Electronic device and assembly method of electronic device

Abstract

The present application relates to an electronic device and an assembly method for the electronic device, wherein the electronic device includes a middle frame and a display module. The middle frame has a middle frame side wall. The display module is housed in the middle frame. The display module includes a display panel and a cover plate and a protective member connected to both sides of the display panel. A colloid is connected between the display panel and the middle frame side wall, and the colloid is located between the cover plate, the protective member and the middle frame side wall. The colloid provides precise protection for the display panel, which is beneficial to improving the mechanical properties of the display panel and reducing the possibility of the display panel being broken or failing when the electronic device falls or is hit. The colloid also seals the display panel, reducing the possibility of external sweat, oil stains and other dirt on the display panel during the use of the electronic device. The colloid acts as a bonding agent between the display panel and the middle frame side wall, thereby connecting the display panel and the middle frame together.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic device and an assembly method of the electronic device. Background Art

[0002] The electronic device includes a display module, which is used to display image information or video information for users to watch.

[0003] Currently, display modules have relatively weak mechanical and corrosion resistance. For example, if an electronic device is bumped or dropped, the edges of the display module are prone to cracking, breaking, or even failure. Furthermore, display modules are susceptible to corrosion from dirt such as sweat and oil, all of which can affect their proper functioning. Summary of the Invention

[0004] The purpose of the present application is to provide an electronic device and an assembly method of the electronic device to solve the problem of weak mechanical properties and corrosion resistance of the display module in the above-mentioned prior art.

[0005] In a first aspect, embodiments of the present application provide an electronic device comprising: a middle frame and a display module. The middle frame has middle frame sidewalls; the display module is housed within the middle frame; the display module comprises a display panel, a cover plate and a protective member connected to both sides of the display panel; a colloid is connected between the display panel and the middle frame sidewalls, and the colloid is located between the cover plate, the protective member, and the middle frame sidewalls.

[0006] The colloid is located on the periphery of the display panel, thereby achieving precise protection for the display panel, which is beneficial to improving the mechanical properties of the display panel and reducing the possibility of the display panel shattering or failing when the electronic device is dropped or impacted, thereby extending the service life of the display panel. At the same time, the colloid can also seal the display panel, reducing the possibility of corrosion caused by external sweat, oil stains and other dirt on the display panel during the use of the electronic device, thereby ensuring the normal and stable operation of the display panel. On the other hand, the colloid also acts as a bond between the display panel and the side wall of the middle frame, thereby connecting the display panel and the middle frame together. This is conducive to simplifying the assembly process of electronic devices and improving the assembly efficiency of electronic devices.

[0007] In a possible implementation manner, the colloid surrounds the display panel along a circumference of the display panel.

[0008] The colloid can protect all edges of the display panel, further improving the mechanical properties and corrosion resistance of the display panel edge. At the same time, it also increases the bonding area between the display panel and the side wall of the middle frame to improve the stability of the connection between the display module and the middle frame.

[0009] In a possible implementation, the middle frame further includes a middle frame bottom wall connected to the middle frame side walls; the display module is fixedly connected to the middle frame side walls, and / or the display module is fixedly connected to the middle frame bottom wall.

[0010] The display module is fixedly connected to the side walls and / or the bottom wall of the middle frame to improve the stability of the display module when installed in the middle frame.

[0011] In a possible implementation manner, the display module is fixedly connected to the side wall of the middle frame, and / or the display module is fixedly connected to the back cover.

[0012] The display module is fixedly connected to the side walls and / or the back cover of the middle frame to improve the stability of the display module when installed in the middle frame.

[0013] In a possible implementation, a first adhesive member is provided between the protective member and the side wall of the middle frame along the circumference of the protective member, and the first adhesive member is connected to the protective member and the side wall of the middle frame.

[0014] The first adhesive member adheres to the display module, pre-fixing the display module to the middle frame and improving the stability of the display module's installation within the middle frame. In addition to pre-fixing the display module to the middle frame, the first adhesive member also seals the protective member and the sidewalls of the middle frame, reducing the possibility of colloid leaking out of the gap between the protective member and the sidewalls of the middle frame, thereby improving the glue injection effect.

[0015] In a possible implementation, the side wall of the middle frame has a protrusion extending toward the interior of the middle frame; along the thickness direction of the electronic device, the first adhesive component is disposed on a side of the protrusion facing the cover plate.

[0016] The raised portion supports and positions the first adhesive component, thereby improving the stability of the first adhesive component in the middle frame, reducing the possibility of the first adhesive component sliding along the side wall of the middle frame or falling off the side wall of the middle frame, and further improving the stability of the connection between the display module and the side wall of the middle frame.

[0017] In a possible embodiment, a sealant is provided between the cover plate and the side wall of the middle frame along the circumference of the cover plate; the sealant is connected to the cover plate and the side wall of the middle frame, and the sealant blocks the gap between the cover plate and the side wall of the middle frame.

[0018] The sealant seals the injection space, reducing the possibility of the glue leaking out of the gap between the cover plate and the sidewalls of the midframe. This ensures effective injection, improves the stability and reliability of the injection process, and reduces the possibility of glue waste. Furthermore, the sealant also acts as a bond, improving the stability of the connection between the display module and the midframe.

[0019] In a possible implementation, the middle frame is provided with a glue injection hole and a glue outlet hole; the glue injection hole and the glue outlet hole are both communicated with the glue injection space located between the cover plate, the protective component and the side wall of the middle frame.

[0020] The glue injection and discharge holes on the middle frame facilitate glue injection using the middle frame as a mold, simplifying the glue injection process. Furthermore, while glue is being injected into the display panel, the connection between the display panel and the middle frame is also completed, simplifying the assembly process of the electronic device and improving its assembly efficiency.

[0021] In a possible implementation manner, the glue injection hole and the glue outlet hole are opened on the side wall of the middle frame.

[0022] The glue injection holes and glue outlet holes are opened on the side wall of the middle frame, which makes it easy to use the middle frame as a glue injection mold for glue injection and helps to simplify the glue injection steps.

[0023] In a possible embodiment, the middle frame includes a middle frame bottom wall connected to the middle frame side wall; the glue injection hole and the glue outlet hole are opened on the middle frame bottom wall; the protective part is provided with a glue injection matching hole at a position corresponding to the glue injection hole, and the glue injection matching hole is connected to the glue injection hole; and; the protective part is provided with a glue outlet matching hole at a position corresponding to the glue outlet hole, and the glue outlet matching hole is connected to the glue outlet hole.

[0024] Since the surface of the protective member is relatively smooth, injecting glue through the protective member is conducive to increasing the flow speed of the glue in the injection space, thereby improving the efficiency of the glue injection. That is, when the glue is injected from the bottom of the middle frame, the efficiency of the glue injection is higher.

[0025] In a possible embodiment, the electronic device includes a support member; the middle frame also includes a middle frame bottom wall connected to the middle frame side wall; along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end is connected to the middle frame bottom wall.

[0026] The support member plays a supporting role for the display module, which is not only conducive to improving the stability of the display module installation, but also conducive to improving the impact resistance of the display module, thereby helping to improve the overall reliability of the display module, so as to reduce the possibility of damage to the display module when the electronic device collides or falls, thereby helping to extend the service life of the display module. On the other hand, when the display module is placed in the middle frame, when the protective member abuts against the support member, it means that the display module has reached the preset installation position. Therefore, the support member plays an installation and positioning role for the display module, which is conducive to improving the assembly accuracy between the display module and the middle frame. In addition, by adjusting the thickness of the support member, the position of the display module in the middle frame can be adjusted, reducing the requirements for the dimensional accuracy of the middle frame.

[0027] In a second aspect, embodiments of the present application provide an electronic device comprising: a housing, a display module, and a support member. The display module is housed within the housing; the support member is housed within the housing and is located on one side of the display module. The display module includes a display panel, a cover plate connected to both sides of the display panel, and a protective member. Along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end of the support member is connected to the bottom wall of the housing.

[0028] The effect of the support member in the embodiment of the present application is the same as the effect of the support member in the above embodiment, and will not be repeated here.

[0029] In a possible implementation, along the thickness direction of the electronic device, a thickness D of the support member satisfies: 0.03 mm ≤ D ≤ 0.2 mm.

[0030] By limiting the size range of the support member, it is helpful to improve the accuracy of its positioning of the display module in the thickness direction of the protective member, thereby improving the assembly accuracy between the display module and the middle frame. At the same time, it is also helpful to improve the supporting effect of the support member on the display module.

[0031] In a possible implementation, the support member includes a main body; a material of the main body includes one or more of PET, TPU, ABS, and PMMA.

