A compound for an encapsulating film, a photocurable composition, an encapsulating film, and a method for producing the same

Abstract

The application discloses a compound for packaging film, a photocuring composition, a packaging film and a preparation method thereof, and relates to the technical field of film packaging. The compound for packaging film has a structure as shown in formula I. After the compound for packaging film is applied, the water vapor permeability of the packaging film is obviously reduced compared with that before the compound is added. By packaging an organic light-emitting device through the packaging film, water vapor can be effectively isolated, and the service life of the organic light-emitting device is prolonged.