Camera module structure capable of improving oil seepage of heat-conducting silica gel

Abstract

The utility model discloses a camera module structure capable of improving oil seepage of heat-conducting silica gel, which comprises a camera module body, heat-conducting silica gel, a heat dissipation frame and an oil absorption piece, and the camera module body is connected with a circuit board; the heat-conducting silica gel is arranged on one side surface of the circuit board; the heat dissipation frame is arranged on the side face, away from the circuit board, of the heat conduction silica gel, and a plurality of oil drainage holes are formed in the heat dissipation frame. The oil absorption piece is arranged on the side face, away from the heat conduction silica gel, of the heat dissipation frame and used for absorbing silicone oil discharged from the oil discharge hole. Thus, subsequent discharge of silicone oil is dredged through the oil discharge hole, meanwhile, the oil absorption piece is arranged on the side face, away from the heat conduction silica gel, of the heat dissipation frame, and the silicone oil discharged by the heat conduction silica gel is absorbed through the oil absorption piece, so that the problem of oil leakage of the heat conduction silica gel can be solved, and the silicone oil is prevented from affecting the appearance and quality of the camera module.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a camera module structure capable of improving oil seepage of heat-conducting silicone. Background Art

[0002] In camera modules, thermally conductive silicone is usually required for heat dissipation. The conventional operation is to attach one side of the thermally conductive silicone to the heat-generating part of the camera module and the other side to an object that dissipates heat faster. Due to the characteristics of silicone material, when using thermally conductive silicone, a small amount of silicone oil will seep out after squeezing. Since silicone oil is not easy to volatilize, it will stay between the camera module and the heat dissipation object for a long time. As time goes by, the silicone oil will enter the module or seep onto the surface of the camera module, or after contacting the outside world, it will stick to dust, causing dirt on the camera module, affecting the appearance and quality of the entire camera module. Utility Model Content

[0003] The utility model aims to overcome the shortcomings of the prior art and provide a camera module structure capable of improving oil seepage of heat-conducting silicone.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A camera module structure capable of improving oil seepage of thermally conductive silicone comprises: a camera module body, thermally conductive silicone, a heat sink and an oil absorber, wherein the camera module body is connected to a circuit board; the thermally conductive silicone is arranged on one side of the circuit board; the heat sink is arranged on one side of the thermally conductive silicone away from the circuit board, and a plurality of oil drain holes are formed on the heat sink; the oil absorber is arranged on one side of the heat sink away from the thermally conductive silicone, and is used to absorb silicone oil discharged from the oil drain holes.

[0006] In one embodiment, the circuit board is a PCB board or an FPC board.

[0007] In one of the embodiments, the thickness of the thermally conductive silicone is 0.2-0.3 mm.

[0008] In one embodiment, the heat dissipation frame is a metal iron frame.

[0009] In one embodiment, the thickness of the metal iron frame is 1.0-1.2 mm.

[0010] In one embodiment, the oil drain hole is a circular structure.

[0011] In one embodiment, the diameter of the oil drain hole is 0.2-0.5 mm.

[0012] In one embodiment, the distance between the oil drain holes is 2 to 5 mm.

[0013] In one of the embodiments, it is characterized in that the oil absorbing member is a heat dissipation cloth.

[0014] In one embodiment, the heat dissipation cloth has a thickness of 0.2-0.3 mm.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The utility model discloses a camera module structure capable of improving the oil leakage of thermally conductive silicone, by arranging a camera module body, thermally conductive silicone, a heat sink and an oil absorption component, and opening a plurality of oil drainage holes on the heat sink, through which the subsequent discharge of silicone oil is facilitated, and at the same time, an oil absorption component is arranged on a side surface of the heat sink away from the thermally conductive silicone, so that the silicone oil discharged from the thermally conductive silicone is absorbed by the oil absorption component, thereby improving the problem of oil leakage of the thermally conductive silicone, and preventing the silicone oil from affecting the appearance and quality of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a schematic diagram of the exploded structure of a camera module structure capable of improving oil leakage of thermally conductive silicone in one embodiment of the utility model;

[0019] Figure 2 for Figure 1 A schematic diagram of the partially enlarged structure of the camera module structure at point A which can improve the oil leakage of thermal conductive silicone. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0021] See also Figure 1 and Figure 2 As shown, a camera module structure 10 capable of improving oil seepage of thermally conductive silicone comprises: a camera module body 100, thermally conductive silicone 200, a heat sink 300 and an oil absorber 400, wherein the camera module body 100 is connected to a circuit board 110; the thermally conductive silicone 200 is arranged on one side of the circuit board 110; the heat sink 300 is arranged on one side of the thermally conductive silicone 200 away from the circuit board 110, and a plurality of oil drain holes 310 are provided on the heat sink 300; the oil absorber 400 is arranged on one side of the heat sink 300 away from the thermally conductive silicone 200, and the oil absorber 400 is used to absorb silicone oil discharged from the oil drain holes 310.

