for preparing a temperature-resistant and wear-resistant electronic wire is as follows: S1: Add 30 mL of deionized water, 1.5 g of zinc acetate, and 0.4 g of boric acid to 30 mL of anhydrous ethanol and stir at 60 °C for 50 min. Then adjust the pH to 5.2 with 0.1 mol / L acetic acid and filter through a 0.45 μm filter membrane to obtain the zinc borate precursor solution. S2: Add 40 mL of deionized water, 0.1 g of sodium dodecylbenzenesulfonate, and 6 g of silicon carbide nanowires (50-100 nm in diameter and 10-20 μm in length) to 210 mL of anhydrous ethanol and sonicate for 40 min. Then, add 60 mL of zinc borate precursor solution dropwise at 0.5 mL / min and reflux and stir at 80 °C for 2 h. After centrifugation and washing 5 times with anhydrous ethanol, vacuum dry at 60 °C for 8 h to obtain modified silicon carbide. S3: Add 6g of modified silicon carbide to 240mL of toluene and ultrasonically disperse for 40min. Then add 9g of aminopropylheptyl-cage polysilsesquioxane and reflux at 110℃ under nitrogen atmosphere for 5h. After centrifugation and washing the precipitate with toluene 5 times, vacuum dry at 155℃ for 10h and finally pass through a 400-mesh sieve to obtain the synergist. S4: Add 25 mL of deionized water, 12 g of 10% phytic acid aqueous solution, 3.5 g of piperazine, and 2.5 g of synergist to 35 mL of anhydrous ethanol and ultrasonically disperse for 40 min. Then stir at 60 °C for 2 h. Add 10 g of silane coupling agent KH-560 and 1 g of silane coupling agent KH-550 and adjust the pH to 5 with acetic acid. React at 80 °C for 5 h and then remove water and low-boiling substances by rotary evaporation at 70 °C to obtain flame retardant crosslinking agent. S5: 12g tannic acid, 6g hexagonal boron nitride and 1.5g sodium dodecylbenzenesulfonate were mixed and ball-milled at 700r / min for 7h, then washed with deionized water 7 times and vacuum dried at 60℃ for 14h to obtain hexagonal boron nitride nanosheets. S6: Add 5g of flame retardant crosslinking agent to 220mL of deionized water and ultrasonically disperse for 50min. Then add 6g of hexagonal boron nitride nanosheets and stir at 80℃ for 3h. After centrifugation and washing with deionized water 5 times, vacuum dry at 80℃ for 8h to obtain modified nanosheets. S7: Add 120g of ethylene-vinyl acetate copolymer to a 140℃ two-roll mill and pre-melt for 4min. Then add 5g of modified nanosheets, 35g of aluminum hydroxide, 19g of magnesium hydroxide, 7g of flame retardant crosslinking agent, 2.5g of synergist, 0.6g of antioxidant 1010, 0.4g of antioxidant 168, 2g of polytetrafluoroethylene micro powder, and 2.5g of vinyltrimethoxysilane and mix at 40r / min for 20min. Then transfer to a flat vulcanizing machine and hot press at 170℃ and 10MPa for 12min. Finally, heat treat at 100℃ for 1h to obtain the sheath material. S8: Twist 10 tin-plated copper wires with a diameter of 0.3mm together to form a conductor; S9: A 0.3mm thick cross-linked polyethylene insulation layer is extruded onto the conductor surface at 200℃, and after cooling and shaping, an insulated wire core is obtained; S10: Extruding sheath material onto the outer surface of the insulated wire core at 160℃ to form a 0.4mm thick sheath layer, and obtaining a temperature-resistant and wear-resistant electronic wire after cooling and shaping.

[0031] Comparative Example 1: Compared with Example 1, this comparative example only did not add a "synergist" in the preparation process of S4. All other steps and parameters were the same, and will not be repeated here. The final result was a temperature-resistant and wear-resistant electronic wire.

[0032] Comparative Example 2: Compared with Example 1, this comparative example only did not add "modified nanosheets" in the preparation process of S7. All other steps and parameters were the same, and will not be repeated here. The final result was a temperature-resistant and wear-resistant electronic wire.

