Display device

Abstract

A display device is disclosed, comprising: a first substrate including a display area and a non-display area surrounding the display area; a second substrate facing the first substrate; a plurality of link lines disposed in the non-display area of ​​the first substrate at different distances from the second substrate; a plurality of protective structures respectively located on the link lines closest to the second substrate among the plurality of link lines; a plurality of shock-absorbing structures respectively located between the second substrate and the plurality of protective structures; and a sealing material surrounding the plurality of shock-absorbing structures in the non-display area between the first substrate and the second substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0202050, filed on December 31, 2024, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to display devices. Background Technology

[0004] Display devices are used in various electronic devices such as TVs, smartphones, laptops, and tablets. Research continues on making display devices thinner, lighter, and with lower power consumption.

[0005] Examples of display devices may include liquid crystal display (LCD) devices, field emission display (FED) devices, and organic light-emitting diode (OLED) display devices.

[0006] Liquid crystal displays (LCDs) are display devices that display images by adjusting the amount of light transmitted through liquid crystals. They are thinner, lighter, and consume less power than earlier display devices, and therefore have been widely used. Summary of the Invention

[0007] In a liquid crystal display device, a sealing material coated onto the bezel area is used to bond the upper and lower substrates of the display device together. The bezel area is a non-display area located outside the display area. The bezel area may include a link area. Link lines may be provided in the link area to provide various signals from external sources to multiple signal lines located in the display area.

[0008] Recently, with the increase in LCD resolution, a larger number of interconnects has been adopted. Furthermore, as the width of the bezel area decreases, the demand for display devices that meet users' aesthetic requirements is also increasing. In the process of reducing the width of the bezel area when applying a larger number of interconnects, stress can cause cracks to appear in the interconnects. When moisture penetrates into cracked interconnects, corrosion can occur. When the circuitry is corroded and damaged, defects may occur in the operation of the display device, degrading the product's reliability.

[0009] Therefore, through various experiments, the inventors of this disclosure have invented a display device that can prevent or suppress potential cracks or damage in the connecting lines provided on the frame area caused by stress.

[0010] One or more embodiments of this disclosure aim to provide a display device that can prevent or suppress cracks in the link wires due to stress, thereby preventing or suppressing damage to the link wires.

[0011] Another object of one or more embodiments of this disclosure is to provide a display device that can place multiple link lines in a limited border area by applying a structure in different layers.

[0012] Another object of one or more embodiments of this disclosure is to provide a display device including a robust structure that protects the connecting lines from damage when the upper and lower substrates are joined together.

[0013] The purposes of various embodiments of this disclosure are not limited to those mentioned above. Other purposes and advantages not mentioned in this disclosure may be understood based on the following description and may be more clearly understood based on exemplary embodiments of this disclosure. Furthermore, it will be readily understood from the description provided herein that the purposes and advantages of various exemplary embodiments of this disclosure can be realized by practicing the exemplary embodiments described herein, including those included in the claims or a combination thereof.

[0014] To achieve these objectives and other advantages, and in accordance with the purposes of this disclosure, as embodied and broadly described herein, a display device according to an embodiment of this disclosure includes: a first substrate including a display area and a non-display area surrounding the display area; a second substrate facing the first substrate; a plurality of link lines disposed in the non-display area of ​​the first substrate at different distances from the second substrate; a plurality of protective structures respectively located on the link lines closest to the second substrate; a plurality of damping structures respectively between the second substrate and the plurality of protective structures; and a sealing material surrounding the plurality of damping structures in the non-display area between the first substrate and the second substrate.

[0015] In another aspect of this disclosure, a display device includes: a first substrate including a display area and a non-display area surrounding the display area; a second substrate overlapping the first substrate; a plurality of link lines in the non-display area of ​​the first substrate, the plurality of link lines being disposed at different distances from the second substrate; a protective structure on the link line closest to the second substrate among the plurality of link lines; and at least one shock-absorbing structure between the protective structure and the second substrate.

[0016] According to an exemplary embodiment of this disclosure, by placing the protective structure on the link line provided on the border area, the link line can be prevented from cracking or being damaged due to stress. Therefore, external moisture and other contaminants can be prevented from corroding the line through cracks.

[0017] According to an example embodiment of this disclosure, by placing a gap filler or auxiliary structure, which serves as a damping structure, on a protective structure, a robust structure capable of mitigating stresses applied to the circuit when the upper and lower substrates are joined together can be constructed.

[0018] According to an example embodiment of this disclosure, multiple link lines can be arranged within a limited bezel area by applying a three-link structure with multiple link lines arranged on different layers. Therefore, the resolution of the liquid crystal display can be improved.

[0019] According to an example embodiment of this disclosure, because the defect rate of the display device caused by link corrosion is reduced, the production energy required for additional production of the display device can be reduced, thereby reducing greenhouse gas emissions.

[0020] The effects of this disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art based on the description set forth below.

[0021] In addition to the effects described above, the specific effects of this disclosure are also described in the following detailed description of the exemplary embodiments for implementing this disclosure, or can be understood from the description. Attached Figure Description

[0022] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application. The drawings illustrate exemplary embodiments of this disclosure and, together with the description, serve to illustrate the principles of this disclosure.

[0023] Figure 1 This is a plan view of a display device according to an exemplary embodiment of the present disclosure.

[0024] Figures 2 to 4 This is a diagram illustrating a display device according to an exemplary embodiment of the present disclosure.

[0025] Figure 5 This is a plan view showing a portion of the link area according to another example implementation of this disclosure.

[0026] Figures 6 to 9 This is a diagram illustrating a method for manufacturing a display device according to another exemplary embodiment of the present disclosure.

[0027] Figure 10 and Figure 11 This is a diagram illustrating a display device according to yet another exemplary embodiment of the present disclosure. Detailed Implementation

[0028] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will be described in the following and appendix. Figure 1 The exemplary embodiments described in detail below will become apparent. However, this disclosure is not limited to the exemplary embodiments disclosed below, but can be implemented in various other forms. Therefore, these embodiments are described only to make this disclosure more complete and to more fully inform those skilled in the art of the scope of this disclosure. The scope of protection of this disclosure can be defined by the scope of the claims and their equivalents.

