Heat-force bidirectional coupling simulation method for mixed tower structure in extremely cold environment with large temperature difference
By establishing a thermo-mechanical two-way coupled simulation method for hybrid tower structures under extremely cold and large temperature difference environments, the problem of inaccurate simulation of hybrid tower structures under extremely cold environments is solved, and high-precision simultaneous solution of temperature and stress fields is achieved, thereby improving the accuracy of structural safety assessment.
Patent Information
- Application Number
- CN202610310503.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-13
- Publication Date
- 2026-07-24
AI Technical Summary
Existing finite element analysis of temperature stress in hybrid tower structures suffers from inaccurate simulations under extremely cold and large temperature difference environments. This includes insufficient dynamics of solar radiation loading, failure to consider gradient wind speed distribution, and failure to reflect the interaction between temperature and structural deformation, which affects the accuracy of structural safety and durability assessments.
A thermo-mechanical two-way coupled simulation method for hybrid tower structures under extremely cold and large temperature difference environments is adopted. By establishing a finite element analysis model and setting dynamic thermal boundary conditions, the temperature field and the structural stress-strain field are solved simultaneously. The dynamic loading of solar radiation and wind speed gradient distribution are considered to construct a high-precision dynamic environmental boundary model.
It achieves high-precision response prediction of hybrid tower structures under extreme temperature environments, improves the accuracy of structural safety assessment, captures the reaction of structural deformation to the heat transfer process, and accurately simulates the heat conduction path and stress distribution.