A cloud-controlled communication gateway device

Abstract

The application relates to a cloud control communication gateway device which comprises a shell, a mainboard and a heat conduction plate arranged between the shell and the mainboard, the mainboard is provided with a plurality of core processing units, the heat conduction plate is provided with liquid cooling channels corresponding to the core processing units, the two sides of the liquid cooling channels are provided with flow resistance wings to form a Tesla valve structure, the liquid cooling channels are in a multi-section nested concave shape, the cooling liquid can be transported to a high-temperature center and the heat exchange time is prolonged, the top plate of the heat conduction plate is provided with high-thermal-conductivity metal sheets corresponding to the chips, the three are connected through diffusion welding, and the heat of non-core chips is directly conducted to the shell through the heat conduction plate. The liquid inlet and the liquid outlet are integrally formed with the heat conduction plate and extend into a heat dissipation chamber, and a liquid cooling circulation mechanism is arranged in the heat dissipation chamber. An independent adjusting assembly is arranged on the liquid inlet valve, the cooling liquid flow can be adjusted as required, and the device can realize on-demand heat dissipation. The device can avoid liquid leakage and dust entering, the heat dissipation cold row, the filter screen and the filtering module are convenient to maintain, the stable operation of the gateway for 24 hours is guaranteed, and the device is suitable for different working scenes.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, specifically to a cloud-controlled communication gateway device. Background Technology

[0002] The cloud-controlled communication gateway is a core edge terminal in Industrial Internet of Things (IIoT) and edge computing scenarios. Acting as a "translator" and "gatekeeper" between heterogeneous field devices and the cloud platform, it is responsible for protocol conversion, data acquisition, edge processing, and remote control, achieving integrated device networking and remote maintenance. The cloud-controlled communication gateway mainly includes a core processing module, power management module, communication module, storage module, and analog-to-digital converter module. Each module contains one or more chips, with the core processing module chip having the highest workload and generating the most heat, making it the main heat source for the gateway and requiring focused heat dissipation design. Therefore, it is crucial to prioritize heat dissipation for the core processing unit. Small gateways typically use a single CPU chip as the main control processing unit, while medium and large gateways use dual-core or multi-core processing chips.

[0003] In existing technologies, small cloud-controlled communication gateways, due to their low power consumption and minimal heat generation, typically employ passive cooling structures, using a thermally conductive substrate to conduct heat from the internal core chip to the outer casing for natural heat dissipation. Medium and large gateways, due to their heavy workload, high power consumption, and significant heat generation, often utilize active air cooling. However, the actual cooling effect is limited and fails to meet the stable heat dissipation requirements under high load conditions. Furthermore, active air cooling requires air inlets and outlets in the gateway casing, allowing dust from the external environment to easily enter the casing with the airflow and adhere to and accumulate on the circuit board surface. Dust accumulation not only further reduces the device's heat dissipation efficiency, leading to performance degradation, but also easily attracts moisture from the air, forming conductive paths on the circuit board surface and causing electrical faults such as leakage and short circuits, severely impacting the gateway's operational reliability and lifespan. Summary of the Invention

[0004] The purpose of this invention is to overcome the above-mentioned technical problems and provide a cloud-controlled communication gateway device.

[0005] To achieve the above objectives, this invention adopts the following technical solution: A cloud-controlled communication gateway device includes a housing and a motherboard. The motherboard has multiple core processing units. A heat-conducting plate is provided between the motherboard and the housing. Multiple liquid-cooling channels are provided within the heat-conducting plate. Multiple flow-blocking vanes are evenly distributed on both sides of the liquid-cooling channels, forming a Tesla valve-like structure. The coolant flows in reverse within this structure, allowing it to pass through the flow-blocking vanes and prolonging its residence time. The positions of the liquid-cooling channels correspond to the positions of the core processing units. Heat from chips other than the core processing units is directly transferred to the housing through the heat-conducting plate. The hot plate has multiple liquid inlets corresponding to multiple liquid cooling channels, and the multiple liquid inlets are connected to the same liquid inlet valve. The liquid inlet valve has multiple adjusting components corresponding to the multiple liquid inlets, and the liquid inlet resistance of the corresponding liquid inlet is adjusted by adjusting the adjusting components. The heat-conducting plate has a liquid outlet, and the outlet ends of the multiple liquid cooling channels converge at the liquid outlet. The top of the shell has a heat dissipation shroud, and the heat dissipation shroud and the shell form a heat dissipation chamber. The liquid inlets, liquid outlets and heat-conducting plates are an integral structure, and all of them extend through the shell into the heat dissipation chamber. The heat dissipation chamber has a liquid cooling heat dissipation circulation mechanism, which is connected to the liquid inlet valve and the liquid outlet.

