Solar silicon wafer laser cutting and splitting equipment

Abstract

The utility model discloses a solar silicon wafer laser cutting and splitting device which comprises a machine base, a feeding device, a splitting device and a carrying device, and the machine base is provided with a feeding position and a splitting position; the feeding device is arranged at the feeding position and used for feeding silicon wafers. The wafer splitting device is arranged at the wafer splitting position and is used for splitting the silicon wafer; the carrying device comprises a mounting base and two carrying mechanisms, the mounting base is arranged on the machine base and located between the feeding position and the splitting position, the two carrying mechanisms are slidably mounted on the mounting base, each carrying mechanism is provided with a carrying part capable of ascending and descending, and each carrying part is provided with a first position and a second position located above the first position; the carrying part carries the silicon wafers from the feeding position to the wafer cracking position in the state of being located at the second position, and moves from the wafer cracking position to the feeding position in the state of being located at the first position. According to the technical scheme, the laser cutting and splitting equipment for the solar silicon wafer can improve the production efficiency of the solar silicon wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of solar silicon wafer production, in particular to a solar silicon wafer laser cutting and splitting device. Background Art

[0002] With the general trend of global energy transformation, the scale of the photovoltaic market will accelerate and the production capacity will further expand. At present, in the process of producing and processing solar silicon wafers, it is usually necessary to set up a handling device to transport the solar silicon wafers from the loading position to the splitting position for cutting and splitting. However, this method of transportation requires the handling device to transport the solar silicon wafers obtained from the loading position to the splitting position, and then return from the splitting position to the loading position to take the material again, and repeat this cycle. This will cause the handling device to spend a lot of time in the reciprocating movement between the loading position and the splitting position, and the handling efficiency is low, which affects the production efficiency of solar silicon wafers. Utility Model Content

[0003] The main purpose of the utility model is to provide a solar silicon wafer laser cutting and splitting device, aiming to improve the handling efficiency of solar silicon wafers.

[0004] To achieve the above-mentioned purpose, the solar silicon wafer laser cutting and splitting device proposed in the utility model comprises:

[0005] The machine base is equipped with a loading position and a splitting position;

[0006] A loading device, arranged at the loading position, for loading silicon wafers;

[0007] a splitting device, disposed at the splitting position, for splitting the silicon wafer; and

[0008] The transport device comprises a mounting seat and two transport mechanisms, wherein the mounting seat is arranged on the machine base and is located between the loading position and the splitting position, and the two transport mechanisms are both slidably mounted on the mounting seat along the direction from the loading position to the splitting position, and the transport mechanism has a transport component that can be raised and lowered, and the transport component has a first position and a second position located above the first position, and the transport component transports the silicon wafer from the loading position to the splitting position when it is in the second position, and moves from the splitting position to the loading position when it is in the first position.

[0009] Optionally, the two conveying mechanisms are slidably installed on opposite sides of the mounting seat, the conveying components of the two conveying mechanisms are located above the mounting seat, and the mounting seat is provided with two driving mechanisms. The two driving mechanisms are connected to the two conveying mechanisms in a one-to-one driving manner, and are used to drive the conveying mechanisms to slide on the mounting seat.

[0010] Optionally, the conveying mechanism also includes a sliding seat and a lifting mechanism, the sliding seat is slidably installed on the mounting seat along the direction from the loading position to the splitting position, and is connected to the driving mechanism, the lifting mechanism is installed on the sliding seat, and the lifting mechanism is connected to the conveying component.

[0011] Optionally, the lifting mechanism includes a connecting piece, a motor, a screw rod and a nut seat. The connecting piece is slidably installed on the sliding seat along the up and down directions and is connected to the transport component. The motor is fixed to the sliding seat. The screw rod is connected to the motor and extends upward from the motor. The nut seat is sleeved on the screw rod and fixed to the connecting piece.

[0012] Optionally, the transport component is provided with an exhaust channel and a plurality of suction ports connected to the exhaust channel, and the plurality of suction ports are all located on the side of the transport component away from the mounting seat. The solar silicon wafer laser cutting and splitting equipment also includes a negative pressure device, and the negative pressure device is connected to the exhaust channel.

