An ultrasonic cleaning apparatus

Abstract

This application relates to the technical field of cleaning devices, providing an ultrasonic cleaning equipment, including a cleaning system, an ultrasonic generating system, and a transport system. The cleaning system includes a washing unit, a rinsing unit, and a spraying unit. The washing unit includes a washing tank, the rinsing unit includes a rinsing tank, and the spraying unit includes a spraying tank and a spraying assembly disposed on the spraying tank. The spraying assembly includes a liquid supply source, a spraying mesh pipe, and spray heads. The spraying mesh pipe is disposed within the spraying tank, and the spray heads are connected to one side of the spraying mesh pipe. The liquid supply source is used to drive the liquid in the spraying mesh pipe to flow towards the spray heads. The ultrasonic generating system is used to provide vibration energy to the washing tank and the rinsing tank. The transport system is used to move the SMT stencil sequentially into the washing tank, the rinsing tank, and the spraying tank. This application reduces damage to the SMT stencil during the cleaning process while ensuring cleanliness.

Description

Technical Field

[0001] This application relates to the technical field of cleaning devices, and in particular to an ultrasonic cleaning device. Background Technology

[0002] SMT stencils (Surface Mount Technology SMT stencils) are key fixtures in surface mount technology, used to precisely print solder paste onto PCB pads. Their core function is to control the amount of solder paste deposited through specific aperture patterns, directly affecting soldering yield.

[0003] Currently, SMT stencil cleaning primarily employs manual brushing or immersion ultrasonic cleaning. Manual brushing is inefficient and inconsistent, failing to meet the cleaning requirements of high-density, fine-pitch SMT stencils. While immersion ultrasonic cleaning offers high efficiency and wide coverage, prolonged immersion can damage the tension layer of the SMT stencil due to ultrasonic cavitation and the chemical corrosion effect of the cleaning agent. This leads to decreased tension and micro-deformation at the opening edges, affecting its reusability and lifespan. Some manufacturers have attempted to replace traditional immersion methods with spray cleaning technology to reduce the contact time and corrosion risk between the SMT stencil and the cleaning medium. However, spray cleaning relies heavily on fluid impact, limiting its ability to remove stubborn solder paste residue from the micropores and edges of the SMT stencil, especially with high-viscosity residues, where incomplete cleaning is particularly problematic.

[0004] Therefore, existing SMT stencil cleaning technologies still present a technical contradiction between cleanliness and SMT stencil protection, and there is an urgent need to provide a cleaning method that can effectively remove residues while reducing damage to the SMT stencil structure. Summary of the Invention

[0005] In order to reduce damage to SMT stencils during the cleaning process while ensuring cleanliness, this application provides an ultrasonic cleaning device.

[0006] This application provides an ultrasonic cleaning device, which adopts the following technical solution: An ultrasonic cleaning device, comprising: A cleaning system includes a washing unit, a rinsing unit, and a spraying unit. The washing unit includes a washing tank, the rinsing unit includes a rinsing tank, and the spraying unit includes a spraying tank and a spraying assembly disposed on the spraying tank. The spraying assembly includes a liquid supply source, a spraying network pipe, and a spraying head. The spraying network pipe is disposed in the spraying tank, and the spraying head is connected to one side of the spraying network pipe. The liquid supply source is used to drive the liquid in the spraying network pipe to flow towards the spraying head. An ultrasonic generating system is used to provide vibration energy to the washing tank and the rinsing tank; The transport system is used to move the SMT stencil sequentially into the washing tank, rinsing tank, and spray tank.

[0007] By adopting the above technical solutions, the washing tank in the washing unit of the cleaning system can hold cleaning agent to perform preliminary washing of the SMT stencil and remove most of the stains; the rinsing tank in the rinsing unit can hold clean water to rinse the SMT stencil and further remove residual cleaning agent and stains; the spraying unit's spraying pipes are connected to a water source, and the cleaning liquid in the spraying pipes can be driven by a liquid supply source to flow towards the spray heads, spraying and cleaning the washed and rinsed SMT stencil, enhancing the cleaning effect. The ultrasonic generation system can provide vibration energy to the washing tank and rinsing tank, using ultrasonic cavitation to improve cleaning efficiency and cleanliness. The transport system can move the SMT stencil sequentially into the washing tank, rinsing tank, and spraying tank, shortening the soaking cleaning time, effectively removing residues from the SMT stencil, and reducing the damage caused by pure ultrasonic cleaning to the SMT stencil.

[0008] Optionally, the ultrasonic generating system includes ultrasonic transducers and an ultrasonic generator, and a plurality of ultrasonic transducers are provided on the outer wall of the washing tank, the ultrasonic transducers being distributed in a matrix on the outer wall of the washing tank. Multiple ultrasonic transducers are also provided on the outer wall of the rinsing tank, and the ultrasonic transducers are also distributed in a matrix on the outer wall of the rinsing tank.

[0009] By adopting the above technical solution, multiple ultrasonic transducers are arranged in a matrix on the outer wall of the washing tank and rinsing tank, which can provide vibration energy to the tank and make the ultrasonic cavitation effect act more evenly on the SMT stencil, effectively removing stubborn solder paste residues inside the micropores and edge areas of the SMT stencil, and improving the cleaning cleanliness of the SMT stencil.

