A kind of mixing light module and passive optical network system

Abstract

The application discloses a kind of mixing light module and passive optical network system, mixing light module includes shell assembly, light emitting receiving component being arranged in shell assembly, light emitting receiving component is equipped with optical port and lens, and is integrated with emitting unit and receiving unit.Emitting unit includes multiple laser assembly and wave combining component, and multiple optical signals are output from optical port after wave combining.Receiving unit includes wave separating optical separating component, first detection component and second detection component, wave separating optical separating component receives mixed frequency optical signal input from optical port, first, receive waveband and emission waveband are separated, then the optical signal of receive waveband is divided into first light beam and second light beam according to optical power, and first light beam and second light beam are respectively incident to two detection components in opposite directions.The application solves the technical problem that multiple system PON uplink signal cannot be independently separated by wavelength selective filter due to wavelength overlap by receiving mode of first wave separation and then light separation.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to a mixing optical module and a passive optical network system. Background Technology

[0002] With the deployment of 50G TDM-PON technology, multiple terminal devices of different standards, such as EPONONU, 10G EPON ONU, and 50G PON ONU, need to be simultaneously mounted on the same optical distribution network (ODN). Among them, the uplink wavelength range of EPON is 1260nm~1360nm, covering the uplink wavelength of 10G EPON (1270nm±10nm) and 50G PON (1286nm±2nm), resulting in a large overlap of the uplink wavelengths of the three in the 1260nm~1360nm range.

[0003] In existing technologies, optical modules in optical line terminals (OLTs) typically use wavelength-selective filters to direct uplink signals of different standards to different photodetectors. However, when the uplink wavelength ranges of these multiple standards overlap significantly, no wavelength-selective filter can effectively separate them, rendering the aforementioned wavelength-separation-based receiving schemes inapplicable.

[0004] Therefore, there is an urgent need for an optical module solution that can reliably receive uplink mixing signals from multiple PON systems with overlapping wavelength ranges. Summary of the Invention

[0005] The purpose of this invention is to provide a mixing optical module that solves the technical problem that traditional wavelength selective filtering schemes cannot effectively separate uplink signals of multiple PON systems when there is wavelength overlap, while achieving compatible integration of multi-rate transmission and multi-system mixing reception in a miniaturized package.

[0006] To achieve the above objectives, the present invention provides a mixing optical module, comprising: Housing assembly; A light emitting and receiving component is disposed within the housing assembly, the light emitting and receiving component having a light port and a lens located inside the light port; The transmitting unit, which is disposed within the optical transmitting and receiving component, includes multiple laser components and a beam combiner disposed on the output side of the multiple laser components. The optical signals emitted by the multiple laser components are combined by the beam combiner and output from the optical port. The receiving unit, which is disposed within the optical transmitting and receiving component, includes a wavelength division multiplexing (WDM) component, a first detection component, and a second detection component. The WDM component is disposed on the optical path between the optical port and the first detection component and the second detection component. The wavelength division multiplexing (WDM) component receives a mixed optical signal input from the optical port, wherein the mixed optical signal includes at least two different optical signals with overlapping wavelength ranges. After the wavelength division and beam splitting component separates the receiving band and the transmitting band in the mixed optical signal, it divides the optical signal of the receiving band into a first beam and a second beam according to the optical power. The first beam and the second beam are incident on the first detection component and the second detection component in opposite directions, respectively.

[0007] Furthermore, the wavelength division multiplexing (WDM) component includes: Wavelength division multiplexing element is used to transmit optical signals within the transmit band and reflect optical signals within the receive band. A beam splitter is used to divide the received wavelength optical signal reflected by the beam splitter into the first beam and the second beam according to optical power.

[0008] Furthermore, the wavelength division multiplexing (WDM) component also includes a substrate, a silicon parallel plate, a glass parallel plate disposed on the substrate, and a plurality of reflective filters; The silicon parallel plate is disposed in the optical path between the lens and the wave splitter element, and the glass parallel plate is disposed between the silicon parallel plate and the wave splitter element; Multiple reflective filters are distributed on both sides of the output optical path of the beam splitter to guide the first beam to the first detection component and the second beam to the second detection component.

