Electronic device and adhesive member

Abstract

This application provides an electronic device and an adhesive component. The electronic device includes a structural component, a component to be bonded, and an adhesive component. The adhesive component is bonded between the metal layers of the structural component and the component to be bonded. The adhesive component includes a buffer layer and an electro-adhesive layer stacked together. The buffer layer is bonded to the structural component, and the electro-adhesive layer is bonded to the metal layer. The metal layer is configured to be conductive with an external power source, so that the electro-adhesive layer is energized. The electro-adhesive layer is an adhesive whose adhesion weakens after being energized. The electronic device of this application, through the provision of the adhesive component, can improve the disassembly yield of the component to be bonded, thereby facilitating the reuse of the component.

Description

[0001] This application is a divisional application. The original application, application number 202311770606.9, was filed on December 20, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to an electronic device and an adhesive. Background Technology

[0003] With the development of technology, electronic devices have become increasingly functional, leading to the widespread use of tablets, laptops, and other electronic devices in people's daily lives and work.

[0004] Electronic devices include a display screen and structural components. The display screen is mounted on and bonded to the structural components to secure it. For example, the display screen can be bonded to the structural components using foam adhesive. When the display screen needs to be removed from the structural components for maintenance, the foam adhesive needs to be removed. However, existing foam adhesives result in a low disassembly yield rate for the display screen. Summary of the Invention

[0005] This application provides an electronic device and an adhesive that can improve the disassembly yield of the parts to be bonded, so as to facilitate the reuse of the parts to be bonded.

[0006] A first aspect of this application provides an electronic device, the electronic device comprising:

[0007] Structural components;

[0008] The parts to be bonded have a metal layer;

[0009] An adhesive component is bonded between a structural component and a metal layer. The adhesive component includes a buffer layer and an electro-adhesive layer stacked together. The buffer layer is bonded to the structural component, and the electro-adhesive layer is bonded to the metal layer. The metal layer is configured to be conductive to an external power source so that the electro-adhesive layer is energized. The electro-adhesive layer is an adhesive whose adhesion weakens after being energized.

[0010] This application enables the bonding of structural components and parts to be bonded within electronic devices through the inclusion of adhesive components. Furthermore, by incorporating an electro-adhesive layer within the adhesive component, the adhesive's adhesion weakens upon application of electricity. Compared to existing foam adhesives, this electro-adhesive layer exhibits a significant reduction in adhesion after energization, making the adhesive component easy to remove from the parts without leaving any residue. This facilitates the removal of the parts from the structural components while simultaneously improving the removal yield, thus enabling non-destructive removal of the parts.

[0011] Furthermore, the inclusion of a buffer layer ensures the impact resistance of the electronic device at the bonding point. Since the display screen is a bonding component in electronic devices, the inclusion of an adhesive layer not only improves the removal yield of the display screen from the structural components, enabling non-destructive removal for reuse, but also satisfies the impact resistance requirements of the electronic device at the display screen location.

[0012] In some alternative embodiments, the adhesive further includes a conductive layer located between the buffer layer and the electro-adhesive layer;

[0013] The conductive layer and the metal layer are configured to form a capacitor when both are connected to an external power source, thereby allowing the anti-adhesive layer to conduct electricity.

[0014] By setting a conductive layer, the adhesive can be electrically depressurized at the electro-adhesive layer, which facilitates the non-destructive removal of the adhesive and improves the reusability of the adhesive.

[0015] In some alternative embodiments, the conductive layer further includes an extension exposed on the same side as the electro-adhesive layer and the buffer layer. The end of the extension away from the electro-adhesive layer is a conductive end, which is configured to be connected to an external power source. This allows the conductive layer to form a capacitor with the metal layer connected to the external power source when the conductive end is connected to the external power source, thereby energizing the electro-adhesive layer.

[0016] In some alternative embodiments, the structural member has a first opening, and a portion of the extension passes through the first opening so that the conductive end is located on the side of the structural member away from the part to be bonded, so as to facilitate the conduction of the conductive end to an external power source without affecting the fixation of the part to be bonded on the structural member.

[0017] In some alternative embodiments, the conductive terminal has a conductive position that is connected to an external power source. The conductive position is located on the side of the conductive terminal away from the structural component, which facilitates the connection between the conductive terminal and the external power source and enhances the stability of the connection between the conductive layer and the external power source.

[0018] In some alternative embodiments, the extension has a first surface and a second surface along the thickness direction of the adhesive, and the conductive site is located on the first surface or the second surface.

[0019] This ensures that the conductive end can be connected to the external power source while maintaining conductivity, and also allows for more diverse bending methods of the extension within the first opening to meet the needs of different electronic devices.

[0020] In some alternative embodiments, the extension bends along the sidewall of the buffer layer toward the first opening so that the extension can pass through the first opening without the need to make holes in the buffer layer, the first adhesive layer and the second adhesive layer of the adhesive, thereby simplifying the structure of the adhesive while ensuring the connection effect between the adhesive and the structural component.

[0021] In some alternative embodiments, the extension and the structural component are insulated from each other to prevent the electrical signal at the extension from being conducted away through the structural component when the conductive layer is connected to an external power source, thus affecting the current conduction of the electro-adhesive layer.

[0022] In some alternative embodiments, the surface of the extension has a first region facing the structural member;

[0023] The adhesive also includes an insulating layer that at least covers the first region.

[0024] While enabling the extension to pass through the first opening of the structural component, the conductive layer can be isolated from the structural component by setting an insulating layer to ensure that the extension and the structural component are mutually insulated.

[0025] In some alternative embodiments, the insulating layer includes an adhesive layer or a non-adhesive layer, and the non-adhesive layer includes an ink layer or an insulating film.

[0026] This ensures that the extension and the structural components are mutually insulated, while also allowing for a greater variety of insulation layers, so that the adhesive can meet the usage requirements of different electronic devices.

[0027] In some alternative implementations, the conductive layer includes a layer of metallic material so that the conductive layer can be connected to the positive or negative terminal of an external power source.

[0028] In some optional embodiments, there are two or more adhesive components, and the conductive layers of adjacent adhesive components are interconnected to make the conductive layers of adjacent adhesive components continuous. This satisfies the requirement that the conductive layers of all adhesive components in the electronic device are connected to the external power supply, thereby achieving non-destructive removal of the adhesive components while simplifying the structure of some adhesive components and reducing the number of openings on the structural components.

[0029] In some alternative implementations, the structural components include conductive structural components;

[0030] The side of the metal layer facing the adhesive has a conductive area that is not covered by the adhesive. When the conductive structure and the conductive area are configured to be connected to an external power source, they can form a capacitor to allow the anti-adhesive layer to conduct electricity.

[0031] This allows the adhesive layer to be energized, resulting in reduced adhesion on one side of the adhesive layer. This enables non-destructive removal of the adhesive components without the need for a conductive layer inside the components, thus simplifying the component structure.

[0032] In some alternative embodiments, the structure has a second opening through which a portion of the metal layer is exposed, so that the metal layer can be connected to an external power source at the second opening.

[0033] In some alternative implementations, the buffer layer is foam to provide a cushioning effect to the adhesive.