[0010] Optionally, the cleaning system further includes a drying unit, which includes a drying tank and a drying assembly. The drying assembly includes an air supply source, an air distribution network pipe, and a plurality of air nozzles connected to the air distribution network pipe. The air distribution network pipe is located inside the drying tank, and the air distribution network pipe is connected to a hot air pipe. The air supply source is used to drive the gas in the hot air pipe to flow toward the air distribution network pipe. The transport system is also used to move the SMT stencil from the spray tank to the drying tank.

[0011] By adopting the above technical solution, the SMT stencil can be dried after cleaning, avoiding secondary contamination caused by residual moisture, improving the dryness and cleanliness of the SMT stencil, and reducing the natural drying time. The transport system moves the SMT stencil sequentially through the washing tank, rinsing tank, and spray tank for cleaning, and then moves it to the drying tank for drying, achieving automated connection between the cleaning and drying processes and improving the overall working efficiency of the cleaning equipment.

[0012] Optionally, one end of the hot air pipe is connected to the air distribution network pipe, and the other end of the hot air pipe is connected to a heating pipe. A heating element is installed inside the heating pipe, and the air outlet of the air supply source is connected to the end of the heating pipe away from the hot air pipe. The drying unit also includes a gas filter, which is connected to an air inlet pipe and an air outlet pipe. The air inlet pipe is connected to the drying tank, and the air outlet pipe is connected to the air inlet of the gas supply source.

[0013] By adopting the above technical solution, the hot air duct is connected to the air distribution network duct and the heating pipe. The heating element inside the heating pipe heats the gas, and the hot air is delivered to the drying tank via the air supply source, effectively drying the SMT stencil. Simultaneously, the gas filter installed in the drying unit filters the gas in the drying tank. The filtered gas returns to the air supply source inlet through the exhaust pipe for recycling. This allows for the reuse of the heat from the filtered gas, reducing operating costs, avoiding direct emissions of waste gas that could pollute the environment, and ensuring the cleanliness of the gas in the drying tank, thus improving the drying effect and the quality of the SMT stencil.

[0014] Optionally, the washing unit includes a first liquid pump and a first filter, and the rinsing unit includes a second liquid pump and a second filter; The inlet of the first liquid pump is connected to the washing tank, the outlet of the first liquid pump is connected to the inlet of the first filter, and the outlet of the first filter is connected to the washing tank. The first liquid pump is used to drive the liquid in the washing tank to move towards the first filter. The inlet of the second liquid pump is connected to the rinsing tank, the outlet of the second liquid pump is connected to the inlet of the second filter, and the outlet of the second filter is connected to the rinsing tank. The second liquid pump is used to drive the liquid in the rinsing tank to move towards the first filter.

[0015] By adopting the above technical solution, the first liquid pump of the washing unit delivers the liquid in the washing tank to the first filter, where the liquid is filtered to remove impurities and contaminants. The filtered clean liquid then flows back to the washing tank, achieving circulating filtration of the liquid within the washing tank. Similarly, the second liquid pump of the rinsing unit delivers the liquid in the rinsing tank to the second filter, where the liquid is filtered to remove impurities and contaminants. The filtered clean liquid then flows back to the rinsing tank, achieving circulating filtration of the liquid within the rinsing tank. This maintains the cleanliness of the liquid in both the washing and rinsing tanks, improves the cleaning effect, and reduces damage to the SMT stencil caused by impurities in the liquid.

[0016] Optionally, the transport system includes a two-dimensional moving module, a moving support, and a hoisting component. The two-dimensional moving module is disposed on one side of the cleaning system and is used to drive the moving support to move in two dimensions. The movable support includes a sliding support and a lifting plate connected to the sliding support, wherein the cross-section of the lifting plate is greater than or equal to the opening of the drying tank; The lifting component is connected to the bottom of the lifting plate and is used to lift the SMT stencil.

[0017] By adopting the above technical solution, the two-dimensional moving module drives the moving bracket to move in two dimensions, which can move the SMT stencil sequentially into the washing tank, rinsing tank, spray tank and drying tank to realize an automated cleaning process; the cross-section of the lifting plate is greater than or equal to the opening of the drying tank, which can close the drying tank during drying to reduce the loss of hot air; the lifting component is connected to the bottom of the lifting plate to lift the SMT stencil, which can facilitate the transfer of the SMT stencil.

[0018] Optionally, the transport system further includes a work basket, and the lifting component includes hooks, with multiple hooks spaced apart.

[0019] By adopting the above technical solution, the working basket can be used to place SMT stencils. The multiple hooks set at intervals can lift the working basket more stably and evenly, so that the SMT stencils remain stable during transportation, which is beneficial to subsequent cleaning operations.

[0020] Optionally, the lifting component includes lifting clamps for holding SMT stencils, wherein the lifting clamps are arranged in multiple rows at the bottom of the lifting plate, and each row has at least two lifting clamps spaced apart.

[0021] By adopting the above technical solution, the lifting clamps are set in multiple rows with at least two clamps spaced apart in each row, which can more stably and reliably hold the SMT stencil and prevent the SMT stencil from shaking or falling during transportation, thus ensuring the smooth progress of the cleaning process.