[0009] Furthermore, the light incident angle of the silicon parallel plate is set to 30±3°; The silicon parallel plate causes the light beam to undergo a spatial translation along a first direction. This spatial translation is equal in amount and opposite in direction to the spatial translation along a second direction that occurs after the light beam passes through the wave-splitting element and the glass parallel plate.

[0010] Furthermore, the light incident angle of the wavelength division element is 8±3°, which is used to transmit light in the 1340nm to 1580nm band and reflect light in the 1260nm to 1330nm band.

[0011] Furthermore, the beam splitter is a 50:50 beam splitter with a light incident angle of 8±3°, used to split the optical signal of the received band into a first beam and a second beam according to the optical power.

[0012] Furthermore, the plurality of laser components are configured in three groups, which are respectively used to emit data optical signals at three rates: 50G, 10G and 1.25G; The beam combining component includes end lens groups and filter groups disposed on each of the lasers. The light emitted by each laser component is shaped into parallel light by the corresponding end lens group and then combined into a beam by the filter group.

[0013] Furthermore, the transmitting unit also includes an isolator and an orthorhombic prism disposed on the beam combining optical path; The combined light is shifted through the rhomboid prism and then incident on the wavelength division and beam splitting assembly through the isolator. After passing through the wavelength division element, the combined light is coupled into the optical fiber in the optical port through the lens.

[0014] Furthermore, it also includes an insulating insert disposed in the contact area between the light emitting and receiving component and the housing assembly.

[0015] The present invention also provides a passive optical network system, including an optical line terminal and multiple standard optical network units connected to the optical line terminal via an optical distribution network; the optical line terminal is provided with a mixing optical module as described above; the multiple standard optical network units include a 50G PON optical network unit and an EPON optical network unit, wherein the uplink wavelength range of the 50G PON optical network unit falls within the uplink wavelength range of the EPON optical network unit.

[0016] The mixing optical module provided in this application solves the technical problem that multi-standard PON uplink mixing signals cannot be independently separated by wavelength selective filters due to wavelength overlap by adopting a "wavelength division first, then beam splitting" receiving strategy in the wavelength division and beam splitting component. It first separates the receiving band from the transmitting band, and then evenly distributes the receiving band optical signals with overlapping wavelengths to two detection components according to optical power. At the same time, the transmitting unit and the receiving unit share the same optical port and lens. The transmitting optical path is directly coupled out of the optical port through the lens after being transmitted through the wavelength division element, which is conducive to realizing the integration of multi-channel transmission and mixing reception functions within a miniaturized package size. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram illustrating an application scenario of a mixing optical module provided in an embodiment of this application; Figure 2 This is a schematic diagram of the overall structure of a mixing optical module provided in an embodiment of this application; Figure 3An exploded view of a mixing optical module provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an optical transmitting and receiving component provided in an embodiment of this application; Figure 5 An exploded view of an optical transmitting and receiving component provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a wavelength division multiplexing (WDM) component provided in an embodiment of this application; Figure 7 A schematic diagram of a mixing optical path provided in an embodiment of this application; Figure 8 This is a schematic diagram of a cover plate structure for an optical transmitting and receiving component provided in an embodiment of this application.