[0034] In some alternative embodiments, the adhesive further includes a first adhesive layer and a second adhesive layer;

[0035] The first adhesive layer is bonded between the electro-reducing adhesive layer and the buffer layer to connect the electro-reducing adhesive layer and the buffer layer. The second adhesive layer is bonded between the buffer layer and the structural component to connect the buffer layer and the structural component.

[0036] In some alternative embodiments, the second adhesive layer includes an adhesive with a cohesive strength greater than or equal to 0.5 MPa, so that the second adhesive layer has a high cohesive strength so that the adhesive can be peeled off from the structural member without leaving any adhesive residue on the surface of the structural member after peeling.

[0037] In some alternative embodiments, the electro-adhesive layer contains an electrolyte. The electro-adhesive layer is a colloid in which, after being energized, cations in the electrolyte move toward the negative electrode of the external power source, anions move toward the positive electrode of the external power source, and a reversible chemical reaction occurs within itself.

[0038] Through the movement of cations and anions and the occurrence of reversible chemical reactions, the adhesiveness of the electro-adhesive layer can be weakened, resulting in a sharp decrease in the adhesiveness of the electro-adhesive layer. This allows for electro-adhesion reduction of the adhesive layer on the bonded parts, enabling non-destructive removal of the bonded parts.

[0039] In some alternative embodiments, the structural component includes a mid-frame, and the component to be bonded includes a display screen having a display surface and a non-display surface in the thickness direction;

[0040] The adhesive is bonded to the peripheral edge of the non-display surface.

[0041] By setting up adhesive components, the bonding between the display screen and the structural components is achieved. This not only improves the removal yield when the display screen is removed from the structural components, enabling non-destructive removal of the display screen for reuse, but also meets the impact resistance requirements of electronic devices at the display screen location.

[0042] In some alternative embodiments, the electronic device also includes a sealant located between the periphery of the display screen and the structural component, and bonding the display screen and the structural component together.

[0043] The sealant has an elastic modulus greater than or equal to 1 MPa to facilitate the removal of the protective cover and structural components of the display screen without cutting the structural components, thus allowing the structural components to be reused.

[0044] A second aspect of this application also provides an adhesive, which includes:

[0045] The buffer layer is configured to bond with the structural components;

[0046] An electro-adhesive layer is stacked with a buffer layer. The electro-adhesive layer is configured to bond with the metal layer of the part to be bonded. The electro-adhesive layer is a colloid whose adhesion weakens when an electric current is applied.

[0047] By applying an electro-adhesive layer, the bonded component can be easily removed from the component to be bonded without leaving any adhesive residue. This facilitates the removal of the component from the structural parts while improving the removal yield and enabling non-destructive removal. Furthermore, the buffer layer also ensures the impact resistance of the electronic device at the bonding point.

[0048] In some alternative embodiments, the adhesive further includes a conductive layer located between the buffer layer and the electro-adhesive layer;

[0049] The conductive layer is configured to form a capacitor with the metal layer when connected to an external power source, thereby energizing the anti-adhesive layer.

[0050] By setting a conductive layer, the adhesive can be electrically depressurized at the electro-adhesive layer, which facilitates the non-destructive removal of the adhesive and improves the reusability of the adhesive.

[0051] In some alternative embodiments, the adhesive further includes a first adhesive layer and a second adhesive layer, the first adhesive layer being bonded between the electro-adhesive layer and the buffer layer, so as to connect the electro-adhesive layer and the buffer layer through the first adhesive layer;

[0052] The second adhesive layer is bonded to the side of the buffer layer away from the electro-adhesive layer in order to achieve the connection between the buffer layer and the structural component. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0054] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0055] Figure 3This is a schematic diagram of a partial assembly of a display screen within an electronic device, as provided in the related art.

[0056] Figure 4 This is a structural schematic diagram of a foam adhesive provided in related technologies;

[0057] Figure 5 This is a schematic diagram illustrating the connection between a component to be bonded and a structural component, provided in an embodiment of this application.

[0058] Figure 6 This is a schematic diagram showing the position of an adhesive component within an electronic device, as provided in an embodiment of this application.

[0059] Figure 7 This is a schematic diagram illustrating the electro-adhesion reduction principle of an adhesive component provided in an embodiment of this application;

[0060] Figure 8 This application provides a schematic diagram illustrating the connection between an adhesive component and a structural component in an embodiment of the present application.

[0061] Figure 9 A schematic diagram illustrating the installation of an adhesive component on a structural member according to an embodiment of this application;

[0062] Figure 10 Another schematic diagram of the adhesive component provided in the embodiments of this application on a structural component;

[0063] Figure 11 A partial exploded view of the electronic device provided in the embodiments of this application;

[0064] Figure 12 A partial schematic diagram of the electronic device provided in this application on the side of the structure away from the part to be bonded;

[0065] Figure 13 A schematic diagram illustrating the connection between a component to be bonded and a structural component, provided in an embodiment of this application;

[0066] Figure 14 for Figure 6 The enlarged view of the electronic device at point A.

[0067] Figure label:

[0068] 100 - Electronic device; 1 - Structural component; 11 - Middle plate; 111 - First opening; 112 - Second opening; 12 - Frame;

[0069] 2-Back cover; 3-Main circuit board; 4-Sub-circuit board;

[0070] 5-Display screen; 501-Display surface; 502-Non-display surface; 51-Protective cover; 52-Display module; 521-Metal layer;

[0071] 6-Foam adhesive; 61-Adhesive layer; 62-Foam; 7-Sealant;

[0072] 8-Adhesive component; 81-Buffer layer; 811-Relief opening; 812-Relief groove; 82-Electro-reducing adhesive layer; 83-Conductive layer; 831-Extension; 8311-Through section; 8312-Conductive end; 8313-Conductive position; 84-First adhesive layer; 85-Second adhesive layer; 86-Insulating layer; 861-Adhesive layer; 862-Non-adhesive layer;

[0073] Y - Length of the electronic device; Z - Thickness of the electronic device. Detailed Implementation

[0074] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0075] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, virtual reality (VR) devices, laptops, personal computers (PCs), ultra-mobile personal computers (UMPCs), handheld computers, smart wearable devices, and other electronic devices with displays. Smart wearable devices may include, but are not limited to, smartwatches and smart bracelets.

[0076] The structure of the electronic device described in this application will be further explained below, taking a mobile phone as an example.

[0077] Figure 1 An overall view of an electronic device 100 is shown. Figure 2 It shows Figure 1 The diagram shows an exploded view of electronic device 100. This diagram only shows a part of the structure of electronic device 100 and does not constitute a limitation on the structure of electronic device 100.

[0078] The following is combined Figure 1 and Figure 2 The structure of the electronic device 100 is described in detail below. The electronic device 100 includes a structural component 1. The structural component 1 is the main supporting structure of the electronic device 100. For example, the structural component 1 can be the middle frame of the electronic device 100. The structure of the electronic device 100 will be further explained below using the structural component 1 as the middle frame as an example.

[0079] See Figure 2 As shown, the electronic device 100 also includes a rear cover 2, which covers and is connected to one side of the structural member 1, and together with the structural member 1 forms the housing of the electronic device 100.