[0032] Specifically, taking PET as an example, PET material has good mechanical properties, is easy to process and shape, and has good dimensional stability and chemical stability, which is beneficial to improving the reliability of the support member and extending the service life of the support member.

[0033] In a possible embodiment, the support member further includes bonding portions located on both sides of the main body; one end of the main body is bonded to the protective member through the bonding portion, and the other end is bonded to the bottom wall of the shell through the bonding portion.

[0034] By providing the adhesive portion, the support member also acts as an adhesive for the display module, thereby improving the stability of the connection between the display module and the midframe. This improves the stability of the display module installation and ensures normal and stable operation of the display module. Furthermore, during the glue injection process, when the display module is placed within the midframe, the adhesive bonding between the support member and the display module allows for pre-fixation of the display module and the midframe.

[0035] In a possible implementation, along a thickness direction of the electronic device, a projected area of ​​the protective member is larger than a projected area of ​​the display panel.

[0036] The protective member at the bottom of the display panel provides buffering, light shielding, heat dissipation, and grounding, thereby facilitating the normal and stable operation of the display module and extending its service life. The projected area of ​​the protective member is larger than that of the display panel. Increasing the effective area of ​​the protective member improves its buffering, light shielding, and heat dissipation capabilities, thereby increasing its reliability and facilitating the normal operation of the display module.

[0037] In one possible implementation, the protective element includes a rigid metal sheet.

[0038] Among them, the rigid metal sheet can be a steel sheet (such as a stainless steel sheet, a stainless steel sheet), a titanium alloy sheet or a metal sheet made of other rigid materials. Taking the steel sheet as an example, the steel sheet has good electrical conductivity and thermal conductivity. At the same time, it also has greater rigidity and hardness, thereby improving the overall rigidity and hardness of the protective member, so that the protective member plays a reliable supporting and protective role for the display panel, which is beneficial to improving the structural strength of the display panel, reducing the possibility of the display panel being broken and damaged under the action of external force, thereby improving the reliability of the display panel and extending the service life of the display panel. On the other hand, due to the large rigidity of the steel sheet itself, there is no need to inject glue around it, that is, it is only necessary to inject glue on the periphery of the display panel, which is beneficial to saving the amount of colloid used and saving the cost of injection.

[0039] In a possible implementation, the protective member further includes a buffer portion; along the thickness direction of the electronic device, one end of the buffer portion is connected to the display panel; and the other end is connected to the rigid metal sheet.

[0040] The buffer portion may include an adhesive layer and a buffer layer. The adhesive layer may be a mesh adhesive with good adhesion properties to achieve a connection between the protective member and the display panel. The mesh adhesive also has good air permeability, allowing the protective member to fit well on the display panel, thereby improving the stability of the connection between the protective member and the display panel. The buffer layer provides both buffering and light shielding.

[0041] In a possible implementation, the buffer portion is a silicone layer.

[0042] The silicone layer not only acts as a buffer but also as an adhesive, thus ensuring the connection between the protective element and the display panel. Since silicone eliminates the need for additional adhesive materials, the aforementioned adhesive and buffer layers can be formed using silicone. This simplifies the structure of the protective element and reduces its thickness, thereby saving space within the electronic device and achieving a thinner and lighter design. Furthermore, silicone's high stability improves the reliability of the protective element and extends its service life.

[0043] In a possible implementation, the cover plate includes an arc-shaped area; and the rigid metal sheet is provided with a matching hole or a matching groove at a position corresponding to the arc-shaped area.

[0044] The rigid metal sheet is provided with a matching hole or a matching groove at a position corresponding to the arc-shaped area of ​​the cover plate, which is conducive to reducing the structural strength of the position and allowing it to undergo a certain amount of deformation, so that the protective member can be well adapted to the cover plate with the arc-shaped area, thereby improving the stability of the protective member in the display module and enabling the protective member to provide reliable protection for the display panel.

[0045] In a third aspect, an embodiment of the present application provides an assembly method for an electronic device, wherein the electronic device includes a middle frame and a display module; the middle frame includes a middle frame side wall; the display module includes a display panel and a cover plate and a protective member located on both sides of the display panel; the assembly method for the electronic device includes: opening a glue injection hole and a glue outlet hole in the middle frame; placing the display module in the middle frame, and pre-fixing the display module to the middle frame; connecting a glue injection pump to the glue injection hole, so that the glue passes through the glue injection hole into the glue injection space located between the middle frame side wall, the cover plate and the protective member.

[0046] The above-mentioned assembly method limits the scope of glue injection, that is, glue is only injected into the glue injection space surrounded by the cover plate, the protective part and the side wall of the middle frame, so that the colloid is only located on the periphery of the display panel. There is no need to inject glue into the peripheral wall of the protective part that is not easily damaged and corroded, thereby achieving precise protection of the display panel to improve its mechanical properties. At the same time, the amount of colloid used is also saved. On the other hand, the colloid can also play a sealing role on the display panel to improve the corrosion resistance of the display panel. At the same time, by using the middle frame as a mold for glue injection. It is conducive to simplifying the assembly process of electronic equipment and improving the assembly efficiency of electronic equipment. In addition, since there is no need to use additional inner molds or outer molds for glue injection, the possibility of imprints on the surface of the display module is reduced, which is conducive to improving the display effect of the display module and also reduces the possibility of the dimensional accuracy of the display module being affected by the mold.

[0047] In a possible implementation manner, providing the glue injection hole and the glue outlet hole in the middle frame specifically includes: providing the glue injection hole and the glue outlet hole on a side wall of the middle frame.

[0048] The glue injection holes and glue outlet holes are opened on the side wall of the middle frame, which makes it easy to use the middle frame as a glue injection mold for glue injection and helps to simplify the glue injection steps.

[0049] In a possible embodiment, the middle frame further includes a middle frame bottom wall connected to the middle frame side wall; the opening of the glue injection hole and the glue outlet hole in the middle frame specifically includes: opening the glue injection hole and the glue outlet hole in the middle frame bottom wall; opening a glue injection matching hole connected to the glue injection hole in the protective part, and; opening a glue outlet matching hole connected to the glue outlet hole in the protective part.

[0050] Since the surface of the protective member is relatively smooth, injecting glue through the protective member is conducive to increasing the flow speed of the glue in the injection space, thereby improving the efficiency of the glue injection. That is, when the glue is injected from the bottom of the middle frame, the efficiency of the glue injection is higher.

[0051] In a possible implementation, pre-fixing the display module to the middle frame specifically includes: bonding the protective member to the side wall of the middle frame via a first adhesive member, wherein the first adhesive member is an annular structure.

[0052] The first adhesive member adheres to the display module, pre-fixing the display module to the midframe. This helps improve the stability of the display module's installation within the midframe. The first adhesive member also seals the protective member against the sidewalls of the midframe, reducing the possibility of colloid leaking out of the gap between the protective member and the sidewalls, thereby improving the glue injection effect.

[0053] In a possible embodiment, after placing the display module in the middle frame and pre-fixing the display module and the middle frame, the assembly method of the electronic device further includes: filling sealant between the side wall of the cover plate and the side wall of the middle frame.

[0054] The sealant seals the injection space, reducing the possibility of the glue leaking out of the gap between the cover plate and the sidewalls of the midframe. This ensures effective injection, improves the stability and reliability of the injection process, and reduces the possibility of glue waste. Furthermore, the sealant also acts as a bond, improving the stability of the connection between the display module and the midframe.

[0055] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 A schematic diagram of the appearance of an electronic device provided in one embodiment of the present application;

[0057] Figure 2 This is a schematic diagram of the interior of an electronic device according to an embodiment of the present application;

[0058] Figure 3 This is a schematic diagram of the interior of an electronic device according to another embodiment of the present application;

[0059] Figure 4 Schematic diagram of a display module, inner mold, and outer mold of an electronic device in one embodiment of the present application;

[0060] Figure 5 This is a schematic diagram of an injection pump injecting glue into a display module through a mold in one embodiment of the present application;

[0061] Figure 6 for Figure 5 Schematic diagram of the display module after glue injection;

[0062] Figure 7 for Figure 4 An enlarged view of the junction between the display module and the inner mold is shown in FIG.