[0019] 1. Housing assembly; 2. Insulating insert; 3. Light emitting and receiving components; 4. Circuit board; 5. Connecting flexible board; 6. Hook; 7. Spring assembly; 8. Screw assembly; 301. Housing assembly; 302. First detection assembly; 303. Second detection assembly; 304. Ceramic substrate; 305. Optical port; 306. Optical port adjustment ring; 307. First cover plate; 308. Second cover plate; 309. First laser assembly; 310. Second laser assembly; 311. Third laser assembly; 312. Semiconductor cooler; 313. Wavelength splitter assembly; 314. Lens; 315. Isolator; 316. Orthographic prism; 317. Filter group; 318. End lens group; 31301, Silicon parallel plate; 31302, Wavelength splitter; 31303, Beam splitter; 31304, First reflective filter; 31305, Second reflective filter; 31306, Third reflective filter; 31307, Fourth reflective filter; 31308, Fifth reflective filter; 31309, Glass parallel plate; 31310, Substrate. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0021] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms "a" and "the" as used in this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0022] To clearly understand the mixing optical module and passive optical network system provided in the embodiments of this application, the relevant application scenarios are described below. Please refer to... Figure 1 The mixing optical module provided in this embodiment is applied to OLT equipment. In this passive optical network system, the optical line terminal is connected to optical network units of various standards through an optical distribution network. The various optical network units include 50G PON ONU, symmetric 10G EPON ONU, asymmetric 10G EPON ONU, and EPON ONU.

[0023] In this application scenario, the uplink transmission wavelength range of the EPON ONU is 1260nm to 1360nm, covering the uplink wavelength of 1286nm±2nm for the 50G PON ONU and 1270nm±10nm for the 10G EPON ONU. The uplink wavelength range of the 50G PON optical network unit falls within the uplink wavelength range of the EPON optical network unit. The uplink wavelengths of the three standards largely overlap within the 1260nm to 1360nm range, making it impossible to guide them separately to different photodetectors using wavelength-selective filters.

[0024] To address the aforementioned problems, this application provides a mixing optical module. Please refer to [link to relevant documentation]. Figure 2 and Figure 3 The mixing optical module in this embodiment adopts an SFP DD package and includes a housing assembly 1, an insulating insert 2, an optical transmitting and receiving component 3, a circuit board 4, a connecting flexible board 5, a hook 6, a spring group 7, and a screw group 8.

[0025] The housing assembly 1 consists of an upper housing and a lower housing, which are fastened together by screws 8, providing mechanical support, electromagnetic shielding and heat dissipation environment for the optical module.

[0026] Circuit board 4 is a rigid circuit board, on which a soft-start chip, a Buck power chip, a negative voltage chip, a Boost power chip, a laser driver chip, an MCU chip, and electronic components such as resistors, capacitors, inductors, ferrite beads, and diodes are mounted. The end surface of circuit board 4 has gold fingers for insertion into the electrical connector of the host computer to achieve electrical connections such as power supply, signal transmission, and grounding.

[0027] The optical transmitting and receiving component 3 is disposed within the cavity of the housing assembly 1 and is electrically connected to the circuit board 4 via a connecting flexible plate 5. The connecting flexible plate 5 has three welding areas, which are respectively connected to the three-in-one flexible plate of the transmitting unit and the two flexible plates of the receiving unit, thereby realizing the electrical signal transmission between the active devices inside the optical transmitting and receiving component 3 and the circuit board 4.

[0028] The latch 6 is used to secure the optical transmitting and receiving component 3 within the housing assembly 1. The spring clip group 7 is located on the outer surface of the housing assembly 1 and is used to provide EMC protection for the optical module.

[0029] An insulating insert 2 is disposed in the contact area between the light emitting and receiving component 3 and the housing assembly 1. Exemplarily, the insulating insert 2 is made of polyimide, engineering plastic, or other polymer insulating materials. The insulating insert 2 is used to block unnecessary current paths between the light emitting and receiving component 3 and the metal housing assembly 1, achieving ground isolation.

[0030] It should be noted that traditional ground isolation designs typically employ a separate isolation substrate or add extra isolation space, which significantly increases the size of the optical module in the thickness direction. This embodiment replaces the traditional design with a thin-film insulating insert 2, achieving both ground isolation and EMC protection without increasing the size of the optical module, effectively avoiding the size contradictions caused by the ground isolation design in traditional solutions.

[0031] Please see Figure 4 and Figure 5 The light transmitting and receiving component 3 is the core module of the optoelectronic device, including a housing assembly 301, a first detection assembly 302, a second detection assembly 303, a ceramic substrate 304, an optical port 305, an optical port adjustment ring 306, a first cover plate 307, a second cover plate 308, a first laser assembly 309, a second laser assembly 310, a third laser assembly 311, a semiconductor cooler 312, a wavelength division and beam splitting assembly 313, a lens 314, an isolator 315, an orthographic prism 316, a filter group 317, and a laser end lens group 318.