[0029] For simplicity and clarity, the elements in the accompanying drawings are not necessarily drawn to scale. Unless otherwise specified, the same reference numerals in different drawings denote the same or similar elements and therefore perform similar functions. Furthermore, for the sake of simplicity, descriptions and details of well-known steps and elements may be omitted. In addition, numerous specific details are set forth in the following detailed description of exemplary embodiments of this disclosure to provide a thorough understanding of this disclosure. However, it should be understood that this disclosure can be practiced without these specific details. In other instances, well-known methods, processes, components, and circuits have not been described in detail to avoid unnecessarily obscuring aspects of this disclosure. Examples of various embodiments are further shown and described below. It should be understood that the description herein is not intended to limit the claims to the specific embodiments described. Rather, it is intended to cover alternatives, modifications, and equivalents that may be included within the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

[0030] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the accompanying drawings are illustrative in order to illustrate exemplary embodiments of this disclosure, and this disclosure is not limited thereto.

[0031] The terminology used herein is intended only to describe the purpose of particular embodiments and is not intended to limit the scope of this disclosure. As used herein, unless the context explicitly indicates otherwise, the singular constructs “a” and “an” are also intended to include the plural constructs. It should also be understood that, when used in this disclosure, the terms “comprise,” “comprising,” “include,” and “including” specify the presence of the stated feature, integer, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one” may modify the entire list of elements or not modify any individual element in that list when preceding a list of elements. Errors or tolerances may be introduced when interpreting numerical values, even if they are not explicitly described.

[0032] Furthermore, it should be understood that when a first element or layer is referred to as existing "on" a second element or layer, the first element may be directly disposed on the second element or may be indirectly disposed on the second element, wherein a third element or layer is disposed between the first element or layer and the second element or layer. It should be understood that when an element or layer is referred to as being "connected to" or "coupled to" another element or layer, it may be directly connected to or coupled to the other element or layer, or one or more intermediate elements or layers may exist therein. Additionally, it should be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may exist.

[0033] Furthermore, as used herein, when a layer, film, region, plate, etc., is described as being disposed "on" or "on top" of another layer, film, region, plate, etc., the former can directly contact the latter, or another layer, film, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc., is described as being directly disposed "above" or "on top" of another layer, film, region, plate, etc., the former directly contacts the latter, while another layer, film, region, plate, etc., is not disposed between the former and the latter. Furthermore, as used herein, when a layer, film, region, plate, etc., is described as being disposed "below" or "underneath" another layer, film, region, plate, etc., the former can directly contact the latter, or another layer, film, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc., is described as being directly disposed "below" or "underneath" another layer, film, region, plate, etc., the former directly contacts the latter, while another layer, film, region, plate, etc., is not disposed between the former and the latter.

[0034] In descriptions of temporal relationships, such as temporal precedents between two events, such as “after,” “following,” “before,” etc., unless a more restrictive phrase such as “immediately after,” “immediately following,” or “immediately before” is specified, another event may occur in between.

[0035] In cases where a particular implementation can be carried out differently, the functions or operations specified in a specific block may occur in a different order than that specified in the flowchart. For example, two consecutive blocks may actually be executed substantially simultaneously, or the two blocks may be executed in reverse order, depending on the functions or operations involved.

[0036] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or periods, these elements, components, regions, layers, and / or periods should not be construed as being limited by these terms. These terms are used to refer to separating one element, component, region, layer, or period from another element, component, region, layer, or period. Therefore, without departing from the spirit and scope of this disclosure, a first element, component, region, layer, or period as described herein may be referred to as a second element, component, region, layer, or period, and vice versa.

[0037] Features of the various embodiments of this disclosure can be combined in whole or in part with each other, and can be technically related to or operable on each other. Embodiments can be implemented independently of each other, or they can be implemented together in an associated relationship.

[0038] When interpreting numerical values, unless otherwise specified, the value is interpreted to include a range of error.

[0039] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0040] As used herein, terms such as “implementation,” “example,” and “aspect” should not be construed as making any aspect or design described superior or better than other aspects or designs.

[0041] Furthermore, the term "or" implies "inclusive or," not "exclusive or." That is, unless otherwise stated or clear from the context, the statement "x uses either a or b" implies one of the naturally inclusive permutations.

[0042] The terminology used in the following description has been chosen to be general and common in the relevant art. However, depending on the development and / or changes in technology, conventions, preferences of those skilled in the art, etc., there may be other equivalent, similar, or suitable terms. Therefore, the terminology used in the following description should not be construed as limiting the technical concept, but should be understood as examples of terminology used to describe embodiments.

[0043] Furthermore, in specific cases, the terminology may be arbitrarily chosen by the applicant, and in such cases, its detailed meaning will be described in the corresponding descriptive paragraph. Therefore, the terminology used in the following description should be understood not only based on the name of the term, but also based on its meaning and its context throughout the specific implementation.

[0044] In descriptions of signal flow, such as when a signal is described as being delivered from node A to node B, this could include cases where the signal is delivered from node A to node B via another node, unless more restrictive phrases such as “immediately after” or “directly” are used.

[0045] Throughout this disclosure, if used, “A and / or B” means A, B, or A and B unless otherwise specified, and “C to D” means C (inclusive) to D (inclusive) unless otherwise specified.

[0046] "At least one" should be understood to include any combination of one or more of the listed components. For example, at least one of the first, second, and third components not only covers the first, second, or third component individually, but also covers all combinations of two or more of the first, second, and third components.

[0047] In the following description, exemplary embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. For ease of explanation, the scale of each component shown in the drawings may differ from its actual scale. Therefore, the present disclosure is not limited to the scales shown in the drawings.

[0048] As used herein, the first direction, second direction, and third direction, or the X-axis direction, Y-axis direction, and Z-axis direction, should not be interpreted merely as having a geometric relationship between them in which the first direction, second direction, and third direction are perpendicular to each other or the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other, but can be interpreted as having a geometric relationship between them in which the first direction, second direction, and third direction intersect each other at an angle other than 90 degrees (°) or the X-axis direction, Y-axis direction, and Z-axis direction intersect each other at an angle other than 90 degrees (°) to the extent that the configuration of this disclosure can be functionally operated.

