Measuring device and calculation method for obtaining heat transfer characteristics of high thermal conductivity plate parts

Abstract

This invention discloses a measuring device and calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate. The measuring device includes a heating module, a second heat-conducting block, and a detection component. The heating module includes a heating element and a first heat-conducting block. The first heat-conducting block has a support portion for contacting the plate under test. The second heat-conducting block and the first heat-conducting block cooperate to clamp the plate under test. The detection component is used to detect the temperature at a first detection position, a second detection position, and a third detection position. The first detection position is located at the first heat-conducting block, the second detection position is located at the support portion, and the third detection position is located at the second heat-conducting block. By using the second heat-conducting block for heat conduction and utilizing the high thermal conductivity of the solid in the second heat-conducting block for fast heat transfer, the detection component can monitor the temperature change curves of the three positions over time in real time, which helps to quickly deduce the thermal transfer performance parameters of the plate under test by analyzing instantaneous temperature data.

Description

Technical Field

[0001] This invention relates to the field of thermal transfer characteristic testing technology, and in particular to a measuring device and calculation method for obtaining the thermal transfer characteristics of high thermal conductivity plates. Background Technology

[0002] In fields such as electronic equipment and energy materials, accurately assessing the thermal conductivity of planar components such as sheets and films is crucial. Thermal resistance is a key parameter for measuring this type of thermal conductivity. Currently, the industry typically uses classical methods based on Fourier's law of heat conduction to measure the thermal resistance characteristics of sheet components.

[0003] One implementation of this method is as follows: The system mainly includes a heating module (usually integrating a heating element and a heat-conducting block) and a cold plate assembly (such as a constant-temperature water-cooled plate). During measurement, the sample of the material to be tested is sandwiched between the heating module and the cold plate assembly. After startup, the heating module generates heat, which flows sequentially through the heat-conducting block and the sample to be tested, and is finally carried away by the cold plate assembly. The system needs to run for a relatively long time until the temperature readings at each measuring point no longer change with time. Under stable temperature conditions, firstly, based on the temperature difference measured at two measuring points at a known distance on the heat-conducting block, the distance between the two points, the cross-sectional area of ​​the heat-conducting block, and its known thermal conductivity, the amount of heat flowing through the heat-conducting block (i.e., through the sample to be tested) is calculated. Then, based on the temperature of the contact surface between the heat-conducting block and the sample to be tested, and the temperature of the contact surface between the cold plate and the sample, the temperature difference between the two sides of the sample is obtained. Dividing this by the calculated amount of heat, the thermal resistance performance of the material to be tested can be calculated.

[0004] However, existing measurement methods have significant limitations in practical applications, making it difficult to meet the needs of efficient production testing and rapid R&D testing. On the one hand, the assembly process of cold plate components is cumbersome and time-consuming; on the other hand, the temperature stabilization phase requires a long time, typically more than ten minutes for a single measurement. For scenarios such as full inspection in mass production and multiple parameter adjustments during R&D, excessively long measurement cycles significantly reduce production efficiency and increase testing costs. Therefore, there is an urgent need for a method to measure the thermal resistance of heat-conducting plates that can shorten assembly time and measurement cycles while ensuring measurement accuracy. Summary of the Invention

[0005] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a measuring device for obtaining the thermal transfer characteristics of high thermal conductivity plates, which can shorten the measurement time.

[0006] The present invention also proposes a calculation method for measuring devices as described above.

[0007] A measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to a first aspect embodiment of the present invention includes a heating module, a second thermally conductive block, and a detection assembly. The heating module includes a heating element and a first thermally conductive block. The first thermally conductive block is connected to the heating element to transfer heat and has a support portion for contacting the plate to be tested. The second thermally conductive block is located on the side of the first thermally conductive block away from the heating element, and the second thermally conductive block and the first thermally conductive block cooperate to clamp the plate to be tested. The detection assembly is used to detect the temperature at a first detection position, a second detection position, and a third detection position. The first detection position, the second detection position, and the third detection position are arranged sequentially at intervals along the arrangement direction of the first thermally conductive block and the second thermally conductive block, and the first detection position is located at the first thermally conductive block, the second detection position is located at the support portion, and the third detection position is located at the second thermally conductive block.

[0008] The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to an embodiment of the present invention has at least the following beneficial effects: By using a second thermally conductive block for heat conduction, and taking advantage of the high thermal conductivity solid characteristic of the second thermally conductive block, the detection component can monitor the temperature change curves of the first thermally conductive block, the support part, and the second thermally conductive block over time in real time, which helps to quickly deduce the thermal transfer performance parameters of the plate under test by analyzing instantaneous temperature data.