[0080] See also Figure 2 The structural component 1 includes a middle plate 11 and a frame 12 that are interconnected. The frame 12 can be a square ring structure formed by multiple side frames joined end to end. The frame 12 surrounds the peripheral edge of the middle plate 11 and is connected to the peripheral edge of the middle plate 11. The rear cover 2 is placed on one side of the structural component 1 and is connected to the frame 12, thereby realizing the setting and fixation of the rear cover 2 on the structural component 1.

[0081] See also Figure 2 When the rear cover 2 is placed on one side of the structural member 1, the rear cover 2 and the structural member 1 can form a receiving cavity (not shown). This receiving cavity is used to accommodate electronic components of the electronic device 100. For example, the electronic components may include circuit boards, camera modules, etc.

[0082] See also Figure 2 The circuit board includes a main circuit board 3 and a secondary circuit board 4. The main circuit board 3 typically houses modules such as a processor module, a system-on-a-chip (SoC), a storage module, a communication module, an RF module, and a power management module. The secondary circuit board 4 typically houses modules such as electrical connectors and speakers. The main circuit board 3 and the secondary circuit board 4 are located at opposite ends of the accommodating cavity within the structural member 1. Along the Y direction, the structural member 1 has a top end and a bottom end. For example, the main circuit board 3 can be located at the top end of the structural member 1, and the secondary circuit board 4 can be located at the bottom end of the structural member 1.

[0083] It should be noted that the positions of the camera module and other components within the accommodating cavity can be referenced from the settings in existing electronic devices 100 (such as mobile phones), and no further limitations are made here.

[0084] Figure 2 This illustration only shows the structure of one type of electronic device 100 and does not constitute a limitation on the structure of the electronic device 100. For example, in some electronic devices 100, the electronic device 100 may also include at least two structural members 1. Two adjacent structural members 1 can be rotatably connected by a pivot mechanism (not shown) in the electronic device 100. By rotating the two adjacent structural members 1 relative to each other around the pivot mechanism, the configuration of the electronic device 100 can be changed. For example, by rotating the two adjacent structural members 1 relative to each other around the pivot mechanism, the folding function of the electronic device 100 can be achieved.

[0085] The structure of the electronic device 100, which includes a structural component 1, will be further explained below.

[0086] See also Figure 2The electronic device 100 also includes a component 8 to be bonded. The component 8 may include a battery (not shown). The battery may be disposed within a receiving cavity. The battery may be bonded to the middle plate 11 of the structural component 1 and located between the main circuit board 3 and the sub-circuit board 4.

[0087] See also Figure 2 The component to be bonded 8 may also include a display screen 5. The display screen 5 can provide a display interface and a user interface for the electronic device 100. The display screen 5 can be a flexible display screen or a non-flexible display screen. For example, a flexible display screen can be an organic light-emitting diode (OLED) display screen. For example, a non-flexible display screen can be a light-emitting diode (LED) display screen. The display screen 5 can be electrically connected to the main circuit board 3, and can be used to display various information and receive information input by the user. The display screen 5 is mounted on the side of the structural component 1 opposite to the rear cover 2, and is connected to the structural component 1, thereby realizing the setting and fixation of the display screen 5 on the structural component 1.

[0088] The structure of the electronic device 100 will be further explained below, taking an OLED display as an example.

[0089] See Figure 3 As shown, the display screen 5 has a display surface 501 and a non-display surface 502 in the thickness direction. The thickness direction of the display screen 5 is parallel to the thickness direction of the electronic device 100, which can be seen in the Z direction. At least a portion of the display surface 501 can display various information and also receive information input by the user. The non-display surface 502 faces the side of the structural member 1 and is hidden inside the electronic device 100.

[0090] Figure 3 A schematic diagram of a partial assembly of a display screen 5 within an electronic device 100 in the related art is shown. Figure 3 The display screen 5 is an OLED display screen. Compared with LED display screens, OLED display screens have better flexibility. Therefore, when the OLED display screen is fixed on the structural member 1, the peripheral edge of the display screen 5 can be bent towards one side of the structural member 1 to increase the display area of ​​the display screen 5, so that the electronic device 100 can obtain a larger screen ratio and thus provide a better user experience.

[0091] See also Figure 3The display screen 5 may include a protective cover plate 51 and a display module 52 stacked together. The display module 52 is a stacked structure of film layers. The stacked structure of the film layers of the display module 52 is well known to those skilled in the art and will not be described in detail here. The display module 52 has a display side and a non-display side in the Z direction. The non-display side faces the structural member 1 and forms the non-display surface 502 of the display screen 5. The protective cover plate 51 is stacked on the display side of the display module 52. The side where the protective cover plate 51 is located forms the display surface 501 of the display screen 5.

[0092] When the display screen 5 is fixed to the structural component 1, the peripheral edge of the non-display side of the display module 52 can be bonded to the middle plate 11 of the structural component 1 using foam adhesive 6. Furthermore, the peripheral edge of the protective cover 51 is also bonded to the frame 12 of the structural component 1 using sealant 7a. The display screen 5 is thus fixed to the structural component 1 using the adhesive 8 and the sealant 7a.

[0093] Figure 4 A schematic diagram of the structure of a foam adhesive 6 provided in the related art is shown. See also Figure 4 As shown, the foam adhesive 6 has an adhesive layer 61 and a foam 62 in the thickness direction. The foam 62 is located between two adjacent adhesive layers 61. When the display module 52 is bonded to the middle plate 11 of the structural component 1, the two adhesive layers 61 can be bonded to the display module 52 and the middle plate 11 of the structural component 1 respectively.

[0094] When the display screen 5 needs repair, in some repair scenarios, it is necessary to remove the display screen 5 from the structural component 1 and remove the foam adhesive 6 and sealant 7 from the display screen 5.

[0095] Existing foam adhesives 6 are mostly removed by heating to reduce their stickiness. However, although heating reduces the stickiness, the foam adhesive still retains some tackiness. When removing the foam adhesive 6 from the display screen 5, it can stretch the film layers in the display module 52, easily damaging the display screen 5. This results in a low disassembly yield, leading to a low reuse rate of the display screen 5. For example, the disassembly yield of the display screen 5 in related technologies is only 70% to 80%.

[0096] In view of this, this application provides an adhesive 8. The electronic device 100 includes the adhesive 8. As described above, the electronic device 100 also includes a structural component 1 and a component to be bonded 8. The adhesive 8 not only bonds the structural component 1 and the component to be bonded 8 within the electronic device 100, but also utilizes the characteristic that the adhesive 8's adhesion decreases after being powered on, thereby improving the removal yield when the component to be bonded 8 is removed from the structural component 1. Since the display screen 5 is one type of component to be bonded 8 in the electronic device 100, the adhesive 8 can replace the foam adhesive 6 to bond the display screen 5 to the structural component 1, improving the removal yield when the display screen 5 is removed from the structural component 1, and facilitating the non-destructive removal of the component to be bonded 8, thus increasing the reusability of the display screen 5.

[0097] The structure of the adhesive 8 and the electronic device 100 will be further described below with reference to the accompanying drawings and embodiments.