[0049] In the following description, an example embodiment of a display device according to the present disclosure will be described with reference to the accompanying drawings.

[0050] Figure 1 This is a plan view of a display device according to an exemplary embodiment of the present disclosure.

[0051] like Figure 1 As shown, the display device 1 according to an example embodiment of the present disclosure may include a display panel comprising a display area AA and a non-display area NAA located outside the display area AA. The display panel according to the example embodiment of the present disclosure may include a first substrate 100 and a second substrate 200 overlapping the first substrate 100. A pixel driving circuit including a plurality of thin-film transistors (TFTs) may be provided on the first substrate 100, and a color filter layer corresponding to the plurality of pixels may be provided on the second substrate 200.

[0052] The display area AA can be an area where an image is displayed. The non-display area NAA can be an area where no image is displayed. The non-display area NAA can be located in the peripheral area (or edge area) of the first substrate 100, but is not limited to this. For example, an area other than the light-emitting area on the display area AA that emits light outward can be called the non-display area NAA. The non-display area NAA located in the peripheral area (or edge area) of the first substrate 100 can be called the border area.

[0053] Multiple pixels can be set in the display area AA, and an image can be displayed accordingly in the display area AA. Various lines, circuits, etc., for driving the multiple pixels in the display area AA can be set in the non-display area NAA. For example, a drive circuit including a gate drive circuit and a data drive circuit can be set in the non-display area NAA. Several drivers 101 for driving the display area AA can be set in the non-display area NAA. For example, the drivers 101 may include a gate driver and a data driver, but are not limited to these.

[0054] A flexible circuit board 102 and a printed circuit board 104 can be disposed at at least one edge of the non-display area NAA. For example, multiple flexible circuit boards 102 can be disposed, but this disclosure is not limited thereto. An integrated circuit chip 103 can be disposed on the flexible circuit board 102. One side of the flexible circuit board 102 can be coupled to the first substrate 100, and the other side can be coupled to the printed circuit board 104 to provide power and signals for driving pixels supplied from the printed circuit board 104 to the display area AA of the first substrate 100. For example, the signals for driving pixels may include high potential voltage, low potential voltage, scan signals, data signals, etc.

[0055] The printed circuit board 104 can supply various signals to the integrated circuit chip 103 disposed on the flexible circuit board 102. Various components for supplying various signals to the integrated circuit chip 103 can be disposed on the printed circuit board 104.

[0056] The first substrate 100 and the second substrate 200 can be bonded to each other using a sealing material. The sealing material can be applied by coating the non-display area (NAA) along the edge of the first substrate 100 or the edge of the second substrate 200.

[0057] Because pixels are not placed in areas with sealing material, the corresponding areas may be blocked by the black matrix and thus not visible from the outside. The non-display area NAA blocked by the black matrix can be referred to as the border area.

[0058] The size of the non-display area (NAA), i.e., the bezel area, is reduced to provide the user with the maximum possible display area (AA) within the limited size of the display device. Additionally, to reduce the width of the bezel area, areas with sealing material can overlap with circuit areas in the NAA. For example, areas with sealing material can overlap with areas containing multiple connecting lines.

[0059] In one example, as the demand for high-resolution displays increases, a larger number of signal lines are implemented. Consequently, the number of signal lines and their corresponding link lines also increases. However, as the number of link lines increases, various problems may arise. For instance, when the number of link lines increases and the area size of the bezel region decreases, it may become difficult to arrange multiple link lines within a single layer.

[0060] Therefore, in order to arrange multiple link lines within a narrow bezel area, the display device according to the exemplary embodiments of this disclosure may include a three-link structure.

[0061] Figures 2 to 4 This is a diagram illustrating a display device according to an exemplary embodiment of the present disclosure. Figure 2 This is a plan view showing a portion of the link area according to an exemplary embodiment of this disclosure. Figure 2 For ease of description, only the first structure 135 of the protective structure 138 is shown. Figure 3 It is along Figure 2 The cross-sectional view taken from line II-II' in the diagram. Figure 4 It is along Figure 2 The cross-sectional view taken from line III-III' in the diagram. For ease of explanation, Figures 2 to 4 The diagram shows a portion of the area where the sealing material 140 is provided in the non-display area NAA overlaps with an area where multiple link lines are provided. The area where multiple link lines are provided can be the link area LKA.

[0062] like Figures 2 to 4 As shown, multiple link lines 105, 115, and 125 can be arranged on different layers. The multiple link lines 105, 115, and 125 may include a first link line 105, a second link line 115, and a third link line 125. The first link line 105, the second link line 115, and the third link line 125 can be arranged to intersect each other in the vertical direction. In another example, the first link line 105 and the second link line 115 can be arranged to at least partially overlap each other in the vertical direction. Additionally, the second link line 115 and the third link line 125 can be arranged to at least partially overlap each other in the vertical direction. The three-link structure can reduce the width of the gap between the first link line 105, the second link line 115, and the adjacent third link line 125. Therefore, in a plan view, the area occupied by the first to third link lines 105, 115, and 125 in the border region can be reduced to achieve a narrow border or a zero border. The first connecting line 105, the second connecting line 115, or the third connecting line 125 may include a metallic material.

[0063] like Figure 2 As shown, the first link line 105, the second link line 115, and the third link line 125 can be arranged in the same direction. For example, the first group of first link lines 105, second link lines 115, and third link lines 125, positioned on the left side relative to the center line C, can be arranged diagonally downwards from the upper left to the lower right. Similarly, the second group of first link lines 105, second link lines 115, and third link lines 125, positioned on the right side relative to the center line C, can be arranged diagonally downwards from the upper right to the lower left. The first link line 105 can extend in a linear shape within the pad area PDA. Furthermore, the protective structure 138, including the first structure 135, can be configured to overlap along the shape of the third link line 125.

[0064] like Figure 3 and Figure 4 As shown, the first link 105, the second link 115, and the third link 125 can be disposed on different layers on the first substrate 100 within the link region LKA. An insulating layer can be disposed between the first link 105, the second link 115, and the third link 125. For example, a gate insulating layer 110 can be disposed between the first link 105 and the second link 115. The gate insulating layer 110 can comprise a single layer or multiple layers made of one or more inorganic insulating materials such as silicon oxide (SiOx) or silicon nitride (SiNx). A first planarization layer 120 and a second planarization layer 123 can be disposed between the second link 115 and the third link 125. The first planarization layer 120 and the second planarization layer 123 can comprise organic insulating materials.