[0033] Comparative Example 3: Compared with Example 1, this comparative example only did not add "flame retardant crosslinking agent" in the preparation process of S7. All other steps and parameters were the same, and will not be repeated here. The final result was a temperature-resistant and wear-resistant electronic wire.

[0034] Comparative Example 4: Compared with Example 1, this comparative example only did not add a "synergist" in the preparation process of S7. All other steps and parameters were the same, and will not be repeated here. The final result was a temperature-resistant and wear-resistant electronic wire.

[0035] Performance testing: Abrasion resistance testing: Referring to GB / T 3960-2016 standard, the sheath material of the temperature-resistant and wear-resistant electronic wire prepared in Examples 1-3 and Comparative Examples 1-4 of this invention was made into a specimen with a size of 30mm×7mm×6mm, and the wear mass (mg) after 1000 revolutions at 100 rpm under a 5N load was measured. The measurement results are shown in Table 1.

[0036] Flame retardancy testing: Referring to GB / T 2408-2008 standard, the vertical combustion flame retardancy rating (grade) of the temperature-resistant and wear-resistant electronic wire sheath materials prepared in Examples 1-3 and Comparative Examples 1-4 of this invention was determined, and the test results are shown in Table 1.

[0037] Water resistance testing: Referring to GB / T 1034-2008 standard, the water absorption rate (%) of the temperature-resistant and wear-resistant electronic wires prepared in Examples 1-3 and Comparative Examples 1-4 of this invention after soaking in deionized water at 25°C for 24 hours was determined. The test results are shown in Table 1.

[0038] Determination of heat distortion temperature: Referring to ASTM D648-18 standard, the temperature (°C) at which the sheath material of the temperature-resistant and wear-resistant electronic wires prepared in Examples 1-3 and Comparative Examples 1-4 of this invention deformed by 0.25 mm under a load of 0.45 MPa and a heating rate of 2 °C / min was measured. The measurement results are shown in Table 1.

[0039] Temperature resistance determination: Referring to GB / T 2951.11-2008 standard, the tensile strength retention rate (%) of the sheath materials of the temperature-resistant and wear-resistant electronic wires prepared in Examples 1-3 and Comparative Examples 1-4 of this invention after being treated at 150℃ for 168 hours and then cooled was determined. The test results are shown in Table 1.

[0040] Table 1: Performance test results of Examples 1-3 and Comparative Examples 1-4 Data Analysis: As can be seen from Table 1, the temperature-resistant and wear-resistant electronic wire prepared by the embodiments of the present invention has excellent wear resistance, flame retardancy, water resistance and temperature resistance.

[0041] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A temperature-resistant and wear-resistant electronic wire, characterized in that, It includes an insulated wire core and a sheath layer. The insulated wire core is a conductor with an extruded insulation layer. The conductor is formed by stranding multiple tinned copper wires. The insulation layer is a cross-linked polyethylene insulation layer. The sheath layer is made of a sheath material comprising the following raw materials in parts by weight: 100-120 parts of ethylene-vinyl acetate copolymer, 4-5 parts of modified nanosheets, 30-35 parts of aluminum hydroxide, 15-19 parts of magnesium hydroxide, 6-7 parts of flame retardant crosslinking agent, 2-2.5 parts of synergist, 0.5-0.6 parts of antioxidant 1010, 0.3-0.4 parts of antioxidant 168, 1.5-2 parts of polytetrafluoroethylene micro powder, and 2-2.5 parts of vinyltrimethoxysilane; The synergist is prepared by first coating and modifying silicon carbide nanowires with zinc borate, and then reacting them with aminopropylheptyl-cage polysilsesquioxane; the flame retardant crosslinking agent is prepared by phytic acid, piperazine, synergist, silane coupling agent KH-560, and silane coupling agent KH-550; the modified nanosheets are prepared by first intercalating hexagonal boron nitride with tannic acid, ball milling and exfoliation, and then surface modification with flame retardant crosslinking agent.