[0006] Furthermore, the liquid cooling channel is a U-shaped structure formed by multiple consecutive nested segments, with its inlet end located on the inner side and its outlet end on the outer side. Since the CPU center generally has the highest temperature, gradually decreasing towards the outside, the above structure allows the coolant to be directly delivered to the high-temperature center, achieving rapid cooling.

[0007] Furthermore, the heat-conducting plate includes a bottom plate and a top plate. The liquid cooling channel is disposed on the bottom plate, and the liquid inlet and outlet are disposed on the top plate. Both the bottom plate and the top plate are made of aluminum. A through hole is hollowed out on the top plate corresponding to the position of the core processing unit, and a high thermal conductivity metal sheet is disposed inside.

[0008] Furthermore, the high thermal conductivity metal sheet is connected to the top plate and the bottom plate to the top plate using a diffusion welding method.

[0009] Furthermore, the inlet valve includes a main valve body pipe and branch pipes. Multiple branch pipes are provided, each corresponding to a multiple inlet port. The branch pipe has a T-shaped structure. One end of the horizontal section of the branch pipe is connected to the main valve body pipe, and the adjustment component is disposed in its horizontal section and connected to the end away from the main valve body pipe.

[0010] Furthermore, the adjustment assembly includes an adjustment screw, an adjustment push plate, a resistance spring, and a sealing piston. The horizontal part of the branch pipe away from the main pipe of the valve body is provided with a through hole with internal threads. The adjustment screw is threadedly engaged with the through hole. The adjustment push plate is slidably disposed in the horizontal part of the branch pipe and is rotatably connected to the adjustment screw. The end of the adjustment push plate away from the adjustment screw is connected to the resistance spring, and the sealing piston is connected to the other end of the resistance spring. The resistance spring always provides a thrust to the sealing piston, so that it seals the opening at the connection between the main pipe of the valve body and the branch pipe and the opening at the connection between the horizontal and vertical parts of the branch pipe.

[0011] Furthermore, the liquid cooling heat dissipation circulation mechanism includes a liquid pump, a heat dissipation radiator, and a cooling fan. The liquid pump is connected to the inlet of the liquid inlet valve and the heat dissipation radiator. The other end of the heat dissipation radiator is connected to the liquid outlet. The cooling fan is located above the heat dissipation radiator and is fixed on the heat dissipation cover.

[0012] Furthermore, a liquid replenishment box is provided between the liquid pump and the heat dissipation radiator. The liquid replenishment box has a filter module at both its inlet and outlet. The inlet and outlet of the liquid replenishment box are located on their opposite side walls, and each side wall has a slot. The filter module is inserted into the slot. The top of the liquid replenishment box has a sealing top cover. The sealing top cover has a liquid filling port in the middle and is connected to a sealing cap. The side wall of the sealing top cover is connected to the top edge of the liquid replenishment box body by a snap-fit ​​method.

[0013] Furthermore, the heat dissipation radiator structure is serpentine, with air ducts formed between adjacent sections, so that multiple air duct inlets are provided on the opposite side walls of the heat dissipation radiator, and air inlets are provided on the opposite side walls of the heat dissipation shroud, with the air inlets aligned with the air duct inlets.

[0014] Furthermore, the top two sides of the housing are provided with mounting strips, and the mounting strips are provided with multiple L-shaped snap-fit ​​grooves. The sides of the heat sink cover are provided with snap-fit ​​blocks corresponding to the snap-fit ​​grooves. Each snap-fit ​​block includes a snap-fit ​​rod part and a limiting plate part. The two ends of the snap-fit ​​rod part are respectively connected to the side wall of the heat sink cover and the center of the limiting plate part. The snap-fit ​​rod part extends from the vertical part of the snap-fit ​​groove and snaps into its horizontal part. The diameter of the limiting plate part is larger than the groove width of the snap-fit ​​groove. On the side of the mounting strips that are close to each other, a right-angled trapezoidal friction block is provided corresponding to the horizontal part of the snap-fit ​​groove. Its inclined surface faces the side close to the vertical part of the snap-fit ​​groove. The heat sink cover is fixed by the friction between the top surface of the limiting plate part and the friction block. The side wall of the heat sink cover is provided with a relief groove corresponding to the mounting strip. The mounting strip and the relief groove are slidably connected. The air inlet of the heat sink cover is provided with a recessed groove, and an air filter is installed inside. Each of the four corners of the air filter is provided with a magnetic block. The heat sink cover is made of magnetic metal, and the air filter is installed in the recessed groove by the magnetic blocks.