[0065] Multiple protective structures 138, including a first structure (or first protective structure) 135 and a second structure (or second protective structure) 137, can be respectively provided on multiple third link lines 125. The multiple protective structures 138 can be arranged to correspond to the multiple third link lines 125 respectively.

[0066] A passivation layer 130 may be disposed on the edge of the third link line 125 and on the second planarization layer 123. The passivation layer 130 may comprise a single layer or multiple layers made of one or more inorganic insulating materials such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0067] The first structure (or first protective structure) 135 may be disposed on the portion of the third link line 125 not covered by the passivation layer 130. The first structure 135 may be in direct contact with the third link line 125. The first structure 135 may include a material for preventing or inhibiting corrosion of the third link line 125. For example, the first structure 135 may include a metal oxide material as a corrosion-resistant material capable of preventing or inhibiting corrosion of the metal material. For example, the first structure 135 may include indium tin oxide (ITO) or indium zinc oxide (IZO).

[0068] A second structure (or second protective structure) 137 may be disposed on the first structure 135. The second structure 137 may have a width greater than that of the first structure 135. Therefore, the second structure 137 may cover the entire top and side surfaces of the first structure 135 and extend into a portion of the passivation layer 130. The second structure 137 may have a columnar shape protruding from the surface of the passivation layer 130 toward the second substrate 200. The second structure 137 may include an organic insulating material. For example, the second structure 137 may be made of photopropylene (PAC) or polyimide (PI).

[0069] The third link 125 can be disposed on the second planarization layer 123, which includes an organic insulating material, and can be covered and protected by the passivation layer 130. Therefore, a step can appear between the portion where the third link 125 is disposed and the portion where the third link 125 is not disposed.

[0070] When a sealing process of applying sealing material 140 is performed with the front (or top) surface of the third link 125 covered by passivation layer 130, the sealing material 140 typically includes a structure with relatively large dimensions to maintain a separation space between the first substrate 100 and the second substrate 200. This structure may include a material with rigidity to maintain the separation space.

[0071] When a sealing material 140 including this structure is applied between the first substrate 100 and the second substrate 200 and pressure is applied for bonding, the rigid structure increases the stress on the passivation layer 130. Therefore, cracks may appear on the surface of the passivation layer 130. When moisture permeates through the cracks, the third connecting line 125 beneath the passivation layer 130 may come into contact with the moisture.

[0072] When a voltage is applied to the third link 125 while it is in contact with moisture that has permeated therein, corrosion may occur in the third link 125, which includes conductive material (or metallic material), due to the electric field and the moisture. When corrosion occurs in the third link 125, defects may occur in the operation of the display device, and the reliability of the product may be degraded.

[0073] Additionally, the third link 125 may be damaged when strong pressure is applied from the rigid structure included in the sealing material 140.

[0074] To address this problem, in an exemplary embodiment of this disclosure, a protective structure 138 comprising a first structure 135 and a second structure 137 can be provided on the third connecting line 125 to prevent or protect the third connecting line 125 from damage due to moisture penetration. Furthermore, by configuring the second structure 137 as a cylindrical shape protruding toward the second substrate 200, it is ensured that the height of the separation space between the first substrate 100 and the second substrate 200 can be maintained. Additionally, the size of the gap filler 145 can be reduced by introducing a sealing material 140 including the gap filler 145. Moreover, since the protective structure 138 is provided between the gap filler 145 and the third connecting line 125, damage to the third connecting line 125 due to stress (e.g., pressure exerted by the gap filler 145) can be prevented or protected.

[0075] In addition, by placing the protective structure 138 at the location where the third connecting line 125 is provided, the separation space can be maintained evenly.

[0076] The second link 115 and the first link 105 can be positioned below the third link 125. In an example embodiment, such as... Figure 4 As shown, the third link 125 can be electrically connected to the second link 115 via a connection electrode extending through the second planarization layer 123 and the first planarization layer 120. Additionally, the second link 115 can be electrically connected to the first link 105 via another connection electrode extending through the gate insulating layer 110. The first link 105 can extend from the link region LKA to the pad region PDA electrically connected to the flexible circuit board 102.

[0077] A lower alignment film 155-2 can be formed on the passivation layer 130 of the first substrate 100 to avoid overlapping with the sealing material 140. Alternatively, an upper alignment film 155-1 can be formed below the outer coating layer 150 of the second substrate 200. A liquid crystal layer LC can be filled between the upper alignment film 155-1 and the lower alignment film 155-2. A black matrix 160 can be formed between the outer coating layer 150, on which the upper alignment film 155-1 is formed, and the second substrate 200, making the various metal lines invisible to the user. A decorative layer 165 can be formed between the second substrate 200 and the outer coating layer 150 corresponding to the portion where the sealing material 140 is formed, surrounding the border area; however, this disclosure is not limited to this. For example, the black matrix can be formed at the location where the decorative layer 165 is formed.

[0078] A sealing material 140 may be disposed between the second substrate 200 and the first substrate 100. A gap filler 145, which may be a shock-absorbing structure, may be disposed between the protective structure 138 and the second substrate 200. The gap filler 145 may be disposed at a position corresponding to the location where the protective structure 138 is disposed. The sealing material 140 may include an adhesive organic material, such as silicone, polyurethane, epoxy resin, or acrylic. The gap filler 145 may include silica particles, glass fiber, or ceramic particles, but is not limited to these. In an example embodiment, the gap filler 145 may have a spherical shape.

[0079] The total height H2 of the protective structure 138 can be greater than half the total height H1 of the sealing material 140 disposed between the first substrate 100 and the second substrate 200. Therefore, since the size of the gap filler 145 disposed between the protective structure 138 and the second substrate 200 can be reduced, the manufacturing cost can be reduced.

