Reconfigurable intelligent surface using ferroelectric materials

Abstract

A reconfigurable smart surface is disclosed. This reconfigurable smart surface includes a ferroelectric layer. Applying a voltage to the ferroelectric layer changes the dielectric constant of the reconfigurable smart surface. This allows the signal to be reflected to be modulated in a continuous manner by changing the voltage. The reconfigurable smart surface can be a panel comprising multiple cells arranged to reflect and modulate the incident signal.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to reconfigurable smart surfaces. More specifically, at least some embodiments of the present invention relate to systems, hardware, software, computer-readable media, and methods for reconfigurable smart surfaces comprising ferroelectric materials. Background Technology

[0002] Cellular wireless communication is primarily based on 5G technology. 5G wireless networks aim to provide gigabit-level data speeds, low latency, and an improved user experience. These goals have largely been achieved. However, the telecommunications industry is now striving to deliver sixth-generation (6G) wireless communication.

[0003] Current radio frequency (RF) bands (5G bands) are largely saturated. Therefore, the next logical step is to utilize higher frequency bands with lower saturation. However, this approach presents new challenges. For example, higher frequencies correspond to shorter wavelengths. Signals at these frequencies can be adversely affected by physical barriers such as buildings, vehicles, and trees. Physical barriers can absorb, reflect, or scatter these high-frequency signals. Consequently, these high-frequency signals may suffer attenuation in free space. Furthermore, establishing numerous transceiver points for line-of-sight communication seems impractical.

[0004] A recent potential solution involves reconfigurable intelligent surfaces (RIS) or intelligent reflective surfaces (IRS). Reconfigurable intelligent surfaces are complex components composed of hundreds, sometimes even thousands, of individual metamaterial unit cells. Currently, most of these units require components such as PIN diodes, varactor diodes, and / or switches to operate effectively. However, the binary nature of each switch or diode (on / off) presents limitations. The existence of two states inevitably restricts the possible phase outcomes of the signal.

[0005] Besides limitations on phase results, current reconfigurable smart surface technologies face other challenges. For example, conventional techniques require receiving, active processing (e.g., amplify and forward (AF), decode and forward (DF)), and retransmitting the signal. Signal processing can negatively impact signal quality. For instance, AF may amplify noise, and DF may introduce decoding errors. Furthermore, at least due to the requirements of processing and amplification (e.g., power), AF and DF cannot be easily integrated into existing infrastructure such as building walls or billboards.

[0006] Traditional RIS (Resonance Induction) technology involves the use of PIN diodes / varactor diodes. PIN diodes and varactor diodes are widely used in radio frequency (RF) applications due to their switching and tuning capabilities. However, some characteristics limit their effectiveness in millimeter-wave (mmWave) applications. As the operating frequency increases, parasitic capacitances and inductances associated with device layout become more pronounced. These parasitic elements can resonate with the diode's junction capacitance, leading to a significant performance degradation and limiting the overall operating bandwidth. Both PIN diodes and varactor diodes have a maximum operating frequency, and their performance degrades sharply when the frequency exceeds this maximum operating frequency.

[0007] PIN diodes are commonly used to achieve reconfigurable properties in reconfigurable smart surfaces because they can function as variable resistors or switches when controlled by a bias current. This allows for a degree of control over the electromagnetic response of each component. However, the reconfigurability achieved using PIN diodes has certain limitations.

[0008] For example, a common application of PIN diodes in reconfigurable smart surfaces involves using them as binary switches. In this role, a PIN diode can only provide two phase states (e.g., 0° and 180°). This binary control limits the accuracy of phase tuning, which in turn limits the resolution of beamforming and wavefront shaping.

[0009] PIN diodes also require bias current to change their state and actively dissipate power. This power consumption can be a problem, especially in large-scale reconfigurable smart surface systems that include a large number of PIN diodes or varactor diodes.

[0010] Secondly, in the active state, PIN diodes operate in a nonlinear region. This can cause signal distortion through them, especially at high power levels. This distortion degrades signal quality and reduces the effectiveness of reconfigurable smart surfaces.

[0011] Furthermore, the speed at which a PIN diode can switch states (and therefore the speed at which RIS can be reconfigured) is determined by the carrier lifetime in the diode. While this is generally fast enough for many applications, there are many high-speed scenarios where this switching speed is insufficient.

[0012] Implementing PIN diodes on a reconfigurable smart surface introduces additional design complexity and cost, as each diode requires its own bias network. Furthermore, the fact that each diode needs individual control to achieve the desired global effect can lead to challenges in terms of control complexity and efficiency.