[0015] The beneficial effects of the present invention are as follows: In the present invention, the heat-conducting plate is provided with liquid cooling channels corresponding to multiple core processing unit chips with large heat generation. The liquid cooling channels are precisely aligned with the core processing unit chips, which can quickly remove the heat generated by them. For other chips with small heat generation, the heat is directly transferred to the shell through the heat-conducting plate to achieve heat dissipation. This ensures that different heat-generating components can receive appropriate heat dissipation treatment, avoid local high temperature, and achieve better heat dissipation effect.

[0016] The present invention features a Tesla valve structure formed by flow-blocking fins distributed on both sides of the liquid cooling channel, allowing the cooling fluid to flow in the opposite direction, thereby delaying the time it takes for the coolant to flow through the channel, ensuring sufficient and uniform heat exchange. The coolant adopts a multi-segment continuously stacked U-shaped structure, allowing the cooling fluid to be directly delivered to the high-temperature center of the core processing unit, and then diffused to the surrounding area. Since the greater the temperature difference between the coolant and the heat source, the more obvious the heat exchange effect, the coolant channel with the above-mentioned U-shaped structure can ensure the maximum heat exchange efficiency.

[0017] This invention employs a top plate and bottom plate connection structure, which facilitates the processing of liquid cooling channels. Although aluminum has a relatively high thermal conductivity, it is far less effective than high thermal conductivity metals such as copper and silver. Therefore, a high thermal conductivity metal sheet is placed on the top plate corresponding to the chip position, which can be directly attached to the chip surface to achieve rapid heat conduction. The high thermal conductivity metal sheet is connected to the top plate and the top plate to the bottom plate using diffusion welding, ensuring a tight connection and extremely low thermal resistance between the bottom plate, the top plate, and the high thermal conductivity metal sheet, reducing heat transfer loss and improving overall heat dissipation efficiency.

[0018] Since the gateway is the data exchange hub between industrial execution equipment, testing equipment, and the cloud platform, it typically operates 24 hours a day without interruption. Damage to it can paralyze and shut down the entire production line. Therefore, this invention integrates the liquid inlet and outlet of the heat-conducting plate with the heat-conducting plate into a single structure, extending through the housing into the heat dissipation chamber. This ensures that there are no leakage points inside the gateway housing, thereby preventing short circuits and chip burnout caused by liquid cooling system leaks. Furthermore, this structure eliminates the need for air inlets and outlets on the gateway housing, preventing dust from entering the housing and affecting the normal operation of the internal circuitry. This ensures both efficient heat dissipation and gateway safety.

[0019] The present invention provides an independent adjustment component for each liquid inlet in the liquid inlet valve. By adjusting the liquid inlet resistance through the adjustment component, the coolant supply of the corresponding liquid cooling channel can be adjusted in a targeted manner when different core processing units of the gateway are under different load states (different heat generation power), so as to achieve "heat dissipation on demand". This avoids the waste of coolant and increased energy consumption at low loads, and also prevents the problem of insufficient heat dissipation at high loads, which greatly improves the adaptability of the device to different working scenarios.

[0020] The serpentine structure of the heat dissipation radiator of this invention, combined with the air duct design, can make full use of the cold air introduced by the air inlet, further enhancing the heat dissipation effect of the heat dissipation radiator and ensuring that the coolant always maintains a low temperature. The heat dissipation cover and air filter can be quickly disassembled and installed, facilitating the maintenance of the internal heat dissipation components. The filter module is set at the inlet and outlet of the liquid replenishment box to facilitate the filtration of impurities in the water, avoiding blockage of the liquid cooling channel and the inside of the heat dissipation radiator, which would lead to the failure of the heat dissipation system. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a cloud-controlled communication gateway device according to the present invention; Figure 2 This is an exploded view of a cloud-controlled communication gateway device according to the present invention; Figure 3 This is an exploded view of the heat sink of a cloud-controlled communication gateway device according to the present invention; Figure 4 This is an exploded view of the heat-conducting plate of a cloud-controlled communication gateway device according to the present invention; Figure 5 This is a schematic diagram of the liquid cooling channel of a cloud-controlled communication gateway device according to the present invention; Figure 6 This is a schematic diagram of the liquid inlet valve of a cloud-controlled communication gateway device according to the present invention, viewed from a perspective. Figure 7 This is an exploded view of the replenishment box of a cloud-controlled communication gateway device according to the present invention; Figure 8 This is a schematic diagram of the card block of a cloud-controlled communication gateway device according to the present invention.

