Miniaturized butting method for high-voltage joint of satellite-borne traveling wave tube amplifier

By using methods such as wire stripping, forming, tinning, hook soldering, and heat shrink tubing, the high-voltage wires of the traveling wave tube power supply and the traveling wave tube are connected, solving the problems of large size and heavy weight of high-voltage connectors in the existing technology. This achieves miniaturization and weight reduction of high-voltage connectors, and improves voltage withstand capability and reliability.

CN122456274APending Publication Date: 2026-07-24XIAN INSTITUE OF SPACE RADIO TECH
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Patent Information

Application Number
CN202610524297.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-20
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

In the existing technology, the high-voltage connector design of the spaceborne traveling wave tube amplifier is complex, resulting in large size, heavy weight and low reliability, making it difficult to meet the reliability requirements of satellite operation in orbit.

Method used

The high-voltage conductors of the traveling wave tube are connected by stripping, shaping, tinning, soldering, applying adhesive, and heat shrink tubing. The high-voltage connector is miniaturized and insulated by combining high-voltage resistant polyolefin heat shrink tubing and epoxy adhesive.

Benefits of technology

This technology enables lightweight and miniaturized high-voltage connectors, improves voltage withstand capability, simplifies the process, shortens the production cycle, and enhances reliability and flexibility.

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Abstract

The invention relates to a miniaturized butting method for a high-voltage joint of a satellite-borne traveling wave tube amplifier. The miniaturized butting method comprises the following steps of: stripping, forming and tinning a butted high-voltage lead between a traveling wave tube power supply and a traveling wave tube; cutting a high-voltage-resistant polyolefin heat-shrinkable sleeve with a required length, and penetrating the high-voltage wire; the method comprises the following steps of: hooking and welding butted high-voltage wires between a traveling-wave tube power supply and a traveling-wave tube together, and controlling the total length of a hooking and welding spot and an exposed wire core to be 4-5mm; epoxy glue is dispensed on the hook welding spots and the high-voltage wire core; and blowing and shrinking the high-voltage-resistant polyolefin heat-shrinkable sleeve by using a hot air gun according to the required process method, and curing the epoxy glue. According to the invention, the miniaturization and light weight of the high-voltage butt joint between the traveling wave tube power supply and the traveling wave tube of the satellite-borne traveling wave tube amplifier are realized, the development period of the product is shortened, and the time of the high-voltage butt joint integration process between the traveling wave tube power supply and the traveling wave tube is reduced from 72 hours to 4 hours.
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