[0098] Figure 5 A schematic diagram illustrating the connection between the component 8 to be bonded and the structural component 1 is shown. See also... Figure 5 As shown, the component to be bonded 8 has a metal layer 521. The adhesive component 8 is bonded between the structural component 1 and the metal layer 521 so that the structural component 1 and the component to be bonded 8 can be bonded through the adhesive component 8.

[0099] See also Figure 5 The adhesive component 8 includes a buffer layer 81 and an electro-adhesive layer 82. The electro-adhesive layer 82 is stacked on top of the buffer layer 81. That is, the adhesive component 8 includes the stacked buffer layer 81 and the electro-adhesive layer 82. The buffer layer 81 is configured to bond to the structural component 1. That is, in the electronic device 100, the buffer layer 81 is bonded to the structural component 1. The electro-adhesive layer 82 is configured to bond to the metal layer 521 of the component to be bonded 8. That is, in the electronic device 100, the electro-adhesive layer 82 is bonded to the metal layer 521 so that the adhesive component 8 and the component to be bonded 8 are bonded through the electro-adhesive layer 82.

[0100] The metal layer 521 is configured to be conductive with an external power source, so that the electro-adhesive layer 82 is energized. The electro-adhesive layer 82 is a colloid whose adhesiveness decreases after being energized.

[0101] By incorporating the electro-adhesive layer 82 in the adhesive component 8, when it is necessary to remove the adhesive component 8 from the structural component 1, the metal layer 521 of the adhesive component 8 can be connected to an external power source to energize the electro-adhesive layer 82. Since the electro-adhesive layer 82 is a colloid whose adhesion weakens after energization, compared to the existing foam adhesive 6, the adhesion of the electro-adhesive layer 82 decreases dramatically after energization, thus achieving the function of reducing adhesion at the electro-adhesive layer 82. For example, after energization (and after energization ends), the adhesion of the electro-adhesive layer 82 is reduced to at least 10% (inclusive) of its initial adhesion. The initial adhesion is the adhesion of the electro-adhesive layer 82 when it is not energized. Therefore, compared to the existing foam adhesive 6, after the electro-adhesive layer 82 is energized, the adhesive component 8 is easily removed from the adhesive component 8 without leaving any residue.

[0102] By setting the electro-adhesive layer 82 in the adhesive component 8, this application not only enables the adhesive component 8 to be removed from the component to be bonded 8, which is beneficial for removing the display screen 5 from the structural component 1, but also prevents damage to the component to be bonded 8 during the removal process. This improves the removal yield of the component to be bonded 8 and facilitates the non-destructive removal of the component to be bonded 8, so as to facilitate the reuse of the component to be bonded 8.

[0103] Meanwhile, the buffer layer 81 in the adhesive 8 provides a cushioning effect. This ensures that when the adhesive 8 is bonded between the structural component 1 and the component to be bonded 8, it provides impact protection for the component to be bonded 8, giving the electronic device 100 a certain degree of impact resistance at the location of the component to be bonded 8.

[0104] As described above, the component 8 to be bonded in the electronic device 100 may include the display screen 5 and the battery. Therefore, the adhesive component 8 of this application can not only bond the display screen 5 to the structural component 1, but also bond the battery to the structural component 1.

[0105] When the component to be bonded 8 is the display screen 5, the adhesive 8 can replace the foam adhesive 6 to bond the display screen 5 to the structural component 1. This improves the removal yield of the display screen 5 from the structural component 1, while also enabling non-destructive removal of the display screen 5, thus increasing its reusability. Furthermore, it also meets the impact resistance requirements of the electronic device 100 at the display screen 5.

[0106] In addition, since the display screen 5 has poor heat resistance, compared with the method of removing the foam adhesive 6 by heating in related technologies, this application can also avoid the damage to the performance of the display screen 5 by applying electricity to the electro-adhesive layer 82 to remove the adhesive 8 from the display screen 5.

[0107] When the component to be bonded 8 is a display screen 5, the metal layer 521 can be a metal material layer on the non-display side of the display module 52 of the display screen 5. The material composition of the metal layer 521 can be found in the relevant descriptions of existing display screens 5, and will not be repeated here.

[0108] It should be noted that when the adhesive 8 is used for bonding between the battery and the structural component 1, the adhesive 8 may not require a buffer layer 81. Currently, adhesive 8 without a buffer layer 81 has been used between the battery and the structural component 1. When the adhesive 8 is a battery, the metal shell of the battery facing the structural component 1 can be regarded as the metal layer 521.

[0109] The structure of the electronic device 100 will be further explained below, taking the display screen 5 as an example of the component to be bonded 8.

[0110] See also Figure 5 The adhesive component 8 further includes a first adhesive layer 84 and a second adhesive layer 85. The first adhesive layer 84 is bonded between the electro-reducing adhesive layer 82 and the buffer layer 81, so as to connect the electro-reducing adhesive layer 82 and the buffer layer 81 through the first adhesive layer 84. The second adhesive layer 85 is bonded between the buffer layer 81 and the structural component 1, so as to achieve the connection between the buffer layer 81 and the structural component 1 through the second adhesive layer 85. Specifically, the second adhesive layer 85 is bonded to the side of the buffer layer 81 away from the electro-reducing adhesive layer 82, so that the buffer layer 81 is connected to the structural component 1 through the second adhesive layer 85.

[0111] Both the first adhesive layer 84 and the second adhesive layer 85 are adhesives. For example, both the first adhesive layer 84 and the second adhesive layer 85 are acrylic resin pressure-sensitive adhesives or other adhesives. In this application, the types of the first adhesive layer 84 and the second adhesive layer 85 are not further limited.

[0112] Cohesion refers to the internal strength of an adhesive. The higher the cohesion, the stronger the adhesive bond, and the less likely it is to leave residue after peeling.

[0113] The second adhesive layer 85 can use a high-cohesive adhesive so that no adhesive residue remains on the surface of the structural member 1 after the bonded part 8 is peeled off. For example, the cohesive strength of the adhesive in the second adhesive layer 85 can be greater than or equal to 0.5 MPa to give the second adhesive layer 85 high cohesive strength. In this application, no particular limitation is made on the maximum value of the cohesive strength of the adhesive in the second adhesive layer 85.

[0114] It should be noted that when the adhesive component 8 is applied within an electronic device 100 such as a mobile phone, the total thickness of the adhesive component 8 can be greater than 0.2 mm and less than 0.4 mm to ensure that the thickness of the adhesive component 8 meets the thickness requirements of the electronic device 100, allowing the adhesive component 8 to be applied to the electronic device 100. The thickness direction of the adhesive component 8 is parallel to the thickness direction of the electronic device 100, which can be referred to as the Z direction.

[0115] Based on the adhesive component 8, by setting the sealant 7, while the display screen 5 can be removed without damage while waiting for the adhesive component 8, the disassembly yield of the display screen 5 can reach 95%~80%.