[0022] 1. Housing; 1.1. Mounting strip; 1.11. Snap-fit ​​groove; 1.12. Friction block; 2. Main board; 3. Core processing unit; 4. Liquid cooling channel; 5. Baffle fin; 6. Liquid inlet; 7. Liquid outlet; 8. Liquid inlet valve; 8.1. Main valve body pipe; 8.2. Branch pipe; 9. Adjustment assembly; 9.1. Adjusting screw; 9.2. Adjusting push plate; 9.3. Resistance spring; 9.4. Sealing piston; 10. Heat sink; 10.1. Air inlet; 10.2. Snap-fit 10.21, Connecting rod; 10.22, Limiting plate; 10.3, Leaving groove; 10.4, Air filter; 10.41, Magnetic block; 11, Liquid pump; 12, Cooling radiator; 13, Cooling fan; 14, Liquid replenishment box; 14.1, Slot; 14.2, Sealed top cover; 14.21, Liquid filling port; 14.22, Sealed cover; 15, Filter module; 16, Heat-conducting plate; 16.1, Base plate; 16.2, Top plate; 16.3, Heat-conducting metal sheet. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0024] Embodiments of the present invention: such as Figure 1 , 2 As shown in Figure 5, a cloud-controlled communication gateway device includes a housing 1 and a motherboard 2. The motherboard 2 has multiple core processing units 3. A heat-conducting plate 16 is provided between the motherboard 2 and the housing 1. Multiple liquid cooling channels 4 are provided within the heat-conducting plate 16. Multiple flow-blocking vanes 5 are evenly distributed on both sides of the liquid cooling channels 4, forming a Tesla valve-like structure. The coolant flows in reverse within this structure, causing turbulence as it flows past the flow-blocking vanes 5, extending its residence time. The positions of the liquid cooling channels 4 correspond to the positions of the core processing units 3. Heat from chips other than the core processing units 3 is directly transferred to the housing 1 through the heat-conducting plate 16, and the heat-conducting plate 16 corresponds to the positions of the multiple core processing units 3. Each liquid cooling channel 4 has multiple liquid inlets 6, which are connected to the same liquid inlet valve 8. The liquid inlet valve 8 has multiple adjusting components 9 corresponding to the multiple liquid inlets 6, which adjust the liquid inlet resistance of the corresponding liquid inlet 6. The heat-conducting plate 16 has a liquid outlet 7, and the outlets of the multiple liquid cooling channels 4 converge at the liquid outlet 7. The top of the housing 1 is provided with a heat dissipation shroud 10, which forms a heat dissipation chamber with the housing 1. The liquid inlets 6, liquid outlets 7 and heat-conducting plate 16 are an integral structure and all extend through the housing 1 into the heat dissipation chamber. The heat dissipation chamber is provided with a liquid cooling heat dissipation circulation mechanism, which is connected to the liquid inlet valve 8 and the liquid outlet 7.

[0025] It is worth noting that thermally conductive grease is applied between the core processing unit 3 and the high thermal conductivity metal sheet 16.3, the other chips and the heat-conducting plate 16, and the heat-conducting plate 16 and the housing; the liquid inlet 6 and the connection between the liquid inlet 6 and the housing 1 can be sealed with sealant or other sealing materials.

[0026] The above structure enables layered heat dissipation of the gateway's core components. Working principle: Heat generated by the core processing unit 3 is transferred to the heat-conducting plate 16 and carried away by the coolant in the liquid-cooling channel 4. Heat from non-core chips is directly conducted through the heat-conducting plate 16 to the housing 1 for dissipation. The coolant, after its flow rate is regulated by the regulating component 9 of the inlet valve 8, enters the liquid-cooling channel 4 from the inlet 6, absorbs heat, and is discharged from the outlet 7 to the liquid-cooling heat dissipation circulation mechanism for cooling and reuse. The integrated inlet 6 and outlet 7 prevent leakage, and the heat dissipation chamber integrates the liquid-cooling components, achieving sealed protection and preventing dust from entering the gateway housing.

[0027] like Figure 5As shown, the liquid cooling channel 4 is a U-shaped structure formed by multiple consecutive nested segments, with its inlet end located on the inner side and its outlet end located on the outer side.

[0028] Since the CPU center typically has the highest temperature, with the temperature gradually decreasing towards the outside, the above structure enables rapid cooling of the high-temperature center of the core processing unit 3 and sufficient heat exchange of the coolant. Working principle: The inlet end of the U-shaped liquid cooling channel 4 extends deep into the high-temperature center, directly delivering the coolant to the area with the most concentrated heat, achieving precise cooling.

[0029] like Figure 4 As shown, the heat-conducting plate 16 includes a bottom plate 16.1 and a top plate 16.2. The liquid cooling channel 4 is disposed on the bottom plate 16.1, and the liquid inlet 6 and liquid outlet 7 are disposed on the top plate. Both the bottom plate 16.1 and the top plate 16.2 are made of aluminum. A through hole is hollowed out on the top plate 16.2 corresponding to the position of the core processing unit 3, and a high thermal conductivity metal sheet 16.3 is disposed inside.

