Semiconductor device, in-memory computing system, and electronic device

Abstract

A semiconductor device, a compute-in-memory system and an electronic device are disclosed. The semiconductor device includes a first die group, the first die group including: a first die including a first substrate and a first circuit layer, the first circuit layer formed in a first direction of the first substrate; a first bonding layer formed on the first circuit layer; a second die stacked on the first bonding layer along the first direction, and the second die including a second circuit layer; and a first intra-group interconnect structure connecting the first circuit layer and the second circuit layer. The design mechanism of the semiconductor device of the present application can make the chip have faster transmission speed and lower energy loss, thereby reducing the power consumption of the chip.