[0116] Figure 6 A schematic diagram illustrating the position of an adhesive element 8 within an electronic device 100 is shown. Figure 6 Only a portion of the electronic devices 100 are shown. See also Figure 6 As shown and described above, the display screen 5 has a display surface 501 and a non-display surface 502 in the thickness direction. An adhesive member 8 is bonded to the peripheral edge of the non-display surface 502 so that the display screen 5 is connected to the structural member 1 via the adhesive member 8 at the peripheral edge of the non-display surface 502, thereby fixing the display screen 5 to the structural member 1. Specifically, the buffer layer 81 of the adhesive member 8 can be bonded to the middle plate 11 of the structural member 1.

[0117] The buffer layer 81 can be a cushioning structure with a certain elasticity, such as foam 62, so that the adhesive 8 has a cushioning effect. When the buffer layer 81 is foam 62, the adhesive 8 can also be understood as a foam adhesive 6 with electro-tack reduction function.

[0118] The electro-adhesive layer 82 is a conventional electro-adhesive. In this application, the structure and composition of the electro-adhesive are not further elaborated. Below, only the anti-adhesion principle of the electro-adhesive layer 82 will be briefly described with reference to the accompanying drawings for ease of understanding.

[0119] The electro-adhesive layer 82 contains an electrolyte. Figure 7 A schematic diagram illustrating the electro-adhesive reduction principle of an electro-adhesive layer 82 in an adhesive component 8 is shown. See also... Figure 7As shown, the electro-adhesive layer 82 is a colloid in which cations in the electrolyte move towards the negative electrode of the external power source and anions move towards the positive electrode after energization, and a reversible chemical reaction occurs within itself. The adhesive 8 is bonded between the structural component 1 and the component to be bonded. By energizing the electro-adhesive layer 82, the cations and anions within the electro-adhesive layer 82 can move, and a reversible chemical reaction occurs within the electro-adhesive layer 82. Through the movement of cations and anions and the occurrence of the reversible chemical reaction, the adhesiveness of the electro-adhesive layer 82 can be weakened, causing a sharp decrease in the adhesiveness of the electro-adhesive layer 82, thereby achieving the function of reducing adhesion of the adhesive 8 at the electro-adhesive layer 82.

[0120] When an electric current is applied to the electro-adhesive layer 82, its voltage increases. As the voltage of the electro-adhesive layer 82 increases, the cations in the electrolyte move towards the negative electrode of the external power source, and the anions move towards the positive electrode. A reversible chemical reaction also occurs within the electro-adhesive layer 82.

[0121] When the voltage of the electro-adhesive layer 82 is low, the energizing time of the electro-adhesive layer 82 can be extended. When the voltage of the electro-adhesive layer 82 is high, the energizing time of the electro-adhesive layer 82 can be shortened. In this application, the voltage of the electro-adhesive layer 82 after energizing is not further limited, as long as it is ensured that the adhesiveness of the electro-adhesive layer 82 can be reduced to less than 10% of the initial adhesiveness after energizing.

[0122] It should be noted that, due to the wide variety of electro-adhesives constituting the electro-adhesive layer 82, the types of electrolytes within the electro-adhesive layer 82 are also numerous, and the aforementioned chemical reactions occurring within the electro-adhesive layer 82 are quite complex. Therefore, in this application, the types of electrolytes and the chemical reactions occurring in the electro-adhesive layer 82 will not be further elaborated; for details, please refer to the relevant descriptions in existing electro-adhesives, which will not be repeated here.

[0123] Since the adhesive 8 is bonded between the structural component 1 and the component to be bonded 8, a capacitor can be formed between the structural component 1 and the component to be bonded 8 so that the electro-adhesive layer 82 located inside the capacitor can be energized, thereby realizing the function of reducing the adhesiveness of the adhesive 8 after being energized.

[0124] See also Figure 7In some embodiments, the adhesive element 8 may further include a conductive layer 83. The conductive layer 83 is located between the buffer layer 81 and the electro-adhesive layer 82. The conductive layer 83 is configured to form a capacitor with the metal layer 521 when connected to an external power source, thereby energizing the electro-adhesive layer 82. To facilitate the formation of a capacitor between the metal layer 521 and the conductive layer 83, the metal layer 521, in addition to the conductive layer 83, is also configured to be connected to an external power source. That is, both the conductive layer 83 and the metal layer 521 are configured to be connected to an external power source. Thus, when both the conductive layer 83 and the metal layer 521 are connected to an external power source, they can form a capacitor, thereby energizing the electro-adhesive layer 82. This achieves the energizing and de-adhesive function of the adhesive element 8 at the electro-adhesive layer 82, which is beneficial for the non-destructive removal of the adhesive element 8 and improves the reusability of the adhesive element 8.

[0125] One of the conductive layer 83 and the metal layer 521 can be connected to the positive terminal of the external power supply, and the other can be connected to the negative terminal of the external power supply. Figure 7 Only the configuration shown is such that the metal layer 521 is connected to the positive terminal of the external power supply, and the conductive layer 83 is connected to the negative terminal of the external power supply. In this case, the side of the electro-adhesive layer 82 bonded to the metal layer 521 is adjacent to the positive terminal of the external power supply after energization, and can be represented by "+". The side of the electro-adhesive layer 82 bonded to the conductive layer 83 is adjacent to the negative terminal of the external power supply after energization, and can be represented by "-". In some embodiments, when removing the component 8 to be bonded, the configuration can also be such that the metal layer 521 is connected to the negative terminal of the external power supply, and the conductive layer 83 is connected to the positive terminal of the external power supply. This application does not further limit the connection method between the conductive layer 83 and the metal layer 521 and the external power supply.

[0126] Probes can be installed on both the positive and negative terminals of the external power supply so that when removing the part to be bonded 8, the probes can be placed on the conductive layer 83 and the metal layer 521 to enable the conductive layer 83 and the metal layer 521 to conduct with the external power supply.

[0127] The conductive layer 83 may include a metal material layer or other conductive material, so that the conductive layer 83 can be connected to the positive or negative terminal of an external power source. For example, the conductive layer 83 may be a metal material layer such as copper foil or aluminum foil. In this application, the material of the conductive layer 83 is not particularly limited.

[0128] Figure 8 A schematic diagram illustrating the connection between an adhesive element 8 and a structural member 1 is shown. See also... Figure 8As shown, the conductive layer 83 may further include an extension 831. The extension 831 is exposed on the same side as the electro-adhesive layer 82 and the buffer layer 81. The end of the extension 831 away from the electro-adhesive layer 82 is a conductive end 8312. The conductive end 8312 may also be referred to as the extended end of the extension 831. The conductive end 8312 is configured to be connected to an external power source so that when the conductive end 8312 is connected to the external power source, the conductive layer 83 can form a capacitor with the metal layer 521 connected to the external power source, thereby energizing the electro-adhesive layer 82.

[0129] Figure 9 A schematic diagram of one installation of the adhesive component 8 on the structural component 1 is shown. See also Figure 9 As shown, the structural component 1 has a first opening 111. A portion of the extension 831 passes through the first opening 111, such that the conductive end 8312 is located on the side of the structural component 1 away from the component 8 to be bonded. Thus, when the component 8 to be bonded is bonded to the structural component 1 by the adhesive 8 and fixed to the structural component 1, the conductive end 8312 can be located on the side of the structural component 1 away from the adhesive 8, so as to facilitate the conduction of the conductive layer 83 to an external power source without affecting the fixation of the component 8 to be bonded to the structural component 1.