[0013] As the transition to higher frequencies that may be used in applications such as 6G progresses, the physical size of these components and circuits becomes a significant factor. Designing compact integrated circuits with PIN diodes or varactor diodes that can operate at millimeter-wave frequencies can be challenging. Attached Figure Description

[0014] To describe how at least some advantages and features of the present invention can be obtained, embodiments of the invention will be described in more detail with reference to the accompanying drawings. It should be understood that these drawings depict only typical embodiments of the invention and should not be considered as limiting its scope. Embodiments of the invention will be described and explained more specifically and in detail using the drawings, wherein:

[0015] Figure 1A Several aspects of a top perspective view of a cell with a reconfigurable smart surface having a variable dielectric constant are disclosed;

[0016] Figure 1B It was made public. Figure 1A A bottom-view perspective view of the unit in the image;

[0017] Figure 1C It was made public. Figure 1A Multiple aspects of the cross-sectional view of the unit;

[0018] Figure 1D Several aspects of the panel, including multiple units arranged in a grid, have been disclosed;

[0019] Figure 2 Several aspects of the relative reflection phase of reconfigurable smart surfaces are disclosed;

[0020] Figure 3 Several aspects of beam manipulation using reconfigurable smart surfaces have been disclosed;

[0021] Figure 4 Several aspects of deploying panels or reconfigurable smart surfaces in an environment have been disclosed;

[0022] Figure 5 Several aspects of deploying panels or reconfigurable smart surfaces in another environment have been disclosed;

[0023] Figure 6 Several aspects of methods for deploying and operating panels or reconfigurable smart surfaces are disclosed; and

[0024] Figure 7 Multiple aspects of the computing device, system, or entity have been disclosed. Detailed Implementation

[0025] Embodiments of the present invention generally relate to reconfigurable smart surfaces (RIS). More specifically, at least some embodiments of the present invention relate to systems, hardware, software, computer-readable media, and methods for using reconfigurable smart surfaces to reflect / transmit electromagnetic signals or waves.

[0026] Reconfigurable smart surfaces, or smart reflective surfaces (IRS), are examples of metasurfaces that can manipulate or control the direction, phase, amplitude, and / or polarization of incident electromagnetic waves or signals. Reconfigurable smart surfaces are typically components composed of hundreds or thousands (or more) of individual metamaterial units.

[0027] Embodiments of the present invention relate to reconfigurable smart surfaces incorporating ferroelectric materials, such as barium strontium titanate (BST). Reconfigurable smart surfaces with BST in the cell allow the cell to be individually tuned and allow for variable or continuous phase shifts in the reflected signal. Embodiments of the present invention are not limited to a discrete set of possible reflection directions, but can reflect signals continuously. Embodiments of the present invention relate to a reconfigurable smart surface that can use ferroelectric materials to provide continuous phase shifts.

[0028] Embodiments of the present invention relate to a reflective surface configured to operate on electromagnetic signals. The embodiments of the present invention are discussed in the context of millimeter (mm) wave signals (e.g., 30 GHz to 300 GHz or 10 mm to 1 mm), but are not limited to signals or waves at these frequencies. Embodiments of the present invention can also be used for signals in the 5G-FR1 and 5G-FR2 bands. However, embodiments of the present invention can operate at other frequencies besides 5G and 6G frequencies. Embodiments of the present invention are applicable to wireless signals in wireless networks, cellular wireless networks, etc.

[0029] In one example, a reconfigurable smart surface can be embodied as a panel comprising multiple individually controllable cells. The panel can be manufactured such that the cells are monolithically formed within the panel. The reconfigurable smart surface is constructed with a ferroelectric material, such as barium strontium titanate (BST), and is configured or controlled to reflect incident signals. This reflection can be controlled or modulated in a continuous manner. Therefore, the panel is reconfigurable because the direction of reflection can be controlled.

[0030] In one implementation, the reconfigurable smart surface comprises multiple cells arranged, for example, in a grid or array configuration. The phase response of each cell can be customized to compensate for different spatial lengths from a feed source (e.g., a signal source), thereby achieving constructive interference in the desired direction.

[0031] During manufacturing, BST or other ferroelectric materials are seamlessly integrated into each unit to create a monolithic structure, such as a panel. Because there is no interconnection between the tuning and reflecting elements, integrating BST in this way allows for high operating frequencies. Furthermore, it eliminates the need for soldering or wire bonding.

[0032] Thin-film beamforming stents (BSTs) achieve variable dielectric constants in a monolithic structure. More specifically, changing the voltage across or applied to the ferroelectric layer alters the dielectric constant of the cell. Therefore, the phase of the reflected signal from each cell can be controlled. In other words, individual control of the phase applied to each cell is achieved by selectively modulating the voltage supplied to the BST layer. The BST's response time is in the nanosecond range, enabling rapid beam scanning and facilitating a variety of beamforming applications.

[0033] Figure 1A , Figure 1B and Figure 1C The unit was presented from different perspectives, revealing multiple aspects of the unit. Figure 1A A top-down perspective view of the unit has been released. Figure 1B Several aspects of the unit's bottom perspective view have been disclosed. Figure 1C Several aspects of the cross-sectional view of the element are disclosed.

