Electro-visbreaking dismounting structure convenient to operate and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to an electric visbreaking dismounting structure convenient to operate and electronic equipment. The electro-induced visbreaking disassembly structure comprises a to-be-bonded piece, a conductive layer, an electro-induced visbreaking adhesive layer and a conductive structural piece. The conductive layer comprises a first bonding part and a first extension part, and the first bonding part is bonded with the non-conductive surface of the to-be-bonded piece; the first extension part at least partially extends out of the edge of one side of the to-be-bonded piece; the electric viscosity reducing adhesive layer is located on the side, away from the to-be-bonded piece, of the conductive layer, the electric viscosity reducing adhesive layer comprises a second bonding part and a second extending part, the second bonding part is bonded with the first bonding part, and the second extending part is bonded with the first extending part; the conductive structural member is located on the side, away from the conductive layer, of the electric viscosity reducing adhesive layer and adheres to the electric viscosity reducing adhesive layer, and the conductive structural member and the conductive layer are arranged in an insulated mode. The part to be bonded can be reliably bonded on the conductive structural part, and can be efficiently and conveniently disassembled.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field, especially a kind of electric viscosity reduction dismounting structure and electronic equipment of convenient operation. BACKGROUND

[0002] At present, the FPC or battery body of electronic equipment is mostly bonded on the main support structure of electronic equipment using double-sided adhesive tape or hot melt adhesive. It is required that the FPC or battery body is reliably bonded, and it is also required that disassembly is convenient. However, things are contradictory. The more reliable the bonding is, the more difficult the disassembly is, and the FPC or battery body is also prone to damage and other problems. For example, the main way to disassemble FPC on the market is: for double-sided adhesive bonding process, FPC is directly pulled and torn apart. For hot melt adhesive bonding process, FPC is first heated by high temperature and then disassembled using tools. The problem is that: it takes a long time to disassemble one electronic device, and the disassembly is unreliable, which is prone to tear FPC, and is not conducive to the reuse rate of FPC. In order to solve the contradictory problem of bonding and disassembly, we urgently need to find a solution that can not only ensure the reliability of FPC bonding, but also make disassembly more efficient and convenient. SUMMARY

[0003] The main purpose of the utility model is to provide a kind of electric viscosity reduction dismounting structure and electronic equipment of convenient operation, to guarantee that the components of electronic equipment can be reliably bonded and efficiently and conveniently disassembled.

[0004] To achieve the above-mentioned purpose, the utility model provides an electric viscosity reduction dismounting structure convenient to operate, comprising:

[0005] a to-be-bonded member, the bonding surface of the to-be-bonded member is a non-conductive surface;

[0006] a conductive layer, the conductive layer includes a first bonding portion and a first extension portion, the first bonding portion is bonded to the non-conductive surface of the to-be-bonded member, and the edge of the first bonding portion does not exceed the edge of the to-be-bonded member; the first extension portion is in conductive connection with the first bonding portion, and the first extension portion at least partially extends out of one side edge of the to-be-bonded member;

[0007] an electric viscosity reduction adhesive layer, the electric viscosity reduction adhesive layer is located on the side of the conductive layer away from the to-be-bonded member, the electric viscosity reduction adhesive layer includes a second bonding portion and a second extension portion, the second bonding portion is bonded to the first bonding portion, and the second extension portion is bonded to the first extension portion;

[0008] a conductive structural member, the conductive structural member is located on the side of the electric viscosity reduction adhesive layer away from the conductive layer and is bonded to the electric viscosity reduction adhesive layer, and the conductive structural member is insulated from the conductive layer.

[0009] Optionally, the edge of the conductive layer is arranged in alignment with the edge of the electrically reduced adhesive layer.

[0010] Optionally, the first adhesive part and the first extension part are in an integrated structure, and the second adhesive part and the second extension part are in an integrated structure.

[0011] Optionally, the thickness of the conductive layer is 50-80 μm.