[0022] Optionally, both the washing tank and the rinsing tank can be detachably equipped with multiple positioning clamps. Each positioning clamp includes a positioning mesh shell and a first abutting component disposed on the positioning mesh shell. The positioning mesh shell is provided with a receiving groove for accommodating the SMT stencil. The first abutting component is used to press against the SMT stencil, including two first abutting rods arranged opposite each other. The two first abutting rods are connected to a first damping head at their close ends. The first damping head is made of elastic damping material. One first abutting rod is connected to one inner side wall of the receiving groove, and the other first abutting rod is connected to the other inner side wall of the receiving groove. The first abutting component is provided in multiple sets, and the first abutting component is distributed in a matrix on the positioning mesh shell.

[0023] By adopting the above technical solution, multiple positioning clamps are detachably installed in the washing and rinsing tanks. The positioning clamps have a receiving groove on their positioning mesh shells to accommodate the SMT stencil. During the cleaning operation, the SMT stencil is located in the receiving groove, which contains multiple sets of first abutting components arranged in a matrix. Each first abutting component presses against the SMT stencil through two opposing first pressing rods and first damping heads made of elastic damping material at their ends, increasing support for the center of the SMT stencil. During the SMT stencil cleaning process, the first damping heads can absorb the energy of ultrasonic vibrations transmitted to the SMT stencil, reducing the resonance amplitude and minimizing tension fluctuations in the SMT stencil after being affected by ultrasonic waves, thus reducing damage to the SMT stencil.

[0024] Optionally, the positioning fixture further includes a second abutting component for pressing against the SMT stencil. The second abutting component includes two opposing second pressing rods. The two second pressing rods are connected to a second damping head at their closest ends. The second damping head is made of elastic damping material. One second pressing rod is connected to one inner side wall of the receiving groove, and the other two second pressing rods are connected to the other inner side wall of the receiving groove. Multiple sets of the second abutment components are provided, and the second abutment components are distributed in a matrix on the positioning mesh shell; Both the first and second pressing rods are movably connected to the inner wall of the receiving groove, and their positions after movement can be locked.

[0025] By adopting the above technical solution, the positioning fixture is equipped with a second abutment component, which can press against the SMT stencil from different positions; the second damping head uses an elastic damping material, and its purpose is the same as that of the first damping head; multiple sets of the second abutment components are arranged in a matrix, which can make the abutment force more uniform. The first and second abutment rods are movably connected and their positions can be locked. On the one hand, the abutment position and force can be adjusted according to the size and shape of the SMT stencil; on the other hand, the usage state of the first and second abutment components can be controlled according to the working frequency of the ultrasonic generating system, controlling the support range and support density of the first and second abutment components for adjusting the SMT stencil at different ultrasonic frequencies, thereby improving the flexibility and adaptability of the positioning fixture.

[0026] Optionally, both the first pressing rod and the second pressing rod pass through the inner wall of the receiving groove and are threadedly connected to the inner wall of the receiving groove.

[0027] By adopting the above technical solution, the position of the first and second damping rods in the receiving groove can be adjusted by rotating the first and second damping rods, thereby adjusting the distance between the first and second damping heads, and the position self-locking is achieved through the threaded connection.

[0028] Optionally, in the positioning fixture in the washing tank, the distance between the two first damping heads in the first abutting component is less than or equal to the thickness of the SMT stencil, and the distance between the two second damping heads in the second abutting component is greater than the thickness of the SMT stencil. Within the positioning fixture in the rinsing tank, the distance between the two first damping heads in the first abutting component is greater than the thickness of the SMT stencil, and the distance between the two second damping heads in the second abutting component is less than or equal to the thickness of the SMT stencil.

[0029] By adopting the above technical solution, in the positioning fixture of the washing tank, the distance between the two first damping heads of the first abutment component is less than or equal to the thickness of the SMT stencil, which can stably support the SMT stencil during washing; the distance between the two second damping heads of the second abutment component is greater than the thickness of the SMT stencil, leaving space for washing operations. In the positioning fixture of the rinsing tank, the distance between the two first damping heads of the first abutment component is greater than the thickness of the SMT stencil, leaving space for rinsing operations; the distance between the two second damping heads of the second abutment component is less than or equal to the thickness of the SMT stencil, which can stably support the SMT stencil during rinsing and reduce the vibration of the SMT stencil. By adjusting the first and second abutment components in the washing tank and the rinsing tank, the support areas of the positioning fixtures for the SMT stencil in the washing tank and the rinsing tank are different, reducing cleaning blind spots.

[0030] Optionally, the positioning mesh shell includes two positioning mesh plates arranged opposite each other, and multiple connecting rods are connected between the bottom of the positioning mesh plates and the two positioning mesh plates.

[0031] By adopting the above technical solution, the positioning mesh shell is composed of two positioning mesh plates arranged opposite each other and multiple connecting rods connecting the bottom of the two plates. This ensures good liquid flow inside the positioning mesh shell, allowing the washing liquid and rinsing water to fully contact the SMT stencil to be cleaned, thus improving the cleaning effect. At the same time, it ensures that the positioning mesh shell has a certain structural strength and can stably position the SMT stencil.