[0034] Figures 1A-1C Unit 100 is shown. Figures 1A-1C Unit 100 illustrates various layers of units that may be included in a reconfigurable smart surface. (Reference) Figure 1C Cell 100 includes a top metal layer 102, a ferroelectric layer 104, a substrate layer 106, a ground metal layer 108, a substrate 110, and a bias layer 116. Substrates 108 and 110 are separated by the ground metal layer 108. Substrates 106 and 110 can be formed using different materials. Example materials for substrates 106 and 110 include silicon (Si) and FR4 (a printed circuit board material that may include epoxy resin and glass composites), glass, sapphire, quartz, Rogers RF, etc. In a particular cell, substrates 106 and 110 can be formed from the same or different materials.

[0035] A ferroelectric layer 104 is disposed between the top metal layer 102 and the substrate 106. In one example, the ferroelectric layer 104 of the cell 100 does not completely cover the top surface of the substrate 106. The length and width dimensions of the ferroelectric layer 104 are smaller than the length and width dimensions of the substrate 106. When the cells are arranged in a panel (or fabricated as a panel), the ferroelectric layers of the individual cells are isolated from each other and do not contact each other.

[0036] More specifically, during the manufacturing process, a uniform thin layer 104 of ferroelectric material BST is deposited on the top substrate 106 using techniques such as pulsed laser deposition (PLD), chemical solution deposition (CSD), metal-organic chemical vapor deposition (MOCVD), and RF magnetron sputtering. The ferroelectric layer 104 is then patterned and etched to form square patches in each cell 100 of the reconfigurable smart surface.

[0037] On the square patch of the ferroelectric material (ferroelectric layer 104), a layer of copper or other suitable material or metal is formed. This layer is selectively patterned and etched to form a top metal layer 102. The shape of the metal layer 102 can vary. Figure 1A A top metal layer 102 with a cross or "X" shape is shown. Typically, the metal layer 102 is configured to have a shape that causes the metal layer 102 to resonate with the incident signal or electromagnetic wave of interest.

[0038] More generally, the size of unit 100 can be designed to operate within the expected frequency range.

[0039] Cell 100 also includes a via 112. The via 112 connects a bias pad 114 to the ferroelectric layer 104. The bias pad 114, which is part of the bias layer 116 and can be formed using patterning and etching techniques, allows voltage to be placed across or applied to the ferroelectric layer 104. V+ is connected to one of the bias pads 114, and V- is connected to the other of the bias pads 114.

[0040] The reflective properties of cell 100 depend on the excitation mode, the physical parameters of the patch or ferroelectric layer 104, and the dielectric properties of the ferroelectric layer 104 and / or the substrate 106. Applying a voltage across the ferroelectric layer 104 and changing the voltage across the ferroelectric layer 104 can change the dielectric constant of the ferroelectric layer 104. This allows the dielectric constant of cell 100 to be variable. By changing the dielectric constant of the ferroelectric layer 104, the phase of the reflected signal can be continuously controlled. Therefore, the resonant frequency and reflection phase of the control unit can be controlled. Therefore, embodiments of the present invention relate to continuously tunable cells and reconfigurable smart surfaces. This allows control of the phase of the reflected signal and allows control of the direction in a continuous manner.

[0041] In contrast, using PIN diodes or varactor diodes limits the ability to determine the phase of the reflected signal, resulting in limited phase states and limited beam direction.

[0042] Figure 1D Several aspects of panels or reconfigurable smart surfaces comprising multiple units have been disclosed. Figure 1DA monolithic panel 150 is shown. More specifically, a top view 152 of panel 150 shows individual units arranged in a grid pattern that can have any desired size. In one example, panel 150 may have a square configuration. However, panel 150 may have a rectangular configuration. Embodiments of the invention are not limited to these geometries and may be circular, elliptical, or other asymmetrical shapes. Furthermore, the geometry of the units in panel 150 can vary depending on the available deployment space. Top view 152 shows that the ferroelectric layer and top metal layer of each unit are separated from each other.

[0043] Bottom view 154 shows each cell associated with a bias pad 114. The bias pad 114 allows the voltage of each cell to be controlled independently of the voltage applied to other cells.

[0044] By controlling the voltage applied to each cell of panel 150, the dielectric constant of the ferroelectric layer is tuned to its paraelectric behavior. This allows for a variable dielectric constant. Therefore, the resonant frequency and reflection phase of each cell can be continuously and independently controlled, thus giving panel 150 a combined effect of beam modulation.

[0045] Therefore, by controlling the dielectric constant of each cell in the control panel 150, the panel 150 can be used to reflect incident electromagnetic waves to the desired direction.