[0012] Optionally, the thickness of the electrically reduced adhesive layer is 0.1-0.2 mm.

[0013] Optionally, the first extension part extends out of the shape of the to-be-adhered member in a semicircular shape, a square shape, a polygonal shape, or an arched door shape combined with a square shape and a semicircular shape.

[0014] Optionally, the area of the first extension part extending out of the to-be-adhered member is 3-4 mm 2 .

[0015] The utility model discloses a second aspect discloses an electronic equipment, including convenient operation's electrically induced reduced adhesive dismounting structure.

[0016] The technical scheme provided by the utility model can include the following beneficial effects:

[0017] In the convenient operation's electrically induced reduced adhesive dismounting structure provided by the utility model, the to-be-adhered member is adhered to the conductive structural member through the conductive layer and the electrically reduced adhesive layer. Wherein, the edge of the to-be-adhered member is extended through the first extension part of the conductive layer, and a conductive potential is formed, facilitating the conduction with one electrode of the external power supply. In addition, the first extension part is supported through the second extension part of the electrically reduced adhesive layer, the structural stability of the conductive layer is improved, and the first extension part is prevented from being arranged in suspension, thereby preventing the first extension part from deforming to contact the conductive structural member when conducting with one electrode of the external power supply, and thus preventing the electric field from being formed at the electrically reduced adhesive layer.

[0018] When the to-be-adhered member and the conductive structural member are disassembled, one electrode of the external power supply is connected to the side of the first extension part of the conductive layer away from the electrically reduced adhesive layer, so that the first adhesive part of the conductive layer is conducted with the external power supply. The other electrode of the external power supply is connected to the conductive structural member, so that the electric field is formed on the two adhesive surfaces of the electrically reduced adhesive layer, the randomly distributed movable charged particles in the electrically reduced adhesive layer are oriented and migrated under the action of the electric field, so that the adhesive surface of the electrically reduced adhesive layer rapidly undergoes electrochemical reaction under the existence of the electric field, the adhesion of the electrically reduced adhesive layer is reduced or disappears, that is, the electrically induced reduced adhesion is realized. This makes the peeling between the to-be-adhered member and the conductive structural member easy, so that the to-be-adhered member can be easily and quickly disassembled from the conductive structural member, the disassembly failure rate is reduced, the to-be-adhered member is disassembled without damage, and the reuse rate of the to-be-adhered member is improved.

[0019] It is worth noting that the distance between the conductive layer and the conductive structural component is only the thickness of the electro-adhesive layer, which poses a potential risk of electrical continuity between them. Therefore, in this solution, the conductive layer and the conductive structural component are insulated to prevent any electrical connection between the flexible circuit board and the conductive structural component. This eliminates the risk of electrical continuity between them due to the small gap between the conductive layer and the conductive structural component, and also prevents direct electrical connection between the conductive surface and the conductive structural component during disassembly, thus avoiding the inability to form an electric field. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is an exploded view of the electro-adhesive de-adhesion disassembly structure of this utility model;

[0022] Figure 2 This is a schematic diagram showing the bonding state between the conductive layer and the electro-adhesive layer of the electro-adhesive disassembly structure of this utility model.

[0023] Figure 3 This is a schematic diagram of the conductive layer of the electro-adhesive de-adhesion disassembly structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the electro-adhesive layer of the electro-adhesive disassembly structure of this utility model.

[0025] Explanation of icon numbers:

[0026] 1-Component to be bonded, 2-Conductive layer, 21-First bonding portion, 22-First extension portion, 3-Electro-reducing adhesive layer, 31-Second bonding portion, 32-Second extension portion, 4-Conductive structural component. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] The following is combined with Figures 1 to 4 The present invention describes an easy-to-operate electro-adhesive de-adhesive disassembly structure comprising a component to be bonded 1, a conductive layer 2, an electro-adhesive layer 3, and a conductive structural component 4.