[0032] In summary, this application includes at least one of the following beneficial effects: 1. The washing unit, rinsing unit and spraying unit of the cleaning system in this application cooperate with the transport system to enable the SMT stencil to be cleaned to pass through several different cleaning stages such as washing, rinsing and spraying in sequence. Through the synergistic effect of multiple cleaning methods, the solder paste residue on the surface of the SMT stencil and in the micropores is effectively removed, significantly improving the cleanliness. It can also prevent the SMT stencil from being soaked in the cleaning agent for a long time, thereby reducing the damage to the tension layer of the SMT stencil. 2. The drying unit in this application, together with the transport system, moves the cleaned SMT stencil from the spray tank to the drying tank. The gas in the hot air pipe is driven by the air supply source to flow towards the air distribution network pipe, and then hot air is sprayed out by the air nozzle, which can quickly dry the SMT stencil and prevent residual moisture from causing secondary pollution. 3. The first liquid pump and first filter, second liquid pump and second filter respectively provided in the washing unit and rinsing unit of this application can circulate and filter the liquid in the washing tank and rinsing tank, remove impurities and residues, ensure the cleanliness of the cleaning liquid, and realize the reuse of the cleaning liquid. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the ultrasonic cleaning equipment in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the cleaning system in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the transportation system in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the overall structure of the ultrasonic cleaning equipment in Embodiment 2 of this application; Figure 5 This is a schematic diagram of the transportation system in Embodiment 2 of this application; Figure 6 This is a schematic diagram of the positioning fixture in Embodiment 2 of this application; Figure 7 This is a side view of the positioning fixture in Embodiment 2 of this application; Explanation of reference numerals in the attached drawings: 1. Washing unit; 11. Washing tank; 12. First liquid pump; 13. First filter; 2. Rinsing unit; 21. Rinsing tank; 22. Second liquid pump; 23. Second filter; 3. Spray unit; 31. Spray tank; 32. Spray assembly; 321. Infusion source; 322. Spray network pipe; 323. Spray head; 4. Ultrasonic transducer; 5. Ultrasonic generator; 6. Transport system; 61. Two-dimensional mobile module; 62. Mobile support frame; 63. Lifting platform; 64. Hook; 65. Lifting clamp; 67. Work basket; 7. Drying unit; 71. Drying tank; 72. Drying assembly; 721. Air supply source; 722. Air distribution network pipe; 723. Air nozzle; 724. Hot air pipe; 73. Heating pipe; 74. Gas filter; 741. Air inlet pipe; 742. Exhaust pipe; 8. Positioning clamp; 81. Positioning mesh shell; 811. Positioning mesh plate; 812. Connecting rod; 82. First abutting assembly; 821. First pressing rod; 822. First damping head; 823. First operating plate; 83. Second abutting assembly; 831. Second pressing rod; 832. Second damping head; 833. Second operating plate; 9. Frame. Implementation

[0034] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This application will be described in further detail.

[0035] This application mainly uses a cleaning system, an ultrasonic system, and a transport system to clean SMT stencils, achieving both effective removal of residues and reduced damage to the SMT stencil structure during cleaning. The following is a further detailed description of this application.

[0036] Example 1

[0037] Reference Figure 1 and Figure 2 The ultrasonic cleaning equipment provided in this application includes a frame 9, a cleaning system mounted on the frame 9, an ultrasonic generating system, and a transport system 6. The cleaning system includes a washing unit 1, a rinsing unit 2, a spraying unit 3, and a drying unit 7, which sequentially perform washing, rinsing, spraying cleaning, and drying operations on the SMT stencil to be cleaned.

[0038] Reference Figure 1 and Figure 2The washing unit 1 includes a washing tank 11, a first liquid pump 12, and a first filter 13. The washing tank 11, fixed to the frame 9, is a container for holding the washing liquid and the SMT stencil to be cleaned. The washing tank 11 can be a square tank made of stainless steel. During use, cleaning agent needs to be added to the washing tank 11, with the amount sufficient to submerge the SMT stencil. The first liquid pump 12 can be an electromagnetic pump. The inlet of the first liquid pump 12 is connected to the washing tank 11 via a pipe, and the outlet of the first liquid pump 12 is connected to the inlet of the first filter 13 via a pipe. The first filter 13 can be a mesh filter with multiple layers of mesh inside, effectively filtering impurities in the washing liquid. The first liquid pump 12 draws liquid from the washing tank 11 and delivers it to the first filter 13. The filtered washing liquid then flows back to the washing tank 11, forming a circulating filtration system that maintains the cleanliness of the washing liquid and improves the washing effect.

[0039] Reference Figure 2 The rinsing unit 2 includes a rinsing tank 21, a second liquid pump 22, and a second filter 23. The rinsing tank 21 is fixed to the frame 9 and located on one side of the washing tank 11. The rinsing tank 21 has the same structure as the washing tank 11, also being a square stainless steel tank. The rinsing tank 21 is used to hold rinsing water and the SMT stencil to be rinsed. The second liquid pump 22 can also be an electromagnetic pump. The inlet of the second liquid pump 22 is connected to the rinsing tank 21 via a pipe, and the outlet of the second liquid pump 22 is connected to the inlet of the second filter 23 via a pipe, driving the liquid flow within the rinsing tank 21. The second filter 23 is a filter with a filter element, filtering the rinsing water to remove impurities and residual detergent. The second liquid pump 22 and the second filter 23 work together to create a circulating filtration of the rinsing water, ensuring effective rinsing.