[0063] Figure 8 This is a flow chart of an assembly process of an electronic device in one embodiment of the present application;

[0064] Figure 9 This is a top view of a middle frame of an electronic device in one embodiment of the present application;

[0065] Figure 10 This is a schematic diagram of the display module and the middle frame being pre-fixed in the first embodiment of the present application;

[0066] Figure 11This is a schematic diagram of the second embodiment of the present application when the display module and the middle frame are pre-fixed;

[0067] Figure 12 This is a schematic diagram of the display module and the middle frame being pre-fixed in the third embodiment of the present application;

[0068] Figure 13 This is a schematic diagram of the display module and the middle frame being pre-fixed in the fourth embodiment of the present application;

[0069] Figure 14 This is a schematic diagram of an embodiment of the present application in which a glue injection pump injects glue into a display module through a glue injection hole on a side wall of the middle frame;

[0070] Figure 15 Schematic diagram of a glue injection pump extending into the first glue injection hole and the second glue injection hole respectively in one embodiment of the present application;

[0071] Figure 16 for Figure 14 Schematic diagram of the display module after glue injection;

[0072] Figure 17 is a schematic diagram of an assembly process of an electronic device in another embodiment of the present application;

[0073] Figure 18 This is a schematic diagram of providing a sealant between a cover plate and a side wall of a middle frame of an electronic device in one embodiment of the present application;

[0074] Figure 19 is a schematic diagram of an assembly process of an electronic device in another embodiment of the present application;

[0075] Figure 20 A top view of a middle frame in another embodiment of the present application;

[0076] Figure 21 A top view of a protective member of a display module in one embodiment of the present application;

[0077] Figure 22 This is a schematic diagram of the display module and the middle frame being pre-fixed in the fifth embodiment of the present application;

[0078] Figure 23 This is a schematic diagram of an embodiment of the present application in which a glue injection pump injects glue into a display module through a glue injection hole on the bottom wall of the middle frame;

[0079] Figure 24 for Figure 23 The diagram in the figure shows the module after the injection is completed;

[0080] Figure 25 This is a schematic diagram of a display module in one embodiment of the present application;

[0081] Figure 26This is a schematic diagram of a display module in another embodiment of the present application;

[0082] Figure 27 This is a schematic diagram of a display module in another embodiment of the present application;

[0083] Figure 28 This is a partial schematic diagram of a display module in one embodiment of the present application;

[0084] Figure 29 This is a schematic diagram showing a display module connected to the bottom wall of the middle frame via a support member in one embodiment of the present application;

[0085] Figure 30 This is a schematic diagram showing a module connected to the bottom wall of the middle frame via a support member in another embodiment of the present application;

[0086] Figure 31 This is a schematic diagram showing a display module connected to the bottom wall of the middle frame via a support member in another embodiment of the present application;

[0087] Figure 32 A schematic diagram of a bar phone provided in an embodiment of the present application;

[0088] Figure 33 for Figure 32 Schematic diagram of the display panel of the display module of a mid-range mobile phone after glue injection;

[0089] Figure 34 A schematic diagram of a foldable mobile phone in a folded state provided in an embodiment of the present application;

[0090] Figure 35 for Figure 34 A schematic diagram of the display panel of the first display module of the foldable mobile phone after glue injection;

[0091] Figure 36 A schematic diagram of a foldable mobile phone in an unfolded state provided by an embodiment of the present application;

[0092] Figure 37 for Figure 36 Schematic diagram of the display panel of the second display module of the foldable mobile phone after glue injection.

[0093] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0094] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0095] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0096] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described from the perspectives shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also indirectly connected to the other element "on" or "under" through an intermediate element.

[0097] In order to make the purpose, technical solutions and advantages of this application more clear, this application is further described in detail below with reference to the accompanying drawings and embodiments.

[0098] like Figure 1 As shown, Figure 1 The figure shows the appearance of an electronic device 100 provided in one embodiment of the present application. This embodiment of the present application provides an electronic device 100. The electronic device 100 can be an electronic product such as a mobile phone, a tablet computer, a laptop computer, or a wearable device. The following description will be made using the example of a mobile phone as an example.

[0099] Electronic device 100 includes a display module 10 and a housing 20. Display module 10 is mounted on housing 20 and is used to display image or video information for viewing by a user. Display module 10 can be a 2D (Dimensions) display (i.e., a flat screen), a 2.5D curved screen, or a 3D curved screen.

[0100] like Figure 2 As shown, Figure 2FIG2 shows a schematic diagram of the interior of an electronic device 100 in one embodiment of the present application. The housing 20 includes a middle frame 30 and a back cover 54. The back cover 54 is connected to the middle frame 30 and encloses a first accommodation space 331 with the middle frame 30. The display module 10, the circuit board 52, and the battery 53 can all be accommodated together in the first accommodation space 331. This design helps to simplify the structure of the middle frame 30. At the same time, accommodating components such as the display module 10, the battery 53, and the circuit board 52 in the same accommodation space helps to save space inside the electronic device 100, thereby facilitating a compact design of the interior of the electronic device 100.

[0101] In other embodiments, the middle frame 30 may also be in other shapes, such as an H-shape. Figure 3 As shown, an H-shaped middle frame 30 is shown. Figure 3 A schematic diagram of the interior of an electronic device 100 in another embodiment of the present application is shown. The middle frame 30 may include a middle frame bottom wall 31 and middle frame side walls 32 circumferentially arranged around the middle frame bottom wall 31. The middle frame bottom wall 31 and the middle frame side walls 32 enclose a first accommodating space 331. The display module 10 is accommodated in the first accommodating space 331, and the display module 10 is connected to the middle frame side walls 32 along the circumferential edge. The middle frame bottom wall 31 and the back cover 54 enclose a second accommodating space 332. The circuit board 52 and the battery 53 are accommodated in the second accommodating space 332. The above-mentioned middle frame bottom wall 31 separates the display module 10 from other components such as the circuit board 52, reducing the possibility of interference between the display module 10 and components such as the circuit board 52 during the assembly process, which is beneficial to reducing the difficulty of assembling the electronic device 100 and also beneficial to improving the stability of the connection between the display module 10 and the middle frame 30.

[0102] The following description uses an H-shaped middle frame as an example. Middle frames of other structures are similar and will not be described in detail herein.

[0103] like Figure 3 As shown, along the thickness direction Z of the electronic device 100 , the display module 10 includes a cover plate 11 , a display panel 12 and a protective member 13 from top to bottom.

[0104] The display panel 12 may be a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

[0105] The cover plate 11 can be bonded to the upper surface of the display panel 12 along the thickness direction Z of the electronic device 100. The surface of the cover plate 11 facing the display panel 12 can be flat or curved. The cover plate 11 is made of a high-strength and high-transparency material, such as glass. The cover plate 11 protects the display panel 12, helping to reduce the possibility of damage to the upper surface of the display panel 12 from scratches or bumps, thereby extending the service life of the display panel 12 and ensuring normal use of the display panel 12.

[0106] Along the thickness direction Z of the electronic device 100 , the projected area of ​​the cover plate 11 may be larger than the projected area of ​​the display panel 12 , that is, the cover plate 11 may completely cover the upper surface of the display panel 12 , thereby improving the protection effect on the display panel 12 .

[0107] The protective member 13 can be bonded to the lower surface of the display panel 12 along the thickness direction Z of the electronic device 100. The protective member 13 can provide buffering, light shielding, heat dissipation, and grounding at the bottom of the display panel 12, thereby facilitating the normal and stable operation of the display module 10 and extending the service life of the display module 10.

[0108] Along the thickness direction Z of the electronic device 100, the projected area of ​​the protective member 13 is larger than the projected area of ​​the display panel 12. By increasing the effective area of ​​the protective member 13, the protective member 13 is improved in terms of buffering, light shielding, and heat dissipation, and the reliability of the protective member 13 is improved, thereby facilitating the normal use of the display module 10.

[0109] When the electronic device 100 is bumped or dropped, the edge of the display module 10 is prone to cracking, breaking or even failure. On the other hand, the edge of the display module 10 is also easily corroded by dirt such as sweat and oil, thereby affecting the normal operation of the display module 10.

[0110] To improve the mechanical properties and corrosion resistance of the edges of the display module 10, glue is injected into the edges of the display module 10 before they are assembled with the middle frame 30 to protect them. Furthermore, in the display module 10, the display panel 12 is at a higher risk of cracking and corrosion than the cover plate 11 and protective member 13. Therefore, the glue injection process primarily protects the edges of the display panel 12.