[0032] The bonding surface of the component to be bonded 1 is a non-conductive surface. Specifically, the component to be bonded 1 is a component of an electronic device, which may include, but is not limited to, mobile phones, tablets, virtual reality devices, laptops, personal computers, super mobile personal computers, handheld computers, smart wearable devices, etc., having an FPC or battery body as a component to be bonded. Smart wearable devices may include, but are not limited to, smartwatches and smart bracelets. Specifically, taking a mobile phone as an example, the component to be bonded 1 can be an FPC, and the surface of the FPC is a non-conductive surface. Of course, in other embodiments, the component to be bonded 1 can also be a battery body.

[0033] The conductive layer 2 comprises a first adhesive part 21 and a first extension part 22, the first adhesive part 21 is adhered to the non-conductive surface of the to-be-adhered part 1, and the edge of the first adhesive part 21 does not exceed the edge of the to-be-adhered part 1; the first extension part 22 is in conductive connection with the first adhesive part 21, and the first extension part 22 at least partially extends out of one side edge of the to-be-adhered part 1; specifically, as shown in the structural schematic diagram of the conductive layer 2, the cross-sectional shadow area of the conductive layer 2 is only used as a distinguishing mark, the cross-sectional shadow area is the first adhesive part 21 of the conductive layer 2, and the rest is the first extension part 22 of the conductive layer 2. Figure 3 The conductive layer 2 comprises a first adhesive part 21 and a first extension part 22, the first adhesive part 21 is adhered to the non-conductive surface of the to-be-adhered part 1, and the edge of the first adhesive part 21 does not exceed the edge of the to-be-adhered part 1; the first extension part 22 is in conductive connection with the first adhesive part 21, and the first extension part 22 at least partially extends out of one side edge of the to-be-adhered part 1; specifically, as shown in the structural schematic diagram of the conductive layer 2, the cross-sectional shadow area of the conductive layer 2 is only used as a distinguishing mark, the cross-sectional shadow area is the first adhesive part 21 of the conductive layer 2, and the rest is the first extension part 22 of the conductive layer 2.

[0034] The electrically reduced adhesive layer 3 is located on the side, away from the to-be-adhered part 1, of the conductive layer 2, the electrically reduced adhesive layer 3 comprises a second adhesive part 31 and a second extension part 32, the second adhesive part 31 is adhered to the first adhesive part 21, and the second extension part 32 is adhered to the first extension part 22; specifically, the electrically reduced adhesive layer 3 is an existing electrically reduced adhesive body, the electrically reduced adhesive layer 3 is specifically a body whose adhesion is reduced or even disappears after being electrified, and the electrically reduced adhesive layer 3 has good adhesion performance in the case of not being electrified. In the application, the structure and composition of the electrically reduced adhesive body are not further described. Further, as shown in the structural schematic diagram of the electrically reduced adhesive layer 3, the cross-sectional shadow area of the electrically reduced adhesive layer 3 is only used as a distinguishing mark, the cross-sectional area is the second adhesive part 31 of the electrically reduced adhesive layer 3, and the rest is the second extension part 32 of the electrically reduced adhesive layer 3. Figure 4 The conductive layer 2 comprises a first adhesive part 21 and a first extension part 22, the first adhesive part 21 is adhered to the non-conductive surface of the to-be-adhered part 1, and the edge of the first adhesive part 21 does not exceed the edge of the to-be-adhered part 1; the first extension part 22 is in conductive connection with the first adhesive part 21, and the first extension part 22 at least partially extends out of one side edge of the to-be-adhered part 1; specifically, as shown in the structural schematic diagram of the conductive layer 2, the cross-sectional shadow area of the conductive layer 2 is only used as a distinguishing mark, the cross-sectional shadow area is the first adhesive part 21 of the conductive layer 2, and the rest is the first extension part 22 of the conductive layer 2.