[0040] Reference Figure 1 The ultrasonic generating system includes ultrasonic transducers 4 and an ultrasonic generator 5. Multiple ultrasonic transducers 4 are arranged in a matrix on the outer wall of the washing tank 11, uniformly transmitting ultrasonic energy to the liquid within the washing tank 11. Multiple ultrasonic transducers 4, also arranged in a matrix, are also arranged on the outer wall of the rinsing tank 21, powered by the ultrasonic generator 5. During rinsing, they generate ultrasonic vibrations, creating a cavitation effect in the liquid within both the washing tank 11 and the rinsing tank 21, enhancing the cleaning effect. The distribution range and number of ultrasonic transducers 4 on the outer walls of the washing tank 11 and the rinsing tank 21 are selected according to specific requirements.

[0041] Reference Figure 2The spray unit 3 includes a spray tank 31 and a spray assembly 32 mounted on the spray tank 31. The spray assembly 32 includes a liquid supply source 321, a spray network pipe 322, and spray heads 323. The liquid supply source 321 is specifically an electromagnetic pump, and a certain amount of spray liquid needs to be filled into the spray tank 31 during use. The spray tank 31 is fixed on the frame 9, and the spray tank 31 is located on the side of the rinsing tank 21 away from the washing tank 11. Spray network pipes 322 are fixed on two opposite inner side walls inside the spray tank 31, and multiple spray heads 323 are connected to one side of the spray network pipes 322. The inlet end of the liquid supply source 321 is connected to the spray tank 31 through a pipe, and the outlet end of the liquid supply source 321 is connected to both sets of spray network pipes 322 through a pipe. Starting the liquid supply source 321 can evenly deliver liquid to each spray head 323, and the SMT stencil to be cleaned is sprayed and cleaned.

[0042] Reference Figure 1 and Figure 2 The drying unit 7 includes a drying tank 71 and a drying assembly 72. The drying tank 71 is a container for holding the SMT stencil to be dried, fixed on the frame 9, and located on the side of the rinsing tank 21 away from the washing tank 11. In this embodiment, the drying tank 71 is a square tank made of stainless steel. The drying assembly 72 includes an air supply source 721, an air distribution pipe 722, and multiple air nozzles 723 connected to the air distribution pipe 722. The air supply source 721 can be a fan, which can provide stable high-pressure gas. The air distribution pipe 722 is fixed inside the drying tank 71, and the air nozzles 723 are connected to one side of the air distribution pipe 722, which can disperse and evenly spray the gas inside the drying tank 71, improving drying efficiency. The air distribution pipe 722 is connected to a hot air pipe 724. One end of the hot air pipe 724 is connected to the air distribution pipe 722, and the other end is connected to a heating pipe 73. A heating element (not shown in the figure) is installed inside the heating pipe 73, which can be an electric heating wire that heats the air entering the heating pipe 73 into hot air. The outlet end of the air supply source 721 is connected to the end of the heating pipe 73 away from the hot air pipe 724, delivering air to the heating pipe 73 for heating, and then delivering it to the air distribution pipe 722 through the hot air pipe 724. Finally, the air is ejected from the nozzle 723 to dry the SMT stencil to be dried. The drying unit 7 also includes a gas filter 74, with an inlet pipe 741 and an exhaust pipe 742 connected to its two ends. The inlet pipe 741 is connected to the side wall of the drying tank 71, and the exhaust pipe 742 is connected to the inlet end of the air supply source 721, allowing part of the air entering the air supply source 721 to come from ambient air, and the other part to come from the residual heat gas discharged from the exhaust pipe 742. The gas filter 74 is an activated carbon filter, which can effectively filter impurities and moisture in the gas discharged from the drying tank 71, keeping the circulating gas clean and improving the drying effect.

[0043] Reference Figure 1 and Figure 3The transport system 6 includes a two-dimensional moving module 61, a moving support 62, a lifting component, and a work basket 67. The two-dimensional moving module 61 is specifically a two-dimensional linear slide module driven by a motor and screw. The two-dimensional moving module 61 is located on one side of the cleaning system. One end of the moving support 62 is fixed to the slide of the two-dimensional moving module 61, and the two-dimensional moving module 61 can drive the moving support 62 to move in two dimensions. The moving support 62 includes a sliding support and a lifting plate 63 fixedly connected to the sliding support. The sliding support can slide along the guide rail inside the two-dimensional moving module 61 under the drive of the two-dimensional moving module 61. The cross-section of the lifting plate 63 is greater than or equal to the opening of the drying tank 71. In this embodiment, the rinsing tank 21, washing tank 11, spray tank 31, and drying tank 71 have the same shape and size, and the cross-section of the lifting plate 63 is equal to the opening of the drying tank 71. The lifting component is fixedly connected to the bottom of the lifting plate 63 and is used to lift the SMT stencil. The lifting component can be a hook 64. A lifting rod (not shown in the figure) is fixed to the top of the work basket 67. Multiple hooks 64 are spaced apart along the length of the lifting rod at the top of the work basket 67, which can stably lift the work basket 67 to simultaneously transport multiple SMT stencils. The transport system 6 is also used to move the SMT stencils from the spray tank 31 to the drying tank 71 to complete the entire cleaning and drying process.

[0044] The implementation principle of this embodiment is as follows: Through the collaborative efforts of the washing unit 1, rinsing unit 2, spraying unit 3, and drying unit 7 within the cleaning system, combined with the assistance of the ultrasonic generating system and the automated transport operation of the transport system 6, efficient and low-damage cleaning of the SMT stencil is achieved. The combination of different units and the circulating filtration system ensure the cleanliness and cleaning effect of the cleaning solution. The application of ultrasound reduces cleaning damage to the SMT stencil, the automated process improves cleaning efficiency and accuracy, and the drying unit 7 further improves the drying quality of the SMT stencil. Compared with existing technologies, this embodiment better balances cleanliness and protection of the SMT stencil.