[0046] In one example, a full-wave electromagnetic simulation was performed using a commercial finite element modeler electromagnetic simulation application to observe the effect of changing the dielectric constant value on element performance. In this example, the dielectric constant was varied from 220 to 380 for an electric field variation of 0 to 18 V / μm. Element analysis was performed for a normal incident angle in this example. This analysis was conducted by varying the dielectric constant of the ferroelectric layer from 220 to 380 in steps of 20.

[0047] Figure 2 Several aspects of the experiment are disclosed. Graph 202 shows the reflection phase and amplitude variations of the cell. In this example, the substrate is silicon and the top metal layer is copper. Graphs 202 and 204 show the reflection phase and amplitude variations of the cell assuming a silicon substrate, a copper top metal layer, and a BST ferroelectric layer. As the voltage across the BST layer increases, the dielectric constant changes from 220 to 380, and the resonant frequency shows a change of approximately 1 GHz. Graph 202 shows curve 210 associated with a dielectric constant of 380, while curve 212 is associated with a dielectric constant of 220. Similarly, curves 214 and 216 are associated with dielectric constants of 380 and 220, respectively. Other curves correspond to dielectric constants whose values ​​are between 220 and 380.

[0048] Graphs 206 and 208 show the reflection phase variation as the dielectric constant changes. Graph 206 is associated with a silicon substrate, and graph 208 is associated with an FR4 substrate. A relatively tunable phase of 360° can be observed when using a silicon substrate, while a reduced phase tunability of approximately 168° can be observed when using an FR4 substrate.

[0049] Figure 3 Several aspects of tunable reconfigurable smart surfaces have been disclosed. Figure 3 Eight different reflections 302 obtained with a panel (e.g., panel 150) for an incident beam perpendicular to the surface are shown. However, since the voltage applied to the ferroelectric layer can be varied in a continuous manner, the direction of the reflected beam or signal can also be varied continuously. This allows the beam to be reflected in a specific direction and allows the reflection direction to be changed by simply altering the voltage applied to the ferroelectric layer of the cells in the panel.

[0050] Reconfigurable smart surfaces can be constructed to extend the coverage of wireless networks. They allow incident signals to be reflected around obstacles to areas where direct transmission is less than ideal.

[0051] Figure 4 Several aspects of regulating signals in an environment have been disclosed. Figure 4 An indoor environment 400 is illustrated, such as a physical work environment (e.g., a building). Indoor environment 400 may be filled with numerous obstructions, including walls, furniture, and appliances, which may block or reduce wireless signals, such as millimeter-wave signals, as exemplified only. Reconfigurable smart surfaces (such as panels) can be strategically mounted on walls, ceilings, or other surfaces and can be used to reflect and modulate these signals toward selected areas or locations. Figure 4 As shown, the reconfigurable smart surface can receive signals from an indoor access point and redirect those signals to areas where the signal from the gateway 402 or router is weak or absent. Embodiments of this invention can be used in multi-story buildings to direct signals to higher or lower floors.

[0052] Reconfigurable smart surfaces not only improve coverage but also enhance the security of wireless communications. By selectively guiding signals, the possibility of eavesdropping is reduced. Reconfigurable smart surfaces can add an additional layer of physical security by creating secure transmission areas where only intended receivers can intercept signals. Passive beamforming from reconfigurable smart surfaces improves energy efficiency by reducing wasted signal scattering and guiding signals only where needed. Embodiments of the invention can be extended to smart homes, where reconfigurable smart surfaces can intelligently direct signals toward connected devices such as smart speakers, smart TVs, IoT sensors, etc., even when these devices are located in hard-to-reach areas.

[0053] More specifically, a wireless network can be established, and it includes an access point 402 for environment 400. Embodiments of the invention use a panel comprising multiple units to modulate or direct signals. For example, panels 404, 406, 408, and 410 can be placed at various locations within environment 400 (other panels are also shown). To provide wireless network coverage in room 412 where signals cannot be received from gateway 402, signals transmitted by gateway 402 are sent to panel 404. Panel 404 includes units configured to direct or reflect signals to panel 406. Panel 406 is configured to direct or reflect signals to panel 408. Panel 408 is configured to direct or reflect signals to panel 410.

[0054] Panel 410 can be configured to guide or reflect signals in multiple directions using, for example, different unit configurations, such that signals can be directed to multiple user equipment 414 (e.g., (or received by it) to provide wireless coverage to user equipment or other devices in room 412 or other locations. The wireless path back to access point 402 can be constructed similarly and can use the same panels. However, movement of user equipment may result in different paths using different panel groups.