[0035] The conductive structure part 4 is located on the side, away from the conductive layer 2, of the electrically reduced adhesive layer 3 and is adhered to the electrically reduced adhesive layer 3, and the conductive structure part 4 is arranged in insulation with the conductive layer 2. Wherein, the conductive structure part 4 is the main supporting structure of the electronic device, and specifically, the conductive structure part 4 is a middle frame of a mobile phone, and the conductive structure part 4 is made of a metal material capable of conducting electricity. The surface, to which the conductive structure part 4 is adhered to the electrically reduced adhesive layer 3, is capable of conducting electricity. One pole of an external power supply is connected to any position of the conductive structure part 4, so that the electric current can be conducted to the surface of the electrically reduced adhesive layer 3.

[0036] In the electrically reduced adhesive dismounting structure convenient to operate, the to-be-adhered part 1 is adhered to the conductive structure part 4 through the conductive layer 2 and the electrically reduced adhesive layer 3. Wherein, the first extension part 22 of the conductive layer 2 extends out of the edge of the to-be-adhered part 1, forms a conductive position, and is conducive to being in conductive connection with one electrode of the external power supply. In addition, the second extension part 32 of the electrically reduced adhesive layer 3 supports the first extension part 22, improves the structural stability of the conductive layer 2, avoids the first extension part 22 being arranged in suspension, and thus avoids the first extension part 22 from being deformed to contact the conductive structure part 4 when being in conductive connection with one electrode of the external power supply, so that the electric field cannot be formed at the electrically reduced adhesive layer 3.

[0037] When disassembling the component 1 to be bonded from the conductive structural component 4, one electrode of the external power supply is connected to the side of the first extension 22 of the conductive layer 2 away from the electro-adhesive layer 3, making the first adhesive portion 21 of the conductive layer 2 conductive with the external power supply. The other electrode of the external power supply is connected to the conductive structural component 4. For example, the conductive layer 2 is connected to the positive terminal of the external power supply, and the conductive structural component 4 is connected to the negative terminal of the external power supply. In this way, an electric field is formed on the two adhesive surfaces of the electro-adhesive layer 3, causing the randomly distributed mobile charged particles in the electro-adhesive layer 3 to migrate directionally under the action of the electric field. This causes the adhesive surface of the electro-adhesive layer 3 to undergo a rapid electrochemical reaction in the presence of the electric field, reducing or eliminating the adhesive force of the electro-adhesive layer 3, thus achieving electro-adhesive reduction. This makes the peeling between the component 1 to be bonded and the conductive structural component 4 easier, allowing the component 1 to be easily and quickly removed from the conductive structural component 4, reducing the failure rate of disassembly, achieving non-destructive removal of the component 1 to be bonded, and improving the reusability of the component 1 to be bonded.

[0038] It is worth noting that the distance between conductive layer 2 and conductive structural component 4 is only the thickness of the electro-adhesive layer 3, which poses a potential risk of circuit continuity between them. Therefore, in this design, conductive layer 2 and conductive structural component 4 are insulated to prevent circuitry between the flexible circuit board and conductive structural component 4. This solves the problem of potential circuitry between them due to the small distance between the conductive layer 2 and conductive structural component 4 (only the electro-adhesive layer 3 is present), and also prevents direct electrical connection between the conductive surface and conductive structural component 4 during disassembly, thus avoiding the formation of an electric field.

[0039] like Figure 2 In the specific embodiment shown, the conductive layer 2 is bonded to the electro-adhesive layer 3, with the edges of the conductive layer 2 aligned with the edges of the electro-adhesive layer 3. Specifically, the first bonding portion 21 and the second bonding portion 31 are both square in shape and the same size. The first extension portion 22 and the second extension portion 32 are both arched doorways composed of square and semi-circular shapes and the same size. When the conductive layer 2 is bonded to the electro-adhesive layer 3, the first bonding portion 21 and the second bonding portion 31 coincide in the thickness direction, and the first extension portion 22 and the second extension portion 32 coincide in the thickness direction. This ensures that the conductive layer 2 does not extend beyond the edge of the electro-adhesive layer 3, meaning that the surface of the conductive layer 2 closest to the conductive structural member 4 is completely covered by the electro-adhesive layer 3, achieving insulation between the conductive layer 2 and the conductive structural member 4 by the insulating electro-adhesive layer 3, thus achieving insulation between the conductive layer 2 and the conductive structural member 4. In addition, the edges of the conductive layer 2 and the electro-adhesive layer 3 are aligned to form an electric field on the surface of the electro-adhesive layer 3 as much as possible, so that the adhesive force of the electro-adhesive layer 3 can be weakened or failed over the entire area, so that the component to be bonded 1 can be completely disassembled from the conductive structural component 4.