[0045] Example 2

[0046] Reference Figure 4 and Figure 5 The difference between this embodiment and the previous embodiment is that the transport system 6 in this embodiment does not include the work basket 67 (not shown in the figure). The lifting component is a lifting clamp 65 for directly clamping the SMT stencil. The lifting clamp 65 is arranged in multiple rows at the bottom of the lifting plate 63, and each row has at least two lifting clamps 65 spaced apart. The two lifting clamps 65 in each row can firmly clamp one piece of SMT stencil. The lifting clamp 65 can be a starter gripper or an electric gripper, etc.

[0047] Reference Figure 4 and Figure 6Both the washing tank 11 and the rinsing tank 21 are detachably connected to multiple positioning clamps 8, the number of which corresponds to the number of SMT stencils cleaned at one time. In this embodiment, three positioning clamps 8 are spaced apart in both the washing tank 11 and the rinsing tank 21, and the lifting clamp 65 is also arranged in three rows corresponding to the positioning clamps 8, so as to clamp three SMT stencils at one time. The positioning clamp 8 includes a positioning mesh shell 81 and a first abutting component 82 and a second abutting component 83 disposed on the positioning mesh shell 81. The positioning mesh shell 81 includes two positioning mesh plates 811 disposed opposite each other, and multiple connecting rods 812 are connected between the bottom of the positioning mesh plates 811 and the two positioning mesh plates 811 to form a rectangular shell-shaped frame structure with one end open. A connecting strip is fixedly connected to the outer wall of the positioning mesh plate 811. The connecting strip is detachably connected to the washing tank 11 or rinsing tank 21 by bolts. The bottom of the washing tank 11 and rinsing tank 21 is also fixed with a bottom support (not shown in the figure). One positioning mesh shell 81 corresponds to four bottom supports. The four bottom supports are located at the four top corners of the bottom of the positioning mesh shell 81 to support the bottom of the positioning mesh shell 81.

[0048] The positioning mesh plate 811 can be made of stainless steel, which has good strength and water permeability. The connecting rod 812 can be a stainless steel round rod to ensure the overall stability of the positioning mesh shell 81. The two positioning mesh plates 811 and multiple connecting rods 812 form a receiving groove for accommodating the SMT stencil, which can stably place the SMT stencil.

[0049] Reference Figure 7 The first abutment component 82 is used to press against the SMT stencil and includes two opposing first abutment rods 821. Each of the two first abutment rods 821 has a first damping head 822 connected to its closest end. The first damping head 822 is made of an elastic damping material, such as rubber or silicone, which has good elasticity and cushioning performance, reducing damage to the SMT stencil when pressing against it. Within a set of first abutment components 82, one first abutment rod 821 is connected to one positioning plate 811, and another first abutment rod 821 is connected to another positioning plate 811. Multiple sets of first abutment components 82 are provided, arranged in a matrix within the receiving groove, enabling stable pressing against the SMT stencil from multiple positions.

[0050] Reference Figure 6 and Figure 7The second abutment component 83 is also used to press against the SMT stencil, including two opposing second abutment rods 831. Each of the two second abutment rods 831 has a second damping head 832 connected to its closest end. The second damping head 832 is also made of elastic damping material. Within a set of second abutment components 83, one second abutment rod 831 is connected to one positioning stencil plate 811, and the other second abutment rod 831 is connected to another positioning stencil plate 811. Multiple sets of second abutment components 83 are also provided, arranged in a matrix within the receiving groove. Both the first pressing rod 821 and the second pressing rod 831 are movably connected to the corresponding positioning mesh plate 811, and their positions can be locked after movement. Specifically, both the first pressing rod 821 and the second pressing rod 831 pass through the corresponding positioning mesh plate 811 and are threadedly connected to the side wall of the corresponding positioning mesh plate 811. After the first pressing rod 821 passes through the corresponding positioning mesh plate 811, a first operating plate 823 is fixed thereon, and one end of the second pressing rod 831 passes through the corresponding positioning mesh plate 811 and is fixed thereon, facilitating position adjustment. Non-mesh plate structures are fixed on the positioning mesh plate 811 in the mounting areas of the first pressing rod 821 and the second pressing rod 831. The positions of the first pressing rod 821 and the second pressing rod 831 can be adjusted and locked by rotating them to accommodate SMT stencils of different thicknesses. The pressing range of the first abutting component 82 and the second abutting component 83 on the SMT stencil can also be selected during cleaning according to different cleaning intensities. Both the first damping head 822 and the second damping head 832 are tapered, and the shapes of the first damping head 822 and the second damping head 832 are different. In this embodiment, the first damping head 822 is specifically configured as a hemispherical shape, and the second damping head 832 is specifically configured as a frustum shape.