[0032] The housing assembly 301 forms the cavity structure of the light transmitting and receiving component 3. In this embodiment, the transmitting end of the housing assembly 301 is hermetically sealed to ensure the reliability of the laser chip, while the receiving end is a non-hermetic cavity to house the detection component and passive optical devices. The first cover plate 307 and the second cover plate 308 respectively seal the openings in corresponding areas of the housing assembly 301. Please refer to... Figure 8 The structure of the cover plate can be adapted to the spatial layout and heat dissipation requirements.

[0033] An optical port 305 is located at one end of the housing assembly 301 and is used to connect to an external optical fiber. An optical port adjustment ring 306 is located outside the optical port 305 and is used to adjust the positional accuracy of the optical port. A lens 314 is located inside the optical port 305, in the optical path between the optical port 305 and the wavelength division multiplexing assembly 313, and is used to perform beam conversion on the light entering or exiting through the optical port 305.

[0034] It is understood that in this embodiment, the transmitting unit and the receiving unit share the same optical port 305 and lens 314. The uplink mixed optical signal input from the optical port 305 is shaped into parallel light by the lens 314 and then enters the wavelength division multiplexing (WDM) component 313. The combined light output from the transmitting unit is transmitted through the WDM component 313 and then converted into converging light by the lens 314 before being coupled into the optical fiber. This shared optical port design enables high spatial integration of the transmitting and receiving optical paths, which helps to reduce the overall size of the optical transmitting and receiving components 3 and meets the space constraints of the SFP DD package.

[0035] Please see Figure 5 The transmitting unit is integrated into the airtight cavity of the housing assembly 301, including a first laser assembly 309, a second laser assembly 310, a third laser assembly 311, a semiconductor cooler 312 (TEC), a laser end lens group 318, a filter group 317, an isolator 315, and an orthorhombic prism 316.

[0036] In one embodiment of this application, multiple laser components are arranged in three groups: a first laser component 309, a second laser component 310, and a third laser component 311. All three groups of laser components are mounted on a semiconductor cooler 312. The semiconductor cooler 312 provides a unified temperature control environment for the three laser components, ensuring the wavelength stability of each laser within its operating temperature range.

[0037] For example, in one specific embodiment, the first laser component 309 is used to emit downlink data light with a center wavelength of approximately 1342 nm and a rate of 49.7664 Gbps for 50G PON downlink signals; the second laser component 310 is used to emit downlink data light with a center wavelength of approximately 1490 nm and a rate of 1.25 Gbps for EPON downlink signals; and the third laser component 311 is used to emit downlink data light with a center wavelength of approximately 1577 nm and a rate of 10.3125 Gbps for 10G EPON downlink signals. That is, the three sets of laser components are used to emit data light signals at rates of 50G, 1.25G, and 10G, respectively.

[0038] It should be noted that the wavelength and rate values ​​mentioned above are only examples of a typical application scenario. Those skilled in the art can select appropriate laser wavelength and rate configurations according to the actual network standard requirements.

[0039] The beam combiner includes a laser-end lens group 318 and a filter group 317. Each laser assembly has a corresponding laser-end lens group 318 at its output end, used to shape the diverging light emitted by the laser assembly into parallel light. The three parallel beams are combined into a single beam by the filter group 317.

[0040] For example, the filter group 317 uses a thin-film filter to combine three optical signals of different wavelengths by selecting the transmission / reflection characteristics of each wavelength optical signal.

[0041] It should be noted that in other embodiments, the filter group 317 may also use an arrayed waveguide grating or other wavelength division multiplexing devices to achieve the multiplexing function, and this application does not make specific limitations on this.