2. The temperature-resistant and wear-resistant electronic wire according to claim 1, characterized in that, The synergist is mixed with anhydrous ethanol, deionized water, sodium dodecylbenzenesulfonate, and silicon carbide nanowires, and then modified by mixing with zinc borate precursor solution. The resulting modified silicon carbide is reacted with aminopropylheptyl-cage polysilsesquioxane in toluene, and then further processed to obtain the final product.

3. The temperature-resistant and wear-resistant electronic wire according to claim 2, characterized in that, The zinc borate precursor solution is obtained by mixing anhydrous ethanol, deionized water, zinc acetate, and boric acid in a ratio of 20-30 mL: 20-30 mL: 1-1.5 g: 0.3-0.4 g. The ratio of anhydrous ethanol, deionized water, sodium dodecylbenzenesulfonate, silicon carbide nanowires, and zinc borate precursor solution is 170-210 mL: 30-40 mL: 0.1 g: 4-6 g: 40-60 mL.

4. The temperature-resistant and wear-resistant electronic wire according to claim 2, characterized in that, The mass ratio of the modified silicon carbide to aminopropylheptyl-cage polysilsesquioxane is 4-6:6-9.

5. The temperature-resistant and wear-resistant electronic wire according to claim 1, characterized in that, The flame retardant crosslinking agent is obtained by mixing and reacting anhydrous ethanol, deionized water, phytic acid aqueous solution, piperazine, and synergist, then mixing and reacting with silane coupling agent KH-560 and silane coupling agent KH-550, and then undergoing subsequent processing.

6. The temperature-resistant and wear-resistant electronic wire according to claim 5, characterized in that, The ratio of anhydrous ethanol, deionized water, phytic acid aqueous solution, piperazine, synergist, silane coupling agent KH-560, and silane coupling agent KH-550 is 30-35mL: 20-25mL: 10-12g: 3-3.5g: 2-2.5g: 8-10g: 1g; The phytic acid aqueous solution has a mass fraction of 10%.

7. The temperature-resistant and wear-resistant electronic wire according to claim 1, characterized in that, The modified nanosheets are obtained by ball milling a mixture of tannic acid, hexagonal boron nitride, and sodium dodecylbenzenesulfonate, followed by washing and drying, then mixing and reacting with a flame retardant crosslinking agent solution, and finally undergoing subsequent processing.

8. The temperature-resistant and wear-resistant electronic wire according to claim 7, characterized in that, The mass ratio of tannic acid, hexagonal boron nitride, and sodium dodecylbenzenesulfonate is 12:6:1.3-1.5; The flame retardant crosslinking agent solution is obtained by mixing deionized water and flame retardant crosslinking agent in a mass ratio of 200-220:5; The mass ratio of the flame retardant crosslinking agent solution to hexagonal boron nitride nanosheets is 205-225:

6.

9. The temperature-resistant and wear-resistant electronic wire according to claim 1, characterized in that, The method for preparing the sheath material is as follows: Ethylene-vinyl acetate copolymer was added to a two-roll mill at 140℃ and pre-melted for 3-4 minutes. Then, modified nanosheets, aluminum hydroxide, magnesium hydroxide, flame retardant crosslinking agent, synergist, antioxidant 1010, antioxidant 168, polytetrafluoroethylene micro powder, and vinyltrimethoxysilane were added and mixed for 15-20 minutes. Then, the mixture was hot-pressed at 170℃ and 10MPa, and finally heat-treated at 100℃ for 1 hour to obtain the sheath material.

10. A method for preparing a temperature-resistant and wear-resistant electronic wire according to any one of claims 1-9, characterized in that, Includes the following steps: S1: Several tin-plated copper wires are twisted together to form a conductor; S2: An insulated wire core is obtained by extruding a cross-linked polyethylene insulation layer onto the surface of the conductor and cooling and shaping it. S3: Extruding sheath material onto the outer surface of the insulated wire core to form a sheath layer, and then cooling and shaping to obtain a temperature-resistant and wear-resistant electronic wire.

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