[0009] According to some embodiments of the present invention, the support portion is configured as a boss protruding from the first heat-conducting block.

[0010] According to some embodiments of the present invention, the area of ​​the support portion is smaller than the area of ​​the plate to be tested along a direction perpendicular to the arrangement direction of the first heat-conducting block and the second heat-conducting block.

[0011] According to some embodiments of the present invention, the contact area between the support portion and the test plate is smaller than the contact area between the second heat-conducting block and the test plate.

[0012] According to some embodiments of the present invention, the outer periphery of the heating module and the outer periphery of the second heat-conducting block are both covered with heat-insulating material.

[0013] According to some embodiments of the present invention, the opposite end faces of the first heat-conducting block and the second heat-conducting block are not covered by the heat-insulating material, while the remaining outer surfaces of the heating module and the second heat-conducting block are covered by the heat-insulating material.

[0014] According to some embodiments of the present invention, the measuring device further includes a driving mechanism for driving the second heat-conducting block to move toward or away from the support portion.

[0015] A calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to a second aspect embodiment of the present invention, applied to the measuring device of the first aspect embodiment of the present invention, characterized in that the calculation method includes: Place the test piece on the support; Start the heating element; Press the second heat-conducting block down onto the plate to be tested; The detection component is activated, and it acquires the temperature values ​​of the first, second, and third detection positions in real time, and plots their respective temperature curves. According to the equation Calculate the heat flow Q through the plate under test, where W1 is the weight of the first heat-conducting block and Cp is the specific heat capacity of the first heat-conducting block. The temperature slope of the temperature curve at the first detection location at t=t1; According to the equation Calculate the thermal resistance R and T of the test plate at t=t1. 1-2 T represents the temperature value at the second detection location at t=t1. 2-1 This is the temperature value at the third detection location at t=t1.

[0016] The calculation method according to the embodiments of the present invention has at least the following beneficial effects: by real-time monitoring of the temperature change curves of three key detection positions on the first heat-conducting block, the support part and the second heat-conducting block over time, and by using the above equations for calculation, the thermal resistance performance R of the test plate at different time points and different temperature differences can be quickly calculated.

[0017] According to some embodiments of the present invention, pressing the second thermally conductive block onto the test plate includes: After the heating element stops heating, the second heat-conducting block is pressed down onto the test plate.

[0018] According to some embodiments of the present invention, the calculation method further includes: When the temperature of the first heat-conducting block is greater than the temperature of the second heat-conducting block, and the temperature difference between the first heat-conducting block and the second heat-conducting block is greater than or equal to 70°C, the heating element stops heating.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a testing device for the thermal resistance performance of sheet metal in related technologies; Figure 2This is a schematic diagram of the measuring device according to an embodiment of the present invention when the plate to be measured and the heating element are in operation; Figure 3 This is a schematic diagram of the measuring device according to an embodiment of the present invention when the second heat-conducting block is pressed down and contacts the plate to be measured. Figure 4 This is a schematic diagram of the detection component of an embodiment of the present invention detecting temperature values ​​at a first detection position, a second detection position, and a third detection position. Figure 5 This is a temperature curve diagram of the first detection position, the second detection position, and the third detection position according to an embodiment of the present invention.

[0021] Figure label: 100. Test plate; 110. Cold plate assembly; 120. Heating assembly; 130. Heat-conducting block; 140. Conductive protrusion; 150. Cooling cavity; 210. Heating element; 220. First heat-conducting block; 230. Second heat-conducting block; 240. Support; 250. First detection position; 260. Second detection position; 270. Third detection position; 280. Insulation material. Detailed Implementation

[0022] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0023] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0024] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0025] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0026] In the early stages of product development in fields such as electronics and energy equipment, it is often necessary to quickly evaluate the thermal resistance performance of different materials, structures, or processes to compare their advantages and disadvantages and pinpoint design flaws. Therefore, a rapid thermal performance measurement method and device is crucial for accelerating R&D iterations and shortening the development cycle. Furthermore, when products enter the mass production stage, to ensure quality consistency, it is usually necessary to conduct full inspection or high-frequency sampling inspection of key heat dissipation components (such as heat spreaders and heat sinks). At this point, the inspection efficiency directly determines the production line cycle time and quality control costs, making rapid measurement capability a critical technology that must be possessed in the mass production process.