[0042] The combined beam undergoes spatial translation of its optical path via the rhomboid prism 316. The function of the rhomboid prism 316 is to translate the optical axis of the combined beam to a position aligned with the optical axis of the aperture lens 314, thereby ensuring the efficiency of subsequent fiber coupling. The translated beam then passes through the isolator 315, which prevents reflected light returning from the direction of the aperture 305 from entering the laser, protecting the laser from backlight interference.

[0043] The beam output from isolator 315 is incident on wavelength division multiplexing (WDM) assembly 313. Since the three emission wavelengths (1342nm, 1490nm, and 1577nm) all fall within the transmission range (1340nm–1580nm) of wavelength division multiplexing element 31302, the combined beam passes directly through WDM element 31302, and then through glass parallel plate 31309 and silicon parallel plate 31301 before reaching lens 314. Lens 314 converts the parallel beam into converging beam, which is then focused onto the end face of the optical fiber in optical port 305, completing the fiber coupling of the emission path.

[0044] It should be noted that the beam in the transmitting optical path undergoes spatial translation when passing through the silicon parallel plate 31301 and the glass parallel plate 31309. This translation is compensated by a pre-performed reverse translation by the rhomboid prism 316, ensuring that the optical axis reaching the lens 314 is precisely aligned with the optical axis of the fiber in the optical port 305. This displacement compensation mechanism shares the same set of optical elements as the displacement compensation in the subsequent receiving optical path, and will be explained together here.

[0045] Combination Figure 6 and Figure 7 The receiving unit is disposed in the non-airtight cavity of the housing assembly 301, and includes a wavelength division and beam splitting assembly 313, a first detection assembly 302, and a second detection assembly 303.

[0046] In the application scenario of this embodiment, the received uplink mixed optical signal includes uplink optical signals of the following formats: 50GPON uplink optical signal, with a rate of 24.8832Gbps and a wavelength of 1286nm±2nm; 10G EPON uplink optical signal, with a rate of 10.3125Gbps and a wavelength of 1270nm±10nm; and EPON uplink optical signal, with a rate of 1.25Gbps and a wavelength of 1310nm±20nm or 1310nm±50nm.

[0047] It is understandable that the uplink wavelengths of these three systems all fall within the range of 1260nm to 1360nm and overlap significantly, which is typical of mixed optical signals. After the uplink mixed optical signal is input from the optical fiber in the optical port 305, it is shaped into parallel light by the lens 314 and then enters the wavelength division multiplexing (WDM) component 313 for processing.

[0048] Please see Figure 7 The wavelength division multiplexing (WDM) beam splitter assembly 313 is mounted entirely on the substrate 31310. The substrate 31310 is made of glass or ceramic, providing a stable mounting reference for the various optical components on it. The WDM beam splitter assembly 313 includes a silicon parallel plate 31301, a wavelength division multiplexing element 31302, a beam splitter element 31303, a first reflective filter 31304, a second reflective filter 31305, a third reflective filter 31306, a fourth reflective filter 31307, a fifth reflective filter 31308, a glass parallel plate 31309, and the substrate 31310.

[0049] In one embodiment of this application, a silicon parallel plate 31301 is disposed in the optical path between the lens 314 and the beam splitter 31302, and the light incident angle is set to 30±3°. The function of the silicon parallel plate 31301 is to cause the light beam to undergo a spatial translation along a first direction (horizontal direction). This spatial translation is equal to, but opposite in direction to, the spatial translation along a second direction generated when the light beam subsequently passes through the beam splitter 31302 and the glass parallel plate 31309, so that the overall translation of the light beam after passing through the beam splitter assembly 313 is zero.

[0050] Understandably, this displacement compensation mechanism ensures that when the transmitting and receiving optical paths share the same optical port 305 and lens 314, their respective optical axes can be precisely aligned without the need for an additional alignment adjustment mechanism in the optical path. Without this displacement compensation mechanism, the received light input from the optical port 305 will experience cumulative spatial translation after passing through the optical elements in the wavelength division and beam splitting assembly 313, causing the beam to fail to accurately strike the photosensitive surface of the detector assembly, resulting in a significant decrease in coupling efficiency.