[0111] Figure 4 A schematic diagram of the display module 10 , the inner mold 92 , and the outer mold 91 of the electronic device 100 in one embodiment of the present application is shown. Figure 4The purpose is to illustrate the process of glue injection. After the cover plate 11, the display panel 12 and the protective member 13 are assembled into the display module 10, the display module 10 can be fixed using the mold 90 and then glue is injected. The mold 90 includes an outer mold 91 and an inner mold 92. The outer mold 91 includes an outer mold mother mold 912. The outer mold mother mold 912 has a through hole 912a. The inner mold 92 has a glue injection hole 92a. When injecting glue, the inner mold 92 is first placed in the outer mold mother mold 912, and the glue injection hole 92a is connected to the through hole 912a. Then, the display module 10 is placed in the outer mold mother mold 912, so that the display module 10 and the inner mold 92 are enclosed to form a glue injection space 40. At this time, the glue injection space 40 is connected to the glue injection hole 92a and the through hole 912a.

[0112] To protect all edges of the display panel 12, the aforementioned glue injection space 40 needs to surround all areas of the display panel 12 not covered by the cover plate 11 and the protective member 13. Therefore, when the display module 10 is placed within the outer mold mother die 912, the inner mold 92 needs to abut against the bottom of the protective member 13. As mentioned above, since the Z-axis projection of the cover plate 11 is larger than that of the display panel 12, the inner mold 92 also needs to abut against the bottom of the cover plate 11 to provide support. At this point, the glue injection space 40 surrounds the edges of the display panel 12, i.e., covers all areas of the display panel 12 not covered by the cover plate 11 and the protective member 13.

[0113] like Figure 5 As shown, Figure 5 A schematic diagram illustrating an embodiment of the present application illustrating a glue injection pump 200 injecting glue into the display module 10 through the mold 90. The outer mold 91 further includes an outer mold male mold 911. After the display module 10 is placed on the outer mold female mold 912, the outer mold male mold 911 is pressed onto the outer mold female mold 912. Under the pressure of the outer mold male mold 911 and the outer mold female mold 912, the display module 10 and the inner mold 92 are firmly pressed together, thereby facilitating glue injection. The glue injection pump 200 is inserted into the glue injection space 40 through the through hole 912a and the glue injection hole 92a to inject glue into the glue injection space 40.

[0114] After the glue injection is completed, the outer mold male mold 911 is first disassembled from the outer mold female mold 912, and then the display module 10 is taken out from the outer mold female mold 912 to obtain the following Figure 6 The display module 10 is shown. Figure 6 Shown Figure 5 After the glue injection is completed, the glue 41 not only covers the four sides of the display panel 12, but also covers the four sides of the protective member 13, and even extends to the position below the protective member 13, so as to play a protective role for the display module 10.

[0115] However, the above solution has the following problems:

[0116] First, the range of glue injection is too large (the glue injection space is too large), which results in an increase in the amount of glue 41 used, which is not conducive to the miniaturization of the electronic device 100.

[0117] Second, as Figure 7 As shown, Figure 7 Shown Figure 4 An enlarged view of the contact area between the display module 10 and the inner mold 92 is shown in FIG. When the inner mold 92 and the display module 10 contact each other, due to manufacturing process errors and other factors, a gap a is likely to exist between the inner mold 92 and the cover plate 11, and a gap b is likely to exist between the inner mold 92 and the protective member 13. The glue injected into the glue injection space 40 is likely to overflow from these gaps a and b, which not only affects the glue injection effect but also causes glue waste.

[0118] Thirdly, under the pressing action of the outer mold male mold 911 and the outer mold female mold 912, the inner mold 92 is likely to leave marks on the surface of the display module 10, thereby easily affecting the display effect of the display module 10 and being detrimental to the user experience.

[0119] Fourthly, the dimensional accuracy of the mold 90 can easily affect the dimensional accuracy of the glue injection space 40, thereby affecting the dimensional accuracy of the entire display module 10. Therefore, when the dimensional accuracy of the mold 90 is low, the dimensional accuracy of the glue 41 connected to the display module 10 after glue injection is low, which can easily affect the subsequent assembly accuracy between the display module 10 and the middle frame 30.

[0120] Fifthly, since the mold 90 is expensive and has a short service life, the production cost of the electronic device increases.

[0121] Sixthly, after the display module 10 is injected with glue, it still needs to be assembled with the middle frame 30 by dispensing glue or backing glue, which makes the production process of the entire electronic device more complicated.

[0122] To solve the above technical problems, the embodiment of the present application limits the glue injection space 40 to between the cover plate 11 and the protective member 13 of the display module 10 to reduce the amount of glue 41 used, thereby simplifying the glue injection steps and improving process efficiency.

[0123] Specifically, an embodiment of the present application provides an assembly method of an electronic device 100 . Figure 8 1 shows a flow chart of the assembly process 300 of the electronic device 100 in one embodiment of the present application. Figures 9 to 16 To describe the assembly process 300. The assembly process 300 may include the following steps:

[0124] S311: Set glue injection holes 42 and glue outlet holes 43 on the middle frame 30. Figure 9 , Figure 9 FIG. 1 shows a top view of the middle frame 30 of the electronic device 100 in one embodiment of the present application. The glue injection hole 42 is connected to the inner cavity 34 of the middle frame 30 . The glue outlet hole 43 is connected to the inner cavity 34 of the middle frame 30 .

[0125] The glue injection holes 42 and glue outlet holes 43 are opened on the side wall 32 of the middle frame, which facilitates the use of the middle frame 30 as a glue injection mold for glue injection and helps simplify the glue injection process. Among them, the glue injection holes 42 and glue outlet holes 43 can be opened along the width direction Y of the electronic device 100.

[0126] Specifically, the middle frame sidewall 32 may be provided with a first glue injection hole 421, a second glue injection hole 422, a first glue outlet hole 431, and a second glue outlet hole 432, thereby improving glue injection efficiency. Along the circumference of the middle frame sidewall 32, the first glue injection hole 421, the first glue outlet hole 431, the second glue injection hole 422, and the second glue outlet hole 432 are sequentially arranged. The middle frame sidewall 32 has a first long side 32a and a second long side 32b. The first glue injection hole 421 and the first glue outlet hole 431 are provided on the first long side 32a. The second glue injection hole 422 and the second glue outlet hole 432 are provided on the second long side 32b.

[0127] After step S311, proceed to step S312. S312: Please refer to Figure 10 , Figure 10 The diagram shows the pre-fixation of the display module 10 and the middle frame 30 in the first embodiment of the present application. The display module 10 is placed in the middle frame 30 and the display module 10 and the middle frame 30 are pre-fixed.

[0128] After the display module 10 and the middle frame 30 are pre-fixed, the cover plate 11, the protective member 13 and the middle frame side wall 32 form a glue injection space 40 along the thickness direction Z of the electronic device 100. That is, for the glue injection space 40, the cover plate 11 and the protective member 13 can serve as the bottom wall and the top wall of the glue injection space 40 respectively. The display panel 12 and the middle frame side wall 32 can serve as the side walls of the glue injection space 40 respectively. Figure 5 Compared with the glue injection space 40 shown in FIG, the glue injection space 40 in this embodiment is significantly reduced. Figure 9 The glue injection space 40 is connected to the glue injection hole 42 and the glue outlet hole 43 provided on the side wall 32 of the middle frame.

[0129] The display module 10 and the middle frame 30 may be pre-fixed in any one or a combination of the following methods.

[0130] The first type: the protective member 13 is pre-fixed to the middle frame side wall 32 .

[0131] Specifically, the outer peripheral wall of the protective member 13 may be provided with a first adhesive member 70. After the display module 10 is placed within the middle frame 30, the first adhesive member 70 is bonded to the middle frame sidewall 32. Alternatively, the first adhesive member 70 may be provided on the middle frame sidewall 32 and, after the display module 10 is placed within the middle frame 30, bonded to the protective member 13. The provision of the first adhesive member 70 helps improve the stability of the display module 10 when installed within the middle frame 30. In addition to pre-fixing the display module 10 to the middle frame 30, the first adhesive member 70 also serves as a seal between the protective member 13 and the middle frame sidewall 32. The first adhesive member 70 may be provided along the circumference of the protective member 13, that is, the first adhesive member 70 may have an annular structure to seal the bottom of the glue injection space 40, thereby reducing the possibility of the glue 41 overflowing from the gap between the protective member 13 and the middle frame sidewall 32, thereby improving the glue injection effect.