[0027] Reference Figure 1 In one existing measurement scheme, a heating module and a cold plate assembly 110 are used. The plate to be tested 100 is sandwiched between the heating module and the cold plate assembly 110. The heating module integrates a heating component 120 and a heat-conducting block 130. The heat-conducting block 130 is provided with conductive protrusions 140, and the plate to be tested 100 is placed on the conductive protrusions 140. The cold plate assembly 110 has a cooling chamber 150 for containing coolant. The two ends of the cooling chamber 150 are for water inlet and water outlet, respectively, to achieve coolant circulation.

[0028] The measurement process is as follows: The heating assembly 120 and the cold plate assembly 110 are activated, and the cold plate assembly 110 removes the fixed heat generated by the heating assembly 120. Simultaneously, the temperatures T1 and T2 at two different locations on the conductive protrusion 140, and the temperature T3 of the cold plate assembly 110 are measured. T2 is the temperature of the conductive protrusion 140 near the test plate 100, T3 is the temperature of the cold plate assembly 110 near the test plate 100 (i.e., the temperature of the outer wall of the cooling cavity 150 near the test plate 100), and T1 is the temperature of the conductive protrusion 140 away from the test plate 100. The three temperature measurement points, T1, T2, and T3, are approximately located on the same straight line.

[0029] The thermal performance calculation process is as follows: First, the heat Q1 passing through the test plate 100 is calculated using temperatures T1 and T2 and formula (1); then, the thermal resistance R of the test plate 100 is calculated using temperatures T2 and T3 and formula (2).

[0030] ------ (1) in, The thermal conductivity of the conductive bump 140 can be determined based on its material properties. A is the cross-sectional area of ​​the conductive bump 140, and L is the distance between the measurement points at temperatures T2 and T1.

[0031] ------(2) However, this measurement method can only be performed after the entire system reaches thermal equilibrium, i.e., after temperatures T2 and T3 have stabilized. Because the heating module, the test plate 100, the cold plate assembly 110, and the internal fluid all possess significant thermal inertia, the time required to reach steady state is typically long. This results in a single effective measurement time often exceeding ten minutes, leading to low overall testing efficiency and making it difficult to meet the demands for efficient and rapid thermal performance evaluation in rapid R&D iterations or mass production online testing. Furthermore, using the cold plate assembly 110 also presents the problem of long assembly time, further impacting overall measurement efficiency.

[0032] Therefore, there is an urgent need for a new thermal resistance measurement method and device that can significantly shorten the single measurement time and simplify the operation process while ensuring measurement accuracy and repeatability, so as to meet the dual needs of rapid product development iteration and efficient mass production testing.

[0033] Reference Figures 2 to 4 The first aspect of this invention discloses a measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate, including a heating module, a second thermally conductive block 230, and a detection assembly. The heating module includes a heating element 210 and a first thermally conductive block 220, which is connected to the heating element 210 to receive and transfer heat. A support portion 240 is formed on the first thermally conductive block 220, on which the plate to be tested 100 is supported. The second thermally conductive block 230 is disposed on the side of the first thermally conductive block 220 opposite to the heating element 210, and the second thermally conductive block 230 and the first thermally conductive block 220 cooperate to clamp and fix the plate to be tested 100. The detection assembly is used to detect the temperature at a first detection position 250, a second detection position 260, and a third detection position 270, respectively. The first detection position 250, the second detection position 260 and the third detection position 270 are arranged alternately along the overlapping arrangement direction of the first heat-conducting block 220 and the second heat-conducting block 230; wherein, the first detection position 250 is located on the first heat-conducting block 220, the second detection position 260 is located on the support part 240 and the third detection position 270 is located on the second heat-conducting block 230.

[0034] A stable heat source is provided by a heating module. A heat conduction path is formed sequentially using the first heat-conducting block 220, the test plate 100, and the second heat-conducting block 230. This ensures unidirectional heat transfer along the arrangement of the first and second heat-conducting blocks 220 and 230, reducing interference from heat loss on the measurement results. The detection component's first detection position 250, second detection position 260, and third detection position 270 are arranged sequentially along the heat conduction direction, accurately capturing the temperature decay pattern of heat during conduction and providing core data support for heat transfer characteristic calculations.

[0035] The first detection position 250 is located at the first heat-conducting block 220 and is used to obtain the reference temperature after the heat source is transferred to the first heat-conducting block 220; the second detection position 260 is located at the support part 240 (where the first heat-conducting block 220 contacts the test board 100) and is used to obtain the temperature at the input end of the test board 100 after the heat is transferred; the third detection position 270 is located at the second heat-conducting block 230 (where it contacts the test board 100) and is used to obtain the temperature at the output end after the heat passes through the test board 100. By using the temperature difference values ​​at the three positions and combining them with the known parameters of the heat-conducting block 130, the thermal transfer characteristic parameters of the test board 100 can be derived.