[0051] It should be noted that silicon has good transmittance and high refractive index (about 3.5) in the 1260nm to 1580nm wavelength range, which enables the silicon parallel plate 31301 to generate sufficient beam shift under relatively small thickness and incident angle conditions.

[0052] The glass parallel plate 31309 is disposed between the silicon parallel plate 31301 and the wave splitter 31302, and cooperates with the silicon parallel plate 31301 to participate in the beam translation compensation process.

[0053] In one embodiment of this application, the wavelength division multiplexing element 31302 is a filter with a light incident angle of 8±3° and wavelength selectivity characteristics of transmitting light in the 1340nm to 1580nm band and reflecting light in the 1260nm to 1330nm band. The wavelength division multiplexing element 31302 is used to perform band separation between the receiving band and the transmitting band.

[0054] Specifically, in the uplink mixed optical signal, light belonging to the receiving band (range of 1260nm to 1330nm) is reflected by the wavelength division multiplexing element 31302, while light belonging to the transmitting band (range of 1340nm to 1580nm) passes through the wavelength division multiplexing element 31302.

[0055] It is understandable that the three downlink beams (1342nm, 1490nm, 1577nm) emitted by the transmitting unit are emitted through this transmission path of the wavelength division multiplexing element 31302, thereby realizing the band separation and spatial multiplexing of the transmitting and receiving optical paths.

[0056] The received wavelength light, reflected by the wavelength division element 31302, reaches the beam splitter 31303. In one embodiment of this application, the beam splitter 31303 is a 50:50 beam splitter with a light incident angle of 8±3°, used to divide the received wavelength optical signal into a first beam and a second beam according to optical power. The first beam is a transmitted beam, and the second beam is a reflected beam, which are emitted in opposite directions.

[0057] Understandably, replacing wavelength-selective filters with power-equalizing beam splitters is the core strategy of this application to solve the mixing reception problem.

[0058] Because the uplink wavelengths of the three standards largely overlap within the 1260nm–1330nm range, no wavelength-selective filter can effectively separate them. The beam splitter 31303 does not select the wavelength of the optical signal; instead, it distributes all received optical signals of all wavelengths equally to the two detection components at a 50:50 power ratio. Each detection component receives an optical signal containing uplink signals from all standards, which are then processed by the processing chip on circuit board 4 according to the data rate and protocol.

[0059] It should be noted that the power-sharing scheme means that the signal power received by each detection component is only half of the original signal, introducing an additional 3dB of optical power loss. Based on this, in the optical power budget of a 50G PON system, this 3dB power loss can be compensated for by using a higher-power laser at the transmitter and a high-sensitivity APD detector at the receiver. Compared to the consequence of being unable to effectively receive mixed signals, the 3dB power loss is an acceptable technical trade-off.

[0060] For example, in an alternative implementation, the power distribution ratio of the beam splitter 31303 may not be strictly 50:50, but may be appropriately adjusted according to the sensitivity differences of the different detection components, for example, set to a splitting ratio of 40:60 or 45:55. When there is a difference in APD sensitivity in the two detection components, more optical power can be allocated to the detection component with lower sensitivity to balance the signal-to-noise ratio of the two receiving channels.

[0061] Multiple reflective filters are distributed on both sides of the output optical path of the beam splitter 31303 to guide the first beam and the second beam to the first detection component 302 and the second detection component 303, respectively.

[0062] For details, please refer to Figure 7 The optical path of the first beam (transmitted beam) is as follows: after passing through the beam splitter 31303, it reaches the first reflective filter 31304 at an incident angle of 0° and passes through, and continues to the second reflective filter 31305. After being reflected on the second reflective filter 31305, it enters the second detection component 303.

[0063] For example, the first reflective filter 31304 has a light incident angle of 0±3° and transmits light in the 1260nm to 1330nm wavelength range; the second reflective filter 31305 has a light incident angle of 37±3° and reflects light in the 1260nm to 1580nm wavelength range.