[0030] The high thermal conductivity metal sheet 16.3 is connected to the top plate 16.2, and the bottom plate 16.1 is connected to the top plate 16.2 using diffusion welding.

[0031] The above structure enables convenient processing of the heat-conducting plate 16 and rapid heat conduction. Working principle: The separate design of the bottom plate 16.1 and the top plate 16.2 facilitates the processing of the liquid cooling channel 4 on the bottom plate 16.1, reducing processing difficulty. Aluminum material has both good thermal conductivity and economy, and can quickly conduct heat. A high thermal conductivity metal sheet 16.3 (with thermal conductivity better than aluminum, such as copper, silver, etc.) is set at the through hole of the top plate 16.2, which is directly attached to the surface of the core processing unit 3, shortening the heat transfer path, reducing heat loss, and improving the heat conduction efficiency from the chip to the heat-conducting plate 16. Diffusion welding enables the high thermal conductivity metal sheet 16.3 to form a metallurgical bond with the top plate 16.2, and the bottom plate 16.1 to the top plate 16.2, resulting in high connection strength and good sealing, preventing leakage of the liquid cooling channel 4. At the same time, it eliminates gaps at the connection points of various components, reduces thermal resistance, and ensures that heat can be smoothly conducted between the high thermal conductivity metal sheet 16.3, the top plate 16.2, and the bottom plate 16.1, further improving the overall heat dissipation efficiency.

[0032] like Figure 6 As shown, the liquid inlet valve 8 includes a main valve body pipe 8.1 and a branch pipe 8.2. The branch pipe 8.2 is provided in multiple ways, each corresponding to a multiple liquid inlet port 6. The branch pipe 8.2 has a T-shaped structure. One end of the horizontal part of the branch pipe 8.2 is connected to the main valve body pipe 8.1. The adjusting component 9 is disposed in its horizontal part and connected to the end away from the main valve body pipe 8.1.

[0033] like Figure 6As shown, the adjusting assembly 9 includes an adjusting screw 9.1, an adjusting push plate 9.2, a resistance spring 9.3, and a sealing piston 9.4. The horizontal portion of the branch pipe 8.2, away from the main valve pipe 8.1, has a threaded through hole. The adjusting screw 9.1 is threaded into this through hole. The adjusting push plate 9.2 is slidably disposed within the horizontal portion of the branch pipe 8.2 and rotatably connected to the adjusting screw 9.1. The end of the adjusting push plate 9.2 away from the adjusting screw 9.1 is connected to the resistance spring 9.3, and the sealing piston 9.4 is connected to the other end of the resistance spring 9.3. The resistance spring 9.3 continuously provides a thrust to the sealing piston 9.4, causing it to seal the opening at the connection between the main valve pipe 8.1 and the branch pipe 8.2, as well as the opening at the connection between the horizontal and vertical portions of the branch pipe 8.2.

[0034] It is worth noting that: a limiting guide block is provided on the inner wall of the horizontal part of the branch pipe 8.2, and a corresponding guide notch is provided on the adjusting push plate 9.2. The two work together to ensure that the adjusting push plate 9.2 can only slide along the horizontal part of the branch pipe 8.2 and cannot rotate the adjusting screw 9.1.

[0035] Through the above structure, the flow rates of multiple liquid cooling channels 4 can be independently adjusted. Working principle: The coolant transported by the main valve body pipe 8.1 is diverted through multiple T-shaped branch pipes 8.2 and then delivered to the corresponding inlet 6, subsequently entering each liquid cooling channel 4. By rotating the adjusting screw 9.1, the threaded engagement drives the adjusting push plate 9.2 to slide within the horizontal section of the branch pipe 8.2, thereby compressing or releasing the resistance spring 9.3, changing the thrust of the resistance spring 9.3 on the sealing piston 9.4; the coolant enters the main valve body pipe 8.1... Subsequently, the liquid pressure partially cancels out the thrust of the resistance spring 9.3, pushing the sealing piston 9.4 to move, thus entering the vertical part of the T-shaped branch pipe 8.2. Because the different resistance springs 9.3 exert different thrusts on the sealing piston 9.4, the resistance to liquid entering the T-shaped branch pipe 8.2 varies, resulting in different opening sizes at the top of the vertical part of the T-shaped branch pipe 8.2. This adjusts the liquid inlet volume 6, enabling individual control of the coolant flow rate in each liquid cooling channel 4, adapting to the heat requirements of different core processing units 3. When the heat dissipation mechanism is not working, the power components of the liquid cooling circulation mechanism stop working, and the resistance spring 9.3 pushes the sealing piston 9.4 to completely block the outlet on the main valve pipe 8.1, preventing further liquid flow.