[0036] In the prior art, the cold plate assembly 110 has a complex structure, cumbersome assembly steps, and a long assembly cycle. The measuring device of the present invention only uses the first heat-conducting block 220 and the second heat-conducting block 230 to clamp the plate to be tested 100. The assembly structure is simple and the operation is convenient. It does not require a complicated cold plate assembly process, which greatly shortens the assembly time and further improves the overall measurement and testing efficiency.

[0037] In this embodiment of the invention, the measuring device uses a second heat-conducting block 230 made of a high thermal conductivity solid material to replace the cold plate assembly 110 in a traditional measuring system. The high thermal conductivity solid (such as copper or aluminum) generates rapid temperature changes, allowing the instantaneous temperature change curves of the first heat-conducting block 220 and the second heat-conducting block 230 to quickly calculate the thermal transfer performance of the board 100 under test. By employing an instantaneous temperature detection method instead of a steady-state measurement method, rapid measurement of the thermal transfer performance of the board 100 under test is achieved.

[0038] Reference Figures 2 to 4 The support portion 240 is configured as a boss protruding from the main body surface of the first heat-conducting block 220 toward the second heat-conducting block 230. Preferably, the boss and the main body of the first heat-conducting block 220 are integrally formed or fixedly connected from the same material with a high thermal conductivity to ensure a continuous and stable heat conduction path from the heating element 210 to the contact interface of the boss.

[0039] The design of this boss allows for precise control and reduction of the contact area between the support portion 240 and the plate under test 100. The cross-sectional area of ​​the boss (i.e., the contact area with the plate under test 100) is smaller than the cross-sectional area of ​​the main body of the first heat-conducting block 220. In other words, along the direction perpendicular to the arrangement direction of the first heat-conducting block 220 and the second heat-conducting block 230, the area of ​​the support portion 240 is smaller than the area of ​​the plate under test 100. This enables the measurement of the thermal resistance performance of the plate under test 100 under localized small-area heat source loading conditions. This is particularly suitable for simulating the working conditions of point heat sources in actual applications and evaluating their diffusion thermal resistance.

[0040] It is understood that in some other embodiments, the support portion 240 may also be constructed as the entire area of ​​the upper surface of the first heat-conducting block 220, that is, the top surface of the support portion 240 is flush with the upper surface of the first heat-conducting block 220, and the area of ​​the support portion 240 is greater than or equal to the area of ​​the plate 100 under test. In this case, when the plate 100 under test is placed directly on the flat surface of the main body of the first heat-conducting block 220, the thermal conductivity performance of the entire heated area of ​​the plate 100 under test can be tested.

[0041] Reference Figures 2 to 4 The contact area between the support portion 240 and the test plate 100 is configured to be smaller than the contact area between the second heat-conducting block 230 and the test plate 100. The support portion 240, as the only contact area where the first heat-conducting block 220 transfers heat to the test plate 100, achieves concentrated heat conduction due to its smaller contact area, reducing temperature measurement deviations caused by heat diffusion and dispersion, and ensuring that the three-point temperatures collected by the detection component accurately reflect the thermal conduction state of the test plate 100. The area of ​​the second heat-conducting block 230 is larger than the area of ​​the test plate 100, which can be approximated as heat being fully transferred in the thickness direction before reaching its edges. This makes the heat transfer through the central region of the test plate 100 closer to the ideal model, improving the accuracy of the algorithm.

[0042] In practical electronic heat dissipation, the area of ​​the heat source (such as a chip) is usually much smaller than the contact area of ​​the heat sink (such as a heat sink or heat sink fins). This structure uses the support part 240 to simulate a localized concentrated heat source and the second heat-conducting block 230 to simulate a highly efficient extended heat dissipation end, thereby making the measurement conditions closer to the actual application scenario of the product, and the measured thermal resistance value (especially the diffusion thermal resistance part) has higher engineering reference value.

[0043] Reference Figures 2 to 4 The outer periphery of the heating module and the outer periphery of the second heat-conducting block 230 are both covered with heat-insulating material 280, which can block the heat exchange between the heating module, the second heat-conducting block 230 and the external environment, avoid the impact of external temperature interference or internal heat loss on the accuracy of three-point temperature detection and the capture of instantaneous temperature change curve, ensure that heat is exchanged along the predetermined conduction path, and further improve the accuracy and reliability of measurement data.