[0055] Figure 5 Several aspects of an environment in which reconfigurable smart surfaces can be deployed have been disclosed. Figure 5 An outdoor environment 500, such as a highway or road, is illustrated. In this example, base station 502 can broadcast signals that can be redirected by panels placed in environment 500. In this example, panels 504, 506, and 508 can be placed on overhead signs, lampposts, road signs, etc. This allows signals to be redirected or reflected to provide coverage in environment 500. Vehicle-to-vehicle (V2V) communication can be realized using embodiments of the invention. V2V and autonomous vehicles benefit from high-speed, reliable, and low-latency wireless communication. Millimeter wave technology is considered a potential enabler for these vehicle communication applications due to its high data rates. However, as previously mentioned, the propagation characteristics of millimeter wave signals can be a limiting factor.

[0056] like Figure 5As shown, panels can be deployed in specific locations to reflect or refract millimeter-wave signals toward intended vehicles (or vehicles in a specific area), thereby increasing signal strength and improving the quality of vehicle-to-vehicle communication. Using reconfigurable smart surfaces to enhance coverage is beneficial in vehicular networks because vehicles may frequently enter and exit coverage areas. Extending millimeter-wave signal coverage using reconfigurable smart surfaces requires fewer base stations and access points. Reconfigurable smart surfaces can support Vehicle-to-Everything (V2X) communication, which involves communication between vehicles and any entities that may affect them, such as pedestrians, roadside infrastructure, or networks.

[0057] Figure 6 Several aspects of a method for redirecting signals or electromagnetic waves in an environment are disclosed. Method 600 may include deploying and operating panel 602 (or multiple panels) in an environment or network. When deploying the panel, the panel may be selected or constructed based on one or more frequencies of the environment. For example, the construction of the top metal layer of the cell may be selected based on expected frequencies in the environment. As previously described, the top metal layer of the cell is constructed to resonate with certain frequencies.

[0058] Deploying and operating the 602 panel may also include connecting the panel to a power source (e.g., connecting each unit of the panel to a DC (direct current) power source). Each panel may also be connected to or include a controller or computing device. The controller or computing device may be local, cloud-based, etc. This allows for remote configuration or reconfiguration of the panel.

[0059] The various aspects of method 600 can be performed individually or as needed. Once the panel is deployed and operational, no further changes are required immediately. In one implementation, the panel may need to be refactored. Because the panel can be redirected in a continuous manner, the required control direction may change due to environmental changes, operational failures of other panels, etc. If refactoring is required ("Yes" at 604), the panel is refactored and operation continues at 606. If refactoring is not required ("No" at 604), the panel continues operation at 608.

[0060] The panels can be arranged in different ways. For example, the cells of a particular panel can be configured to guide incident signals in multiple directions (e.g., using a portion of the cells for each direction). Alternatively, multiple panels can be used—each panel for a desired modulation or reflection direction.

[0061] It should be noted that embodiments of the present invention, whether or not claimed, cannot be actually performed in human thought or otherwise. Therefore, nothing herein should be construed as teaching or suggesting that any aspect of any embodiment of the invention can be actually performed in human thought or otherwise. Furthermore, unless otherwise expressly stated herein, the disclosed methods, processes, and operations are contemplated for implementation by a computing system that may include hardware and / or software. That is, these methods, processes, and operations are defined as computer-implemented.

[0062] The following is a discussion of several aspects of example operating environments for various embodiments of the present invention. This discussion is not intended to limit the scope of the invention or the applicability of the embodiments in any way.

[0063] Generally, embodiments of the present invention can be implemented in combination with systems, software, and components that individually and / or collectively implement and / or cause signal processing operations, wireless coverage operations, signal modulation or reflection operations, wireless coverage operations, etc. More generally, the scope of the present invention includes any operating environment in which the disclosed concepts may be useful.

[0064] It should be noted that any operation of any method disclosed herein can be performed in response to, due to, and / or based on the execution of any prior operation. Accordingly, for example, the execution of one or more operations can be a prerequisite or trigger for the subsequent execution of one or more additional operations. Thus, for example, various operations that can constitute a method can be linked together or otherwise associated with each other through relationships such as those described in the examples just mentioned. Finally, although not required, in some embodiments, the various operations constituting the various example methods disclosed herein are executed in the specific order described in those examples. In other embodiments, the various operations constituting the disclosed method may be executed in an order different from the specific order described herein.

[0065] The following are some other exemplary embodiments of the present invention. These embodiments are presented by way of example only and are not intended to limit the scope of the invention in any way.

[0066] Embodiment 1. A unit comprising: a bias layer; a first substrate formed on the bias layer; a ground layer formed on the first substrate; a second substrate formed on the ground layer; a ferroelectric layer formed on the second substrate; a metal layer formed on the ferroelectric layer; and a first via and a second via electrically connecting the ferroelectric layer to the bias layer, wherein the bias layer is configured such that a voltage can be applied to the ferroelectric layer through the first via and the second via.

[0067] Embodiment 2: The unit as described in Embodiment 1, wherein the first substrate comprises silicon or FR4, and wherein the second substrate comprises silicon, FR4, glass sapphire, quartz, or Rogers RF.

