High-precision chip three-temperature test sorting machine

By integrating a heating plate and coolant circulation components into the chip testing platform, combined with an air curtain door design and a multi-level vision positioning system, the problems of inaccurate positioning, unstable temperature, and condensation in the testing of small, high-precision chips by existing three-temperature testing and sorting machines have been solved, achieving efficient and accurate three-temperature testing.

CN122421706APending Publication Date: 2026-07-17HEFEI SEMITECH TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202610747614.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-28
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing three-temperature testing and sorting machines are unable to accurately pick up and place small, high-precision chips, have unstable temperature control, are prone to condensation, and lack testing efficiency and accuracy, making it difficult to meet the requirements of high precision and high reliability.

Method used

The chip testing station, which integrates heating plates and coolant circulation components, combined with an air curtain door design and a multi-level vision positioning system, achieves rapid temperature control and precise positioning. Through the cooperation of multiple independent testing stations and a dual-drive gantry mechanism, the motion path is decoupled to ensure testing stability and efficiency.

Benefits of technology

It enables rapid switching and precise positioning for high-temperature, low-temperature, and room-temperature testing, suppresses condensation, improves testing efficiency and temperature uniformity, and ensures accurate chip placement and stable test results.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122421706A_ABST
    Figure CN122421706A_ABST
Patent Text Reader

Abstract

本发明涉及芯片测试技术领域,公开了一种高精密芯片三温测试用分选机,包括基座,还包括晶圆上料机构、双工位供料机构、双驱龙门机构、吸取芯片机构、三温测试箱、移载机构、芯片测试台和芯片测试机,所述芯片测试机安装于三温测试箱上方,其内部的测试针用于对芯片进行测试。本发明通过集成加热板和冷却液循环组件于同一放置台,使单一测试载台能够在高温、低温及常温之间快速切换,无需在不同温区设备间转移芯片,既避免了芯片二次搬运带来的损伤和定位误差,又显著提升了测试效率和温度均匀性。
Need to check novelty before this filing date? Find Prior Art