[0022] It should be noted that in order to prevent the thermal conductive silicone 200 from being squeezed and leaking silicone oil to pollute the camera module, affecting the appearance and quality of the camera module. Therefore, an oil drain hole 310 is provided on the heat sink 300, and the subsequent silicone oil is discharged through the oil drain hole 310. At the same time, an oil absorber 400 is provided on the side of the heat sink 300 away from the thermal conductive silicone 200, and the silicone oil flowing out of the oil drain hole 310 is absorbed by the oil absorber 400. The oil absorber 400 needs to be a material that can absorb silicone oil. In this way, the problem of oil leakage of the thermal conductive silicone can be improved, and the silicone oil can be prevented from affecting the appearance and quality of the camera module. In this embodiment, the circuit board 110 is a PCB (circuit board) board or an FPC (flexible circuit board) board. The conventional PCB thickness is 0.8 to 1.2 mm, and the FPC thickness is 0.11 to 0.13 mm. The electronic components on the circuit board are the main source of heat, so it is necessary to set the thermal conductive silicone 200 and the heat sink 300 for heat dissipation. Specifically, avoidance holes are provided on the thermal conductive silicone 200 , the heat sink 300 and the oil absorber 400 . The avoidance holes are aligned with the cameras on the camera module body 100 , and the cameras are avoided by opening the avoidance holes.

[0023] Preferably, the thickness of the thermal conductive silicone 200 is 0.2-0.3 mm. By attaching the thermal conductive silicone 200 to the bottom of the circuit board 110, the thermal conductive silicone 200 can absorb the heat transmitted through the circuit board by the electronic components.

[0024] Preferably, the heat sink 300 is a metal iron frame. Metal materials have the advantage of fast heat dissipation, so the use of a metal iron frame can improve the heat dissipation efficiency, thereby improving the heat dissipation effect. Preferably, the thickness of the metal iron frame is 1.0 to 1.2 mm, that is, the metal iron frame does not need to be too thick to avoid the overall thickness of the camera module being too thick.

[0025] Preferably, the oil drain hole 310 is a circular structure. The circular structure of the oil drain hole 310 can avoid the residual silicone oil at an angle, so that the silicone oil can be better discharged to the oil absorption member 400. Preferably, the diameter of the oil drain hole 310 is 0.2 to 0.5 mm. The spacing between the oil drain holes is 2 to 5 mm. The diameter of the oil drain hole 310 and the spacing between the oil drain holes 310 can be matched and selected according to the size of the circuit board. Within a certain range, the larger the diameter of the oil drain hole 310, the better the corresponding oil drainage effect.

[0026] In one embodiment, the oil absorber 400 is a heat dissipation cloth. The heat dissipation cloth can absorb silicone oil and has a heat dissipation function, so it can further improve the heat dissipation effect of the camera module, thereby increasing the service life of the camera module. Preferably, the thickness of the heat dissipation cloth is 0.2-0.3 mm.

[0027] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A camera module structure capable of improving oil seepage of thermally conductive silicone, characterized in that: include: A camera module body, to which a circuit board is connected; Thermally conductive silica gel, the thermally conductive silica gel is arranged on one side surface of the circuit board; A heat sink, the heat sink is arranged on a side of the thermally conductive silica gel away from the circuit board, and a plurality of oil drain holes are provided on the heat sink; and An oil absorbing member is arranged on a side surface of the heat dissipation frame away from the thermally conductive silica gel, and is used for absorbing the silicone oil discharged from the oil drain hole.

2. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 1, characterized in that: The circuit board is a PCB board or an FPC board.

3. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 1, characterized in that: The thickness of the thermally conductive silica gel is 0.2-0.3 mm.

4. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 1, characterized in that: The heat dissipation frame is a metal iron frame.

5. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 4, characterized in that: The thickness of the metal iron frame is 1.0-1.2 mm.

6. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 1, characterized in that: The oil drain hole is in a circular structure.

7. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 6, characterized in that: The diameter of the oil drain hole is 0.2-0.5 mm.

8. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 7, characterized in that: The distance between the oil drain holes is 2 to 5 mm.

9. The camera module structure capable of improving oil leakage of thermally conductive silicone rubber according to any one of claims 1 to 8, characterized in that: The oil absorbing member is a heat dissipation cloth.

10. The camera module structure capable of improving oil seepage of thermally conductive silicone according to claim 9, characterized in that: The thickness of the heat dissipation cloth is 0.2-0.3 mm.

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