[0080] When the sealing material 140 is applied to join the first substrate 100 and the second substrate 200 together and the joining is performed, pressure can be reduced at the point where the gap filler 145 contacts the protective structure 138. Therefore, a robust structure can be produced that can alleviate the stress applied to the link line (e.g., the third link line 125) when the first substrate 100 and the second substrate 200 are joined together. Furthermore, since the gap filler 145 and the protective structure 138 are arranged to overlap each other in the vertical direction, a separation space between the first substrate 100 and the second substrate 200 can be maintained.

[0081] like Figure 4As shown, multiple gap fillers 145 can be arranged spaced apart from each other on the second structure 137 of the protective structure 138, which has a strip shape. When multiple gap fillers 145 are disposed on a protective structure 138 to contact it via engagement, the pressure applied to the protective structure 138 can be dispersed. Therefore, because the increase in strain caused by the stress applied to the third connecting line 125 disposed below the protective structure 138 can be prevented or suppressed, the occurrence of cracks can be prevented or suppressed.

[0082] Because cracks can be prevented or inhibited from forming in the third connecting line 125, moisture can be prevented from penetrating through the cracks and coming into contact with the third connecting line 125. Therefore, potential corrosion of the third connecting line 125 due to moisture contact can be prevented or inhibited, thereby preventing or inhibiting defects from occurring in the display device. Therefore, the defect rate of the display device caused by corrosion of the connecting lines can be reduced, and the production yield can be improved. Therefore, the production energy required for the additional production of the display device can be reduced, which can lead to the beneficial effect of reducing greenhouse gas emissions.

[0083] Furthermore, by applying a three-link structure that includes first, second, and third link lines set in different layers, multiple link lines can be set within a limited bezel area. Therefore, the resolution of the LCD display can be improved.

[0084] Figure 5 This is a plan view showing a portion of the link area according to another example implementation of this disclosure.

[0085] Figure 5 It can include and Figure 2 The configuration is the same as the first link 105, except for the direction of the second link 115. For example, the first link 105 and the third link 125 on the left side can be set diagonally downwards from the upper left to the lower right. The second link 115 on the left side can be set diagonally upwards from the lower left to the upper right. Similarly, the first link 105 and the third link 125 on the right side can be set diagonally downwards from the upper right to the lower left. The second link 115 on the right side can be set diagonally upwards from the lower right to the upper left. Furthermore, the protective structure 138, including the first structure 135, can be configured to overlap along the shape of the third link 125.

[0086] Figures 6 to 9 This is a diagram illustrating a method for manufacturing a display device according to another exemplary embodiment of the present disclosure.

[0087] like Figure 6As shown, multiple first connection lines 105 can be disposed on the first substrate 100. The first substrate 100 may include glass, but is not limited thereto. Adjacent first connection lines 105 can be arranged to be spaced apart from each other, defining a separation space between them. The first connection lines 105 may include the same conductive material (or metallic material) as the conductive material (or metallic material) of the gate electrode. The multiple first connection lines 105 can be electrically connected to the gate lines respectively. A gate insulating layer 110 may be disposed covering the first connection lines 105. The gate insulating layer 110 may include an inorganic insulating material.

[0088] Multiple second interconnect lines 115 may be disposed on the gate insulating layer 110. The multiple second interconnect lines 115 may be disposed on a different layer than the multiple first interconnect lines 105. The second interconnect lines 115 may be configured such that at least a portion of their area overlaps with the first interconnect lines 105 in the vertical direction. The multiple second interconnect lines 115 may include the same conductive material (or metallic material) as the conductive material (or metallic material) of the source electrode or drain electrode. The multiple second interconnect lines 115 may be electrically connected to data lines respectively. A first planarization layer 120 may be disposed covering the second interconnect lines 115. The first planarization layer 120 may be formed to have a sufficient thickness to planarize one or more steps generated by the underlying circuit elements, and may include an organic insulating material.

[0089] A second planarization layer 123 may be disposed on the first planarization layer 120. The second planarization layer 123 may include an inorganic insulating material. For example, the second planarization layer 123 may include a single layer or multiple layers made of one or more inorganic insulating materials such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0090] Multiple third link lines 125 can be disposed on the second planarization layer 123. Adjacent third link lines 125 can be arranged to be spaced apart from each other, with a separation space defined between them. The multiple third link lines 125 can be disposed on a different layer than the multiple second link lines 115. The third link lines 125 can be configured such that at least a portion of their area overlaps with the second link lines 115 in the vertical direction. The multiple third link lines 125 can include the same conductive material (or metallic material) as the conductive material (or metallic material) of the common electrode.

[0091] A passivation layer 130 may be provided on the third link 125. The passivation layer 130 may include an inorganic insulating material. For example, the passivation layer 130 may include a single layer or multiple layers made of one or more inorganic insulating materials such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0092] Subsequently, one or more openings 131 may be defined in the passivation layer 130. The openings 131 may be defined by removing a portion of the passivation layer 130. The openings 131 may correspond to the area where the third link line 125 is provided. For example, the openings 131 may expose a portion of the surface of the third link line 125. The passivation layer 130 may cover the upper edge of the third link line 125.

[0093] like Figure 7 As shown, a first structure (or first protective structure) 135 can be provided on a portion of the third link line 125 and the passivation layer 130. The first structure 135 can be configured to overlap with the opening 131. Therefore, the first structure 135 can directly contact the exposed surface of the third link line 125. In an example embodiment, the first structure 135 can extend to a portion of the passivation layer 130 while contacting the third link line 125. When viewed in a plan view, the first structure 135 can overlap with the third link line 125 in the vertical direction. For example, when viewed in a plan view, the first structure 135 can overlap with the third link line 125 in a strip shape.

[0094] The first structure 135 may include a material for preventing corrosion of the third link line 125. For example, the first structure 135 may include a metal oxide material for preventing corrosion of the third link line 125. For example, the metal oxide material may include indium tin oxide (ITO) or indium zinc oxide (IZO). The first structure 135 may be made of the same material as the pixel electrode connected to the drain electrode in the display area AA and formed using the same processing.

[0095] like Figure 8 As shown, a second structure (or a second protective structure) 137 can be formed on the first structure 135. The second structure 137 can cover a portion of the passivation layer 130, while also covering the first structure 135. Therefore, the third link line 125 can be protected from potential cracks by the protective structure 138 including the first structure 135 and the second structure 137.

