Conductive powder having copper as a main component
CN122935463APending Publication Date: 2026-10-16SHOEI CHEM IND CO LTD
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Patent Information
- Application Number
- CN202580020485.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-04-24
- Filing Date
- 2025-03-10
- Publication Date
- 2026-10-16
AI Technical Summary
Technical Problem
[0008]然而,特别是在使用以铜为主成分的金属粉末在低氧气氛中进行烧制的情况下,难以适当地进行用于使粘合剂树脂等有机成分得以燃烧、分解、飞散的脱粘合剂
Benefits of technology
[0029] According to the present invention, a conductive paste suitable for forming a dense conductive film even when fired at low temperatures and a copper-based conductive powder capable of removing surface treatment agents at low temperatures can be provided.
✦ Generated by Eureka AI based on patent content.
Abstract
The present application provides a conductive powder with copper as a main component, wherein D50 is 0.3 μm or more and 7.5 μm or less, the ratio of long diameter X to medium diameter Y is 1.0 or more and 3.0 or less, and the ratio of long diameter X to short diameter Z is 1.5 or more and 8.0 or less, and at least a part of the surface of the conductive powder has an aliphatic amine, the aliphatic amine is an aliphatic amine that, when the conductive powder with copper as a main component is heated from 38°C to 900°C at a temperature increasing rate of 10°C / min in an inert atmosphere by TG-MS, at least one peak is detected in a chromatogram of mass number 44, and the ratio of the area of the peak existing in a range of 250°C or more and 400°C or less to the area of the peak existing in a range of 250°C or more and 900°C or less is 0.9 or more. The conductive paste using the conductive powder can remove the surface treatment agent by low-temperature firing, and can form a dense conductor film.
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