[0044] In some embodiments, the test plate 100 may be a plate-shaped component with high thermal conductivity or specific thermal management functions, such as a ceramic plate, aluminum plate, copper plate, alloy plate, or a vapor chamber-containing heat spreader.

[0045] Reference Figures 2 to 4The opposing end faces of the first heat-conducting block 220 and the second heat-conducting block 230 remain exposed and are not covered by the insulation material 280. That is, the upper surface of the first heat-conducting block 220 and the lower surface of the second heat-conducting block 230 are not covered by the insulation material 280. All other outer surfaces of the heating module and the second heat-conducting block 230 are completely covered by the insulation material 280. During the entire measurement process, the heating and cooling rates of the first heat-conducting block 220 and the second heat-conducting block 230 are relatively fast. Furthermore, for the highly thermally conductive components of the test plate 100, even without the insulation material 280, the airflow generated by thermal buoyancy is very weak. Correspondingly, the heat dissipated to the environment through the upper surface of the first heat-conducting block 220 and the lower surface of the second heat-conducting block 230 is also at a very low level. This heat dissipation will not cause significant measurement errors in the measurement results and will not affect the accuracy of the measurement data. The savings of 280 units of insulation material can reduce costs on the one hand, and reduce assembly difficulty and time on the other.

[0046] In some embodiments, the measuring device further includes a driving mechanism. The driving mechanism is connected to the second heat-conducting block 230 and is used to drive the second heat-conducting block 230 to move linearly in a direction toward or away from the support portion 240 of the first heat-conducting block 220. Specific implementations of the driving mechanism may include, but are not limited to, an electric push rod, a combination of a servo motor and a lead screw, a pneumatic cylinder, or a hydraulic cylinder. The driving mechanism drives the second heat-conducting block 230 to move, thereby clamping, fixing, and placing / removing the test piece 100, ensuring a tight fit and smooth heat conduction between the second heat-conducting block 230 and the test piece 100. It also facilitates quick operation of the test piece 100 before and after measurement, improving the ease of use of the device.

[0047] The present invention also provides a calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate, which is applied to the measuring device of the first aspect embodiment of the present invention. The calculation method includes, but is not limited to, steps 100, 200, 300, 400, 500 and 600.

[0048] Step 100: Place the test plate 100 on the support 240.

[0049] Reference Figure 2 The test board 100 is placed on the support 240 to ensure that the test board 100 is placed stably and that the test board 100 is in good contact with the support 240.

[0050] Step 200: Activate heating element 210.

[0051] The heat generated by the heating element 210 is transferred to the support part 240 through the first heat-conducting block 220, and then conducted to the plate under test 100, providing the basic thermal conditions for subsequent temperature curve acquisition, heat flow and thermal resistance calculation.

[0052] Step 300: Press the second heat-conducting block 230 down onto the test plate 100.

[0053] Reference Figure 3 The second heat-conducting block 230 is pressed down to clamp and fix the test plate 100, ensuring that the test plate 100 is in close contact with the support part 240 and the second heat-conducting block 230, eliminating contact gaps, reducing contact thermal resistance, and ensuring that heat can be smoothly transferred from the test plate 100 to the second heat-conducting block 230. At the same time, the position of the test plate 100 is fixed to avoid displacement of the temperature measuring point during the measurement process.

[0054] Step 400: The detection component is activated, and the temperature values ​​of the first detection position 250, the second detection position 260 and the third detection position 270 are acquired in real time, and their respective temperature curves are plotted.

[0055] Reference Figure 4 Real-time acquisition of the first temperature value T at the first detection position 250. 1-1 Real-time acquisition of the second temperature value T at the second detection position 260. 1-2 Real-time acquisition of the third temperature value T at the third detection position 270. 2-1 And plot the first temperature value T. 1-1 Second temperature value T 1-2 and the third temperature value T 2-1 Temperature curve over time, temperature curve graph as follows Figure 5 As shown.

[0056] Step 500, according to the equation Calculate the heat flow Q through the plate 100 under test.

[0057] By analyzing the instantaneous temperature change slope of the first heat-conducting block 220, combined with its known weight and specific heat capacity, the heat flow can be rapidly calculated. Time t=0 represents the time when the first heat-conducting block 220 and the second heat-conducting block 230 begin to experience temperature changes. The analysis can be performed on the temperature value several seconds after the start of the heating or cooling process (e.g., t1=5 seconds or 10 seconds). Here, W1 is the weight of the first heat-conducting block 220, and Cp is the specific heat capacity of the first heat-conducting block 220. S1 is the temperature slope of the temperature curve at the first detection position 250 at t=t1.

