Instantaneous high voltage resistant differential plate

Abstract

The utility model provides an anti instant high voltage differential board, relates to antenna equipment technical field, including DIFT-TTL differential board and TTL-DIF differential board, the PCB is provided with two MAX3096ESE + chip, one 74LVX4245 chip and one AMC1117 chip, the AMC1117 chip is located between the two MAX3096ESE + chip, and one MAX3096ESE + chip is located between the AMC1117 chip and the 74LVX4245 chip. According to the utility model, through the arrangement of the circuit, the lightning protection device has a good lightning protection property, so that the lightning protection device can be applied to a more severe weather environment.

Description

Technical Field

[0001] The utility model relates to the technical field of antenna equipment, in particular to an anti-instantaneous high-voltage differential board. Background Art

[0002] In bad weather conditions, such as thunderstorms, the antenna can be easily electrocuted, which can easily cause damage to the differential board inside the antenna. Therefore, the circuit design of the differential board and the selection of differential chips and synthetic chips with better lightning protection performance are particularly important in actual use.

[0003] Therefore, there is an urgent need for a differential board that can resist instantaneous high voltage to solve the problem that the differential board in the existing antenna is easily damaged. Utility Model Content

[0004] The utility model provides a differential board resistant to instantaneous high voltage, which solves the problem that the differential board in the existing antenna is easily damaged.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A transient high voltage differential board, comprising:

[0007] A DIF-TTL differential board, wherein two MAX3096ESE+ chips, a 74LVX4245 chip and an AMC1117 chip are arranged on the DIF-TTL differential board, wherein the AMC1117 chip is located between the two MAX3096ESE+ chips, and wherein one MAX3096ESE+ chip is located between the AMC1117 chip and the 74LVX4245 chip;

[0008] A TTL-DIF differential board, wherein two MAX3030EESE chips, a 74LCX244MTC chip and an AMC1117 chip are arranged on the TTL-DIF differential board, wherein the 74LCX244MTC chip is located between the two MAX3030EESE chips, and wherein one of the MAX3030EESE chips is located between the 74LCX244MTC chip and the AMC1117 chip.

[0009] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0010] In the actual working process, the input signal in the DIF-TTL differential board first goes to the RS-422 receiving chip, which uses two MAX3096ESE+ chips. The chip is a 3.3V power supply, which synthesizes the two input 3.3V differential signals into one 3.3V signal; the converted 3.3V signal is connected to a level conversion chip 74LVX4245, which requires 3.3V and 5V power supplies. Its function is to convert the 3.3V signal into a 5V TTL signal, and then output the TTL signal to the phase shifter; AMC1117 is a power supply chip, because the input is 5V DC voltage, some chips need 3.3V power supply, and the chip needs to be converted into 3.3V to power it.

[0011] In the DIF-TTL differential board, the TTL signal first passes through a level conversion chip (74LCX244MTC) to convert the 5V DC signal into a 3.3V signal; then it is converted into a 3.3V signal to the RS-422 conversion chip, in which two RS-422 conversion chips (MAX3030EESE) are used to complete the 6-bit signal conversion. The chip requires a 3.3V power supply and can convert one TTL signal into two differential signals, which are then output externally. Similar to the DIF-TTL differential board, the chip power supply requires 3.3V, so the AMC1117 chip is required to power it. The utility model has good lightning resistance properties through such a circuit setting, so it can be used in more severe weather environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is the PCB circuit diagram of the DIF-TTL differential board in the utility model;

[0013] Figure 2 This is a PCB circuit diagram of the TTL-DIF differential board in the utility model. DETAILED DESCRIPTION

[0014] The utility model is described in detail below in conjunction with the accompanying drawings.

[0015] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0016] This embodiment provides a transient high voltage differential board, such as Figure 1-Figure 2 As shown, including:

[0017] like Figure 1As shown, a DIF-TTL differential board is provided with two MAX3096ESE+ chips (D2 and D1 in the figure), a 74LVX4245 chip (D3 in the figure) and an AMC1117 chip (D4 in the figure), the AMC1117 chip (D4 in the figure) is located between the two MAX3096ESE+ chips (D2 and D1 in the figure), and one MAX3096ESE+ chip (D2 and D1 in the figure) is located between the AMC1117 chip and the 74LVX4245 chip;

[0018] like Figure 2 As shown, a TTL-DIF differential board is provided with two MAX3030EESE chips (D2 and D3 in the figure), a 74LCX244MTC chip (D1 in the figure) and an AMC1117 chip (D4 in the figure), the 74LCX244MTC chip is between the two MAX3030EESE chips, and one of the MAX3030EESE chips is between the 74LCX244MTC chip and the AMC1117 chip.

[0019] like Figure 1 As shown, in the actual working process, the input signal in the DIF-TTL differential board first goes to the RS-422 receiving chip, which uses two MAX3096ESE+ chips. The chip is a 3.3V power supply, which synthesizes the two input 3.3V differential signals into one 3.3V signal; the converted 3.3V signal is connected to a level conversion chip 74LVX4245, which requires 3.3V and 5V power supplies. Its function is to convert the 3.3V signal into a 5V TTL signal, and then output the TTL signal to the phase shifter; AMC1117 is a power supply chip, because the input is 5V DC voltage, some chips need 3.3V power supply, and the chip needs to be converted into 3.3V for power supply.

[0020] like Figure 2 As shown in the figure, in the DIF-TTL differential board, the TTL signal first passes through a level conversion chip (74LCX244MTC) to convert the 5V DC signal into a 3.3V signal; then it is converted into a 3.3V signal to the RS-422 conversion chip, where two RS-422 conversion chips (MAX3030EESE) are used to complete the 6-bit signal conversion. The chip needs 3.3V power supply and can convert one TTL signal into two differential signals, which are then output externally. Same as the DIF-TTL differential board, the chip power supply needs 3.3V, so the AMC1117 chip is needed to power it.

[0021] The utility model has good lightning resistance through such circuit setting, so it can be used in more severe weather environments.

[0022] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A transient high voltage differential board, characterized in that: include: A DIF-TTL differential board, wherein two MAX3096ESE+ chips, a 74LVX4245 chip and an AMC1117 chip are arranged on the DIF-TTL differential board, wherein the AMC1117 chip is located between the two MAX3096ESE+ chips, and wherein one MAX3096ESE+ chip is located between the AMC1117 chip and the 74LVX4245 chip; A TTL-DIF differential board, wherein two MAX3030EESE chips, a 74LCX244MTC chip and an AMC1117 chip are arranged on the TTL-DIF differential board, wherein the 74LCX244MTC chip is located between the two MAX3030EESE chips, and wherein one of the MAX3030EESE chips is located between the 74LCX244MTC chip and the AMC1117 chip.

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