[0068] Implementation 3: The unit as described in Implementation 1 and / or 2, wherein the bias layer and the ground layer comprise metal or are made of metal.

[0069] Embodiment 4: The unit as described in Embodiments 1, 2 and / or 3, wherein the ferroelectric layer covers only a portion of the top surface of the second substrate.

[0070] Embodiment 5: The unit as described in Embodiments 1, 2, 3 and / or 4, wherein the ferroelectric layer comprises barium strontium titanate, BaTiO3, PbTiO3, lead zirconium titanate, triglycine sulfate, PVDF, or lithium tantalate.

[0071] Embodiment 6: The unit as described in Embodiments 1, 2, 3, 4 and / or 5, wherein the metal layer is shaped to resonate over a frequency range.

[0072] Implementation method 7: The unit as described in implementation methods 1, 2, 3, 4, 5 and / or 6, wherein the frequency range is greater than 30 GHz, greater than 35 GHz, less than 30 GHz, or between 30 GHz and 300 GHz.

[0073] Embodiment 8: The unit as described in Embodiments 1, 2, 3, 4, 5, 6 and / or 7, wherein the bias layer includes a first bias pad connected to a first side of the ferroelectric layer through the first through-hole and a second bias pad connected to a second side of the ferroelectric layer through the second through-hole.

[0074] Embodiment 9: The unit as described in Embodiments 1, 2, 3, 4, 5, 6, 7 and / or 8, wherein the dielectric constant of the ferroelectric layer varies according to the voltage applied across the ferroelectric layer using the first bias pad and the second bias pad.

[0075] Embodiment 10: The unit as described in Embodiments 1, 2, 3, 4, 5, 6, 7, 8 and / or 9, wherein a 360-degree relative tunable phase is achieved in the signal reflected by the unit by controlling the voltage applied to the ferroelectric layer.

[0076] Implementation 11: The unit as described in Implementations 1, 2, 3, 4, 5, 6, 7, 8, 9 and / or 10, wherein, by controlling the voltage, the signal reflected by the unit can be modulated to a specified direction.

[0077] Embodiment 12: A panel comprising: a plurality of units arranged in a grid pattern, wherein each unit comprises: a bias layer; a first substrate formed on the bias layer; a ground layer formed on the first substrate; a second substrate formed on the ground layer; a ferroelectric layer formed on the second substrate; a metal layer formed on the ferroelectric layer; and a first via and a second via electrically connecting the ferroelectric layer to the bias layer, wherein the bias layer is configured such that a voltage can be applied to the ferroelectric layer through the first via and the second via.

[0078] Embodiment 13: The panel as described in Embodiment 12, wherein the first substrate comprises silicon, FR4, glass sapphire, quartz, or Rogers RF, wherein the second substrate comprises silicon, FR4, glass sapphire, quartz, or Rogers RF, wherein the bias layer and the ground layer comprise metal or are metallic, and wherein the ferroelectric layer covers only a portion of the top surface of the second substrate.

[0079] Embodiment 14: A panel as described in Embodiments 12 and / or 13, wherein the ferroelectric layer comprises barium strontium titanate, BaTiO3, PbTiO3, lead zirconium titanate, triglycine sulfate, PVDF, or lithium tantalate.

[0080] Embodiment 15: A panel as described in Embodiments 12, 13 and / or 14, wherein the metal layer is shaped to resonate with a frequency range, wherein the frequency range is greater than 30 GHz, greater than 35 GHz, greater than 40 GHz, or between 30 GHz and 300 GHz.

[0081] Embodiment 16: A panel as described in Embodiments 12, 13, 14 and / or 15, wherein the bias layer includes a first bias pad connected to a first side of the ferroelectric layer through a first via and a second bias pad connected to a second side of the ferroelectric layer through a second via, and wherein the dielectric constant of the ferroelectric layer varies according to the voltage applied across the ferroelectric layer using the first bias pad and the second bias pad.

[0082] Embodiment 17: A panel as described in Embodiments 12, 13, 14, 15 and / or 16, wherein a 360-degree relative tunable phase is achieved in the signal reflected by the panel by controlling the voltage applied to both ends of the ferroelectric layer of the unit, and wherein the signal reflected by the panel can be modulated to a specified direction by controlling the voltage.

[0083] Implementation 18, a method for modulating a signal, the method comprising: operating a panel in an environment, the panel including a plurality of units; determining the direction of the modulating signal, wherein the signal is received from a base station, an access point, or a different panel; and applying a voltage to each of the units such that the signal is reflected in the determined direction, wherein each of the units is configured to be independently controlled, and wherein the voltage applied to each of the units alters the dielectric properties of the unit.

[0084] Implementation 19, the method as described in Implementation 18, further includes reconstructing the panel by applying different voltages to the plurality of units.