[0051] Reference Figure 4 and Figure 7 Within the positioning clamp 8 in the washing tank 11, the distance between the two first damping heads 822 in the first abutting component 82 is less than or equal to the thickness of the SMT stencil, which firmly presses against the SMT stencil and prevents it from shaking during ultrasonic vibration and liquid flow. The distance between the two second damping heads 832 in the second abutting component 83 is greater than the thickness of the SMT stencil, without affecting the pressing effect of the first abutting component 82. Within the positioning clamp 8 in the rinsing tank 21, the distance between the two first damping heads 822 in the first abutting component 82 is greater than the thickness of the SMT stencil, and the distance between the two second damping heads 832 in the second abutting component 83 is less than or equal to the thickness of the SMT stencil, which can stabilize the SMT stencil from different directions during rinsing. In this embodiment, within the positioning fixture 8 in the washing tank 11, the distance between the two first damping heads 822 in the first abutting component 82 is equal to the thickness of the SMT stencil; within the positioning fixture 8 in the rinsing tank 21, the distance between the two second damping heads 832 in the second abutting component 83 is equal to the thickness of the SMT stencil.

[0052] The implementation principle of this embodiment is as follows: the positioning clamp 8 stabilizes the position of the SMT stencil during washing and rinsing, reducing the shaking and collision of the SMT stencil and lowering the risk of damage. The different arrangements of the various abutment components in different tanks allow for flexible adjustment of the pressure applied to the SMT stencil according to different washing and rinsing requirements. The lifting clamp 65 provides more secure support to the SMT stencil, improving the cleaning effect while better protecting the SMT stencil.

[0053] Example 3

[0054] This application provides a cleaning method that uses the ultrasonic cleaning equipment described in Example 1 to clean SMT stencils. Specifically, it includes the following steps: S1, detergent is introduced into the washing tank 11, and clean water is introduced into the rinsing tank 21 and the spray tank 31. The clean water in the spray tank 31 occupies 1 / 4 of the volume of the spray tank 31. The work basket 67 containing the SMT stencil to be cleaned is hoisted onto the mobile support 62 by the hook 64.

[0055] S2, activate the two-dimensional moving module 61, driving the moving bracket 62 to move the SMT stencil into the washing tank 11. Inside the washing tank 11, the washing solution circulates under the drive of the first liquid pump 12 and is filtered by the first filter 13. Simultaneously, the ultrasonic generator system is activated, and the ultrasonic vibrations generated by the ultrasonic transducer 4 are transmitted to the washing solution, washing the SMT stencil to be cleaned and removing most of the solder paste residue. During operation, it is essential to ensure that the SMT stencil is stably placed in the washing tank 11 and that the washing solution level is maintained within an appropriate range.

[0056] S3, after washing, the two-dimensional moving module 61 drives the moving bracket 62 to move the SMT stencil from the washing tank 11 to the rinsing tank 21. In the rinsing tank 21, the rinsing water circulates under the drive of the second liquid pump 22 and is filtered by the second filter 23. The ultrasonic transducer 4 generates ultrasonic vibrations again to rinse the SMT stencil, further removing residual washing liquid and impurities. It is also necessary to ensure the stable placement of the SMT stencil in the rinsing tank 21, and to maintain suitable cleanliness and temperature of the rinsing water.

[0057] S4, after rinsing, the movable support 62 moves the SMT stencil into the spray tank 31. The liquid supply source 321 drives the liquid in the spray mesh tube 322 to be sprayed out from the spray head 323 to spray and clean the SMT stencil, using the fluid impact force to remove stubborn residues from the surface and micropores of the SMT stencil. During the spraying process, the output pressure of the liquid supply source 321 should be adjusted according to the degree and type of dirt on the SMT stencil to ensure the cleaning effect.

[0058] S5, after the spray cleaning is completed, the movable support 62 moves the SMT stencil into the drying tank 71. The air supply source 721 delivers air to the heating pipe 73, where the heating element heats the air into hot air. The hot air is then delivered through the hot air pipe 724 to the air distribution pipe 722, and finally ejected from the nozzle 723 to dry the SMT stencil. Simultaneously, the gas filter 74 filters and dehumidifies the gas discharged from the drying tank 71, keeping the circulating gas clean and improving drying efficiency and quality. During the drying process, the temperature and airflow of the hot air must be carefully controlled to avoid thermal damage to the SMT stencil during cleaning.

[0059] The implementation principle of this embodiment is as follows: by combining different cleaning methods and drying processes, SMT stencils can be thoroughly and effectively cleaned and dried. Each step works in concert, fully utilizing the function of each unit. While ensuring cleanliness, the risk of damage to the SMT stencil during the cleaning process is reduced by reasonably controlling the cleaning and drying parameters.

[0060] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An ultrasonic cleaning device, characterized in that, include: A cleaning system includes a washing unit (1), a rinsing unit (2), and a spraying unit (3). The washing unit (1) includes a washing tank (11), the rinsing unit (2) includes a rinsing tank (21), and the spraying unit (3) includes a spraying tank (31) and a spraying assembly (32) disposed on the spraying tank (31). The spraying assembly (32) includes a liquid infusion source (321), a spraying network pipe (322), and a spraying head (323). The spraying network pipe (322) is disposed in the spraying tank (31), and the spraying head (323) is connected to one side of the spraying network pipe (322). The liquid infusion source (321) is used to drive the liquid in the spraying network pipe (322) to flow toward the spraying head (323). An ultrasonic generating system is used to provide vibration energy to the washing tank (11) and the rinsing tank (21); The transport system (6) is used to move the SMT stencil sequentially into the washing tank (11), rinsing tank (21) and spray tank (31).