[0040] Specifically, the first bonding part 21 and the first extending part 22 are in an integrated structure, and the second bonding part 31 and the second extending part 32 are in an integrated structure.

[0041] Optionally, the thickness of the conductive layer 2 is 50-80 μm. Specifically, the conductive layer 2 can be a layered structure formed by conductive glue, which can adhere to the to-be-bonded part 1 and has conductivity. In the embodiment, if the thickness of the conductive layer 2 is less than 50 μm, the conductive layer 2 has poor power-off effect, and if the thickness of the conductive layer 2 is greater than 80 μm, the thickness of the whole structure is prone to exceed the standard.

[0042] Optionally, the thickness of the electrically reduced adhesive layer 3 is 0.1-0.2 mm.

[0043] Optionally, the first extending part 22 extends out of the to-be-bonded part 1 in a semicircular shape, a square shape, a polygonal shape, or an arched door shape combined with a square shape and a semicircular shape.

[0044] Optionally, the area of the first extending part 22 extending out of the to-be-bonded part 1 is 3-4 mm 2 . Specifically, in one specific embodiment of the utility model, the first extending part 22 is in a square shape, and the area of the square shape is 2*2 mm.

[0045] The utility model also discloses an electronic equipment which comprises the convenient-to-operate electrically reduced adhesive dismounting structure.

[0046] Specifically, the to-be-bonded part 1 is a component of an electronic equipment, and the electronic equipment can include but is not limited to a mobile phone, a tablet computer, a virtual reality device, a notebook computer, a personal computer, an ultra-mobile personal computer, a handheld computer, a smart wearable device, and an electronic equipment with a to-be-bonded part such as an FPC or a battery. The smart wearable device can include but is not limited to a smart watch and a smart bracelet. Specifically, the utility model takes the mobile phone as an example, the to-be-bonded part 1 can be an FPC or a battery, the surfaces of the FPC and the battery are non-conductive surfaces, and the conductive structural part 4 is a mobile phone middle frame made of a metal material capable of conducting electricity. The surface of the conductive structural part 4 bonded to the electrically reduced adhesive layer 3 is capable of conducting electricity. One pole of an external power supply is connected to the conductive structural part 4 at any position, so that the current can be conducted to the surface of the electrically reduced adhesive layer 3.

[0047] In the electronic device, the to-be-bonded part 1 is bonded on the conductive structural part 4 through the conductive layer 2 and the electrically-reduced adhesive layer 3. The edge of the to-be-bonded part 1 is extended through the first extension part 22 of the conductive layer 2 to form a conductive position, so as to facilitate the conduction with one electrode of the external power supply. In addition, the first extension part 22 is supported through the second extension part 32 of the electrically-reduced adhesive layer 3, so as to improve the structural stability of the conductive layer 2 and avoid the first extension part 22 being suspended, thereby avoiding the deformation of the first extension part 22 to contact the conductive structural part 4 when the first extension part 22 is conducted with one electrode of the external power supply, and the electric field cannot be formed at the electrically-reduced adhesive layer 3.