[0085] Embodiment 20, the method as described in Embodiments 18 and / or 19, wherein each of the units comprises: a metal bias layer; a first substrate formed on the bias layer; a metal ground layer formed on the first substrate; a second substrate formed on the ground layer; a ferroelectric layer formed on the second substrate; a metal layer formed on the ferroelectric layer, wherein the metal layer is configured to resonate with a signal having a frequency between 30 GHz and 300 GHz; and electrically connecting the ferroelectric layer to a first via and a second via of the bias layer, wherein the bias layer is configured such that the voltage can be applied to the ferroelectric layer through the first via and the second via.

[0086] Implementation 21: A non-transitory storage medium storing instructions that can be executed by one or more hardware processors to perform operations including any or more of the operations disclosed herein.

[0087] The embodiments disclosed herein may include the use of a dedicated or general-purpose computer, which includes various computer hardware or software modules, as discussed in more detail below. The computer may include a processor and a computer storage medium carrying instructions that, when executed by the processor and / or causing the processor to execute the instructions, perform any or more of the methods disclosed herein, or any one or more portions of any of the disclosed methods.

[0088] By way of example, and not limitation, such computer storage media may include hardware memory such as solid-state drives (SSDs), RAM, ROM, EEPROM, CD-ROM, flash memory, phase-change memory (“PCM”), or other optical disk storage, magnetic disk storage, or other magnetic storage devices, or any other hardware storage device that can be used to store program code in the form of computer-executable instructions or data structures that can be accessed and executed by general-purpose or special-purpose computer systems to perform the functions disclosed herein. Combinations of the above should also be included within the scope of computer storage media. These media are also examples of non-transitory storage media, and non-transitory storage media also include cloud-based storage systems and architectures, although the scope of the invention is not limited to these examples of non-transitory storage media.

[0089] Computer-executable instructions include, for example, instructions and data that, when executed, cause a general-purpose computer, a special-purpose computer, or a special-purpose processing device to perform a function or a set of functions. Therefore, some embodiments of the present invention can be downloaded, for example, from a website, mesh topology, or other source to one or more systems or devices. Similarly, the scope of the present invention includes any hardware system or device that includes instances of an application program containing the disclosed executable instructions.

[0090] As used herein, the terms “module,” “component,” “engine,” “agent,” “service,” etc., can refer to software objects or routines that execute on a computing system. These can be implemented as objects or processes that execute on a computing system, for example, as independent threads. Although the systems and methods described herein can be implemented in software, implementation in hardware or a combination of software and hardware is also feasible and contemplated. In this invention, a “computing entity” can be any computing system as defined herein, or any module or combination of modules running on a computing system.

[0091] In at least some instances, a hardware processor is provided that is operable to execute executable instructions for performing methods or processes, such as those disclosed herein. The hardware processor may or may not include elements of other hardware, such as elements of computing devices and systems disclosed herein.

[0092] Regarding the computing environment, embodiments of the present invention can be executed in a client-server environment (whether a network environment or a local environment) or any other suitable environment. Suitable operating environments for at least some embodiments of the present invention include cloud computing environments, in which one or more of the client, server, or other machines can reside in and run within the cloud environment.

[0093] Now for a brief reference Figure 7 Any one or more entities disclosed or implied by the accompanying drawings and / or elsewhere herein may take the form of, include, or be implemented on, or hosted by a physical computing device, one example of which is indicated by 700. Similarly, if any of the foregoing elements includes or consists of a virtual machine (VM), then that VM may constitute Figure 7 Virtualization of any combination of physical components disclosed in the documentation.

[0094] exist Figure 7 In the example, physical computing device 700 includes memory 702, one or more hardware processors 706, non-transitory storage medium 708, UI device 710, and data memory 712. Memory 702 may include one, some, or all of random access memory (RAM), non-volatile memory (NVM) 704 (e.g., NVRAM), read-only memory (ROM), and persistent memory. One or more of the memory components 702 of physical computing device 700 may take the form of solid-state drive (SSD) memory. Similarly, one or more application programs 714 may be provided, comprising instructions executable by one or more hardware processors 706 to perform any or part of the operations disclosed herein.

[0095] Such executable instructions can take various forms, including, for example, instructions executable to perform any method or part thereof disclosed herein, and / or instructions executable by / at any storage site, whether on-premises or cloud computing site, client, data center, data protection site including cloud storage site, or backup server, to perform any function disclosed herein. Similarly, such instructions can be executable to perform any other operations and methods disclosed herein and any part thereof.

[0096] The invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered illustrative rather than restrictive in all respects. Therefore, the scope of the invention is indicated by the appended claims rather than by the foregoing description. All variations within the meaning and equivalent scope of the claims should be included within their scope.