[0013] Optionally, the surface of the transport component has a cutting slit, and the cutting slit is used to correspond to a preset cutting line on the silicon wafer. When the transport component transports the silicon wafer to the splitting position, the transport component is located below the splitting device so that the silicon wafer on the transport component can be cut by the splitting device.

[0014] Optionally, the splitting device includes a mounting frame, a cutting mechanism, a heating mechanism and a cooling mechanism, wherein the cutting mechanism, the heating mechanism and the cooling mechanism are all arranged on the mounting frame, the cutting mechanism is used to cut the two ends of a preset splitting line on the silicon wafer, the heating mechanism is located on one side of the cutting mechanism, and is used to heat the portion between the two ends of the preset splitting line on the silicon wafer, the cooling mechanism is located on one side of the heating mechanism, and the cooling mechanism is provided with a cooling head, and the cooling head is used to spray a low-temperature fluid onto the preset splitting line on the silicon wafer after being heated by the heating mechanism.

[0015] Optionally, the solar silicon wafer laser cutting and splitting equipment further includes a first imaging device, which is disposed on the machine base and located between the loading device and the transporting device, and is used to acquire an image of the silicon wafer to be split.

[0016] Optionally, the solar silicon wafer equipment also includes a unloading device and a drying device, both of which are arranged on the machine base, and the drying device is located between the splitting device and the unloading device, the drying device is used to dry the silicon wafers split by the splitting device, and the unloading device is used to unload the silicon wafers dried by the drying device.

[0017] Optionally, the drying device includes a conveying mechanism, a mounting cover, a fan and a heating structure, wherein the conveying mechanism is used to receive the cut silicon wafers; the mounting cover has an air inlet, an air outlet and an air duct connected between the air inlet and the air outlet, the mounting cover is arranged on the upper side of the conveying mechanism, and the air outlet faces the conveying mechanism; the fan is arranged on the mounting cover, and is used to drive the airflow from the air inlet into the air duct and then be discharged from the air outlet; the heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct.

[0018] The technical solution of the utility model is to set a loading position and a splitting position on the machine base, set the loading device at the loading position, set the splitting device at the splitting position, and the transport device is provided with a mounting seat and two transport mechanisms, which are mounted on the machine base and located between the loading position and the splitting position. The two transport mechanisms are slidably mounted on the mounting seat along the direction of the loading pointing to the splitting, and the transport mechanism has a transport component that can be lifted up and down, and the transport component has a first position and a second position located above the first position. When the transport component transports the silicon wafer from the loading position to the splitting position, it is in the second position, and when it moves from the splitting position to the loading position, it will drop to the first position. This ensures that the conveying mechanism in the second position that transports the silicon wafers from the loading position to the splitting position will not interfere with the conveying mechanism in the first position that returns to the loading position for loading. Therefore, when one of the two conveying mechanisms transports the silicon wafers from the loading position to the splitting position, the other conveying mechanism can return from the splitting position to the loading position for loading, saving the reciprocating movement time of a single conveying mechanism between the loading position and the splitting position, realizing the continuous conveying of silicon wafers by the two conveying mechanisms, improving the conveying efficiency of solar silicon wafers, and helping to improve the production efficiency of silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 This is a schematic structural diagram of an embodiment of a solar silicon wafer laser cutting and splitting device of the utility model;

[0021] Figure 2 for Figure 1 A schematic diagram of the structure of the medium handling device;

[0022] Figure 3 for Figure 2 A side view of the middle handling device;

[0023] Figure 4 for Figure 2 Another side view of the handling device in the middle.