[0036] like Figure 2 As shown, the liquid cooling heat dissipation circulation mechanism includes a liquid pump 11, a heat dissipation radiator 12, and a heat dissipation fan 13. The liquid pump 11 is connected to the inlet of the liquid inlet valve 8 and the heat dissipation radiator 12. The other end of the heat dissipation radiator 12 is connected to the liquid outlet 7. The heat dissipation fan 13 is located above the heat dissipation radiator 12 and is fixed on the heat dissipation cover 10.

[0037] like Figure 2As shown, the heat dissipation radiator 12 has a serpentine structure, with air ducts formed between adjacent sections, so that multiple air duct inlets are provided on the opposite side walls of the heat dissipation radiator 12, and air inlets 10.1 are provided on the opposite side walls of the heat dissipation shroud 10, with the air inlets 10.1 aligned with the air duct inlets.

[0038] The above structure enables efficient circulation and heat dissipation of the coolant. The working principle is as follows: the liquid pump 11 provides power, delivering the coolant, after being cooled by the radiator 12, to the inlet valve 8 and into the inlet 6. After heat exchange through the liquid cooling channel 4 within the heat-conducting plate 6, the coolant collects at the outlet 7 and enters the radiator 12. The cooling fan 13 generates airflow; external air enters the air duct through the air inlet 10.1 and is then exhausted by the cooling fan 13, carrying away heat and cooling the coolant. The cooled coolant is then pumped back into the inlet valve 8 by the liquid pump 11, forming a complete liquid cooling cycle and ensuring the coolant continues to provide cooling. The serpentine structure of the radiator 12 extends the coolant's flow path, increases the heat dissipation area, and allows air to fully contact the surface of the radiator 12, quickly removing heat from the coolant and ensuring effective cooling.

[0039] like Figure 7 As shown, a liquid replenishment box 14 is provided between the liquid pump 11 and the heat dissipation radiator 12. The liquid replenishment box 14 is equipped with a filter module 15 at both its inlet and outlet. The inlet and outlet of the liquid replenishment box 14 are located on its opposite side walls, and each side wall is provided with a slot 14.1. The filter module 15 is inserted into the slot. The top of the liquid replenishment box 14 is provided with a sealing top cover 14.2. The sealing top cover 14.2 is provided with a liquid filling port 14.21 in the middle and is connected to a sealing cover 14.22. The side wall of the sealing top cover 14.2 is connected to the top edge of the liquid replenishment box 14 by a snap-fit ​​method.

[0040] The above structure enables coolant replenishment, filtration, and convenient maintenance of the coolant replenishment box 14. Working principle: Coolant is periodically replenished to the cooling circulation system through the coolant replenishment box 14 to prevent coolant loss. The sealing cover 14.22 can be opened to replenish coolant through the filling port 14.21. When the coolant flows through the coolant replenishment box 14, the inlet and outlet filter modules 15 filter out impurities, preventing them from entering the liquid cooling channel 4, the liquid pump 11, and the radiator 12 and causing blockages. The filter module 15 is inserted into the slot 14.1, and the sealing top cover 14.2 uses a snap-fit ​​connection, allowing for quick disassembly and assembly, facilitating the replacement of the filter module 15 and inspection of the coolant replenishment box 14. Simultaneously, the sealing cover 14.22 and the sealing top cover 14.2 prevent coolant leakage and the entry of impurities.

[0041] like Figure 2 , 3As shown in Figure 8, mounting strips 1.1 are provided on both sides of the top of the housing 1. Multiple L-shaped snap-fit ​​grooves 1.11 are provided on the mounting strips 1.1. Snap-fit ​​blocks 10.2 are provided on both sides of the heat sink 10 corresponding to the snap-fit ​​grooves 1.11. Each snap-fit ​​block 10.2 includes a snap-fit ​​rod portion 10.21 and a limiting plate portion 10.22. The two ends of the snap-fit ​​rod portion 10.21 are respectively connected to the side wall of the heat sink 10 and the center of the limiting plate portion 10.22. The snap-fit ​​rod portion 10.21 extends from the vertical part of the snap-fit ​​groove 1.11 and snaps into its horizontal part. The diameter of the limiting plate portion 10.22 is larger than the width of the snap-fit ​​groove 1.11. The side of the mounting strips 1.1 that is close to each other corresponds to the horizontal part of the snap-fit ​​groove 1.11. The heat sink 10 is secured by a right-angled trapezoidal friction block 1.12, with its inclined surface facing the side closest to the vertical part of the locking groove 1.11. The friction between the limiting plate 10.12 and the top surface of the friction block 1.12 achieves the fixation of the heat sink 10. A clearance groove 10.3 is provided on the side wall of the heat sink 10 corresponding to the mounting strip 1.1, and the mounting strip 1.1 is slidably connected to the clearance groove 10.3. A recessed groove is provided at the air inlet 10.1 of the heat sink 10, inside which an air filter 10.4 is installed. Magnetic blocks 10.41 are provided at each of the four corners of the air filter 10.4. The heat sink 10 is made of magnetic metal, and the air filter 10.4 is installed in the recessed groove by the magnetic blocks 10.41. It is worth noting that a groove is provided on the outer side of the air filter 10.4 to facilitate pulling out the air filter 10.4 for cleaning.