[0064] The optical path of the second beam (reflected beam) is as follows: after being reflected by the beam splitter 31303, it passes through the glass parallel plate 31309, is reflected by the third reflective filter 31306, passes through the glass parallel plate 31309 again, passes through the fourth reflective filter 31307, is reflected by the fifth reflective filter 31308, and enters the first detection component 302.

[0065] For example, the third reflective filter 31306 has a light incident angle of 8±3° and reflects light in the 1260nm to 1580nm wavelength range; the fourth reflective filter 31307 has a light incident angle of 8±3° and transmits light in the 1260nm to 1330nm wavelength range; and the fifth reflective filter 31308 has a light incident angle of 53±3° and reflects light in the 1260nm to 1580nm wavelength range.

[0066] Both the first detection component 302 and the second detection component 303 are in TO package form, each containing a converging lens, an avalanche photodiode (APD), and a transimpedance amplifier (TIA). The incident light beam is focused onto the photosensitive surface of the APD by the converging lens, where the APD converts the optical signal into an electrical signal, which is then amplified by the TIA before being output. The electrical signals from the two detection components are connected to the circuit board 4 through their respective flexible boards, where the back-end processing chip on the circuit board 4 identifies and processes the signals according to the data rate and communication protocol.

[0067] The above mixing and receiving process will be explained using a typical application scenario as an example: When the uplink optical signal from the 50G PON ONU arrives at the optical module, the optical signal with a wavelength of approximately 1286nm is reflected by the wavelength division element 31302 and then enters the beam splitter 31303. It is divided into a first beam and a second beam with a power ratio of 50:50. The first beam is then guided to the second detection component 303 and the first detection component 302 respectively through a reflective filter. The two detection components simultaneously receive the 24.8832Gbps signal, and the processing chip on the circuit board 4 identifies it as 50G PON uplink data based on the signal rate.

[0068] Similarly, when the uplink optical signal (wavelength around 1310nm, rate 1.25Gbps) of the EPON ONU arrives, it is also received by two detection components after being split and divided. The processing chip identifies it as EPON uplink data based on the lower data rate.

[0069] Therefore, the mixed uplink signals of various standards are not distinguished by wavelength in the optical path and are all equally distributed to two detection components, and the standard identification is completed by the electrical signal processing layer.

[0070] Based on the working processes of the above units, the transmission process of the mixing optical module is as follows: Circuit board 4 sends drive signals to three sets of laser components 309, 310, and 311. The three sets of laser components emit downlink optical signals of different wavelengths. The three optical signals are shaped into parallel light by the laser end lens group 318, and then combined into a single beam by the filter group 317. The combined beam is translated by the rhomboid prism 316, passes through the isolator 315, and then enters the beam splitter component 313. The combined beam passes directly through the beam splitter element 31302, and after beam displacement compensation by the silicon parallel plate 31301 and the glass parallel plate 31309, it reaches the lens 314. After being focused by the lens 314, it is coupled into the optical fiber in the optical port 305 and output to the external network.

[0071] The receiving process of the mixing optical module is as follows: Uplink mixed optical signals from ONUs of various standards are input through optical fiber at optical port 305, shaped into parallel light by lens 314, and then pass through silicon parallel plate 31301 and glass parallel plate 31309 before reaching wavelength division element 31302. Wavelength division element 31302 reflects the light in the receiving band and transmits the light in the transmitting band. The reflected light in the receiving band reaches beam splitter 31303 and is divided into a first beam and a second beam with a power ratio of 50:50. The first beam and the second beam are guided by multiple reflective filters and then incident on the second detection component 303 and the first detection component 302 in opposite directions. After photoelectric conversion, the two detection components transmit the electrical signal through the flexible board to the circuit board 4 for subsequent signal processing.