[0048] When the to-be-bonded part 1 is disassembled from the conductive structural part 4, one electrode of the external power supply is connected to the side of the first extension part 22 of the conductive layer 2 away from the electrically-reduced adhesive layer 3, so that the first bonding part 21 of the conductive layer 2 is conducted with the external power supply. The other electrode of the external power supply is connected to the conductive structural part 4, so that the electric field is formed between the two adhesive surfaces of the electrically-reduced adhesive layer 3, so that the randomly distributed movable charged particles in the electrically-reduced adhesive layer 3 migrate directionally under the action of the electric field, so that the adhesive surface of the electrically-reduced adhesive layer 3 rapidly undergoes an electrochemical reaction in the presence of the electric field, so that the adhesion of the electrically-reduced adhesive layer 3 is reduced or disappears, that is, the electrically-reduced adhesion is realized. In this way, the peeling between the to-be-bonded part 1 and the conductive structural part 4 becomes easy, so that the to-be-bonded part 1 can be easily and quickly disassembled from the conductive structural part 4, the disassembly failure rate is reduced, the to-be-bonded part 1 is disassembled without damage, and the reuse rate of the to-be-bonded part 1 is improved.

[0049] It is worth noting that the spacing between the conductive layer 2 and the conductive structural part 4 is only the thickness of the electrically-reduced adhesive layer 3, and there is a risk of circuit conduction between the conductive layer 2 and the conductive structural part 4. Therefore, in the present scheme, the conductive layer 2 and the conductive structural part 4 are insulated, so as to prevent the flexible circuit board from being conducted with the conductive structural part 4, solve the problem that the spacing between the conductive layer 2 and the conductive structural part 4 is only the electrically-reduced adhesive layer 3, and avoid the direct conduction between the conductive surface and the conductive structural part 4 when disassembled.

[0050] The above only describes the preferred embodiments of the present application, and does not limit the patent range of the present application, and any equivalent structural transformation or direct / indirect application in other related technical fields within the concept of the present application is included in the patent protection range of the present application.

Claims

1. A convenient electro-adhesive de-adhesion disassembly structure, characterized in that, include: The parts to be bonded, wherein the bonding surface of the parts to be bonded is a non-conductive surface; A conductive layer, the conductive layer including a first adhesive portion and a first extension portion, the first adhesive portion being bonded to a non-conductive surface of the part to be bonded, and the edge of the first adhesive portion not extending beyond the edge of the part to be bonded; The first extension is electrically connected to the first adhesive portion, and the first extension extends at least partially beyond one edge of the part to be bonded; An electro-adhesive layer is located on the side of the conductive layer away from the part to be bonded. The electro-adhesive layer includes a second bonding portion and a second extension portion. The second bonding portion is bonded to the first bonding portion, and the second extension portion is bonded to the first extension portion. A conductive structural component is located on the side of the electro-adhesive layer away from the conductive layer and is bonded to the electro-adhesive layer. The conductive structural component is insulated from the conductive layer.

2. The convenient electro-adhesive de-adhesion disassembly structure according to claim 1, characterized in that, The edge of the conductive layer is aligned with the edge of the electro-adhesive layer.

3. The convenient electro-adhesive de-adhesion disassembly structure according to claim 1, characterized in that, The first adhesive portion and the first extension portion are integrally formed, and the second adhesive portion and the second extension portion are integrally formed.

4. The convenient electro-adhesive de-adhesion disassembly structure according to claim 1, characterized in that, The thickness of the conductive layer is 50-80 μm.

5. The convenient electro-adhesive de-adhesion disassembly structure according to claim 1, characterized in that, The thickness of the electro-adhesive layer is 0.1~0.2mm.

6. The convenient electro-adhesive de-adhesion disassembly structure according to claim 1, characterized in that, The first extension extends out to form the shape of the part to be bonded, which is semi-circular, square, polygonal, or an arched doorway combining square and semi-circular shapes.

7. The convenient electro-adhesive de-adhesion disassembly structure according to claim 6, characterized in that, The first extension extends 3-4 mm beyond the area of ​​the part to be bonded. 2 .

8. An electronic device, characterized in that: Includes the easy-to-operate electro-adhesion disassembly structure as described in any one of claims 1-7.

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