[0024] Description of Figure Numbers:

[0025] 10. base; 20. feeding device; 30. splitting device; 40. conveying device; 41. mounting seat; 42. conveying mechanism; 421. conveying component; 4211. cutting gap; 43. driving mechanism; 431. second motor; 432. second screw rod; 48. second guide rail; 49. second slider; 44. sliding seat; 45. lifting mechanism; 451. connecting piece; 452. first motor; 453. screw rod; 46. first slider; 47. first guide rail; 50. drying device; 60. unloading device; 70. first imaging device; 80. second imaging device

[0026] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0030] The utility model provides a solar silicon wafer laser cutting and splitting device.

[0031] In the embodiment of the present utility model, Figures 1 to 4 As shown, the solar silicon wafer laser cutting and splitting equipment includes a machine base 10, a loading device 20, a splitting device 30 and a transport device 40.

[0032] Specifically, the machine base 10 is provided with a loading position and a splitting position. The loading device 20 is provided at the loading position for loading silicon wafers; the splitting device 30 is provided at the splitting position for splitting silicon wafers.

[0033] The transport device 40 includes a mounting seat 41 and two transport mechanisms 42. The mounting seat 41 is arranged on the machine base 10 and is located between the loading position and the splitting position. The two transport mechanisms 42 are both slidably installed on the mounting seat 41 along the direction from the loading position to the splitting position. The transport mechanism 42 has a transport component 421 that can be raised and lowered. The transport component 421 has a first position and a second position above the first position. The transport component 421 transports the silicon wafer from the loading position to the splitting position when it is in the second position, and moves from the splitting position to the loading position when it is in the first position.

[0034] In the embodiment, the mounting seat 41 is provided with two driving mechanisms 43 , and the two driving mechanisms 43 are connected to the two conveying mechanisms 42 in a one-to-one correspondence, and the driving mechanisms 43 are used to drive the corresponding conveying mechanisms 42 to slide on the mounting seat 41 .

[0035] When the transport mechanism 42 moves to the loading position, the transport component 421 rises to the second position to pick up the material. At this time, the driving mechanism 43 drives the transport component 421 to transport the silicon wafer from the loading position to the splitting position in the state of being in the second position to split the silicon wafer.

[0036] When the transport mechanism 42 moves to the splitting position, the transport component 421 will descend to the first position for unloading. At this time, the driving mechanism 43 drives the transport component 421 to move from the splitting position to the loading position in the state of being in the first position.

[0037] This ensures that the transport mechanism 42 in the second position that transports silicon wafers from the loading position to the splitting position will not interfere with the transport mechanism 42 in the first position that returns from the splitting position to the loading position for loading. Therefore, when one of the two transport mechanisms 42 transports silicon wafers from the loading position to the splitting position, the other transport mechanism 42 can return from the splitting position to the loading position for loading.

[0038] The technical solution of the utility model is to set a loading position and a splitting position on the machine base 10, set the loading device 20 at the loading position, set the splitting device 30 at the splitting position, and the transport device 40 is provided with a mounting seat 41 and two transport mechanisms 42, which are mounted on the machine base 10 and located between the loading position and the splitting position. The two transport mechanisms 42 are slidably mounted on the mounting seat 41 along the direction of the loading pointing to the splitting, and the transport mechanism 42 has a transport component 421 that can be lifted up and down, and the transport component 421 has a first position and a second position located above the first position. When the transport component 421 transports the silicon wafer from the loading position to the splitting position, it is in the second position, and when it moves from the splitting position to the loading position, it will drop to the first position. This ensures that the transport mechanism 42 in the second position that transports silicon wafers from the loading position to the splitting position will not interfere with the transport mechanism 42 in the first position that returns from the splitting position to the loading position for loading. Therefore, when one of the two transport mechanisms 42 transports silicon wafers from the loading position to the splitting position, the other transport mechanism 42 can return from the splitting position to the loading position for loading, saving the reciprocating movement time of a single transport mechanism 42 between the loading position and the splitting position, realizing the continuous transport of silicon wafers by the two transport mechanisms 42, improving the transport efficiency of solar silicon wafers, and helping to improve the production efficiency of silicon wafers.

