Nitride semiconductor device and method for manufacturing nitride semiconductor device
Patent Information
- Application Number
- CN202511503574.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-04-02
- Filing Date
- 2025-10-21
- Publication Date
- 2026-10-16
AI Technical Summary
[0004]根据前述,本申请提供一种氮化物半导体装置及氮化物半导体装置的制造方法,以解决GaN HEMT的误开启的问题
[0008] Based on the foregoing, this application provides a method for manufacturing a nitride semiconductor device, comprising: sequentially forming a channel layer, a spacer layer, and a polarization layer on a substrate; partially etching the channel layer, spacer layer, and polarization layer to form a platform structure, wherein the platform structure exposes the channel layer; forming a first passivation layer, a drain, and a source on the platform structure and on both sides of the platform structure, wherein the drain and source are located on the first passivation layer and extend from the first passivation layer to the channel layer; forming a second passivation layer on the first passivation layer and partially etching the second passivation layer to have an opening, wherein the opening extends to the spacer layer; forming a gate insulating layer on the second passivation layer and in the opening; and forming a gate on the gate insulating layer.