2. The ultrasonic cleaning equipment according to claim 1, characterized in that, The ultrasonic generating system includes an ultrasonic transducer (4) and an ultrasonic generator (5). Multiple ultrasonic transducers (4) are provided on the outer wall of the washing tank (11), and the ultrasonic transducers (4) are distributed in a matrix on the outer wall of the washing tank (11). Multiple ultrasonic transducers (4) are also provided on the outer wall of the rinsing tank (21), and the ultrasonic transducers (4) are also distributed in a matrix on the outer wall of the rinsing tank (21).

3. The ultrasonic cleaning equipment according to claim 2, characterized in that, The cleaning system also includes a drying unit (7), which includes a drying tank (71) and a drying assembly (72). The drying assembly (72) includes an air supply source (721), an air distribution network pipe (722), and a plurality of air nozzles (723) connected to the air distribution network pipe (722). The air distribution network pipe (722) is located inside the drying tank (71), and the air distribution network pipe (722) is connected to the hot air pipe (724). The air supply source (721) is used to drive the gas in the hot air pipe (724) to flow towards the air distribution network pipe (722). The transport system (6) is also used to move the SMT stencil from the spray tank (31) to the drying tank (71).

4. The ultrasonic cleaning equipment according to claim 3, characterized in that, One end of the hot air pipe (724) is connected to the air distribution network pipe (722), and the other end of the hot air pipe (724) is connected to a heating pipe (73). A heating element is installed inside the heating pipe (73), and the outlet end of the air supply source (721) is connected to the end of the heating pipe (73) away from the hot air pipe (724). The drying unit (7) further includes a gas filter (74), which is connected to an air inlet pipe (741) and an exhaust pipe (742). The air inlet pipe (741) is connected to the drying tank (71), and the exhaust pipe (742) is connected to the air inlet of the gas supply source (721).

5. The ultrasonic cleaning equipment according to claim 3, characterized in that, The washing unit (1) includes a first liquid pump (12) and a first filter (13), and the rinsing unit (2) includes a second liquid pump (22) and a second filter (23). The inlet end of the first liquid pump (12) is connected to the washing tank (11), the outlet end of the first liquid pump (12) is connected to the inlet end of the first filter (13), the outlet end of the first filter (13) is connected to the washing tank (11), and the first liquid pump (12) is used to drive the liquid in the washing tank (11) to move towards the first filter (13). The inlet end of the second liquid pump (22) is connected to the rinsing tank (21), the outlet end of the second liquid pump (22) is connected to the inlet end of the second filter (23), the outlet end of the second filter (23) is connected to the rinsing tank (21), and the second liquid pump (22) is used to drive the liquid in the rinsing tank (21) to move towards the first filter (13).

6. The ultrasonic cleaning equipment according to claim 3, characterized in that, The transport system (6) includes a two-dimensional moving module (61), a moving support (62) and a hoisting component. The two-dimensional moving module (61) is located on one side of the cleaning system and is used to drive the moving support (62) to move in two dimensions. The movable support (62) includes a sliding support and a lifting plate (63) connected to the sliding support, wherein the cross-section of the lifting plate (63) is greater than or equal to the opening of the drying tank (71); The lifting component is connected to the bottom of the lifting plate (63) and is used to lift the SMT steel mesh.

7. An ultrasonic cleaning device according to claim 6, characterized in that, The transport system (6) also includes a work basket (67), and the lifting component includes hooks (64), with multiple hooks (64) spaced apart.

8. An ultrasonic cleaning device according to claim 6, characterized in that, The lifting component includes lifting clamps (65) for holding SMT stencils. The lifting clamps (65) are arranged in multiple rows at the bottom of the lifting plate (63), and each row is provided with at least two of the lifting clamps (65) at intervals.

9. An ultrasonic cleaning device according to claim 8, characterized in that, Both the washing tank (11) and the rinsing tank (21) are detachably equipped with multiple positioning clamps (8). Each positioning clamp (8) includes a positioning mesh shell (81) and a first abutting component (82) disposed on the positioning mesh shell (81). The positioning mesh shell (81) is provided with a receiving groove for accommodating the SMT stencil. The first abutting component (82) is used to press against the SMT stencil, including two first pressing rods (821) arranged opposite to each other. The two first pressing rods (821) are connected to a first damping head (822) at their close ends. The first damping head (822) is made of elastic damping material. One first pressing rod (821) is connected to one inner side wall of the receiving groove, and the other first pressing rod (821) is connected to the other inner side wall of the receiving groove. The first abutting component (82) is provided in multiple sets, and the first abutting component (82) is distributed in a matrix on the positioning mesh shell (81).

10. An ultrasonic cleaning device according to claim 9, characterized in that, The positioning fixture (8) further includes a second abutting component (83) for pressing against the SMT stencil. The second abutting component (83) includes two opposing second pressing rods (831). The two second pressing rods (831) are connected to a second damping head (832) at their closest ends. The second damping head (832) is made of elastic damping material. One second pressing rod (831) is connected to one inner side wall of the receiving groove, and the other two second pressing rods (831) are connected to the other inner side wall of the receiving groove. Multiple sets of the second abutment components (83) are provided, and the second abutment components (83) are distributed in a matrix on the positioning mesh shell (81); Both the first pressing rod (821) and the second pressing rod (831) are movably connected to the inner sidewall of the receiving groove, and their positions after movement can be locked.

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