[0039] In some embodiments, two conveying mechanisms 42 are slidably installed on opposite sides of a mounting seat 41, and the conveying components 421 of the two conveying mechanisms 42 are both located above the mounting seat 41. The mounting seat 41 is provided with two driving mechanisms 43, and the two driving mechanisms 43 are drivingly connected to the two conveying mechanisms 42 in a one-to-one correspondence, so as to drive the conveying mechanisms 42 to slide on the mounting seat 41.

[0040] Specifically, the two conveying mechanisms 42 are respectively slidably installed on opposite sides of the mounting seat 41, so that when the two conveying mechanisms 42 meet, the one located at the bottom does not need to move outward, so as to prevent the two conveying mechanisms 42 from interfering with each other. This can reduce the conveying space, that is, reduce the installation space required for the conveying device 40, make the overall structure of the conveying device 40 more compact, and improve the overall structural compactness of the conveying device 40.

[0041] Of course, in other implementations, the two conveying mechanisms 42 can also be installed on the same side of the mounting seat 41, and the two conveying mechanisms 42 are spaced apart up and down, and the conveying mechanism 42 located on the lower side can move in the direction away from the mounting seat 41. During the conveying process, when the two conveying mechanisms 42 meet, the conveying mechanism 42 located on the lower side moves in the direction away from the mounting seat 41 to prevent the two conveying mechanisms 42 from interfering with each other.

[0042] In some embodiments, the conveying mechanism 42 also includes a sliding seat 44 and a lifting mechanism 45. The sliding seat 44 is slidably installed on the mounting seat 41 along the direction of the loading position pointing to the splitting position, and is connected to the driving mechanism 43. The lifting mechanism 45 is installed on the sliding seat 44, and the lifting mechanism 45 is connected to the conveying component 421.

[0043] Specifically, when the driving mechanism 43 drives the sliding seat 44 to slide on the mounting seat 41 , the lifting mechanism 45 moves along with the sliding of the sliding seat 44 to realize the transportation of the silicon wafer.

[0044] Furthermore, the mounting seat 41 is provided with a second guide rail 48, and the sliding seat 44 is provided with a second slider 49, and the second slider 49 is slidably matched with the guide rail. It can be understood that the sliding seat 44 is more stable when sliding on the mounting seat 41 through the sliding match of the second guide rail 48 and the second slider 49, that is, the sliding stability of the transport mechanism 42 is improved.

[0045] Furthermore, the mounting seat 41 is provided with two second guide rails 48, which are spaced apart from each other, and the sliding seat 44 is provided with two second sliders 49 corresponding to the two second guide rails 48, which are slidably connected to the two second guide rails 48 in a one-to-one correspondence, so as to further improve the sliding stability of the transport mechanism 42.

[0046] Further, the lifting mechanism 45 includes a connecting member 451, a motor, a screw rod 453 and a nut seat, wherein the connecting member 451 is slidably mounted on the sliding seat 44 along the up-down direction and connected to the transporting member 421, the motor is fixed to the sliding seat 44, the screw rod 453 is connected to the motor and extends upward from the motor, and the nut seat is sleeved on the screw rod 453 and fixed to the connecting member 451. Specifically, the motor is located below the screw rod 453, and the nut seat is driven by the motor to move on the screw rod 453 to drive the transporting member 421 to rise and fall, thereby moving the transporting member 421 between the first position and the second position. As we know, the screw rod 453 transmission has the characteristic of stable transmission. When applied to this solution, the first motor 452 can be made to have a relatively high stability in driving the transporting member 421 up and down or descending, that is, the lifting stability of the transporting member 421 is improved. Of course, in other embodiments, the lifting mechanism 45 can also be set as a cylinder, which is directly connected to the transporting member 421.

[0047] Furthermore, a first guide rail 47 is provided on the side of the sliding seat 44 away from the mounting seat 41, and a first slider 46 is provided on the connecting member 451, and the first slider 46 is slidably matched with the first guide rail 47. Specifically, it can be understood that the sliding match between the first guide rail 47 and the first slider 46 makes the transport component 421 more stable when it is lifted, that is, the lifting stability of the transport mechanism 42 is improved.