[0072] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above provides a detailed description of a mixing optical module and a passive optical network system provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A mixing optical module, characterized in that, include: Housing assembly (1); A light emission and receiving component (3) is disposed inside the housing assembly (1). The light emission and receiving component (3) is provided with a light port (305) and a lens (314) located inside the light port (305). The transmitting unit is located within the optical transmitting and receiving component (3) and includes multiple laser components and a beam combiner located on the output side of the multiple laser components. The optical signals emitted by the multiple laser components are combined by the beam combiner and output from the optical port (305). The receiving unit is disposed within the optical transmitting and receiving component (3) and includes a wavelength division multiplexing (WDM) component (313), a first detection component (302), and a second detection component (303). The WDM component (313) is disposed on the optical path between the optical port (305) and the first detection component (302) and the second detection component (303). The wavelength division multiplexing (WDM) component (313) receives a mixed optical signal input from the optical port (305), wherein the mixed optical signal includes at least two different optical signals with overlapping wavelength ranges. After the wavelength division and beam splitting component (313) performs wavelength division between the receiving band and the transmitting band in the mixed optical signal, it divides the optical signal of the receiving band into a first beam and a second beam according to the optical power. The first beam and the second beam are incident on the first detection component (302) and the second detection component (303) in opposite directions, respectively.

2. The mixing optical module according to claim 1, characterized in that, The wavelength division multiplexing (WDM) component (313) includes: The wavelength division multiplexing element (31302) is used to transmit optical signals within the transmit band and reflect optical signals within the receive band. The beam splitter (31303) is used to divide the received band optical signal reflected by the beam splitter (31302) into the first beam and the second beam according to the optical power.

3. The mixing optical module according to claim 2, characterized in that, The wavelength division multiplexing (313) component also includes a substrate (31310), a silicon parallel plate (31301), a glass parallel plate (31309) disposed on the substrate (31310), and a plurality of reflective filters; The silicon parallel plate (31301) is disposed in the optical path between the lens (314) and the wave splitter (31302), and the glass parallel plate (31309) is disposed between the silicon parallel plate (31301) and the wave splitter (31302). Multiple reflective filters are distributed on both sides of the output optical path of the beam splitter (31303) to guide the first beam to the first detection component (302) and the second beam to the second detection component (303).

4. The mixing optical module according to claim 3, characterized in that, The light incident angle of the silicon parallel plate (31301) is set to 30±3°; The silicon parallel plate (31301) causes the light beam to undergo a spatial translation along a first direction, which is equal in amount and opposite in direction to the spatial translation along a second direction caused by the light beam passing through the wave splitter (31302) and the glass parallel plate (31309).

5. The mixing optical module according to claim 2, characterized in that, The wavelength division element (31302) has an incident angle of 8±3° and is used to transmit light in the 1340nm to 1580nm band and reflect light in the 1260nm to 1330nm band.

6. The mixing optical module according to claim 2, characterized in that, The beam splitter (31303) is a 50:50 beam splitter with an incident angle of 8±3°, used to split the optical signal of the received band into a first beam and a second beam according to the optical power.

7. The mixing optical module according to claim 1, characterized in that, The laser components are arranged in three groups, which are used to emit data optical signals at three rates: 50G, 10G and 1.25G, respectively. The beam combining assembly includes an end lens group (318) and a filter group (317) disposed on each of the lasers. The light emitted by each laser assembly is shaped into parallel light by the corresponding end lens group (318) and then combined into a beam by the filter group (317).

8. The mixing optical module according to claim 7, characterized in that, The transmitting unit also includes an isolator (315) and an orthorhombic prism (316) disposed on the beam combining optical path. After the combined light is translated by the rhomboid prism (316), it is incident on the wavelength splitter assembly (313) through the isolator (315). After passing through the wavelength splitter element (31302), the combined light is coupled into the optical fiber in the optical port (305) through the lens (314).

9. The mixing optical module according to claim 1, characterized in that, It also includes an insulating insert (2), which is disposed in the contact area between the light emitting and receiving component (3) and the housing assembly (1).

10. A passive optical network system, characterized in that, It includes optical line terminals and various types of optical network units connected to the optical line terminals via an optical distribution network; The optical line terminal is provided with a mixing optical module as described in any one of claims 1-9; The various optical network units include 50G PON optical network units and EPON optical network units, wherein the uplink wavelength range of the 50G PON optical network unit falls within the uplink wavelength range of the EPON optical network unit.

Images