[0132] Please refer to Figure 11 , Figure 11 The figure shows a schematic diagram of the display module 10 and the middle frame 30 being pre-fixed in the second embodiment of the present application. The middle frame sidewall 32 may be provided with a raised portion 321. The raised portion 321 extends toward the interior of the middle frame 30. The first adhesive member 70 is provided on the raised portion 321. The raised portion 321 supports and positions the first adhesive member 70, thereby improving the stability of the first adhesive member 70 within the middle frame 30 and reducing the possibility of the first adhesive member 70 sliding along the middle frame sidewall 32 or falling off the middle frame sidewall 32, thereby improving the stability of the connection between the display module 10 and the middle frame sidewall 32. In some embodiments, the raised portion 321 may be provided along the circumference of the middle frame sidewall 32, that is, the raised portion 321 may be an annular boss. In other embodiments, the middle frame sidewall 32 is provided with multiple raised portions 321, and the multiple raised portions 321 are arranged at intervals along the circumference of the middle frame sidewall 32.

[0133] The second method is to pre-fix the protective member 13 to the bottom wall 31 of the middle frame.

[0134] Please refer to Figure 12 , Figure 12 A schematic diagram illustrates the pre-attachment of the display module 10 and the middle frame 30 in the third embodiment of the present application. When the display module 10 is placed within the middle frame 30, the bottom of the protective member 13 in the display module 10 can be bonded to the bottom wall 31 of the middle frame via a second adhesive 55. Specifically, the second adhesive 55 can be adhesive. Simultaneously, the sidewalls of the protective member 13 can also be bonded to the sidewalls 32 of the middle frame via a first adhesive 70.

[0135] Alternatively, please refer to Figure 13 , Figure 13A schematic diagram of the display module 10 and the middle frame 30 during pre-fixation in the fourth embodiment of the present application is shown. A support member 80 can be provided in the space enclosed by the middle frame bottom wall 31 and the middle frame side walls 32, and the support member 80 is located on the middle frame bottom wall 31. When the display module 10 is placed in the middle frame 30, the protective member 13 can abut against the support member 80. The support member 80 can be mounted on the middle frame bottom wall 31, or it can be integrally formed with the middle frame bottom wall 31. During the process of placing the display module 10 in the middle frame 30, when the protective member 13 abuts against the support member 80, it indicates that the display module 10 has reached the preset installation position. The support member 80 plays a role in installing and positioning the display module 10, thereby facilitating improved assembly accuracy between the display module 10 and the middle frame 30. In addition, by adjusting the thickness of the support member 80, the position of the display module 10 in the middle frame 30 can be adjusted, reducing the requirements for the dimensional accuracy of the middle frame 30.

[0136] That is, the display module 10 is pre-fixed to the middle frame side wall 32 , and / or the display module 10 is pre-fixed to the middle frame bottom wall 31 .

[0137] In other embodiments, the display module may also be pre-fixed to the back cover.

[0138] After step S312, the process proceeds to step S313. S313: Connect the glue injection pump 200 to the glue injection hole 42, allowing the glue 41 to enter the glue injection space 40 through the glue injection hole 42. When the glue 41 is discharged from the glue outlet hole 43, the glue injection into the glue injection space 40 is complete, and the display panel 12 is connected to the middle frame 30 through the glue 41.

[0139] Please refer to Figure 14 , Figure 14 A schematic diagram illustrates an embodiment of the present invention, wherein a glue injection pump 200 injects glue into the display module 10 through a glue injection hole 42 on the middle frame sidewall 32. During glue injection, the glue injection pump 200 extends into the glue injection hole 42 to inject glue 41 onto the outer peripheral wall of the display panel 12, thereby connecting the display panel 12 to the middle frame sidewall 32 via the glue 41.

[0140] like Figure 15 As shown, Figure 15 A schematic diagram of an embodiment of the present application is shown in which the glue injection pump 200 extends into the first glue injection hole 421 and the second glue injection hole 422 respectively. The middle frame side wall 32 can be provided with two glue injection holes 42, namely the first glue injection hole 421 and the second glue injection hole 422. The first glue injection hole 421 and the second glue injection hole 422 can be connected to a glue injection pump 200 respectively, so that two glue injection pumps 200 can be used to inject glue at the same time to improve the efficiency of glue injection. When the glue injection pump 200 injects colloid into the glue injection space, the colloid flows in the glue injection space. When the glue injection space is filled with the glue, the colloid is discharged outward through the glue outlet hole 43.

[0141] For details, please refer to Figure 15 As shown, the following describes the glue injection process by taking the first glue injection hole 421 as an example. The first glue injection hole 421 is located between the first glue outlet hole 431 and the second glue outlet hole 432. The path between the first glue injection hole 421 and the first glue outlet hole 431 is L1, and the path between the first glue injection hole 421 and the second glue outlet hole 432 is L2. After glue is injected from the first glue injection hole 421, the colloid flows through path L1 and path L2 respectively, and is discharged from the first glue outlet hole 431 and the second glue outlet hole 432. The principle of the position design between the second glue injection hole 422 and the two glue outlet holes 43 is the same as the principle of the position design between the first glue injection hole 421 and the two glue outlet holes 43, and will not be repeated here.

[0142] The embodiment of the present application limits the positions of the glue injection hole 42 and the glue outlet hole 43, which is beneficial for achieving synchronous glue outlet from the first glue outlet hole 431 and the second glue outlet hole 432 after synchronous glue injection of the first glue injection hole 421 and the second glue injection hole 422, thereby improving the efficiency of glue injection.

[0143] Please refer to Figure 16 , Figure 16 Shown Figure 14 Schematic diagram of the display module 10 after the glue injection is completed. Figure 16 The connection structure between the middle frame 30 and the display module 10 is shown. Colloid 41 is filled between the cover plate 11, the protective member 13, and the middle frame sidewalls 32 of the display module 10. This colloid 41 connects the display panel 12 to the middle frame sidewalls 32 and circumferentially protects the display panel 12. Specifically, colloid 41 can be an adhesive such as epoxy adhesive.

[0144] The above-mentioned assembly method limits the scope of glue injection, that is, glue is only injected into the glue injection space 40 surrounded by the cover plate 11, the protective member 13, and the side wall 32 of the middle frame, so that the glue 41 is only located on the periphery of the display panel 12. There is no need to inject glue into the outer peripheral wall of the protective member 13, which is not easily damaged or corroded. This achieves precise protection for the display panel 12, which is beneficial to improving the mechanical properties of the display panel 12 and reducing the possibility of the display panel 12 being broken or failing when the electronic device 100 is dropped or impacted, thereby extending the service life of the display panel 12. At the same time, the amount of glue 41 used is also saved, which is beneficial to reducing the weight of the electronic device 100 and reducing the production cost of the electronic device 100. On the other hand, the glue 41 can also seal the display panel 12, reducing the possibility of corrosion of the display panel 12 by external dirt such as sweat and oil during the use of the electronic device 100. It is also beneficial to extend the service life of the display panel 12 and ensure that the display panel 12 operates normally and stably.

[0145] At the same time, the middle frame 30 is used as a mold for glue injection. After the glue injection is completed, the colloid 41 not only protects the display panel 12, but also plays a bonding role between the display panel 12 and the middle frame side wall 32, thereby connecting the display panel 12 and the middle frame 30 together. That is, the embodiment of the present application completes the connection between the display panel 12 and the middle frame 30 while completing the glue injection on the display panel 12, which is beneficial to simplify the assembly process of the electronic device and improve the assembly efficiency of the electronic device. In addition, since there is no need to use additional inner molds or outer molds for glue injection, the possibility of imprints forming on the surface of the display module 10 is reduced, which is beneficial to improving the display effect of the display module 10 and also reduces the possibility that the dimensional accuracy of the display module 10 is affected by the mold.

[0146] Figure 17 FIG. 4 is a flow chart showing an assembly process 400 of an electronic device 100 according to another embodiment of the present application. Figure 18 4. The assembly process 400 may include the following steps:

[0147] S411: Setting a glue injection hole 42 and a glue outlet hole 43 on the middle frame 30. The glue injection hole 42 is communicated with the inner cavity 34 of the middle frame 30, and the glue outlet hole 43 is communicated with the inner cavity 34 of the middle frame 30.

[0148] In step 411 , the glue injection hole 42 and the glue outlet hole 43 are arranged on the middle frame 30 in the same manner as in step S311 , and are not described again here.

[0149] After step S411 , the process proceeds to step S412 : S412 : placing the display module 10 in the middle frame 30 , and pre-fixing the display module 10 and the middle frame 30 .

[0150] The method of pre-fixing the display module and the middle frame in step S412 can be the same as that in step S312, and will not be repeated here.

[0151] After step S412 , the process proceeds to step S413 . In step S413 , the gap between the side wall of the cover plate 11 and the side wall 32 of the middle frame is sealed with the sealant 60 , thereby sealing the glue injection space 40 .