[0048] Furthermore, the sliding seat 44 is provided with two first guide rails 47, the two first guide rails 47 are arranged at intervals up and down, the first screw rod 453 is located between the two first guide rails 47, the connecting member 451 is provided with two first sliders 46 corresponding to the two first guide rails 47, and the two first sliders 46 are connected to the two first guide rails 47 in a one-to-one correspondence, so as to further improve the lifting stability of the transport mechanism 42.

[0049] In some embodiments, the transport component 421 is provided with an exhaust channel and multiple suction ports connected to the exhaust channel, and the multiple suction ports are all located on the side of the transport component 421 away from the mounting seat 41. The solar silicon wafer laser cutting and splitting equipment also includes a negative pressure device, which is connected to the exhaust channel.

[0050] Specifically, the exhaust channel is connected to the negative pressure device. When the conveying mechanism 42 is conveying the silicon wafer, the silicon wafer 80 will block the suction port on the conveying component 421. By exhausting air through the negative pressure device, the silicon wafer can be fixed on the conveying component 421 to prevent the silicon wafer from falling during the conveying process of the conveying mechanism 42. At the same time, it is not necessary to fix the silicon wafer when the splitting device 30 separates the silicon wafer, so as to prevent the silicon wafer from shifting during the cutting process, thereby improving the production quality of the silicon wafer. At the same time, it is not necessary to set a positioning mechanism on the conveying component 421 to fix the silicon wafer, thereby reducing the complexity of the structure. Of course, in other embodiments, a limiting structure is provided on the conveying component 421 to limit the silicon wafer.

[0051] Furthermore, the surface of the transport component 421 has a cutting slit 4211, and the cutting slit 4211 is used to correspond to the preset cutting line on the silicon wafer. When the transport component 421 transports the silicon wafer to the splitting position, the transport component 421 is located below the splitting device 30, so that the silicon wafer on the transport component 421 can be cut by the splitting device 30. In this way, when the splitting device 30 is cutting the silicon wafer, after the sealing plate profile is cut, it can prevent the splitting device 30 from colliding with the transport component 421, thereby preventing the splitting device 30 or the transport component 421 from being damaged.

[0052] In some embodiments, the slicing device 30 includes a mounting frame, a cutting mechanism, a heating mechanism and a cooling mechanism. The cutting mechanism, the heating mechanism and the cooling mechanism are all arranged on the mounting frame. The cutting mechanism is used to cut the two ends of a preset slicing line on the silicon wafer. The heating mechanism is located on one side of the cutting mechanism and is used to heat the portion between the two ends of the preset slicing line on the silicon wafer. The cooling mechanism is located on one side of the heating mechanism. The cooling mechanism is provided with a cooling head, which is used to spray a low-temperature fluid onto the preset slicing line on the silicon wafer after being heated by the heating mechanism.

[0053] Specifically, the cutting mechanism is a laser emitter, which cuts the two ends of the preset cutting line of the silicon wafer by laser, and then heats the part between the two ends of the preset separation line on the silicon wafer by the heating component. After the heating is completed, the cooling head of the cooling mechanism sprays low-temperature fluid on the heated part. The silicon wafer will crack along the preset separation line under the action of thermal expansion and contraction, so that the silicon wafer can be naturally cracked without external force, reducing the risk of edge collapse and hidden cracks of the silicon wafer under external force, which is conducive to improving the production quality of solar silicon wafers.

[0054] Regarding the division of the silicon wafer, the splitting device 30 can be selectively configured. Specifically, the selective configuration means that the splitting device 30 has multiple ways to divide the silicon wafer.

[0055] For example, in some embodiments, the cutting mechanism may first cut one end of a preset splitting line on the silicon wafer, and then heat the portion between the two ends of the preset splitting line on the silicon wafer through a heating mechanism. After the heating is completed, a cooling head sprays a low-temperature fluid onto the preset splitting line on the silicon wafer that has been heated by the heating mechanism. In the process of the cooling head spraying the low-temperature fluid onto the preset splitting line on the silicon wafer, the cutting mechanism cuts the other end of the preset splitting line on the silicon wafer, so that when the silicon wafer is split from one end of the preset splitting line to the other end, the two ends of the preset splitting line are merged together, thereby realizing the division of the silicon wafer.