[0042] Through the above structure, the heat sink 10 can be easily disassembled and installed, stably fixed, and the dust can be filtered through the air inlet 10.1. Working principle: When installing the heat sink 10, the locking rod 10.21 of the locking block 10.2 is inserted vertically into the L-shaped locking groove 1.11 and then slid to the horizontal position. Because the diameter of the limiting plate 10.22 is larger than the groove width, the heat sink 10 is initially limited. As the heat sink 10 moves along with the limiting plate 10.22, the contact area between the limiting plate 10.22 and the top surface of the friction block 1.12 gradually increases. After moving into position, the friction between the limiting plate 10.22 and the friction block 1.12 enables the heat sink 10 to... The inclined surface on the friction block 1.12 provides stable fixation, reducing the resistance between the heat sink 10 and the limiting plate 10.22 during the initial sliding phase, making it easier for the snap-fit ​​rod 10.21 to snap into the horizontal part of the snap-fit ​​groove 1.11. The clearance groove 10.3 slides with the mounting strip 1.1 to ensure accurate installation alignment. The air filter 10.4 at the air inlet 10.1 is fixed to the magnetic metal heat sink 10 by magnetic block 10.41, which can filter the cold air entering the heat dissipation chamber and prevent dust, hair or other impurities from adhering to the heat sink 12 and the cooling fan 13, thus affecting heat dissipation. The filter is also easy to install and remove and clean; it can be removed by simply lifting the filter upwards.

Claims

1. A cloud-controlled communication gateway device, comprising a housing (1) and a motherboard (2), wherein the motherboard (2) is provided with multiple core processing units (3), characterized in that: A heat-conducting plate (16) is provided between the motherboard (2) and the housing (1). The heat-conducting plate (16) has multiple liquid cooling channels (4). Multiple flow-blocking wings (5) are also evenly provided on both sides of the liquid cooling channels (4). The coolant flows through the flow-blocking wings (5) to prolong its residence time. The position of the liquid cooling channel (4) corresponds to the position of the core processing unit (3). The heat of the chip other than the core processing unit (3) is directly transferred to the housing (1) through the heat-conducting plate (16). The heat-conducting plate (16) has multiple liquid inlets (6) corresponding to the multiple liquid cooling channels (4). The multiple liquid inlets (6) are connected to the same liquid inlet valve (8). The component (8) is provided with multiple adjustment components (9) corresponding to multiple liquid inlets (6), and the liquid inlet resistance of the corresponding liquid inlet (6) is adjusted by adjusting components (9); the heat conduction plate (16) is provided with a liquid outlet (7), and the outlet ends of multiple liquid cooling channels (4) converge at the liquid outlet (7); the top of the housing (1) is provided with a heat dissipation shroud (10), and the heat dissipation shroud (10) and the housing (1) form a heat dissipation chamber. The liquid inlet (6), the liquid outlet (7) and the heat conduction plate (16) are an integral structure, and both extend through the housing (1) into the heat dissipation chamber. The heat dissipation chamber is provided with a liquid cooling heat dissipation circulation mechanism, and is connected to the liquid inlet valve (8) and the liquid outlet (7).

2. The cloud-controlled communication gateway device according to claim 1, characterized in that: The liquid cooling channel (4) is a U-shaped structure formed by multiple consecutive stacked segments, with its inlet end located on the inner side and its outlet end located on the outer side.

3. The cloud-controlled communication gateway device according to claim 1, characterized in that: The heat-conducting plate (16) includes a bottom plate (16.1) and a top plate (16.2). The liquid cooling channel (4) is set on the bottom plate (16.1), and the liquid inlet (6) and liquid outlet (7) are set on the top plate. Both the bottom plate (16.1) and the top plate (16.2) are made of aluminum. The top plate (16.2) has a through hole corresponding to the position of the core processing unit (3), and a high thermal conductivity metal sheet (16.3) is provided inside.

4. The cloud-controlled communication gateway device according to claim 3, characterized in that: The high thermal conductivity metal sheet (16.3) is connected to the top plate (16.2), and the bottom plate (16.1) is connected to the top plate (16.2) using diffusion welding.