[0130] The shape of the first opening 111 can be rectangular, circular, etc. In this application, the shape of the first opening 111 is not particularly limited, as long as the extension 831 can be inserted into the first opening 111.

[0131] See also Figure 9 The conductive end 8312 has a conductive position 8313 that is connected to an external power source. The conductive position 8313 is located on the side of the conductive end 8312 away from the structural member 1. Compared to the sidewall of the conductive end 8312 in the thickness direction (see Z direction) of the adhesive member 8, the conductive end 8312 has a larger area on the side away from the structural member 1. Therefore, when the conductive position 8313 is located on the side of the conductive end 8312 away from the structural member 1, it is easier for the conductive end 8312 to be connected to the external power source, thus enhancing the stability of the conductive layer 83's connection to the external power source.

[0132] Furthermore, when the conductive position 8313 is located on the side of the conductive end 8312 away from the structural member 1, the conductive end 8312 can be fixed to the structural member 1 without affecting the conduction of the conductive end 8312 to the external power supply, so as to meet the fixing requirements of the adhesive 8 on the side of the structural member 1 away from the adhesive 8.

[0133] It should be noted that, please continue to refer to Figure 9The portion of the conductive end 8312 away from the structural member 1 can form a conductive position 8313. Alternatively, the entire surface of the conductive end 8312 away from the structural member 1 can also form a conductive position 8313. In this application, the size of the conductive position 8313 is not particularly limited.

[0134] See you again Figure 8 Along the thickness direction of the adhesive member 8, the extension 831 has a first surface and a second surface. The conductive position 8313 can be located on either the first surface or the second surface of the extension 831. The thickness direction of the adhesive member 8 is parallel to the thickness direction of the electronic device 100, as shown in the Z direction. This ensures that the conductive end 8312 can be connected to an external power source at the conductive position 8313, while also allowing for more diverse bending methods within the first opening 111 to accommodate different electronic devices 100. In this application, the location of the conductive position 8313 on the extension 831 is not particularly limited.

[0135] See you again Figure 8 and combined Figure 9 When the conductive position 8313 is located on the first surface, the extension 831 can be inserted into the first opening 111 and bend in a U-shape so that the conductive end 8312 is located on the side of the structural member 1 away from the member 8 to be bonded, while the conductive position 8313 is located on the side of the conductive end 8312 away from the structural member 1.

[0136] Figure 10 Another schematic diagram showing the installation of adhesive component 8 on structural component 1 is shown. See also Figure 10 As shown, when the conductive position 8313 is located on the second surface, the extension 831 can be inserted into the first opening 111 and bend in a Z-shape so that the conductive end 8312 is located on the side of the structural member 1 away from the member 8 to be bonded, while the conductive position 8313 is located on the side of the conductive end 8312 away from the structural member 1.

[0137] Figure 11 An exploded view of a portion of the electronic device 100 is shown schematically. Figure 11 The second adhesive layer 85 is not shown. See also Figure 11 and combined Figure 10 As shown, the extension 831 can be bent along the side wall of the buffer layer 81 toward the first opening 111, so that the extension 831 can be inserted into the first opening 111 without opening holes in the buffer layer 81, the first adhesive layer 84 and the second adhesive layer 85 of the adhesive member 8. This simplifies the structure of the adhesive member 8 and allows the adhesive member 8 to have a larger bonding area with the structural member 1 and the member to be bonded, thus ensuring the connection effect between the member to be bonded 8 and the structural member 1.

[0138] When the component to be bonded 8 is the display screen 5, the component 8 is located on the peripheral edge of the non-display surface 502 of the display screen 5. Therefore, the first opening 111 can be located on the structural component 1 in the area corresponding to the component 8, so that the extension 831 can pass through the first opening 111. Specifically, the first opening 111 can be located in the edge area of ​​the middle plate 11 of the structural component 1. Figure 11 This is merely a schematic representation of the location of the first opening 111 and does not constitute a limitation on the location of the first opening 111 on the structural member 1.

[0139] See also Figure 11 The buffer layer 81 has a clearance groove 812 on its side wall, which is correspondingly provided with the first opening 111. The extension 831 can be bent along the clearance groove 812 of the buffer layer 81 toward the first opening 111 to limit the bending part and ensure that the bending part can pass through the clearance groove 812 and pass into the first opening 111.

[0140] Correspondingly, the sidewalls of the first adhesive layer 84 and the second adhesive layer 85 are also provided with relief grooves 812 at the positions of the relief grooves 812 of the corresponding buffer layer 81. Through the relief grooves 812 on the buffer layer 81, the first adhesive layer 84 and the second adhesive layer 85, the bending part can be better limited.

[0141] Figure 12 The schematic illustration shows the fixing effect of the conductive end 8312 of the adhesive 8 on the structural member 1. See also Figure 12 As shown, the conductive end 8312 can be fixed to the edge area of ​​the structural component 1. Figure 12 The diagram only illustrates the fixed position of the conductive end 8312 on the structural component 1 and does not constitute a limitation on the fixed position of the conductive end 8312 on the structural component 1. In this application, no special limitation is made on the fixed position of the conductive end 8312 on the structural component 1.

[0142] When the length of the adhesive member 8 meets the bonding requirements of the member to be bonded to the structural member 1, the number of adhesive members 8 can be one. In this case, the adhesive member 8 can be disposed around the peripheral edge of the side of the member to be bonded facing the structural member 1. Specifically, the adhesive member 8 can be disposed around the peripheral edge of the non-display surface 502 of the display screen 5.

[0143] When the length of the adhesive component 8 is insufficient to meet the bonding requirements of the component 8 to be bonded to the structural component 1, the number of adhesive components 8 can be two or more. Along the circumference of the component 8 to be bonded, two or more adhesive components 8 can be arranged sequentially on the peripheral edge of the side of the component 8 facing the structural component 1.

[0144] At this time, the conductive layers 83 of adjacent adhesive components 8 can be interconnected to make the conductive layers 83 of adjacent adhesive components 8 continuous. In this way, while the bonding requirements of the component to be bonded 8 on the structural component 1 are met by using two or more adhesive components 8, since the conductive layers 83 of adjacent adhesive components 8 are interconnected, when one conductive layer 83 is connected to the external power supply, the adjacent conductive layers 83 are also connected to the external power supply. Therefore, the electronic device 100 of this application can provide a conductive end on the conductive layer 83 of only one adhesive component 8 to meet the requirement of the conductive layers 83 of all adhesive components 8 in the electronic device 100 being connected to the external power supply, realizing the non-destructive removal of the component to be bonded 8, which not only simplifies the structure of some adhesive components 8, but also reduces the number of first openings 111 on the structural component 1.

[0145] It should be noted that the conductive layers 83 of adjacent adhesive components 8 may not be connected, and the conductive layers 83 of adjacent adhesive components 8 may be in a discontinuous state. In this case, the electronic device 100 may provide a conductive position 8313 on the conductive layer 83 of each adhesive component 8.