[0058] Step 600, according to the equation Calculate the thermal resistance R and T of the test plate 100 at t=t1. 1-2 The temperature value at the second detection position 260 at t=t1, T 2-1 This is the temperature value at the third detection position 270 at t=t1.

[0059] The temperature and time values ​​mentioned above can be recorded in real time using a temperature acquisition device. The recorded time and temperature data can be used to calculate the thermal resistance R of the material in real time using a program.

[0060] This invention also provides a calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate, wherein step 300 includes, but is not limited to, step 310.

[0061] Step 310: After the heating element 210 stops heating, the second heat-conducting block 230 is pressed down onto the test plate 100.

[0062] Heating is initiated when the second heat-conducting block 230 is not in contact with the device under test. At this time, almost all the heat generated by the heating element 210 is used to raise the temperature of the first heat-conducting block 220 itself. Once the first heat-conducting block 220 reaches a suitable temperature (e.g., 90°C), the second heat-conducting block 230 (at this point, the second heat-conducting block 230 is at a low temperature, for example, 20°C) is pressed down to bring it into contact with the device under test. Heat begins to flow from the preheated first heat-conducting block 220, through the device under test, to the initially cooler second heat-conducting block 230. Subsequent temperature measurements at the first detection position 250, the second detection position 260, and the third detection position 270 are relatively stable and not affected by fluctuations in the heating of the heating element 210. This avoids the complexity and error sources caused by continuous heating, significantly improving the accuracy, stability, and repeatability of the measurement.

[0063] This invention also provides a calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate, wherein step 300 includes, but is not limited to, step 320.

[0064] Step 320: When the temperature of the first heat-conducting block 220 is greater than the temperature of the second heat-conducting block 230, and the temperature difference between the first heat-conducting block 220 and the second heat-conducting block 230 is greater than or equal to 70°C, the heating element 210 stops heating.

[0065] The first heat-conducting block 220 and the second heat-conducting block 230 generate a sufficiently large temperature difference. After the heating element 210 stops heating, this large temperature difference creates a strong thermal driving potential, allowing heat to be transferred quickly and efficiently from the high-temperature first heat-conducting block 220 to the low-temperature second heat-conducting block 230. This avoids the problem of slow heat transfer rate and insignificant temperature changes due to a small temperature difference. This stable and high-speed heat exchange process makes the temperature change data collected by the temperature sensor clearer and the fluctuations more regular, effectively reducing measurement errors.

[0066] This invention also provides a control method for the above calculation method, specifically including the following steps: Heat the first heat-conducting block and monitor its temperature; Heating stops when the temperature difference between the first heat-conducting block and the second heat-conducting block reaches or exceeds a preset threshold. After heating is stopped, the second heat-conducting block is controlled to move so as to clamp the test plate together with the first heat-conducting block; Collect transient data on the temperature changes of the first heat-conducting block, the contact interface between the test plate and the second heat-conducting block, and the second heat-conducting block over time; Based on the transient data, the thermal transfer characteristics of the test plate are calculated.

[0067] In some embodiments, the preset threshold is greater than or equal to 70°C.

[0068] In some embodiments, the step of calculating the thermal transfer characteristics of the test plate based on the transient data specifically includes: The moment when the second heat-conducting block begins to heat up is defined as the starting zero point of the cooling transient (t=0). The heat flow rate through the test plate is calculated based on the temperature drop rate of the first heat-conducting block during the cooling transient. The thermal resistance of the test plate is calculated based on the heat flow and the temperature difference between the interfaces on both sides of the test plate.

[0069] In some embodiments, the step of calculating the heat flow through the plate under test specifically includes: According to the equation Calculate the heat flow Q through the plate under test.

[0070] In some embodiments, the control method further includes the following steps: If the ratio of the temperature rise rate of the second heat-conducting block to the cooling rate of the first heat-conducting block exceeds a preset range, an instruction indicating that the test is invalid or has low reliability is issued.

[0071] If the ratio of the temperature rise rate of the second heat-conducting block to the cooling rate of the first heat-conducting block is greater than or equal to a preset upper limit, such as 1, it indicates that the test board may have been forgotten to be placed between them. If the ratio of the temperature rise rate of the second heat-conducting block to the cooling rate of the first heat-conducting block is less than or equal to a preset lower limit, such as 1 (0.1), it indicates poor contact between the first and second heat-conducting blocks and the test board, or other problems. Upon detecting a problem, an alarm should be issued promptly to avoid wasting time and other costs.