[0152] Please refer to Figure 18 , Figure 18A schematic diagram of an embodiment of the present application showing a sealant 60 provided between the cover plate 11 and the middle frame side wall 32 of the electronic device 100. A sealant 60 is provided between the cover plate 11 and the middle frame side wall 32. The sealant 60 can be provided along the circumference of the cover plate 11. During the glue injection process, the sealant 60 seals the glue injection space, thereby reducing the possibility of the glue 41 overflowing from the gap between the cover plate 11 and the middle frame side wall 32, thereby ensuring the glue injection effect, improving the stability and reliability of the glue injection, and reducing the possibility of the glue 41 being wasted. At the same time, the sealant 60 can also play a bonding role to improve the stability of the connection between the display module 10 and the middle frame 30.

[0153] Specifically, the sealant 60 can be a caulking adhesive. After the display module 10 is placed in the middle frame 30 and pre-fixed with the middle frame 30, a dispensing mechanism (not shown) can be used to apply the caulking adhesive to the gap between the cover plate 11 and the sidewall 32 of the middle frame.

[0154] After step S413 , the process proceeds to step S414 . S414 : Connect the glue injection pump 200 to the glue injection hole 42 , so that the glue 41 enters the glue injection space 40 through the glue injection hole 42 . When the glue is discharged from the glue outlet hole 43 , the glue injection into the glue injection space is completed.

[0155] In step 414 , the method of injecting and discharging the colloid 41 into the colloid injection space 40 may be the same as that in step S313 , and will not be described in detail here.

[0156] The above description describes glue injection from the side of the middle frame 30, i.e., the glue injection holes 42 and glue outlet holes 43 are provided on the middle frame side walls 32. In other embodiments, glue injection can also be performed from the bottom of the middle frame 30, i.e., the glue injection holes 42 and glue outlet holes 43 are provided on the middle frame bottom wall 31. The following describes glue injection from the bottom of the middle frame 30 in detail.

[0157] Figure 19 FIG. 5 is a flow chart showing an assembly process 500 of an electronic device 100 according to another embodiment of the present application. Figures 19 to 24 5. The assembly process 500 may include the following steps:

[0158] S511 : setting a glue injection hole 42 and a glue outlet hole 43 on the middle frame 30 , and setting a glue injection matching hole 135 and a glue outlet matching hole 136 on the protective member 13 .

[0159] For details, please refer to Figure 20 , Figure 20A top view of the middle frame 30 in another embodiment of the present application is shown. Glue injection holes 42 and glue outlet holes 43 are provided on the bottom wall 31 of the middle frame and are both connected to the inner cavity of the middle frame 30. Specifically, the bottom wall 31 of the middle frame may be provided with a first glue injection hole 421, a second glue injection hole 422, a first glue outlet hole 431, and a second glue outlet hole 432. Along the circumference of the middle frame sidewall 32, the first glue injection hole 421, the first glue outlet hole 431, the second glue injection hole 422, and the second glue outlet hole 432 are sequentially provided.

[0160] Please also refer to Figure 21 , Figure 21 A top view of the protective member 13 of the display module 10 in one embodiment of the present application is shown. The protective member 13 may be provided with a first glue injection hole 135a, a second glue injection hole 135b, a first glue outlet hole 136a, and a second glue outlet hole 136b. Along the circumference of the protective member 13, the first glue injection hole 135a, the first glue outlet hole 136a, the second glue injection hole 135b, and the second glue outlet hole 136b are arranged in this order.

[0161] S512 : placing the display module 10 in the middle frame 30 , and pre-fixing the display module 10 and the middle frame 30 .

[0162] The method of pre-fixing the display module 10 and the middle frame 30 in step S512 may be the same as that in step S312 and will not be repeated here.

[0163] Please refer to Figure 22 , Figure 22 Schematic diagram of the display module 10 and the middle frame 30 being pre-fixed in the fifth embodiment of the present application is shown. After the display module 10 and the middle frame 30 are pre-fixed, the glue injection hole 42 is connected to the glue injection space 40 through the glue injection matching hole 135. Figure 22 Not shown) through the glue outlet hole ( Figure 22 (not shown) is connected to the glue injection space 40.

[0164] Specifically, the position of the first glue injection hole 135a corresponds to the position of the first glue injection hole 421, that is, along the thickness direction Z of the electronic device 100, the first glue injection hole 135a is connected to the first glue injection hole 421. The first glue outlet hole 136a corresponds to the position of the first glue outlet hole 431, that is, along the thickness direction Z of the electronic device 100, the first glue outlet hole 136a is connected to the first glue outlet hole 431. The position of the second glue injection hole 135b corresponds to the position of the second glue injection hole 422, that is, along the thickness direction Z of the electronic device 100, the second glue injection hole 135b is connected to the second glue injection hole 422. The position of the second glue outlet hole 136b corresponds to the position of the second glue outlet hole 432, that is, along the thickness direction Z of the electronic device 100, the second glue outlet hole 136b is connected to the second glue outlet hole 432.

[0165] After step S512 , the process proceeds to step S513 . In step S513 , the gap between the side wall of the cover plate 11 and the side wall 32 of the middle frame is sealed by the sealant 60 , thereby sealing the glue injection space 40 .

[0166] This step is the same as the above step S413 and will not be repeated here.

[0167] After step S513 , the process proceeds to step S514 . S514 : connecting the glue injection pump 200 to the glue injection hole 42 so that the glue 41 enters the glue injection space 40 through the glue injection hole 42 . When the glue 41 is discharged from the glue outlet hole 43 , the glue injection into the glue injection space 40 is completed.

[0168] Please refer to Figure 23 , Figure 23 The figure shows a schematic diagram of a glue injection pump 200 injecting glue into the display module 10 through the glue injection hole 42 on the bottom wall 31 of the middle frame in one embodiment of the present application. The glue injection pump 200 extends into the glue injection space 40 through the glue injection hole 42 and the glue injection matching hole 135 to inject glue into the glue injection space 40.

[0169] Please refer to Figure 24 , Figure 24 Shown Figure 23 The schematic diagram of the module 10 after the glue injection is completed is shown in FIG. The glue 41 is filled into the above-mentioned glue injection space by the glue injection pump 200. Figure 20 and Figure 21 When the glue injection space is filled with glue 41, the glue 41 is discharged from the glue injection space through the glue outlet holes 136 on the protective member 13, and then discharged outside the middle frame 30 through the glue outlet holes 43 on the middle frame 30. After glue is injected simultaneously through the first glue injection holes 135a and the second glue injection holes 135b, the glue 41 can be discharged simultaneously through the first glue outlet holes 136a and the second glue outlet holes 136b. This helps improve glue injection efficiency.

[0170] Since the surface of the protective member 13 is relatively smooth, injecting glue through the protective member 13 is conducive to increasing the flow speed of the glue 41 in the glue injection space 40, thereby improving the efficiency of glue injection. Therefore, when injecting glue from the bottom of the middle frame 30, the efficiency of glue injection is higher.

[0171] In addition, in each of the above embodiments, after the glue injection is completed, the glue injection hole and the glue outlet hole can be sealed, for example, by filling the glue injection hole and the glue outlet hole with sealant, or by blocking the glue injection hole and the glue outlet hole with a component such as tape. Alternatively, the glue injection hole and the glue outlet hole can be directly sealed using the above-mentioned glue.

[0172] like Figure 25 As shown, Figure 25A schematic diagram of the display module 10 in one embodiment of the present application is shown. Along the thickness direction Z of the protective member 13, the protective member 13 may be a multi-layer structure. Specifically, the protective member 13 may have a buffer portion and a flexible metal sheet 137, wherein the buffer portion may include an adhesive layer 131 and a buffer layer 132. The adhesive layer 131 may be a mesh adhesive having good bonding properties to achieve a connection between the protective member 13 and the display panel 12. At the same time, the mesh adhesive also has good air permeability, so that the protective member 13 fits well on the display panel 12 to improve the stability of the connection between the protective member 13 and the display panel 12. The adhesive layer 131 may also use other adhesive materials as long as they meet the use requirements of the display module 10. The buffer layer 132 plays a role of buffering and shading. The buffer layer 132 may be made of foam, and of course other materials with good buffering properties may also be used. The flexible metal sheet 137 may be a metal material such as copper foil or aluminum foil.