Claims

1. A unit comprising: Bias layer; A first substrate formed on the bias layer; A ground layer formed on the first substrate; A second substrate formed on the grounding layer; A ferroelectric layer formed on the second substrate; A metal layer formed on the ferroelectric layer; as well as The ferroelectric layer is electrically connected to a first via and a second via of the bias layer, wherein the bias layer is configured such that a voltage can be applied to the ferroelectric layer through the first via and the second via.

2. The unit as claimed in claim 1, wherein, The first substrate comprises silicon, FR4, glass sapphire, quartz, or Rogers RF, and wherein the second substrate comprises silicon, FR4, glass sapphire, quartz, or Rogers RF.

3. The unit as claimed in claim 1, wherein, The bias layer and the ground layer comprise metal or are made of metal.

4. The unit as claimed in claim 1, wherein, The ferroelectric layer covers only a portion of the top surface of the second substrate.

5. The unit as claimed in claim 1, wherein, The ferroelectric layer includes barium strontium titanate, BaTiO3, PbTiO3, lead zirconium titanate, triglycine sulfate, PVDF, or lithium tantalate.

6. The unit as claimed in claim 1, wherein, The metal layer is shaped to generate resonance within a frequency range.

7. The unit as claimed in claim 6, wherein, The frequency range is greater than 30 GHz, greater than 35 GHz, less than 30 GHz, or between 30 GHz and 300 GHz.

8. The unit as claimed in claim 1, wherein, The bias layer includes a first bias pad connected to a first side of the ferroelectric layer through the first via and a second bias pad connected to a second side of the ferroelectric layer through the second via.

9. The unit as claimed in claim 8, wherein, The dielectric constant of the ferroelectric layer varies depending on the voltage applied across the ferroelectric layer using the first bias pad and the second bias pad.

10. The unit as claimed in claim 9, wherein, By controlling the voltage applied to the ferroelectric layer, a 360-degree relative tunable phase is achieved in the signal reflected by the unit.

11. The unit as claimed in claim 10, wherein, By controlling the voltage, the signal reflected by the unit can be modulated to a specified direction.

12. A panel comprising: Multiple units, the multiple units being arranged in a grid pattern, wherein each of the units comprises: Bias layer; A first substrate formed on the bias layer; A ground layer formed on the first substrate; A second substrate formed on the grounding layer; A ferroelectric layer formed on the second substrate; The metal layer formed on the ferroelectric layer; and The ferroelectric layer is electrically connected to a first via and a second via of the bias layer, wherein the bias layer is configured such that a voltage can be applied to the ferroelectric layer through the first via and the second via.

13. The panel of claim 12, wherein, The first substrate includes silicon, FR4, glass sapphire, quartz, or Rogers RF, wherein the second substrate includes silicon, FR4, glass sapphire, quartz, or Rogers RF, wherein the bias layer and the ground layer include metal or are made of metal, and wherein the ferroelectric layer covers only a portion of the top surface of the second substrate.

14. The panel of claim 13, wherein, The ferroelectric layer includes barium strontium titanate, BaTiO3, PbTiO3, lead zirconium titanate, triglycine sulfate, PVDF, or lithium tantalate.

15. The panel of claim 12, wherein, The metal layer is shaped to resonate with a frequency range, wherein the frequency range is greater than 30 GHz, greater than 35 GHz, greater than 40 GHz, less than 30 GHz, or between 30 GHz and 300 GHz.

16. The panel of claim 12, wherein, The bias layer includes a first bias pad connected to a first side of the ferroelectric layer through a first via and a second bias pad connected to a second side of the ferroelectric layer through a second via, wherein the dielectric constant of the ferroelectric layer varies according to the voltage applied across the ferroelectric layer using the first bias pad and the second bias pad.

17. The panel of claim 16, wherein, By controlling the voltage applied across the ferroelectric layer of the unit, a 360-degree relative tunable phase is achieved in the signal reflected by the panel, and wherein, by controlling the voltage, the signal reflected by the panel can be modulated to a specified direction.

18. A method for modulating a signal, the method comprising: An operating panel is provided in the environment, the panel comprising multiple units; Determine the direction of the control signal, wherein the signal is received from a base station, an access point, or different panels; A voltage is applied to each of the units such that the signal is reflected in a determined direction, wherein each of the units is configured to be independently controlled, and wherein the voltage applied to each of the units alters the dielectric properties of the unit.

19. The method of claim 18, further comprising reconstructing the panel by applying different voltages to the plurality of cells.

20. The method of claim 18, wherein, Each of the units includes: Metal bias layer; A first substrate formed on the bias layer; A metal ground layer formed on the first substrate; A second substrate formed on the grounding layer; A ferroelectric layer formed on the second substrate; A metal layer formed on the ferroelectric layer, wherein the metal layer is configured to resonate with a signal having a frequency of interest; and The ferroelectric layer is electrically connected to a first via and a second via of the bias layer, wherein the bias layer is configured such that the voltage can be applied to the ferroelectric layer through the first via and the second via.

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