[0096] In a cross-sectional view, the second structure 137 may have a cylindrical shape protruding from the passivation layer 130. The second structure 137 may be made of the same material and formed using the same processing as the columnar spacers disposed in the display area AA. The second structure 137 may be a structure for maintaining a constant cell gap between the first substrate 100 and the second substrate 200. When viewed in a plan view, the second structure 137 may overlap with the first structure 135 in the vertical direction. For example, when viewed in a plan view, the second structure 137 may overlap with the third link line 125 and the first structure 135 in a strip shape.

[0097] The second structure 137 may include an organic insulating material to adjust its height and shape. Inorganic insulating materials may be difficult to achieve the height and shape desired by the second structure 137. For example, the second structure 137 may be made of acrylic acid (PAC), polyimide (PI), etc., but is not limited to these.

[0098] like Figure 9 As shown, a second substrate 200 is disposed at a position facing the first substrate 100. In the region corresponding to the display area AA of the second substrate 200, a color filter layer (not shown) corresponding to a plurality of pixels can be disposed. The second substrate 200 may include an outer coating layer 150. A decorative layer 165 surrounding a border region may be disposed between the second substrate 200 and the outer coating layer 150, but this disclosure is not limited to this. For example, a black matrix may instead be disposed at the position shown where the decorative layer 165 is disposed.

[0099] The first substrate 100 and the second substrate 200 can be joined together by a sealing material 140 including a gap filler 145. For example, the sealing material 140 may include an adhesive organic material, such as silicone, polyurethane, epoxy resin, or acrylic. The gap filler 145 may include silica particles, glass fibers, or ceramic particles, but is not limited to these.

[0100] When pressure is applied to join the first substrate 100 and the second substrate 200 together, the gap filler 145 helps maintain a separation space (gap) between the first substrate 100 and the second substrate 200. The gap filler 145 can be disposed between the second structure 137 of the protective structure 138 and the outer coating 150. Therefore, the size of the gap filler 145 can be adjusted based on the vertical dimension between the second structure 137 and the outer coating 150. Thus, a gap filler 145 with a relatively smaller size than the gap filler typically disposed between the first substrate 100 and the second substrate 200 can be used, thereby reducing manufacturing costs.

[0101] Figure 10 and Figure 11 This is a diagram illustrating a display device according to yet another exemplary embodiment of the present disclosure. Figure 10 and Figure 11 In, with Figure 3 and Figure 4 The same components may be assigned the same reference numerals. Therefore, redundant descriptions will be omitted or simplified, and different parts will be described.

[0102] like Figure 10 and Figure 11As shown, multiple protective structures 138, including a first structure (or first protective structure) 135 and a second structure (or second protective structure) 137, can be provided in the link region LKA on the first substrate 100 to protect multiple third link lines 125. The multiple protective structures 138 can be arranged to correspond to the multiple third link lines 125 respectively.

[0103] The second link 115 and the first link 105 may be disposed on different layers below the third link 125. In an example embodiment, the third link 125 may be electrically connected to the second link 115 via a connection electrode extending through the second planarization layer 123 and the first planarization layer 120. Additionally, the second link 115 may be electrically connected to the first link 105 via another connection electrode extending through the gate insulating layer 110. The first link 105 may extend from the link region LKA to the pad region PDA electrically connected to the flexible circuit board 102.

[0104] A lower alignment film 155-2 can be provided on the passivation layer 130 of the first substrate 100 so as not to overlap with the sealing material 140. Alternatively, an upper alignment film 155-1 can be provided below the outer coating layer 150 of the second substrate 200. A liquid crystal layer LC can be filled between the upper alignment film 155-1 and the lower alignment film 155-2. A black matrix 160 can be provided between the outer coating layer 150 on which the upper alignment film 155-1 is provided and the second substrate 200, making the various metal lines invisible to the user. A decorative layer 165 surrounding the border area can be provided between the second substrate 200 and the outer coating layer 150 corresponding to the portion where the sealing material 140 is provided, but this disclosure is not limited to this. For example, the black matrix can instead be provided at the location shown where the decorative layer 165 is provided.

[0105] Multiple auxiliary structures 139 may be disposed on the second substrate 200. The auxiliary structures 139 may be formed on the outer coating 150 of the second substrate 200 to align with the location where the protective structure 138 is disposed. For example, the auxiliary structure 139 may have a surface facing the protective structure 138 and a shape protruding from the outer coating 150 of the second substrate 200. For example, the auxiliary structure 139 may comprise the same material as the second structure 137. For example, the auxiliary structure 139 may be made of an organic insulating material including acrylic acid (PAC) or polyimide (PI). However, the material is not limited to these. The overall thickness of the protective structure 138 may be equal to or greater than the overall thickness of the auxiliary structure 139.

[0106] Multiple auxiliary structures 139 can be arranged such that one surface of the auxiliary structure 139 faces one surface of the protective structure 138. Therefore, when the sealing material 140 is applied to bond the first substrate 100 and the second substrate 200 to each other and the bonding is performed, pressure can be reduced at the point of contact between the auxiliary structure 139 and the protective structure 138. Furthermore, since the auxiliary structure 139 and the protective structure 138 are arranged to overlap each other in the vertical direction, a separation space between the first substrate 100 and the second substrate 200 can be maintained. Therefore, manufacturing costs can be reduced because gap fillers (e.g., gap filler 145) in the sealing material 140 can be removed.

[0107] like Figure 11 As shown, multiple auxiliary structures 139 can be arranged spaced apart from each other on a protective structure 138 having a strip shape. When multiple auxiliary structures 139 are disposed on a protective structure 138 to contact it through engagement, the pressure applied to the protective structure 138 can be dispersed. Therefore, because the increase in strain caused by the stress applied to the third connecting line 125 disposed below the protective structure 138 can be prevented or suppressed, the occurrence of cracks can be prevented or suppressed.

[0108] The display device according to various exemplary embodiments of the present disclosure can be described as follows.

[0109] A display device according to an embodiment of the present disclosure includes: a first substrate including a display area and a non-display area surrounding the display area; a second substrate facing the first substrate; a plurality of link lines disposed in the non-display area of ​​the first substrate at different distances from the second substrate; a plurality of protective structures respectively located on the link lines closest to the second substrate; a plurality of shock-absorbing structures respectively located between the second substrate and the plurality of protective structures; and a sealing material surrounding the plurality of shock-absorbing structures in the non-display area between the first substrate and the second substrate.