[0173] The following explanation will be given by taking the flexible metal sheet 137 as copper foil as an example. Copper foil has good electrical and thermal conductivity, which is beneficial to improving the reliability of the protective part 13. Since copper foil is relatively soft, the protective part 13 can be well adapted to a straight screen or a curved screen. However, relatively speaking, since copper foil is easily deformed under the impact of external forces, its reliability is relatively low. In order to improve the mechanical properties of copper foil, it is necessary to inject glue on the periphery of the copper foil, that is, it is necessary not only to inject glue on the periphery of the display panel 12, but also to inject glue on the periphery of the protective part 13, resulting in an increase in the amount of glue used and an increase in cost. In addition, since the glue layer 131, the buffer layer 132 and the flexible metal sheet 137 are all relatively soft, the overall rigidity of the protective part 13 is low, making it difficult to provide reliable protection for the display panel 12, causing the display panel 12 to shatter or even fail when impacted, which is not conducive to improving the service life of the display panel 12.

[0174] In response to the above technical issues, such as Figure 26 As shown, Figure 26A schematic diagram of a display module 10 in another embodiment of the present application is shown. This embodiment of the present application provides a rigid metal sheet 133 to replace the flexible metal sheet 137 described above. The rigid metal sheet 133 can serve the functions of heat dissipation, light shielding, grounding, and support. The rigid metal sheet 133 can be a steel sheet (e.g., a 304 stainless steel sheet, a 316 stainless steel sheet), a titanium alloy sheet, or a metal sheet made of other rigid materials. Taking a steel sheet as an example, a steel sheet has good electrical and thermal conductivity. At the same time, it also has high rigidity and hardness, thereby improving the overall rigidity and hardness of the protective member 13, so that the protective member 13 provides reliable support and protection for the display panel 12, which is beneficial to improving the structural strength of the display panel 12 and reducing the possibility of the display panel 12 being broken or damaged under external forces, thereby improving the reliability of the display panel 12 and extending the service life of the display panel 12. On the other hand, due to the high rigidity of the steel sheet itself, there is no need to inject glue around it. That is, only the outer periphery of the display panel 12 needs to be injected with glue, which helps save the amount of colloid 41 and saves the cost of injection. Therefore, in this embodiment, the protective member 13 uses a rigid metal sheet 133 instead of the flexible metal sheet 137 to help reduce the volume of the glue injection.

[0175] The process of glue injection is as described in the above embodiments, and will not be repeated here. Figure 24 After the glue injection is completed, the colloid 41 can be carried on the protective member 13. Under the support of the rigid metal sheet 133, the possibility of deformation of the protective member 13 under the influence of the gravity of the colloid 41 is reduced, thereby improving the stability of the colloid 41.

[0176] like Figure 27 As shown, Figure 27 A schematic diagram of a display module 10 in another embodiment of the present application is shown. The buffer portion in the protective member 13 may be a silicone layer 134. Specifically, along the thickness direction Z of the protective member 13, the protective member 13 may be provided with a silicone layer 134 and a rigid metal sheet 133 from top to bottom. The silicone layer 134 not only plays a buffering role but also plays a bonding role, thereby realizing the connection between the protective member 13 and the display panel 12. Since silicone is used, there is no need to set additional glue material, that is, the above-mentioned glue layer and buffer layer can be realized by the silicone layer, which is conducive to simplifying the structure of the protective member 13 and reducing the thickness of the protective member 13, thereby helping to save space inside the electronic device 100, so as to realize a lightweight design of the electronic device 100. In addition, silicone has high stability, which is conducive to improving the reliability of the protective member 13 and extending the service life of the protective member 13.

[0177] like Figure 28 As shown, Figure 28A partial schematic diagram of a display module 10 in an embodiment of the present application is shown. The display module 10 may be a curved screen. Specifically, the cover plate 11 includes a straight area 111 and a curved area 112. The curved area 112 is located at the edge of the straight area 111 and is bent at a certain angle relative to the straight area 111 to form a curved surface. The display panel 12 may be a flexible display panel that can be deformed under the action of an external force to fit on the cover plate 11 having the curved area 112. The rigid metal sheet 133 is provided with a matching hole 133a or a matching groove ( Figure 28 (not shown in the figure), which helps to reduce the structural strength of this position and allows it to undergo a certain amount of deformation, so that the protective member 13 can be well adapted to the cover plate 11 having the arc-shaped area 112, thereby improving the stability of the protective member 13 in the display module 10, so that the protective member 13 can reliably protect the display panel 12.

[0178] The above-mentioned matching holes 133 a or matching grooves may be formed on the rigid metal sheet 133 by a stamping process, or may be formed by an etching process.

[0179] like Figure 29 As shown, Figure 29 A schematic diagram showing an embodiment of the present application in which the display module 10 is connected to the bottom wall 31 of the middle frame through the support member 80. Along the thickness direction Z of the electronic device 100, the support member 80 is arranged between the protective member 13 and the bottom wall 31 of the middle frame. One end of the support member 80 is connected to the protective member 13, and the other end is connected to the bottom wall 31 of the middle frame. Specifically, the above-mentioned support member 80 can abut against the rigid metal sheet 133 in the protective member 13. Due to the large rigidity and hardness of the rigid metal sheet 133, the possibility of deformation of the protective member 13 when abutting against the support member 80 is reduced, which is conducive to improving the supporting effect of the support member 80. At the same time, it also reduces the possibility of marks appearing at the position where the protective member 13 abuts against the support member 80, thereby affecting the display effect of the display module 10.

[0180] The support member 80 supports the display module 10, which not only helps improve the stability of the display module 10 during installation, but also helps improve the impact resistance of the display module 10, thereby improving the overall reliability of the display module 10, reducing the possibility of damage to the display module 10 when the electronic device 100 collides or falls, and thus helps extend the service life of the display module 10. On the other hand, when the display module 10 is placed on the middle frame 30, when the protective member 13 abuts the support member 80, it means that the display module 10 has reached the preset installation position. Therefore, the support member 80 plays a role in installing and positioning the display module 10, thereby helping to improve the assembly accuracy between the display module 10 and the middle frame 30.

[0181] In other embodiments, the support member may be located in a space enclosed by the back cover and the middle frame. In the thickness direction of the electronic device, one end of the support member may abut against the protective member and the other end may abut against the back cover.

[0182] The number of the support member 80 can be one or more. Specifically, when the number of the support member 80 is one, the support member 80 can be set in the middle area of ​​the bottom wall 31 of the middle frame (such as Figure 29 ), to improve the support effect on the display module 10. When there are two support members 80 (not shown in the figure), the two support members 80 can be arranged at intervals along the width direction Y of the electronic device 100, or can be arranged at intervals along the length direction X of the electronic device 100. When there are multiple support members 80, the multiple support members 80 can be arranged at intervals along the circumference of the protective member 13.

[0183] like Figure 30 As shown, Figure 30 A schematic diagram shows another embodiment of the present application, in which the display module 10 is connected to the bottom wall 31 of the middle frame via a support member 80. In some embodiments, the support member 80 is arranged along the circumference of the protective member 13, that is, the support member 80 has an annular structure. This design helps increase the contact area between the support member 80 and the protective member 13, providing more uniform support for the display module 10, thereby improving the support effect of the support member 80 and, in turn, the reliability of the display module 10.

[0184] Along the thickness direction Z of the electronic device 100, the thickness D of the support member 80 satisfies the following conditions: 0.03mm≤D≤0.2mm. Specifically, the thickness D of the support member 80 can be 0.03mm, 0.04mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm or 0.2mm, and of course other values ​​within the above range are also possible. By limiting the size range of the support member 80, it is beneficial to improve the accuracy of its positioning of the display module 10 in the thickness direction Z of the protective member 13, thereby improving the assembly accuracy between the display module 10 and the middle frame 30. At the same time, it is also beneficial to improve the supporting effect of the support member 80 on the display module 10.

[0185] like Figure 31 As shown, Figure 31A schematic diagram showing another embodiment of the present application showing the display module 10 connected to the bottom wall 31 of the middle frame via a support member 80 is shown. The support member 80 includes a main body 81. The main body 81 plays a primary supporting role. In some embodiments, the main body 81 can be a single-layer structure. For example, the main body 81 can be a PET (polyethylene terephthalate) layer, a TPU (thermoplastic polyurethanes) layer, an ABS (acrylonitrile butadiene styrene) layer, or a PMMA (polymethyl methacrylate) layer. Taking the PET layer as an example, PET material has excellent mechanical properties, is easy to process and shape, and has good dimensional stability and chemical stability, thereby improving the reliability of the support member 80 and extending the service life of the support member 80. In the embodiment of the present application, the main body 81 may also be made of other materials that can play a supporting role, as long as the use requirements of the electronic device 100 are met.

[0186] In other embodiments, the main body 81 may be a multi-layer composite structure. For example, the main body 81 may be a composite of a PET layer and a TPU layer, so that the support member 80 can reliably support the display module 10 and improve the reliability of the display module 10.