5. The cloud-controlled communication gateway device according to claim 1, characterized in that: The inlet valve (8) includes a main valve body pipe (8.1) and a branch pipe (8.2). The branch pipe (8.2) is provided in multiple ways, each corresponding to a multiple inlet port (6). The branch pipe (8.2) has a T-shaped structure. One end of the horizontal part of the branch pipe (8.2) is connected to the main valve body pipe (8.1). The adjusting component (9) is set in its horizontal part and connected to the end away from the main valve body pipe (8.1).

6. The cloud-controlled communication gateway device according to claim 5, characterized in that: The adjustment assembly (9) includes an adjustment screw (9.1), an adjustment push plate (9.2), a resistance spring (9.3), and a sealing piston (9.4). The horizontal part of the branch pipe (8.2) away from the main pipe (8.1) of the valve body is provided with a through hole with internal threads. The adjustment screw (9.1) is threadedly engaged with the through hole. The adjustment push plate (9.2) is slidably disposed in the horizontal part of the branch pipe (8.2) and is rotatably connected to the adjustment screw (9.1). The end of the adjustment push plate (9.2) away from the adjustment screw (9.1) is connected to the resistance spring (9.3), and the sealing piston (9.4) is connected to the other end of the resistance spring (9.3). The resistance spring (9.3) always provides a thrust to the sealing piston (9.4), so that it seals the opening at the connection between the main pipe (8.1) of the valve body and the branch pipe (8.2) and the opening at the connection between the horizontal and vertical parts of the branch pipe (8.2).

7. The cloud-controlled communication gateway device according to claim 1, characterized in that: The liquid cooling heat dissipation circulation mechanism includes a liquid pump (11), a heat dissipation radiator (12), and a heat dissipation fan (13). The liquid pump (11) is connected to the inlet of the liquid inlet valve (8) and the heat dissipation radiator (12). The other end of the heat dissipation radiator (12) is connected to the liquid outlet (7). The heat dissipation fan (13) is located above the heat dissipation radiator (12) and is fixed on the heat dissipation cover (10).

8. A cloud-controlled communication gateway device according to claim 7, characterized in that: A replenishment box (14) is provided between the liquid pump (11) and the heat dissipation radiator (12). The replenishment box (14) is equipped with a filter module (15) at both the inlet and outlet. The inlet and outlet of the replenishment box (14) are located on their opposite side walls, and slots (14.1) are provided on both side walls. The filter module (15) is inserted into the slot. A sealing top cover (14.2) is provided on the top of the replenishment box (14). A liquid filling port (14.21) is provided in the middle of the sealing top cover (14.2) and a sealing cover (14.22) is connected to it. The side wall of the sealing top cover (14.2) is connected to the top edge of the replenishment box (14) by a snap-fit ​​method.

9. A cloud-controlled communication gateway device according to claim 7, characterized in that: The structure of the heat dissipation radiator (12) is like a snake structure, with air ducts formed between adjacent sections, so that multiple air duct inlets are provided on the opposite side walls of the heat dissipation radiator (12), and air inlets (10.1) are provided on the opposite side walls of the heat dissipation cover (10), with the air inlets (10.1) aligned with the air duct inlets.

10. A cloud-controlled communication gateway device according to claim 1, characterized in that: The top two sides of the housing (1) are provided with mounting strips (1.1), and the mounting strips (1.1) are provided with multiple L-shaped snap-fit ​​grooves (1.11). The heat sink (10) is provided with snap-fit ​​blocks (10.2) on both sides corresponding to the snap-fit ​​grooves (1.11). The snap-fit ​​block (10.2) includes a snap-fit ​​rod part (10.21) and a limiting plate part (10.22). The two ends of the snap-fit ​​rod part (10.21) are respectively connected to the side wall of the heat sink (10) and the center of the limiting plate part (10.22). The snap-fit ​​rod part (10.21) extends from the vertical part of the snap-fit ​​groove (1.11) and snaps into its horizontal part. The diameter of the limiting plate part (10.22) is larger than the groove width of the snap-fit ​​groove (1.11). The side of the mounting strips (1.1) that are close to each other corresponds to the water in the snap-fit ​​groove (1.11). The flat part is provided with a friction block (1.12) with a right-angled trapezoidal structure. Its inclined surface faces the side close to the vertical part of the snap-fit ​​groove (1.11). The heat sink (10) is fixed by the friction between the limiting plate part (10.12) and the top surface of the friction block (1.12). The side wall of the heat sink (10) is provided with a relief groove (10.3) corresponding to the mounting strip (1.1). The mounting strip (1.1) and the relief groove (10.3) are slidably connected. The heat sink (10) has a recessed groove at the air inlet (10.1) on the upper part of the air inlet (10.1). An air filter (10.4) is installed inside. The air filter (10.4) has magnetic blocks (10.41) at each of its four corners. The heat sink (10) is made of magnetic metal, and the air filter (10.4) is installed in the recessed groove by the magnetic blocks (10.41).

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