[0072] In some embodiments, the control method further includes the following steps: For multiple sets of continuous temperature sampling data collected in transient heat transfer measurements, median filtering and sliding window mean filtering are performed simultaneously to form a composite filter; The median filter is used to filter out random spike noise and pulsed temperature fluctuations in the temperature sampling data, and the sliding window mean filter is used to smooth the temperature change curve and retain the temperature heat transfer change trend. After composite filtering, the output temperature data is smooth and conforms to the actual heat transfer law, which is used for subsequent calculation of temperature slope and heat transfer characteristic parameters.

[0073] The specific steps of the median filtering include: setting the median filtering window length N, where N is an odd number greater than 1; sorting N consecutive sets of temperature sampling data according to their numerical values; and selecting the value at the middle position after sorting as the median filtering output value at the current moment.

[0074] The specific steps of the sliding window mean filtering include: setting the sliding window length M, where M is a positive integer greater than 1; taking the current sampling time as the endpoint, selecting M consecutive sets of temperature sampling data; calculating the arithmetic mean of the M sets of data as the sliding window mean filtering output value at the current time; and as the sampling process progresses, the sliding window moves forward synchronously, repeating the above mean calculation process.

[0075] The median filter window length N and the sliding window mean filter window length M satisfy: M≥N, and the values ​​of N and M are adaptively adjusted according to the transient heat transfer temperature change rate and sampling frequency.

[0076] For example, the median filter window length N is selected as 5 (N is an odd number greater than 1, which can be adjusted according to the actual sampling frequency and the frequency of temperature changes, such as 3, 7, etc.) to accurately filter out random spikes and pulsed temperature fluctuations, avoiding interference from a single abnormal sampling point on the overall signal. The sliding window mean filter window length M is selected as 10 (M is a positive integer greater than 1, and satisfies M≥N, which can be adaptively adjusted according to the rate of temperature change, such as 8, 12, etc.) to smooth the temperature curve, retain the true heat transfer trend, and avoid signal distortion caused by over-filtering.

[0077] Centered on the current sampling time, extract N=5 consecutive sets of temperature sampling data (i.e., the current time data, the previous 2 sets of data, and the last 2 sets of data). Sort these 5 sets of data in ascending (or descending) order of value. Select the value in the middle position (3rd position) after sorting as the output value of the median filter at the current time. As the sampling process continues, the filtering window moves forward synchronously. Repeat the above operations of extraction, sorting, and median selection for each set of sampling data to complete the median filtering of all temperature data, effectively filtering out random spike noise and pulse temperature fluctuations (such as temperature abrupt changes caused by transient distortion of interface contact or instantaneous interference of the sensor) in the original data.

[0078] Starting from the current sampling time, extract M=10 consecutive sets of median-filtered temperature data, calculate the arithmetic mean of these 10 sets of data (i.e., the sum of the 10 sets of data divided by 10), and use this arithmetic mean as the output value of the sliding window mean filter at the current time. As the sampling process progresses, the sliding window moves forward synchronously (for each new set of data collected, the window removes the earliest set of data and includes the latest set of data), repeating the above extraction and mean calculation operations to complete the mean filtering process for all data, thereby smoothing the temperature curve and preserving the true trend of temperature changes during transient heat transfer, avoiding the influence of small fluctuations still existing after median filtering on the temperature slope calculation.

[0079] In some embodiments, during the transient heat transfer measurement phase after heating stops, the system employs a heating shutdown thermal inertia compensation algorithm. Based on a preset residual heat decay model of the heating element, the collected temperature data is corrected in real time to eliminate interference signals caused by residual heat of the heating element and achieve decoupling of the real heat transfer signal. At the same time, a variable period adaptive sampling algorithm is adopted to automatically increase the sampling frequency when the temperature difference is large and the temperature change is drastic in the early stage of heat transfer, and decrease the sampling frequency when the temperature difference gradually decreases. Combined with a digital lead correction filtering algorithm, the sensor sampling lag is dynamically compensated to restore the real temperature change curve.

[0080] The controller pre-stores a residual heat decay model for the heating element. This model is constructed based on the heating element's power, heating duration, and its own heat capacity parameters, and can specifically employ an exponential decay model or a polynomial fitting decay model. After heating stops, the controller calculates the residual heat of the heating element and its impact on the temperature sensor's acquired signal in real time based on this residual heat decay model. It then subtracts this residual heat interference component from the original temperature data, achieving real-time correction of the temperature data. This eliminates the interference signal caused by the residual heat of the heating element, decoupling the system to obtain the true heat transfer signal generated solely by heat conduction between the first and second heat-conducting blocks.