[0110] According to various embodiments of this disclosure, the plurality of link lines may include: a first link line on a first substrate; a second link line above the first link line; and a third link line above the second link line, wherein the third link line is closest to the second substrate among the plurality of link lines, and wherein each of the plurality of protective structures is on a corresponding third link line among the third link lines.

[0111] According to various embodiments of this disclosure, each of the plurality of protection structures may include: a first protection structure in direct contact with the corresponding third link line; and a second protection structure on the first protection structure.

[0112] According to various embodiments of this disclosure, the second protective structure may have a width greater than that of the first protective structure.

[0113] According to various embodiments of this disclosure, the third link may include a conductive metal material, the first protective structure may include a metal oxide material, and the second protective structure may include an organic insulating material.

[0114] According to various embodiments of this disclosure, the display device may further include a passivation layer on the third link line, the passivation layer having an opening that exposes the top surface of the corresponding third link line. A first protective structure may contact the top surface of the corresponding third link line. A second protective structure may completely cover the upper and side surfaces of the first protective structure and may also cover a portion of the passivation layer.

[0115] According to various embodiments of this disclosure, the second protective structure may have a cylindrical shape protruding from the passivation layer toward the second substrate.

[0116] According to various embodiments of this disclosure, in a plan view: the first link line, the second link line, and the third link line may include a first group of first link lines, second link lines, and third link lines disposed on the left side of the non-display area and a second group of first link lines, second link lines, and third link lines disposed on the right side of the non-display area; each first link line, each second link line, and each third link line in the first group may extend diagonally between the upper left end and the lower right end on the left side of the non-display area; and each first link line, each second link line, and each third link line in the second group may extend diagonally between the upper right end and the lower left end on the right side of the non-display area.

[0117] According to various embodiments of this disclosure, in a plan view: the first link line, the second link line, and the third link line may include a first group of first link lines, second link lines, and third link lines disposed on the left side of the non-display area and a second group of first link lines, second link lines, and third link lines disposed on the right side of the non-display area; each first link line and each third link line in the first group may extend diagonally between the upper left end and the lower right end of the left side of the non-display area, and each second link line in the first group may extend diagonally between the lower left end and the upper right end of the left side of the non-display area; and each first link line and each third link line in the second group may extend diagonally between the upper right end and the lower left end of the right side of the non-display area, and each second link line in the second group may extend diagonally between the lower right end and the upper left end of the right side of the non-display area.

[0118] According to various embodiments of this disclosure, the display device may further include: a gate electrode, a source electrode, a drain electrode, and a common electrode in a display region of a first substrate; a first insulating layer between a first link line and a second link line; and a second insulating layer between a second link line and a third link line. The first link line may include the same material as the gate electrode, the second link line may include the same material as the source electrode or the drain electrode, and the third link line may include the same material as the common electrode.

[0119] According to various embodiments of this disclosure, each of the plurality of damping structures may include a gap filler or an auxiliary structure. The gap filler may include silica particles, glass fiber, or ceramic particles, and the auxiliary structure may protrude from the second substrate to face a corresponding protective structure among the plurality of protective structures and may include an organic insulating material. Furthermore, the plurality of damping structures may include more than one auxiliary structure disposed on a protective structure to distribute the pressure applied to the protective structure.

[0120] In another aspect, a display device according to an exemplary embodiment of the present disclosure may include: a first substrate including a display area and a non-display area surrounding the display area; a second substrate overlapping the first substrate; a plurality of link lines in the non-display area of ​​the first substrate, the plurality of link lines being disposed at different distances from the second substrate; a protective structure on the link line closest to the second substrate among the plurality of link lines; and at least one shock-absorbing structure between the protective structure and the second substrate.

[0121] According to various embodiments of this disclosure, the plurality of link lines may include: a first link line on a first substrate; a second link line above the first link line; and a third link line above the second link line, wherein the third link line may be closest to the second substrate among the plurality of link lines, and the protective structure may be on the third link line.

[0122] According to various embodiments of this disclosure, the protection structure may include: a first protection structure that is in direct contact with the third link line; and a second protection structure that covers the first protection structure.

[0123] According to various embodiments of this disclosure, the third link may include a conductive metal material, the first protective structure may include a metal oxide material, and the second protective structure may include an organic insulating material.

[0124] According to various embodiments of this disclosure, the display device may further include: a passivation layer on the third link line and having an opening that exposes the top surface of the third link line, wherein the first protective structure can contact the top surface of the third link line. The second protective structure may have a width greater than that of the first protective structure, and may completely cover the upper and side surfaces of the first protective structure and may also cover a portion of the passivation layer.

[0125] According to various embodiments of this disclosure, the second protective structure may have a cylindrical shape protruding from the passivation layer toward the second substrate.

[0126] According to various embodiments of this disclosure, the display device may further include: a gate electrode, a source electrode, a drain electrode, and a common electrode in a display region of a first substrate; a first insulating layer between a first link line and a second link line; and a second insulating layer between a second link line and a third link line. The first link line may include the same material as the gate electrode, the second link line may include the same material as the source electrode or the drain electrode, and the third link line may include the same material as the common electrode.

[0127] According to various embodiments of this disclosure, the display device may further include: a first insulating layer between the first connecting line and the second connecting line; and a second insulating layer between the second connecting line and the third connecting line. The second connecting line may be electrically connected to the first connecting line via a first contact hole passing through the first insulating layer, and the third connecting line may be electrically connected to the second connecting line via a second contact hole passing through the second insulating layer.

[0128] According to various embodiments of the present disclosure, the display device may further include: a sealing material surrounding at least one damping structure in a non-display area between a first substrate and a second substrate, wherein the at least one damping structure may include a plurality of spherical gap fillers or a plurality of cylindrical auxiliary structures.

[0129] Although some exemplary embodiments of this disclosure have been described above with reference to the accompanying drawings, this disclosure is not limited to these exemplary embodiments and can be implemented in various different forms. Those skilled in the art to which this disclosure pertains will understand that this disclosure can be implemented in other specific forms without departing from the technical concept, spirit, or characteristics of this disclosure. Therefore, it should be understood that the exemplary embodiments described above are not limiting but illustrative in all respects.