[0146] See also Figure 12 The structural component 1 may have a second opening 112. A portion of the metal layer 521 is exposed through the second opening 112 so that the metal layer 521 can be connected to an external power source at the second opening 112. Specifically, when it is necessary to connect the metal layer 521 to an external power source, a probe of the external power source can be placed at the second opening 112 so that the probe of the external power source contacts the metal layer 521, thereby achieving connection between the metal layer 521 and the external power source.

[0147] The second opening 112 can be a circular hole, a rectangular hole, etc. In this application, the shape of the second opening 112 is not particularly limited. The second opening 112 can be located on the edge area of ​​the middle plate 11 of the structural member 1. Figure 12 This is merely an illustration of the location of the second opening 112 and does not constitute a limitation on the location of the second opening 112 on the structural member 1.

[0148] See you again Figure 11 Each layer of the adhesive component 8 is provided with a clearance hole 811. The clearance hole 811 is provided corresponding to the second opening 112 to avoid the metal layer 521 so that a portion of the metal layer 521 can be exposed in the second opening 112. The shape of the clearance hole 811 can be the same as a circular hole, a rectangular hole, etc.

[0149] When the component to be bonded 8 is the display screen 5, since the display screen 5 is conductive to the structural component 1, when the display screen 5 needs to be connected to an external power source, the structural component 1 can also be connected to the external power source. This also enables the display screen 5 and the conductive layer 83 to be connected to the external power source, and allows the electro-adhesive layer 82 to be energized. In this case, the structural component 1 is a metal frame or a frame with a conductive surface.

[0150] When structural component 1 is a metal frame or a frame with a conductive surface, the extension 831 is insulated from structural component 1 to prevent the electrical signal at the extension 831 from being conducted away through structural component 1 when the conductive layer 83 is connected to the external power supply, thus affecting the power supply of the electro-adhesive layer 82.

[0151] See you again Figure 9 and Figure 10 The surface of the extension 831 has a first region facing the structural member 1. The adhesive member 8 also includes an insulating layer 86, which at least covers the first region. While enabling the extension 831 to pass through the first opening 111 of the structural member 1, the insulating layer 86 isolates the conductive layer 83 from the structural member 1, ensuring that the extension 831 and the structural member 1 are mutually insulated.

[0152] The portion of the extension 831 that passes through the first opening 111 can be referred to as the through section 8311, and the through section 8311 is connected to the conductive end 8312. Since the through section 8311 passes through the first opening 111 of the structural member 1, and the conductive end 8312 is located on the side of the structural member 1 away from the member 8 to be bonded, the first region can at least include both sides of the through section 8311 on the member 8 in the thickness direction. When the conductive end 8312 is fixed to the structural member 1 and in contact with the structural member 1, the first region also includes the side of the conductive end 8312 facing the structural member 1.

[0153] Figure 9 and Figure 10 The diagram shows a structure where the insulating layer 86 covers only the first region. See again for some embodiments. Figure 8 The insulating layer 86 can also cover the structure outside the first region of the extension 831.

[0154] See you again Figure 9 and Figure 10 An insulating layer 86 is disposed on both sides of the extension 831 along the thickness direction of the adhesive member 8. That is, the insulating layer 86 is disposed on the first and second sides of the extension 831 in the Z direction so that the insulating layer 86 can cover the surfaces of the through section 8311 and the conductive end 8312. Thus, when the extension 831 is inserted into the first opening 111, the insulating layer 86 can cover the first area of ​​the extension 831 facing the structural member 1 to isolate the conductive layer 83 from the structural member 1, thereby ensuring that the extension 831 and the structural member 1 are mutually insulated.

[0155] It should be noted that the conductive terminal 8312 is not covered by the insulating layer 86 at the portion corresponding to the conductive position 8313, so that the conductive layer 83 can be connected to the external power supply at the conductive position 8313.

[0156] The insulating layer 86 may include an adhesive layer 861 or a non-adhesive layer 862. The non-adhesive layer 862 may include an ink layer or an insulating film, etc. This ensures that the extension 831 is mutually insulated from the structural member 1, while also allowing for a greater variety of insulating layers 86, so that the adhesive member 8 can meet the usage requirements of different electronic devices 100. For example, when the conductive end 8312 is connected to the structural member 1, the insulating layer 86 may be an adhesive layer 861, ensuring that the extension 831 and the structural member 1 are mutually insulated while allowing the conductive end 8312 to be bonded to the structural member 1 through the adhesive layer 861. For example, when the conductive end 8312 does not need to be connected to the structural member 1, the insulating layer 86 may be a non-adhesive layer 862, ensuring that the extension 831 and the structural member 1 are mutually insulated.

[0157] The conductive end 8312 is connected and bonded to the structural component 1 via an adhesive layer 861. The insulating layer 86 of the through section 8311 can be a non-adhesive layer 862 to prevent the through section 8311 from rubbing against the structural component 1 when it passes through the first opening 111, thus ensuring smooth assembly of the through section 8311 within the first opening 111. In this case, the insulating layer 86 on the extension 831 can be a combination of the adhesive layer 861 and the non-adhesive layer 862.

[0158] The adhesive layer 861 can use a high-cohesion adhesive so that when the bonded part 8 is peeled off from the structural part 1, no adhesive residue is left on the structural part 1. Specifically, the adhesive layer 861 can use the same adhesive as the second adhesive layer 85, as detailed in the description of the second adhesive layer 85 above, which will not be repeated here.

[0159] It should be noted that in some embodiments, the insulating layer 86 can also be disposed on the surface of the structural member 1 facing the adhesive member 8, which can also ensure that the extension 831 is insulated from the structural member 1. Alternatively, the insulating layer 86 can be disposed on both the adhesive member 8 and the structural member 1. In this application, the placement of the insulating layer 86 in the electronic device 100 is not particularly limited.

[0160] Figure 13 A schematic diagram of another adhesive element 8 connecting the component to be bonded 8 and the structural component 1 is shown. See also Figure 13As shown, in some embodiments, structural member 1 includes a conductive structural member 1. For example, structural member 1 can be a metal frame or a frame with a conductive surface. The side of the metal layer 521 facing the adhesive member 8 has a conductive area, which is not covered by the adhesive member 8. When the conductive structural member 1 and the conductive area are configured to be connected to an external power source, they can form a capacitor to energize the electro-adhesive layer 82. In this way, after the electro-adhesive layer 82 is energized, the adhesiveness of the adhesive member 8 on one side of the electro-adhesive layer 82 is reduced, so as to achieve non-destructive removal of the adhesive member 8 without the need to provide a conductive layer 83 inside the adhesive member 8, thereby simplifying the structure of the adhesive member 8.

[0161] The conductive area can be the area corresponding to the clearance hole 811 of the upper adhesive 8 on the metal layer 521, to ensure that the conductive area is not covered by the adhesive 8. The conductive area can be exposed on the surface of the conductive structure 1 through the second opening 112, so that when both the conductive structure 1 and the conductive area are connected to an external power source, a capacitor can be formed to energize the electro-adhesive layer 82.

[0162] It should be noted that, in some embodiments, the conductive area may also be the area of ​​the component 8 to be bonded (such as the display screen 5) facing the structural component 1 that is not covered by the bonding component 8. In this application, the structure of the conductive area will not be further described.

