Light emitting device

Abstract

The present application provides a light emitting device, in which a plurality of pixels can be implemented by one chip, the bonding strength between a substrate and a chip can be improved. The light emitting device comprises a substrate with a plurality of terminal portions, a light emitting element with a plurality of electrode portions, and a plurality of bonding portions for bonding the substrate and the light emitting element. The plurality of terminal portions comprises a central terminal portion with a first recess on the surface, and a plurality of peripheral terminal portions each with a second recess on the surface. The plurality of electrode portions comprises a central electrode portion with a third recess on the surface, and a plurality of peripheral electrode portions each with a fourth recess on the surface. The center-to-center distance between the second recesses of adjacent peripheral terminal portions is different from the center-to-center distance between the fourth recesses of corresponding adjacent peripheral electrode portions. In a plan view, the center of at least one fourth recess does not overlap with the corresponding second recess.