[0187] like Figure 31 As shown, the support member 80 may further include adhesive portions 82 located on both sides of the main body portion 81. Along the thickness direction Z of the electronic device 100, one end of the main body portion 81 is bonded to the protective member 13 through the adhesive portion 82, and the other end is bonded to the bottom wall 31 of the middle frame through the adhesive portion 82. The support member 80 also plays a bonding role on the display module 10, which is beneficial to improve the stability of the connection between the display module 10 and the middle frame 30, that is, it improves the stability of the installation of the display module 10 to ensure that the display module 10 works normally and stably. In addition, during the glue injection process, when the display module 10 is placed in the middle frame 30, the display module 10 and the middle frame 30 can be pre-fixed by bonding the support member 80 to the display module 10.

[0188] Specifically, the support member 80 can be pre-set on the middle frame bottom wall 31 . When the display module 10 reaches a preset installation position, the display module 10 abuts against the support member 80 , thereby being bonded to the middle frame bottom wall 31 through the support member 80 .

[0189] In other embodiments, the bonding portion of the support member may be bonded to the back cover.

[0190] like Figure 32 As shown, Figure 32 FIG1 shows a schematic diagram of a bar phone provided by an embodiment of the present application. The electronic device 100 can be a bar phone. Figure 33 As shown, Figure 33 Shown Figure 32 Schematic diagram of the display panel 12 of the display module 10 for a mid-range phone after glue injection. For a display module 10 used in a bar phone, the glue 41 can be arranged along the circumference of the display panel 12, that is, the glue 41 is provided on all four peripheries of the display panel 12. This increases the effective area of ​​the glue 41, allowing the glue 41 to protect the entire periphery of the display panel 12, thereby improving the reliability of the display panel 12.

[0191] In some other embodiments, the colloid 41 may also be provided on both sides of the display panel 12, for example, the colloid 41 may be provided on both sides of the display panel 12 along the width direction Y of the electronic device 100, or the colloid 41 may be provided on both sides of the display panel 12 along the length direction X of the electronic device 100. This design is beneficial for protecting the display panel 12 while further saving the amount of colloid 41, thereby reducing the production cost of the electronic device 100.

[0192] like Figure 34 As shown, Figure 34 The schematic diagram of a foldable mobile phone provided by an embodiment of the present application in a folded state is shown. The above-mentioned electronic device 100 can be a foldable mobile phone. The foldable mobile phone has a first display module 10A. The first display module 10A can be the outer screen of the foldable mobile phone. When the mobile phone is in the folded state, the first display module 10A is located on the outside for the user to use. Specifically, the first display module 10A can be a screen without a folding function. Also refer to Figure 35 , Figure 35 Shown Figure 34 Schematic diagram of the display panel 10Aa of the first display module 10A of the foldable mobile phone after glue injection. For the first display module 10A, the glue 41 can be provided along the periphery of the first display panel 10Aa in the first display module 10A to protect the periphery of the first display panel 10Aa. Of course, depending on the usage requirements of the electronic device 100, the glue 41 can also be provided on both sides of the first display panel 10Aa along the width direction Y, or on both sides of the first display panel 10Aa along the length direction X.

[0193] like Figure 36 As shown, Figure 36The figure shows a schematic diagram of a foldable mobile phone provided by an embodiment of the present application in an unfolded state. The foldable mobile phone also has a second display module 10B, which can be the inner screen of the foldable mobile phone. Specifically, the second display module 10B can be a screen with a foldable function. When the mobile phone is in the unfolded state, the second display module 10B is also in the unfolded state for user use. Also refer to Figure 37 , Figure 37 Shown Figure 36 Schematic diagram of the display panel 10Ba of the second display module 10B of the foldable phone after glue injection. The second display module 10B can rotate about the rotation axis 51. The glue 41 can be placed on both sides of the second display panel 10Ba along the width direction Y, facing away from the rotation axis 51, to reduce the possibility of the glue 41 affecting the normal operation of the rotation axis 51, thereby facilitating the unfolding and folding of the phone.

[0194] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: a middle frame, the middle frame having middle frame side walls and a middle frame bottom wall connected to the middle frame side walls; a display module housed in the middle frame; The display module includes a display panel and a cover plate and a protective member connected to both sides of the display panel; a colloid is connected between the display panel and the side wall of the middle frame, and the colloid is located between the cover plate, the protective member and the side wall of the middle frame; The middle frame is provided with a glue injection hole and a glue outlet hole; The glue injection hole and the glue outlet hole are both connected to the glue injection space located between the cover plate, the protective member and the side wall of the middle frame; The glue injection hole and the glue outlet hole are provided on the bottom wall of the middle frame; The protective member is provided with a glue injection matching hole at a position corresponding to the glue injection hole, and the glue injection matching hole is connected to the glue injection hole; and; The protective member is provided with a glue outlet matching hole at a position corresponding to the glue outlet hole, and the glue outlet matching hole is communicated with the glue outlet hole.

2. The electronic device according to claim 1, wherein The colloid surrounds the display panel along a circumference of the display panel.

3. The electronic device according to claim 1, wherein The display module is fixedly connected to the side wall of the middle frame, and / or the display module is fixedly connected to the bottom wall of the middle frame.

4. The electronic device according to claim 3, wherein: A first adhesive member is provided between the protective member and the side wall of the middle frame and is arranged along the circumference of the protective member. The first adhesive member is connected to the protective member and the side wall of the middle frame.

5. The electronic device according to claim 4, characterized in that The side wall of the middle frame has a protrusion extending toward the interior of the middle frame; Along the thickness direction of the electronic device, the first adhesive component is arranged on a side of the raised portion facing the cover plate.

6. The electronic device according to any one of claims 1 to 5, characterized in that: There is a sealant arranged along the circumference of the cover plate between the cover plate and the side wall of the middle frame; The sealant is connected to the cover plate and the side wall of the middle frame, and the sealant blocks the gap between the cover plate and the side wall of the middle frame.

7. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device includes a support member; Along the thickness direction of the electronic device, one end of the support member is connected to the protective member, and the other end of the support member is connected to the bottom wall of the middle frame.

8. The electronic device according to claim 7, wherein: Along the thickness direction of the electronic device, the thickness D of the support member satisfies: 0.03 mm ≤ D ≤ 0.2 mm.

9. The electronic device according to claim 7, wherein: The support member includes a body portion; The material of the main body includes one or more of PET, TPU, ABS, and PMMA.

10. The electronic device according to claim 9, characterized in that The support member further includes bonding portions located on both sides of the main body portion; One end of the main body is bonded to the protective component through the bonding portion, and the other end is bonded to the bottom wall of the housing of the electronic device through the bonding portion.

11. The electronic device according to any one of claims 1 to 5, characterized in that: The guard comprises a rigid sheet of metal.

12. The electronic device according to claim 11, wherein: The protective member further includes a buffer portion; Along the thickness direction of the electronic device, one end of the buffer portion is connected to the display panel; and the other end is connected to the rigid metal sheet.

13. The electronic device according to claim 11, wherein: The cover plate includes an arc-shaped area; The rigid metal sheet is provided with a matching hole or a matching groove at a position corresponding to the arc-shaped area.

14. A method for assembling an electronic device, characterized in that: The electronic device includes a middle frame and a display module; the middle frame includes a middle frame side wall and a middle frame bottom wall connected to the middle frame side wall; the display module includes a display panel and a cover plate and a protective member located on both sides of the display panel; The electronic device assembly method includes: A glue injection hole and a glue outlet hole are provided on the middle frame; Placing the display module in the middle frame, and pre-fixing the display module and the middle frame; Connecting the glue injection pump to the glue injection hole so that the glue enters the glue injection space between the side wall of the middle frame, the cover plate and the protective member through the glue injection hole; The glue injection holes and glue outlet holes are provided in the middle frame specifically including: The glue injection hole and the glue outlet hole are provided on the bottom wall of the middle frame; A glue injection matching hole connected to the glue injection hole is provided on the protective part, and a glue discharge matching hole connected to the glue discharge hole is provided on the protective part.

15. The electronic device assembly method according to claim 14, wherein: Pre-fixing the display module to the middle frame specifically includes: The protective member is bonded to the side wall of the middle frame via a first adhesive member, and the first adhesive member is an annular structure.

16. The electronic device assembly method according to claim 14, wherein: After placing the display module in the middle frame and pre-fixing the display module and the middle frame, the electronic device assembly method further includes: Fill the gap between the side wall of the cover plate and the side wall of the middle frame with sealant.

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