[0081] The controller calculates the temperature difference and rate of temperature change between the first and second heat-conducting blocks in real time. In the initial stage of heat transfer, due to the large temperature difference and drastic temperature changes between the two heat-conducting blocks, the controller automatically increases the sampling frequency of the temperature sensor to collect temperature data more frequently. As the heat transfer process progresses, the temperature difference gradually decreases and the temperature change becomes more gradual, at which point the controller correspondingly reduces the sampling frequency, minimizing data processing while maintaining data accuracy. The adjustment of the sampling frequency is positively correlated with the real-time temperature difference or the real-time rate of temperature change; that is, the larger the temperature difference and the higher the rate of temperature change, the higher the sampling frequency.

[0082] To address the issues of an excessively narrow effective measurement window and insufficient data points, the system employs a low-power intermittent heating control strategy. After the main heating stops, a small amount of intermittent heating is used to maintain the temperature difference near the target measurement range, extending the effective heat transfer measurement time. Furthermore, a piecewise exponential fitting algorithm is used to fit the temperature decay curve, improving the reliability and repeatability of the heat transfer characteristic calculation.

[0083] In addition, the system has a built-in online compensation model for convection and radiation heat loss. It calculates and removes additional heat loss components based on real-time temperature, temperature difference and ambient temperature, and retains only the effective signal of solid heat conduction. This eliminates the masking of the real heat transfer characteristics by micro-convection and thermal radiation during transient processes, and ensures that the calculation of heat transfer characteristic parameters such as thermal resistance and thermal conductivity is accurate and reliable.

[0084] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate, characterized in that, include: A heating module includes a heating element and a first heat-conducting block, the first heat-conducting block being connected to the heating element to transfer heat, and the first heat-conducting block having a support portion for contacting the plate to be tested; The second heat-conducting block is located on the side of the first heat-conducting block away from the heating element. The second heat-conducting block and the first heat-conducting block cooperate to clamp the plate to be tested. A detection component is used to detect the temperature of a first detection position, a second detection position, and a third detection position. The first detection position, the second detection position, and the third detection position are arranged sequentially at intervals along the arrangement direction of the first heat-conducting block and the second heat-conducting block. The first detection position is located on the first heat-conducting block, the second detection position is located on the support portion, and the third detection position is located on the second heat-conducting block.

2. The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 1, characterized in that, The support portion is constructed as a boss protruding from the first heat-conducting block.

3. The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 2, characterized in that, Along a direction perpendicular to the arrangement direction of the first and second heat-conducting blocks, the area of ​​the support portion is smaller than the area of ​​the plate to be tested.

4. The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 2, characterized in that, The contact area between the support and the test plate is smaller than the contact area between the second heat-conducting block and the test plate.

5. The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 1, characterized in that, The outer periphery of the heating module and the outer periphery of the second heat-conducting block are both covered with heat-insulating material.

6. The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 5, characterized in that, The plate to be tested is a ceramic plate, aluminum plate, copper plate, alloy plate or a heat spreader containing a vapor chamber. The opposite end faces of the first heat-conducting block and the second heat-conducting block are not covered by the insulation material, while the remaining outer surfaces of the heating module and the second heat-conducting block are covered by the insulation material.

7. The measuring device for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 1, characterized in that, The measuring device further includes a driving mechanism for driving the second heat-conducting block to move toward or away from the support.

8. A calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate, applied to the measuring device according to any one of claims 1 to 7, characterized in that, The calculation method includes: Place the test piece on the support; Start the heating element; Press the second heat-conducting block down onto the plate to be tested; The detection component is activated, and it acquires the temperature values ​​of the first, second, and third detection positions in real time, and plots their respective temperature curves. According to the equation Calculate the heat flow Q through the plate under test, where W1 is the weight of the first heat-conducting block and Cp is the specific heat capacity of the first heat-conducting block. The temperature slope of the temperature curve at the first detection location at t=t1; According to the equation Calculate the thermal resistance R and T of the test plate at t=t1. 1-2 T represents the temperature value at the second detection location at t=t1. 2-1 This is the temperature value at the third detection location at t=t1.

9. The calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 8, characterized in that, The step of pressing the second heat-conducting block onto the plate to be tested includes: After the heating element stops heating, the second heat-conducting block is pressed down onto the test plate.

10. The calculation method for obtaining the thermal transfer characteristics of a high thermal conductivity plate according to claim 9, characterized in that, The calculation method further includes: When the temperature of the first heat-conducting block is greater than the temperature of the second heat-conducting block, and the temperature difference between the first heat-conducting block and the second heat-conducting block is greater than or equal to 70°C, the heating element stops heating.

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