[0163] As described above, in the related technology, in addition to being bonded to the middle plate 11 of the structural component 1 by foam adhesive 6, the peripheral edge of the protective cover 51 is also bonded to the frame 12 of the structural component 1 by sealant 7a (see [link to related technology]). Figure 3 In some maintenance scenarios, the existing sealant 7a is firmly bonded to the protective cover 51 and the frame 12, making it difficult to remove the protective cover 51 of the display screen 5 from the structural component 1. This requires cutting the structural component 1, which would render it unusable and hinder its reuse.

[0164] Furthermore, during the dismantling of the display screen 5, the structural component 1 is cut open, which will render the structural component 1 unusable and hinder its reuse.

[0165] Figure 14 It shows Figure 6 An enlarged view of electronic device 100 at point A. See also Figure 14As shown, the electronic device 100 may also include a sealant 7. For example, the sealant 7 may be polyurethane adhesive, etc. The sealant 7 is located between the periphery of the display screen 5 and the structural member 1, and bonds the display screen 5 and the structural member 1. Specifically, the sealant 7 may be bonded between the periphery edge of the protective cover 51 of the display screen 5 and the frame 12 of the structural member 1. Thus, through the combined action of the adhesive 8 and the sealant 7, the display screen 5 (and the adhesive 8) can be fixed to the structural member 1, enhancing the fixation of the display screen 5 to the structural member 1 while ensuring the airtightness of the electronic device 100 between the display screen 5 and the frame 12 of the structural member 1.

[0166] The elastic modulus refers to the ratio between stress and strain within the elastic range of an adhesive, reflecting its elastic properties. The higher the elastic modulus of an adhesive, the weaker the bond between it and the bonded object, and the easier it is to remove the adhesive from the bonded object.

[0167] The sealant 7 can be a colloid with a high elastic modulus. For example, the elastic modulus of the sealant 7 can be greater than or equal to 1 MPa. For instance, the elastic modulus of the sealant 7 can be greater than or equal to 1 MPa and less than or equal to 80 MPa.

[0168] Compared to the sealant 7a of related technologies, when the sealant 7 of this application uses a colloid with a higher elastic modulus, the protective cover 51 of the display screen 5 is easier to remove from the sealant without cutting the structural component 1, allowing the structural component 1 to be reused. Furthermore, since the sealant 7 primarily protects the sealing performance between the cover 51 and the structural component 1, when the elastic modulus of the sealant 7 is greater than 1 MPa, a sealing performance can be achieved while bonding the protective cover 51 to the structural component 1.

[0169] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms installation, connection, and linking should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0170] The terms first, second, third, fourth, etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. An electronic device, comprising: include: A first component and a second component, wherein the first component has a metal surface; An adhesive component, comprising an electro-adhesive layer, a conductive layer, and an adhesive layer, wherein the electro-adhesive layer is bonded to the metal surface, the conductive layer is disposed on the side of the electro-adhesive layer away from the metal surface, and the adhesive layer is disposed on the side of the conductive layer away from the first component; the first component is bonded to the second component via the adhesive component. The conductive layer includes an extension portion, the end of which is a conductive end. The conductive end is located on the side of the second component away from the first component. The conductive end includes a conductive bit, which is used to connect to an external power source.

2. The electronic device of claim 1, wherein, The conductive position is formed on the side of the conductive terminal away from the first component.

3. The electronic device of claim 2, wherein, The extension is insulated from the second component.

4. The electronic device of claim 2, wherein, An insulating layer is provided on both sides of the extension in the thickness direction.

5. The electronic device of claim 4, wherein, The conductive terminal is not covered by the insulating layer in the portion corresponding to the conductive position.

6. The electronic device of claim 4, wherein, The insulating layer includes an adhesive layer and / or a non-adhesive layer.

7. The electronic device of claim 6, wherein, The non-adhesive layer includes an ink layer or an insulating film.

8. The electronic device of claim 6, wherein, The conductive end and the second component are bonded together by the adhesive layer.

9. The electronic device of any of claims 1-8, wherein, The extension is U-shaped, so that the conductive end is located on the side of the second component away from the first component.

10. The electronic device of claim 1, wherein, The conductive layer and the metal surface are configured to form a capacitor when both are connected to an external power source, thereby energizing the electro-adhesive layer.

11. The electronic device of claim 1, wherein, The conductive layer includes a metallic material layer.

12. The electronic device of claim 1, wherein, The number of adhesive components is two or more, and the conductive layers of adjacent adhesive components are interconnected.

13. The electronic device of claim 1, wherein, The adhesive further includes a buffer layer, wherein the buffer layer and the conductive layer are stacked together. The adhesive layer further includes a first adhesive layer and a second adhesive layer; The first adhesive layer is bonded between the conductive layer and the buffer layer, and the second adhesive layer is bonded between the buffer layer and the second component.

14. The electronic device of claim 13, wherein, The second adhesive layer includes an adhesive with a cohesive strength greater than or equal to 0.5 MPa.

15. The electronic device of claim 1, wherein, The electro-adhesive layer is a colloid whose adhesion weakens after being energized.

16. The electronic device of claim 15, wherein, The electro-adhesive layer contains an electrolyte. The electro-adhesive layer is a colloid in which, after being energized, the cations in the electrolyte move toward the negative electrode of the external power source, and the anions move toward the positive electrode of the external power source, and a reversible chemical reaction occurs within itself.

17. The electronic device of claim 1, wherein, One of the first and second components is a battery, and the other component is the middle plate of the electronic device.

18. An adhesive member characterized by comprising: The adhesive is used to bond the first component and the second component, and the adhesive includes: an electro-adhesive layer, which is used to bond to the first component; A conductive layer is disposed on the side of the electro-adhesive layer away from the first component, and the conductive layer is used to bond with the second component; The conductive layer includes an extension portion, and insulating layers are provided on both sides of the extension portion in the thickness direction. The end of the extension portion away from the electro-adhesive layer is a conductive end, and a conductive position is provided on the conductive end; the conductive position is used to conduct to an external power source.

19. The electronic device of claim 18, wherein, The insulating layer includes an adhesive layer and / or a non-adhesive layer, wherein the non-adhesive layer includes an ink layer or an insulating film.

20. The electronic device of claim 18, wherein, The conductive layer includes a metallic material layer.

21. The electronic device of claim 18, wherein, The adhesive further includes a buffer layer, wherein the buffer layer and the conductive layer are stacked together. The adhesive layer further includes a first adhesive layer and a second adhesive layer; The first adhesive layer is bonded between the conductive layer and the buffer layer, and the second adhesive layer is bonded between the buffer layer and the second component.

22. The electronic device of claim 18, wherein, The second adhesive layer includes an adhesive with a cohesive strength greater than or equal to 0.5 MPa.

23. The electronic device of claim 18, wherein, The electro-adhesive layer is a colloid whose adhesion weakens after being energized.

24. The electronic device of claim 23, wherein, The electro-adhesive layer contains an electrolyte. The electro-adhesive layer is a colloid in which, after being energized, the cations in the electrolyte move toward the negative electrode of the external power source, and the anions move toward the positive electrode of the external power source, and a reversible chemical reaction occurs within itself.

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