[0056] For another example, in another embodiment, the cutting mechanism first cuts the two ends of a preset splitting line on the silicon wafer, and then heats the portion between the two ends of the preset splitting line on the silicon wafer through the heating mechanism. After the heating is completed, a low-temperature fluid is sprayed from a cooling head onto the preset splitting line on the silicon wafer that has been heated by the heating mechanism. In this way, when the silicon wafer is split from one end of the preset splitting line to the other end, it can be combined with the two ends of the preset splitting line, thereby realizing the splitting of the silicon wafer.

[0057] In some embodiments, the solar silicon wafer laser cutting and splitting device further includes a first imaging device 70, which is disposed on the machine base 10 and between the loading device 20 and the transport device 40. Specifically, the first imaging device 70 is used to obtain an image of the silicon wafer to be split, and detect whether the silicon wafer to be split is damaged, so as to improve the production quality of the silicon wafer. Of course, in other embodiments, the solar silicon wafer laser cutting and splitting device may not be provided with the first imaging device 70.

[0058] Furthermore, the solar silicon wafer laser cutting and splitting device further includes a second imaging device 80, which is disposed on the machine base 10 and located between the splitting device 30 and the drying device 50. Specifically, the second imaging device 80 is used to obtain images of the split silicon wafers and detect whether the split silicon wafers are damaged, so as to further improve the production quality of the silicon wafers.

[0059] In some embodiments, the solar silicon wafer equipment further includes a feeding device 60 and a drying device 50, both of which are arranged on the machine base 10, and the drying device 50 is located between the splitting device 30 and the feeding device 60. Specifically, the drying device 50 is used to dry the silicon wafers split by the splitting device 30, and the feeding device 60 is used to feed the silicon wafers dried by the drying device 50, so as to realize the automation of silicon wafer splitting, drying and feeding, thereby improving the production efficiency of solar silicon wafers.

[0060] Furthermore, the drying device 50 includes a conveying mechanism, a mounting cover, a fan and a heating structure. The conveying mechanism is used to receive the cut silicon wafers. The mounting cover has an air inlet, an air outlet and an air duct connected between the air inlet and the air outlet. The mounting cover is arranged on the upper side of the conveying mechanism, and the air outlet faces the conveying mechanism. The fan is arranged on the mounting cover, and is used to drive the airflow from the air inlet into the air duct and then be discharged from the air outlet. The heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct. Specifically, the fan is used to accelerate the flow of the airflow, so that the airflow heated by the heating mechanism quickly flows from the air outlet to the silicon wafers on the conveying mechanism, so as to blow water droplets off the surface of the silicon wafers, and the hot airflow can also heat and dry the silicon wafers, thereby improving the drying efficiency of the solar silicon wafers, which is conducive to improving the production efficiency of the solar silicon wafers.

[0061] It is worth noting that, compared with the prior art method of first processing the solar silicon wafer and then cutting it, in this embodiment, the solar energy conversion rate of the solar silicon wafer is improved by first cutting the solar silicon wafer and then performing other subsequent processing steps.

[0062] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A solar silicon wafer laser cutting and splitting device, characterized in that: include: The machine base is equipped with a loading position and a splitting position; A loading device, arranged at the loading position, for loading silicon wafers; A chip splitting device, disposed at the chip splitting position, for splitting the silicon wafer; as well as The transport device comprises a mounting seat and two transport mechanisms, wherein the mounting seat is arranged on the machine base and is located between the loading position and the splitting position, and the two transport mechanisms are both slidably mounted on the mounting seat along the direction from the loading position to the splitting position, and the transport mechanism has a transport component that can be raised and lowered, and the transport component has a first position and a second position located above the first position, and the transport component transports the silicon wafer from the loading position to the splitting position when it is in the second position, and moves from the splitting position to the loading position when it is in the first position.