Claims

1. A display device, comprising: A first substrate includes a display area and a non-display area surrounding the display area; A second substrate facing the first substrate; Multiple link lines are disposed in the non-display area of ​​the first substrate, and the multiple link lines are disposed at different distances from the second substrate; Multiple protective structures are respectively located on the link line closest to the second substrate among the multiple link lines; Multiple shock-absorbing structures are respectively located between the second substrate and the multiple protective structures; as well as A sealing material surrounds the plurality of damping structures in the non-display area between the first substrate and the second substrate.

2. The display device according to claim 1, wherein, The multiple connection lines include: The first link line on the first substrate; The second link line above the first link line; and The third link above the second link, Among the plurality of link lines, the third link line is closest to the second substrate, and Each of the plurality of protection structures is located on the corresponding third link line in the third link line.

3. The display device according to claim 2, wherein, Each of the plurality of protective structures includes: The first protective structure that is in direct contact with the corresponding third link line; and A second protective structure on top of the first protective structure.

4. The display device according to claim 3, wherein, The second protective structure has a width greater than that of the first protective structure.

5. The display device according to claim 3, wherein, The third link line comprises a conductive metal material, the first protective structure comprises a metal oxide material, and the second protective structure comprises an organic insulating material.

6. The display device according to claim 3, further comprising a passivation layer on the third link line, the passivation layer having an opening that exposes the top surface of the corresponding third link line. in, The first protective structure contacts the top surface of the corresponding third connecting line, and The second protective structure completely covers the upper and side surfaces of the first protective structure and also covers a portion of the passivation layer.

7. The display device according to claim 6, wherein, The second protective structure has a columnar shape that protrudes from the passivation layer toward the second substrate.

8. The display device according to claim 2, wherein, In the plan view: The first link, the second link, and the third link include a first group of first link, second link, and third link disposed on the left side of the non-display area and a second group of first link, second link, and third link disposed on the right side of the non-display area; Each of the first, second, and third link lines in the first group extends diagonally between the upper left and lower right ends of the left side of the non-display area; and Each of the first, second, and third link lines in the second group extends diagonally between the upper right and lower left ends on the right side of the non-display area.

9. The display device according to claim 2, wherein, In the plan view: The first link, the second link, and the third link include a first group of first link, second link, and third link disposed on the left side of the non-display area and a second group of first link, second link, and third link disposed on the right side of the non-display area; Each first link and each third link in the first group extends diagonally between the upper left and lower right ends of the left side of the non-display area, and each second link in the first group extends diagonally between the lower left and upper right ends of the left side of the non-display area; and Each first link and each third link in the second group extends diagonally between the upper right and lower left ends of the right side of the non-display area, and each second link in the second group extends diagonally between the lower right and upper left ends of the right side of the non-display area.

10. The display device according to claim 2, further comprising: The gate electrode, source electrode, drain electrode, and common electrode in the display area of ​​the first substrate; A first insulating layer between the first connecting line and the second connecting line; as well as A second insulating layer between the second link line and the third link line. The first link wire is made of the same material as the gate electrode. The second link wire comprises the same material as the source electrode or the drain electrode, and The third link line is made of the same material as the common electrode.

11. The display device according to claim 1, wherein: Each of the plurality of damping structures includes a gap filler, the gap filler comprising silica particles, glass fiber or ceramic particles; or Each of the plurality of damping structures includes an auxiliary structure that protrudes from the second substrate to face a corresponding protective structure among the plurality of protective structures, and includes an organic insulating material.

12. The display device according to claim 1, wherein, The plurality of damping structures include more than one auxiliary structure disposed on a protective structure to distribute the pressure applied to the protective structure.

13. A display device, comprising: A first substrate includes a display area and a non-display area surrounding the display area; A second substrate overlapping the first substrate; Multiple link lines in the non-display area of ​​the first substrate are respectively disposed at different distances from the second substrate; A protective structure, located on the link line closest to the second substrate among the plurality of link lines; and At least one shock-absorbing structure is located between the protective structure and the second substrate.

14. The display device according to claim 13, wherein, The multiple connection lines include: The first link line on the first substrate; The second link line above the first link line; and The third link above the second link, The third link line is the closest to the second substrate among the plurality of link lines, and the protective structure is located on the third link line.

15. The display device according to claim 14, wherein, The protective structure includes: The first protective structure that is in direct contact with the third link line; and A second protective structure that covers the first protective structure.

16. The display device according to claim 15, wherein, The third link line comprises a conductive metal material, the first protective structure comprises a metal oxide material, and the second protective structure comprises an organic insulating material.

17. The display device according to claim 15, further comprising: A passivation layer is provided on the third link line and has an opening that exposes the top surface of the third link line. Wherein, the first protective structure contacts the top surface of the third connecting line, and The second protective structure has a width greater than that of the first protective structure, and the second protective structure completely covers the upper and side surfaces of the first protective structure and a portion of the passivation layer.

18. The display device according to claim 17, wherein, The second protective structure has a columnar shape that protrudes from the passivation layer toward the second substrate.

19. The display device according to claim 14, further comprising: The gate electrode, source electrode, drain electrode, and common electrode in the display area of ​​the first substrate; A first insulating layer between the first connecting line and the second connecting line; as well as A second insulating layer between the second link line and the third link line. The first link wire is made of the same material as the gate electrode. The second link wire comprises the same material as the source electrode or the drain electrode, and The third link line is made of the same material as the common electrode.

20. The display device according to claim 14, further comprising: A first insulating layer between the first connecting line and the second connecting line; as well as A second insulating layer between the second link line and the third link line. The second connecting wire is electrically connected to the first connecting wire via a first contact hole passing through the first insulating layer, and The third link wire is electrically connected to the second link wire via a second contact hole that passes through the second insulating layer.

21. The display device according to claim 13, further comprising: A sealing material surrounds the at least one damping structure in the non-display area between the first substrate and the second substrate. The at least one damping structure includes multiple spherical gap fillers or multiple cylindrical auxiliary structures.

Images