2. The solar silicon wafer laser cutting and splitting device according to claim 1, characterized in that: The two conveying mechanisms are slidably installed on opposite sides of the mounting seat, and the conveying components of the two conveying mechanisms are located above the mounting seat. The mounting seat is provided with two driving mechanisms, and the two driving mechanisms are drivingly connected to the two conveying mechanisms in a one-to-one correspondence, and are used to drive the conveying mechanisms to slide on the mounting seat.

3. The solar silicon wafer laser cutting and splitting device according to claim 2, characterized in that: The conveying mechanism also includes a sliding seat and a lifting mechanism. The sliding seat is slidably installed on the mounting seat along the direction from the loading position to the splitting position and is connected to the driving mechanism. The lifting mechanism is installed on the sliding seat and connected to the conveying component.

4. The solar silicon wafer laser cutting and splitting device according to claim 3, characterized in that: The lifting mechanism includes a connecting piece, a motor, a screw rod and a nut seat. The connecting piece is slidably installed on the sliding seat along the up and down directions and is connected to the conveying component. The motor is fixed to the sliding seat. The screw rod is connected to the motor and extends upward from the motor. The nut seat is sleeved on the screw rod and fixed to the connecting piece.

5. The solar silicon wafer laser cutting and splitting device according to claim 1, characterized in that: The transport component is provided with an exhaust channel and a plurality of suction ports connected to the exhaust channel, the plurality of suction ports are all located on the side of the transport component away from the mounting seat, the solar silicon wafer laser cutting and splitting equipment also includes a negative pressure device, and the negative pressure device is connected to the exhaust channel.

6. The solar silicon wafer laser cutting and splitting device according to claim 5, characterized in that: The surface of the transport component has a cutting slit, and the cutting slit is used to correspond to the preset cutting line on the silicon wafer. When the transport component transports the silicon wafer to the splitting position, the transport component is located below the splitting device so that the silicon wafer on the transport component can be cut by the splitting device.

7. The solar silicon wafer laser cutting and splitting device according to claim 1, characterized in that: The wafer splitting device includes a mounting frame, a cutting mechanism, a heating mechanism and a cooling mechanism. The cutting mechanism, the heating mechanism and the cooling mechanism are all arranged on the mounting frame. The cutting mechanism is used to cut the two ends of a preset splitting line on the silicon wafer. The heating mechanism is located on one side of the cutting mechanism and is used to heat the portion between the two ends of the preset splitting line on the silicon wafer. The cooling mechanism is located on one side of the heating mechanism and is provided with a cooling head. The cooling head is used to spray a low-temperature fluid onto the preset splitting line on the silicon wafer after being heated by the heating mechanism.

8. The solar silicon wafer laser cutting and splitting device according to claim 1, characterized in that: The solar silicon wafer laser cutting and splitting equipment also includes a first imaging device, which is arranged on the machine base and located between the loading device and the transporting device, and is used to obtain an image of the silicon wafer to be split.

9. The solar silicon wafer laser cutting and splitting device according to claim 1, characterized in that: The solar silicon wafer equipment also includes a feeding device and a drying device, both of which are arranged on the machine base, and the drying device is located between the splitting device and the feeding device. The drying device is used to dry the silicon wafers split by the splitting device, and the feeding device is used to feed the silicon wafers dried by the drying device.

10. The solar silicon wafer laser cutting and splitting device according to claim 9, characterized in that: The drying device includes a conveying mechanism, a mounting cover, a fan and a heating structure, wherein the conveying mechanism is used to receive the cut silicon wafers; the mounting cover has an air inlet, an air outlet and an air duct connected between the air inlet and the air outlet, the mounting cover is arranged on the upper side of the conveying mechanism, and the air outlet faces the conveying mechanism; the fan is arranged on the mounting cover, and is used to drive the airflow from the air inlet into the air duct and then be discharged from the air outlet; the heating structure is arranged in the air duct, and the heating structure is used to heat the airflow flowing through the air duct.

Images